JP2002093489A - Current passing method for extremely thin layered product and sheet-like electrode - Google Patents
Current passing method for extremely thin layered product and sheet-like electrodeInfo
- Publication number
- JP2002093489A JP2002093489A JP2000283764A JP2000283764A JP2002093489A JP 2002093489 A JP2002093489 A JP 2002093489A JP 2000283764 A JP2000283764 A JP 2000283764A JP 2000283764 A JP2000283764 A JP 2000283764A JP 2002093489 A JP2002093489 A JP 2002093489A
- Authority
- JP
- Japan
- Prior art keywords
- ultra
- rivet
- thin
- conducting
- metal pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J15/00—Riveting
- B21J15/02—Riveting procedures
- B21J15/025—Setting self-piercing rivets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J15/00—Riveting
- B21J15/10—Riveting machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J15/00—Riveting
- B21J15/10—Riveting machines
- B21J15/36—Rivet sets, i.e. tools for forming heads; Mandrels for expanding parts of hollow rivets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Insertion Pins And Rivets (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、極薄金属片でなる
極薄積層体を導通させる技術に関し、更に詳しくは、電
池等の電極において極薄金属片でなる極薄積層体を導通
させる方法及び導通されたシート状電極に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for conducting an ultra-thin laminate made of ultra-thin metal pieces, and more particularly, to a method for conducting an ultra-thin laminate made of ultra-thin metal pieces in an electrode of a battery or the like. And conductive sheet electrodes.
【０００２】[0002]
【従来の技術】半導体分野では小型電池が多く使用され
ているが、この種の電池には、例えば、図７（Ａ）のよ
うに、電池本体１００にシート状のプラス（＋）電極１
０１及びマイナス（−）電極１０２が突設されている。
そして、これらの電極１０１，電極１０２は、通常、薄
い金属箔を多数枚重ね合わせることによりシート状に構
成されているものが多い。また、電極１０１，１０２
は、必要に応じて端子状に形成され、その端子に導線が
接続されるようになっている。2. Description of the Related Art In the field of semiconductors, small batteries are often used. In this type of battery, for example, as shown in FIG.
01 and a minus (−) electrode 102 are protruded.
The electrode 101 and the electrode 102 are usually formed in a sheet shape by laminating many thin metal foils. Also, the electrodes 101 and 102
Is formed in a terminal shape as required, and a conductor is connected to the terminal.
【０００３】このような薄い金属箔を多数枚重ね合わせ
たシート状電極では、電極１０１，電極１０２を端子と
して形成する場合、電通効率を良くするために、多数の
薄い金属箔を相互に導通させることが必要である。その
ため、従来は、例えば図７（Ｂ）に示すような導通手法
が行われている。すなわち、まず電極１０１，電極１０
２の所定部位にスルーホール１０１ａ（１０２ａ）を形
成する。つぎに、スルーホール１０１ａ周辺をマスキン
グして、点線で示すようなメッキ処理１０３を施す。こ
のメッキ処理により電極１０１，電極１０２を構成する
金属箔同士が接続され、相互の導通を図ることにより電
極端子が得られる。In the case of a sheet-like electrode in which a large number of such thin metal foils are stacked, when the electrodes 101 and 102 are formed as terminals, a large number of thin metal foils are electrically connected to each other in order to improve conduction efficiency. It is necessary. Therefore, conventionally, for example, a conduction method as shown in FIG. That is, first, the electrode 101, the electrode 10
A through hole 101a (102a) is formed at a predetermined portion of No. 2. Next, the periphery of the through hole 101a is masked, and a plating process 103 shown by a dotted line is performed. By this plating process, the metal foils constituting the electrodes 101 and 102 are connected to each other, and mutual conduction is achieved, whereby an electrode terminal is obtained.
【０００４】あるいはまた、電極１０１，電極１０２の
所定部位に高周波溶着又はスポット溶接を施し、これに
より金属箔同士を電気的に接続する等の手段も採用され
ている。Alternatively, high-frequency welding or spot welding is performed on predetermined portions of the electrodes 101 and 102 to electrically connect the metal foils to each other.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前述し
たメッキを施す方法では多くの工数を必要とするため手
間と時間、さらにはコストがかからざるを得なかった。
また、メッキには金、銀あるいは銅等が用いられるた
め、この点でもコストが大となる。またメッキ工程は、
廃液を出すため公害問題の原因となり、一般的に採用を
極力控える傾向がある。さらに、高周波溶着あるいはス
ポット溶接等を用いるものでは、導通状態が安定せず、
更に、外部からでは導通しているか否かを判別すること
が難しい場合が多く、品質的に一定しない。However, the above-described plating method requires a lot of man-hours, so that it requires labor, time, and cost.
Further, since gold, silver, copper, or the like is used for plating, the cost is increased in this respect as well. Also, the plating process
Discharge of waste liquid causes pollution problems and generally tends to refrain from adoption. Furthermore, when using high frequency welding or spot welding, the conduction state is not stable,
Further, it is often difficult to determine whether or not there is electrical continuity from outside, and the quality is not constant.
【０００６】本発明はかかる実状に鑑み、それらの問題
点を解決するものである。すなわち、簡単かつ確実に導
通を取ることができ、しかも安定した導通状態を得るこ
とができる極薄積層体の導通方法及びシート状電極を提
供することを目的とする。The present invention has been made in view of such circumstances, and has been made to solve those problems. That is, an object of the present invention is to provide a method of conducting an ultra-thin laminate and a sheet-like electrode which can conduct conduction easily and reliably and can obtain a stable conduction state.
【０００７】[0007]
【課題を解決するための手段】かくして、本発明者は、
このような課題背景に対して鋭意研究を重ねた結果、リ
ベットを打ち込みかしめることにより上記の諸問題点を
解決することができることを見出し、この知見に基づい
て本発明を完成させたものである。Means for Solving the Problems Thus, the present inventor has:
As a result of intensive research on such a background of the problem, it has been found that the above-mentioned problems can be solved by driving a rivet, and the present invention has been completed based on this finding. .
【０００８】すなわち、本発明は、（１）、複数の積層
された極薄金属片でなる極薄積層体を導通させるための
方法であって、前記極薄積層体に貫通リベットを打設
し、そのリベットを介して前記極薄金属片同士を導通さ
せる極薄積層体の導通方法に存する。That is, the present invention provides (1) a method for conducting an ultra-thin laminate composed of a plurality of laminated ultra-thin metal pieces, wherein a through rivet is set in the ultra-thin laminate. The present invention also provides a method for conducting an ultra-thin laminate in which the ultra-thin metal pieces are conducted through the rivets.
【０００９】そして、（２）、複数の積層された極薄金
属片でなる極薄積層体を導通させるための方法であっ
て、前記極薄積層体に貫通リベットを打設し、貫通リベ
ットの外周面に各極薄金属片を高密度で屈曲した状態で
接触させることにより、前記極薄金属片同士を導通させ
る極薄積層体の導通方法に存する。(2) A method for conducting an ultra-thin laminate comprising a plurality of laminated ultra-thin metal pieces, wherein a through rivet is driven into the ultra-thin laminate to form a through rivet. The present invention resides in a method for conducting an ultra-thin laminate in which the ultra-thin metal pieces are brought into contact with each other in a state of being bent at a high density on the outer peripheral surface to thereby conduct the ultra-thin metal pieces.
【００１０】そしてまた、（３）、極薄金属片と同一材
質の貫通リベットを用いる極薄積層体の導通方法に存す
る。Further, (3) a method for conducting an ultra-thin laminate using a penetration rivet made of the same material as the ultra-thin metal piece.
【００１１】そしてまた、（４）、複数の積層された極
薄金属片でなる極薄積層体を導通させるための方法であ
って、抜き穴を有する抜きダイス上に前記極薄積層体を
セットし、ステムにより担持した貫通リベットを前記極
薄積層体に打ち込む工程と、前記極薄積層体に打ち込ま
れた前記貫通リベットの先端からかしめポンチを圧入
し、該貫通リベットをかしめる工程と、貫通リベットの
内周面に残留付着している抜けカスを除去する極薄積層
体の導通方法に存する。(4) A method for conducting an ultra-thin laminate comprising a plurality of laminated ultra-thin metal pieces, wherein the ultra-thin laminate is set on a punching die having a punched hole. And a step of driving a through rivet carried by a stem into the ultra-thin laminate, a step of press-fitting a punch from the tip of the through rivet driven into the ultra-thin laminate, and caulking the through rivet; The present invention relates to a method of conducting an ultra-thin laminated body for removing a scum remaining on the inner peripheral surface of a rivet.
【００１２】そしてまた、（５）、複数の積層された極
薄金属片でなるシート状電極であって、所定部位に打設
された貫通リベットを介して前記極薄金属片同士が導通
されており、貫通リベットの外周面に各極薄金属片が高
密度で屈曲した状態で接触しているシート状電極に存す
る。(5) A sheet-like electrode comprising a plurality of laminated ultra-thin metal pieces, wherein the ultra-thin metal pieces are electrically connected to each other through penetrating rivets set at predetermined locations. In the sheet-like electrode, each ultrathin metal piece contacts the outer peripheral surface of the through rivet in a state of being bent at a high density.
【００１３】そしてまた、（６）、前記極薄金属片と前
記貫通リベットが同一材質であるシート状電極に存す
る。(6) The ultra-thin metal piece and the through rivet are in the sheet-like electrode made of the same material.
【００１４】そしてまた、（７）、前記貫通リベットの
内周面に残留付着した抜けカスが除去されていることを
特徴とする請求項５に記載のシート状電極に存する。Further, (7) the sheet-like electrode according to claim 5, characterized in that the scraps remaining on the inner peripheral surface of the through rivet are removed.
【００１５】本発明によれば、複数の積層された極薄金
属片でなる極薄積層体にリベットを打設し、該リベット
の外周面を各金属片の破断面と接触させることにより、
極薄積層体の導通をとる。このように極めて簡単な工程
により、しかも確実に極薄積層体の導通を図ることがで
きる。According to the present invention, a rivet is driven into an ultra-thin laminated body composed of a plurality of laminated ultra-thin metal pieces, and the outer peripheral surface of the rivet is brought into contact with the fractured surface of each metal piece.
Conduct conduction of the ultra-thin laminate. In this way, conduction of the ultra-thin laminate can be reliably achieved by an extremely simple process.
【００１６】[0016]
【発明の実施の形態】以下、図面に基づき本発明による
極薄積層体の導通方法及びシート状電極の好適な実施の
形態を説明する。この実施形態において、例えば既に図
７（Ａ）に示したような小型電池等の電極１０１，電極
１０２を対象とする例で示すことにする。すなわち、金
属箔を多数枚重ね合わせることによりシート状に構成さ
れる電極１０１，電極１０２を形成するものとする。そ
して、この電極１０１，電極１０２を構成する極薄積層
体を導通させ端子として機能させるものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a method for conducting an ultra-thin laminate and a sheet-like electrode according to the present invention will be described below with reference to the drawings. In this embodiment, an example will be described in which the electrodes 101 and 102 of a small battery or the like as already shown in FIG. That is, the electrodes 101 and 102 formed in a sheet shape are formed by stacking a large number of metal foils. The ultra-thin laminates constituting the electrodes 101 and 102 are made conductive to function as terminals.
【００１７】図１は、本発明方法の主要工程を示してい
る。ここでまず、各工程を概略説明する。図１（Ａ）に
おいて、抜き穴１１を有する抜きダイス１０上に、まず
極薄積層体１（ワーク）をセットする。打設されるべき
リベット２は、下端から上端まで貫通した貫通孔２ａを
有する貫通リベットであり、抜きダイス１０の抜き穴１
１と芯合わせされてステム１２により担持される。な
お、貫通リベットは、ステム１２に形成された吸引穴１
４（図２参照）により吸引吸着されて保持される。FIG. 1 shows the main steps of the method of the present invention. First, each step will be described briefly. In FIG. 1A, first, an ultrathin laminate 1 (work) is set on a punching die 10 having a punching hole 11. The rivet 2 to be cast is a through rivet having a through hole 2 a penetrating from the lower end to the upper end.
1 and carried by the stem 12. In addition, the penetration rivet is attached to the suction hole 1 formed in the stem 12.
4 (see FIG. 2) is held by suction.
【００１８】図１（Ｂ）において、ステム１２により担
持した貫通リベット２を極薄積層体１に打ち込む。そし
て打ち込み終了後に、エアー噴出孔１５からエアーブロ
ーを行って、内周面に残留付着している抜けカスを除去
する。In FIG. 1B, the through rivet 2 carried by the stem 12 is driven into the ultra-thin laminate 1. Then, after the driving is completed, air blow is performed from the air ejection hole 15 to remove scum remaining on the inner peripheral surface.
【００１９】図１（Ｃ）において、極薄積層体１に打ち
込まれた貫通リベット２に対してかしめポンチ１３を位
置決めする。図１（Ｄ）において、かしめポンチ１３の
圧入により貫通リベット２をかしめる。In FIG. 1 (C), the swaging punch 13 is positioned with respect to the penetrating rivet 2 driven into the ultra-thin laminate 1. In FIG. 1 (D), the penetrating rivet 2 is caulked by press-fitting the punch 13.
【００２０】ここで、貫通リベット２は、極薄積層体１
を構成する極薄金属片と同一材質のものを用いることが
好ましい。例えばアルミニウムの極薄積層体１に対して
は、アルミニウム製の貫通リベット２を用い、また銅の
極薄積層体１に対しては、銅製のリベット２を用いる。
このように同一材質とすることにより極薄金属片と貫通
リベット２との良好な電気的接続を行なうことができ
る。なお、電池においては、電極１０１，電極１０２の
一方をアルミニウムの極薄積層体１としアルミニウム製
の貫通リベット２をかしめ、他方を銅の極薄積層体１と
し、銅製のリベット２をかしめたものとする場合が多
い。Here, the penetrating rivet 2 is used for the ultra-thin laminate 1
It is preferable to use the same material as the ultra-thin metal piece that constitutes the above. For example, a through rivet 2 made of aluminum is used for the ultra-thin laminate 1 of aluminum, and a rivet 2 made of copper is used for the ultra-thin laminate 1 of copper.
By using the same material as described above, excellent electrical connection between the extremely thin metal piece and the through rivet 2 can be performed. In the battery, one of the electrode 101 and the electrode 102 was formed by crimping an aluminum ultrathin laminate 1 with an aluminum through rivet 2 and the other was formed by a copper ultrathin laminate 1 with a copper rivet 2 crimped. In many cases.
【００２１】図２は、貫通リベット２の打込み時の様子
を更に拡大して示したものである。ステム１２は、貫通
リベット２を吸引吸着するための吸引孔１４と、貫通リ
ベット２を打ち込んだ際、極薄積層体１の抜きカス３を
エアブローによって除去するためのエア噴出孔１５を有
する。抜きダイス１０の抜き穴１６の内径Ｄは、貫通リ
ベット２の外径ｄよりも大きく設定され間隙を有する
が、この間隙の大きさは極薄積層体１の材質及び厚み等
を考慮して決定する。FIG. 2 shows a further enlarged view of the state when the through rivet 2 is driven. The stem 12 has a suction hole 14 for sucking and sucking the through rivet 2 and an air ejection hole 15 for removing the scrap 3 of the ultra-thin laminate 1 by air blowing when the through rivet 2 is driven. The inner diameter D of the punched hole 16 of the punching die 10 is set to be larger than the outer diameter d of the through rivet 2 and has a gap. The size of the gap is determined in consideration of the material and thickness of the ultrathin laminate 1. I do.
【００２２】ステム１２は、吸引孔１４を通じて貫通リ
ベット２を吸引吸着することで的確に担持することがで
きる。また、貫通リベット２の打込みにより生じた抜き
カス３は、エア噴出孔１５からのエアブローによって確
実に除去される。このように抜きカス３を除去すること
で導通抵抗も一定のものとなり適正な導通を取ることが
できる。また、抜きカス３は、貫通リベット２から排除
されることにより、以後、製品となった場合、不用意に
抜け落ちることがない。The stem 12 can be properly held by sucking the suction rivet 2 through the suction hole 14. Further, the scrap 3 generated by driving the through rivet 2 is reliably removed by air blow from the air ejection hole 15. By removing the scrap 3 in this manner, the conduction resistance becomes constant and proper conduction can be achieved. Further, since the scrap 3 is removed from the piercing rivet 2, when it becomes a product thereafter, it does not drop out carelessly.
【００２３】極薄積層体１は、先述したように、多数枚
の極薄金属片４により構成されており、貫通リベット２
の打込みにより形成される抜き孔１ａにおいては、各極
薄金属片４は貫通リベット２の打込み方向に流れるよう
に屈曲変形する。このような状態にて、かしめポンチ１
３の圧入により貫通リベット２をかしめることで、屈曲
した領域の密度がより高まり貫通リベット２の外周面と
各極薄金属片４の破断面とが強固に接触（圧接）する。As described above, the ultra-thin laminate 1 is constituted by a large number of ultra-thin metal pieces 4,
In the punched hole 1a formed by the driving, each ultrathin metal piece 4 is bent and deformed so as to flow in the driving direction of the through rivet 2. In such a state, caulking punch 1
By crimping the through rivet 2 by press-fitting 3, the density of the bent region is further increased, and the outer peripheral surface of the through rivet 2 and the fractured surface of each ultrathin metal piece 4 come into firm contact (pressure contact).
【００２４】そのため貫通リベット２を介して極薄積層
体１全体を的確に導通させることができる。このように
貫通リベット２をかしめ終えた状態では、確実に導通が
取れ、導通不備や導通不可が避けられる。すなわち、従
来のスポット溶接のように外見から見て完全でも内部が
導通不備や導通不全となっている場合があり、検査工程
が必須なのに比べ、本発明では、貫通リベット２がかし
められていることで内部も導通していることが視認でき
検査が不要である。なお、参考までに、図３は、かめし
が完了した後の状態を示し、（Ａ）は、断面図であり、
（Ｂ）は平面図である。Therefore, the entire ultra-thin laminate 1 can be accurately conducted through the through rivet 2. In the state where the penetrating rivet 2 has been caulked in this manner, conduction is reliably achieved, and insufficient conduction or impermissible conduction is avoided. That is, there is a case where conduction is insufficient or conduction is insufficient even though it is completely visible from the outside like a conventional spot welding, and in the present invention, the penetration rivet 2 is caulked in comparison with the case where the inspection step is essential. Thus, it is possible to visually recognize that the inside is also conductive, and no inspection is required. For reference, FIG. 3 shows a state after caulking is completed, (A) is a sectional view,
(B) is a plan view.
【００２５】導通方法において、貫通リベット２の打込
み工程とかしめ工程の間でステム１２及び抜きダイス１
０又はかしめポンチ１３の相対移動が行なわれる。例え
ば図４に示すように貫通リベット２の打込み工程終了
後、ステム１２を矢印Ａのようにかしめポンチ１３上に
移動する。或いはまた、貫通リベット２の打込み工程終
了後、抜きダイス１０を矢印Ｂのように離脱させるとと
もに、かしめポンチ１３を矢印Ｃのようにステム１２の
下方に移動させるようにしてもよい。本発明において
は、抜きダイス１０とかしめポンチ１３の両方を使って
打込み工程とかしめ工程の２段の区別した工程を採用し
ているが、これは抜きカスを除去するために区別したも
のである。因みに、本発明と異なって抜きカスを除去し
ない場合は、通常行うように打込みとかしめを同時に行
うための下金型を使えばよい。In the conduction method, the stem 12 and the punching die 1 are inserted between the driving step of the through rivet 2 and the caulking step.
The relative movement of the punch 13 or zero is performed. For example, as shown in FIG. 4, after the driving step of the through rivet 2 is completed, the stem 12 is swaged as shown by an arrow A and moved onto the punch 13. Alternatively, after the driving step of the through rivet 2 is completed, the punching die 10 may be detached as shown by the arrow B, and the caulking punch 13 may be moved below the stem 12 as shown by the arrow C. In the present invention, two distinct steps of a driving step and a caulking step are employed by using both the punching die 10 and the punching punch 13, but this step is distinguished in order to remove punching waste. . Incidentally, in the case where the scrap is not removed unlike the present invention, a lower mold for simultaneously performing driving and swaging may be used as usual.
【００２６】図５は、上記のように極薄積層体１に貫通
リベット２が打設された状態を示し、実際に打込み実験
を行った状態の断面を忠実に描いた図であり、（Ａ）は
リベット全体を（Ｂ）はその一部拡大を示す。FIG. 5 shows a state in which the penetration rivet 2 has been driven into the ultra-thin laminate 1 as described above, and is a drawing faithfully showing a cross section of a state where an actual driving test was performed. ) Shows the entire rivet, and (B) shows a part of it.
【００２７】図６は、参考までに、電池本体から突設さ
れた電極を示し、（Ａ）はリベットをかしめていない状
態、また（Ｂ）はリベット２のかしめ状態を示す図であ
る。上述したように、貫通リベット２の外周面と各極薄
金属片４とが接触することで、貫通リベット２を介して
極薄積層体１全体が導通された状態となっており、貫通
リベットの外周面に各極薄金属片が高密度で屈曲した状
態で接触していることがわかる。FIGS. 6A and 6B show, for reference, electrodes protruding from the battery body, wherein FIG. 6A shows a state in which the rivet is not caulked, and FIG. 6B is a view showing a state in which the rivet 2 is caulked. As described above, by contact between the outer peripheral surface of the through rivet 2 and each ultrathin metal piece 4, the entire ultrathin laminate 1 is in a state of conduction through the through rivet 2, and It can be seen that each ultrathin metal piece is in contact with the outer peripheral surface in a state of being bent at a high density.
【００２８】このように貫通リベットの外周面に極薄金
属片が高密度で屈曲した状態で接触しているために高い
導通効果を得ることができる。従来のようにスルーホー
ルやメッキを施す工程が不要であり、簡単なかしめ工程
のみで導通が可能である。また溶接等の場合のような不
安定な接続状態が生じることがなく、確実に導通を取
れ、また導通状態も安定したものとなる。As described above, since the extremely thin metal piece is in contact with the outer peripheral surface of the through rivet in a state of being bent at a high density, a high conduction effect can be obtained. Unlike the conventional case, a step of applying a through hole or plating is unnecessary, and conduction can be achieved only by a simple caulking step. In addition, an unstable connection state such as in the case of welding or the like does not occur, conduction is reliably achieved, and the conduction state is also stable.
【００２９】なお、本発明は上記実施形態にのみ限定さ
れるものでなく、本発明の範囲内で種々の変形等が可能
である。抜けカスの除去は、エアーブロによる例で示し
たが、押し出しピンを使った方法も可能である。この場
合、エアー噴出孔に相当する孔から押し出しピンを突出
可能に仕込むことで可能となる。図６で示した電極の形
状も適用する対象物によって適宜変更可能である。電池
等の電極を導通する場合の例を説明したが、例えばＩＣ
カードやハーネス配線、半導体部品等の導通にも本発明
は有効に適用可能であり、上記実施形態と同様な作用効
果を得ることができる。It should be noted that the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention. The removal of the debris has been described with an example using an air blower, but a method using an extrusion pin is also possible. In this case, it becomes possible by charging the push pin so as to protrude from the hole corresponding to the air ejection hole. The shape of the electrode shown in FIG. 6 can also be appropriately changed depending on the object to which the electrode is applied. The example of the case where the electrodes of a battery or the like are conducted has been described.
The present invention can be effectively applied to conduction of a card, a harness wiring, a semiconductor component, and the like, and the same operational effects as those of the above embodiment can be obtained.
【００３０】[0030]
【発明の効果】以上説明したように本発明によれば、こ
の種の極薄積層体においてリベットを打ち込むだけで確
実に導通をとることができる。また、導通が取れたこと
を簡単に視認識することができる。したがって、簡単な
工程でしかも安定した導通性を確保し、優れた品質を保
証することができる上、コストを実質的に安くすること
ができる等の利点を有している。As described above, according to the present invention, conduction can be reliably achieved only by driving a rivet in this kind of ultra-thin laminate. Further, it is possible to easily visually recognize that the conduction has been achieved. Therefore, there are advantages in that stable conductivity can be ensured by a simple process, excellent quality can be guaranteed, and the cost can be substantially reduced.
【図１】図１は、本発明の実施形態における極薄積層体
の導通方法の主要工程を示す図である。FIG. 1 is a diagram showing main steps of a method for conducting an ultra-thin laminate according to an embodiment of the present invention.
【図２】図２は、本発明の実施形態における極薄積層体
の導通方法のリベット打込み工程を示す図である。FIG. 2 is a view showing a rivet driving step of the method for conducting an ultra-thin laminate according to the embodiment of the present invention.
【図３】図３は、本発明の実施形態における極薄積層体
の導通方法のリベットかしめ工程を示す図である。FIG. 3 is a diagram showing a rivet setting step of the method for conducting an ultra-thin laminate according to the embodiment of the present invention.
【図４】図４は、本発明の実施形態における極薄積層体
の導通方法に使用するステム及び抜きダイス又はかしめ
ポンチの相対移動の例を示す図である。FIG. 4 is a view showing an example of relative movement of a stem and a punching die or a caulking punch used in a method of conducting an ultra-thin laminate according to an embodiment of the present invention.
【図５】図５は、本発明の実施形態における極薄積層体
にリベットが打設された状態を示す図である。FIG. 5 is a diagram showing a state in which a rivet is driven into the ultrathin laminate according to the embodiment of the present invention.
【図６】図６は、電池本体から突設された電極を示す図
である。FIG. 6 is a diagram showing electrodes protruding from a battery main body.
【図７】図７は、極薄積層体でなるシート状電極を有す
る電池の例を示す図である。FIG. 7 is a diagram showing an example of a battery having a sheet-like electrode formed of an extremely thin laminate.
１…極薄積層体 ２…リベット（貫通リベット） ３…抜きカス ４…極薄金属片 １０…抜きダイス １１…抜き穴 １２…ステム １３…かしめポンチ １４…吸引孔 １５…エア噴出孔 １６…抜き穴 １０１…電極 １０２…電極 １０１ａ…スルーホール １０３…メッキ処理 DESCRIPTION OF SYMBOLS 1 ... Ultra-thin laminated body 2 ... Rivet (penetrating rivet) 3 ... Die scrap 4 ... Ultra-thin metal piece 10 ... Die die 11 ... Drill hole 12 ... Stem 13 ... Crimping punch 14 ... Suction hole 15 ... Air ejection hole 16 ... Drill Hole 101: Electrode 102: Electrode 101a: Through hole 103: Plating process
Claims (7)
積層体を導通させるための方法であって、 前記極薄積層体に貫通リベットを打設し、そのリベット
を介して前記極薄金属片同士を導通させることを特徴と
する極薄積層体の導通方法。1. A method for conducting an ultra-thin laminate composed of a plurality of laminated ultra-thin metal pieces, wherein a penetration rivet is driven into the ultra-thin laminate and the pole is inserted through the rivet. A method for conducting an ultra-thin laminate, comprising conducting thin metal pieces to each other.
積層体を導通させるための方法であって、 前記極薄積層体に貫通リベットを打設し、貫通リベット
の外周面に各極薄金属片を高密度で屈曲した状態で接触
させることにより、前記極薄金属片同士を導通させるこ
とを特徴とする極薄積層体の導通方法。2. A method for conducting an ultra-thin laminate comprising a plurality of laminated ultra-thin metal pieces, wherein a through rivet is driven into the ultra-thin laminate, and each of the through-rivets is formed on an outer peripheral surface of the through-rivet. A method of conducting an ultra-thin laminate, wherein the ultra-thin metal pieces are brought into contact with each other in a state of being bent at a high density, thereby conducting the ultra-thin metal pieces.
用いることを特徴とする請求項２に記載の極薄積層体の
導通方法。3. The method for conducting an ultra-thin laminate according to claim 2, wherein a through rivet made of the same material as the ultra-thin metal piece is used.
積層体を導通させるための方法であって、 抜き穴を有する抜きダイス上に前記極薄積層体をセット
し、ステムにより担持した貫通リベットを前記極薄積層
体に打ち込む工程と、 前記極薄積層体に打ち込まれた前記貫通リベットの先端
からかしめポンチを圧入し、該貫通リベットをかしめる
工程と、 貫通リベットの内周面に残留付着している抜けカスを除
去することを特徴とする極薄積層体の導通方法。4. A method for conducting an ultra-thin laminate comprising a plurality of laminated ultra-thin metal pieces, comprising: setting the ultra-thin laminate on a punching die having a punched hole; Driving the pierced rivet into the ultra-thin laminated body, press-fitting a punch from the tip of the pierced rivet driven into the ultra-thin laminated body, and caulking the penetrating rivet; A method for conducting an ultra-thin laminate, characterized by removing scum remaining on the substrate.
ト状電極であって、所定部位に打設された貫通リベット
を介して前記極薄金属片同士が導通されており、貫通リ
ベットの外周面に各極薄金属片が高密度で屈曲した状態
で接触していることを特徴とするシート状電極。5. A sheet-like electrode comprising a plurality of laminated ultra-thin metal pieces, wherein said ultra-thin metal pieces are electrically connected to each other via penetrating rivets set at predetermined locations, and wherein A sheet-shaped electrode, wherein each ultrathin metal piece is in contact with the outer peripheral surface in a state of being bent at a high density.
一材質であることを特徴とする請求項５に記載のシート
状電極。6. The sheet-like electrode according to claim 5, wherein the ultra-thin metal piece and the through rivet are made of the same material.
た抜けカスが除去されていることを特徴とする請求項５
に記載のシート状電極。7. The removal scum remaining on the inner peripheral surface of the through rivet is removed.
3. The sheet-like electrode according to 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000283764A JP3681327B2 (en) | 2000-09-19 | 2000-09-19 | Method for conducting ultrathin laminate and sheet electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000283764A JP3681327B2 (en) | 2000-09-19 | 2000-09-19 | Method for conducting ultrathin laminate and sheet electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002093489A true JP2002093489A (en) | 2002-03-29 |
| JP3681327B2 JP3681327B2 (en) | 2005-08-10 |
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ID=18768082
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000283764A Expired - Fee Related JP3681327B2 (en) | 2000-09-19 | 2000-09-19 | Method for conducting ultrathin laminate and sheet electrode |
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| Country | Link |
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| JP (1) | JP3681327B2 (en) |
Cited By (10)
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| JP2006202539A (en) * | 2005-01-18 | 2006-08-03 | Fukui Byora Co Ltd | Conduction method for ultrathin laminate, and sheet electrode |
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