JP2002093328A - Alternating current driving plasma display device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alternating current driving plasma display device prevented from cracking and abnormal discharge, capable of stably driving with long life, and to provide a manufacturing method of the same. SOLUTION: A dielectric layer 14 made of SiO2 formed on the first panel 10, and a dielectric layer 23 made of glass with low melting point formed on the second panel 20 are burned, or heat-treated, in a burning furnace 30 with reduced pressure, hereupon, degree of vacuum is made less than 1×10-1 Pa, and burning temperature is made to range between 350 deg.C and 650 deg.C. By the above, the dielectric layers 14, 23 are molten and recrystallized and made to have few defects and high flatness, consequently, it becomes hard to generate cracks, and stability of discharge is improved. Further, as the organic substances contained in the dielectric layers 14, 23 like binder are compulsorily removed, the purity of the gas in a discharging space 26 is maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device for displaying by utilizing plasma discharge and a method of manufacturing the same, and more particularly, to an AC drive type plasma display having a dielectric layer on a sustain electrode or an address electrode. The present invention relates to an apparatus and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, with the trend of lightening and thinning, displays such as personal computers have been developed.
There is a need for space saving and improved portability, and instead of the cathode ray tube (CRT), which has been the mainstream until now, LCD
(Liquid Crystal Display), FE
Developed and commercialized various FPD (Flat Panel Display) such as D (Field Emission Display), organic EL (Electroluminescence) display, PDP (Plasma Display Panel) Have been.

[0003] Among them, PDPs are characterized by relatively easy enlargement of the screen and wide viewing angle, excellent resistance to environmental factors such as temperature, magnetic field and vibration, and long life. In addition, it is expected to be applied to large information terminals for public use in addition to home wall-mounted televisions.

In this PDP, a discharge space is formed between two glass substrates facing each other, called a front substrate and a rear substrate, and each discharge cell is formed by dividing the discharge space by a partition. In the discharge cell, a phosphor is provided on the inner wall on the rear (partition) substrate side, and an inert gas is sealed inside as a discharge gas. When a predetermined voltage is applied to the discharge cells, ultraviolet rays are generated by glow discharge in the discharge gas, and the ultraviolet rays excite the phosphor layer in the discharge cells to emit light. Normally, one display screen is formed by collecting such discharge cells in units of several hundred thousand. Also, depending on the method of applying a voltage to the discharge cells, P
DP is roughly classified into a direct current drive (DC) type and an alternating current drive (AC) type. Among them, in the AC type PDP, the surface of each electrode on the discharge side is covered with a protective film made of a dielectric material, so that the electrodes are hardly worn and are suitable for extending the life.

[0005]

However, AC-type PDPs currently on the market are required to have further improved discharge stability and longer life. For example, although a life of about 30,000 hours has been reported for a 42-inch PDP, if the luminance is increased beyond the current specification, deterioration of characteristics such as luminance is expected to be accelerated in the future. After all, extending the life is still an issue.

[0006] The life of a PDP is mainly determined by a decrease in luminance, and the decrease in luminance is caused by deterioration of a phosphor, a protective film, a dielectric film, and a decrease in discharge gas purity. In particular, in the current method of manufacturing a PDP, the inside of the discharge cell is evacuated after forming the discharge cell, and there is a problem that it takes a long time to reach a sufficient vacuum state. In addition, there is another problem in that the discharge of gas from the partition walls and the dielectric film into the sealed discharge cells after evacuation lowers the discharge gas purity.

For example, when a partition is formed on a rear substrate by a thick film printing method, a decomposition gas such as a resin binder contained in a paste is sometimes enclosed in the partition during firing. In a PDP using this, a part of the decomposed gas is released during use, causing deterioration of the light emitting state and shortening of the life. This can be avoided by performing a vacuum evacuation process from an atmospheric pressure state at a temperature in the vicinity of the thermal / oxidative decomposition temperature range of the resin binder, and then performing firing at the atmospheric pressure state ( JP Hei 10
-302632).

[0008] However, no definitive solution has been found yet for deterioration other than that of the partition walls. Above all, since the deterioration of the dielectric film greatly affects the life of the PDP, a countermeasure has been desired. The dielectric film is generally formed by printing paste-like low-melting glass, and as described above, the resin binder contained in the paste may volatilize little by little, resulting in a reduction in discharge gas purity. there were. Furthermore, if the formed film is not uniform or its surface is not smooth, cracks and abnormal discharge may occur. The abnormal discharge impairs the discharge stability and deteriorates the protective film and the dielectric film, thus causing a problem that the life of the PDP is shortened.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to prevent the occurrence of cracks and abnormal discharge, to achieve stable driving and to extend the life of an AC drive. And a method of manufacturing the same.

[0010]

In the AC-driven plasma display device according to the present invention, the dielectric layer is fired in a reduced pressure atmosphere.

A method of manufacturing an AC-driven plasma display device according to the present invention includes a step of forming a dielectric layer on a substrate and then firing the dielectric layer in a reduced-pressure atmosphere.

In the present invention, the firing of the dielectric layer is performed at 350 ° C. in a reduced pressure atmosphere of 1 × 10 ^-1 Pa or less.
It is preferable to carry out at a temperature within the range of not less than 650 ° C.

In the AC-driven plasma display device and the method of manufacturing the same according to the present invention, the dielectric layer is melted by firing.
It is recrystallized and cracks hardly occur. At the same time, the resin binder contained in the paste is forcibly released from the dielectric layer by the heating in the reduced pressure atmosphere, and the degree of vacuum in the discharge cells is improved.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a schematic configuration of a plasma display device according to an embodiment of the present invention. FIG.
FIG. 2 is a cross-sectional view of the plasma display device shown in FIG. 1 taken along the line II. This plasma display device is a so-called surface discharge type of the AC type.
The first panel 1 has a structure in which the panel 20 is opposed to the first panel 1.
The space between the zero and the second panel 20 is hermetically sealed at the periphery. In this plasma display device, both the address discharge and the sustain discharge are performed by, for example, a cathode glow discharge.

The first panel includes a front glass substrate 11 and various components provided on the front glass substrate 11. That is, the front glass substrate 11
A set of two sustain electrodes (transparent electrodes) 12 (12a, 12b) is provided directly above the surface electrodes for surface discharge. One of these electrodes is a bus electrode 13 (1) for impedance reduction.
3a, 13b) are provided integrally. Further, a dielectric layer 14 and a protective layer 15 are sequentially provided on the sustain electrode 12 and the bus electrode 13.

As the front glass substrate 11, for example,
Strain point glass is used, and soda glass (Na
_TwoO ・ CaO ・ SiO_Two), Borosilicate glass (Na_TwoO ・
B_TwoO_Three・ SiO_Two), Forsterite (2MgO
SiO_Two), Lead glass (Na _TwoO ・ PbO ・ SiO_Two)
Are used. The sustain electrode 12 is transparent.
A suitable conductive material is used. Transparency here means fluorescence
Light transmittance at the emission wavelength (visible light range) specific to body materials
It is based on. Specifically, for example, ITO
(Alloy oxide of indium and tin), SnO_TwoEtc.
Can be As the bus electrode 13, the sustain electrode 12
Conductive material with a lower electrical resistivity than, for example, chromium
(Cr), copper (Cu), or a laminated film thereof is used.
In addition, silver (Ag), aluminum (Al), nickel
(Ni) can also be used.

The dielectric layer 14 has a function of accumulating wall charges generated during the address period, a function as a resistor for limiting an excessive discharge current, and a memory function for maintaining a discharge state. , Low-melting glass or silicon dioxide (SiO ₂ ). In the present embodiment, the dielectric layer 14 is fired in a reduced pressure atmosphere as described later, and is formed by recrystallizing these dielectric materials.

The protective layer 15 has the same function as the dielectric layer 14 and also serves to prevent contact of ions or electrons with the sustain electrode 12 to prevent the sustain electrode 12 from being worn. It is composed of a magnesium oxide (MgО) film. MgО is chemically stable and has an excellent protection function, and also has a function of emitting secondary electrons required for discharge. The light transmittance at the emission wavelength of the phosphor 25 described later is high, and the discharge starting voltage is low. And the protective film 15.

The second panel 20 includes a back glass substrate 21
And various components provided on the rear glass substrate 21. That is, a plurality of address electrodes 22 arranged in parallel with each other are provided on the rear glass substrate 21, and a dielectric layer 23 is provided so as to cover these address electrodes 22. On the dielectric layer 23, stripe-shaped barrier ribs 24 are provided between the address electrodes 22, respectively. Furthermore, adjacent partition walls 2
Between the four, from the side surface of the partition wall 24 to the dielectric layer 23, phosphors 25 of three primary colors of red, green and blue are provided so as to periodically arrange the three colors.

The back glass substrate 21 is a front glass substrate 1
1 and can be made of the same material. As the address electrode 22, for example, silver (Ag), aluminum (Al), or the like is used. In addition, gold (Au), N
i, Cr, Cu, tantalum (Ta), vanadium (B
a), a laminated film of lead (Pd) and Ag, LaB ₆ Ca _0.2
La _0.8 CrO ₃ or the like can be used in appropriate combination. The dielectric layer 23 is formed of the same material as the dielectric layer 14 on the first panel 10 side.
Similarly to the above, it is fired and recrystallized in a reduced pressure atmosphere.

As the partition wall 24, a known insulating material can be used. For example, a material obtained by mixing a metal oxide such as alumina with low-melting glass can be used. In addition,
When the partition walls 24 are formed of a color resist material colored black to form a so-called black matrix, high contrast of a displayed image can be achieved.

Further, as the phosphor 25, a known phosphor is used.
Select materials with high quantum efficiency (luminous efficiency) from materials
Can be used selectively. By the way, the phosphor material is
It is composed of a mother body and a light-emitting center.
The collision of the ionized host excites the emission center,
Emits visible light as it returns to the ground state. So, fluorescent
The body material is displayed as [base: emission center]. An example
For example, [(Y, Gd) BO_Three: Eu] is Europium
Yttrium (Y), gado with (Eu) as the emission center
It is a borate of rhinium (Gd). With red phosphor material
For example, [Y_TwoO_Three: Eu], [YBO_Three: E
u], [YVO_Four: Eu], [Y_0.96P _0.60V
_0.40O_Four: Eu_0.04], [(Y, Gd) BO_Three: E
u], [GdBO_Three: Eu], [ScBO_Three: Eu],
[3.5MgO.0.5MgF_Two・ GeO_Two: Mn]
Which is used. As a green phosphor material, for example,
[ZnSiO_Two: Mn], [BaAl₁₂O₁₉: Mn],
[BaMg_TwoAl₁₆O₂₇: Mn], [MgGa_TwoO_Four:
Mn], [YBO_Three: Tb], [LuBO_Three: Tb],
[Sr_FourSi_ThreeO₈C₁₄: Eu]. Blue
Examples of the color phosphor material include [Y_TwoSiO_Five: Ce],
[CaWO_Four: Pb], [BaMgAl₁₄O_{twenty three}: E
u], [Sr_TwoP_TwoO₇: Eu], [Sr_TwoP_TwoO₇:
Sn] etc. are used.

In this plasma display device, the sustain electrodes 12a and 12b of the first panel 10 and the address electrodes 22 of the second panel are arranged in a matrix at right angles. Further, as shown in FIG.
Thus, a discharge space 26 is defined in the extension direction of the address electrode 22, and a mixed gas such as neon or xenon or a single gas is filled in the discharge space 26 as a discharge gas. Each intersection of the pair of sustain electrodes 12a and 12b and the address electrode 22 thus arranged in a matrix corresponds to a dot (minimum light emission unit), and the red, green, and blue phosphors 25 are respectively provided. One unit pixel (pixel) is constituted by the provided three minimum light emission units.

Next, a method for manufacturing such a plasma display device will be described.

First, the first panel 10 is manufactured.

For example, sustain electrodes 12a and 12b made of ITO are formed in stripes on a front glass substrate 11 of high strain point glass or soda lime glass by using a sputtering method and a photolithography technique. Next, for example, a chromium (Cr) film is formed and patterned by using a sputtering method or an evaporation method and a photolithography technique to form the bus electrodes 13a and 13b in a predetermined shape.

Next, a dielectric layer 14 is formed on the front glass substrate 11 on which the sustain electrodes 12 and the bus electrodes 13 are formed. First, for example, a glass paste prepared by mixing and kneading powdery low-melting glass and a resin binder is solid-printed on the front glass substrate 11 to a thickness of 20 μm. After that, for example, the dielectric layer 14 is fired together with the front glass substrate 11.

FIG. 3 shows a schematic configuration of a firing furnace 30 used for firing the dielectric layer 14 of the present embodiment. The baking furnace 30 is a horizontal tubular furnace in which a heater 33 is fixed along the inner wall and a muffle 34 covers the baking furnace. In some cases, the inside is shut off from the outside air. The heater 33 is, for example, a resistance type electric furnace, and is connected to an AC power supply via a transformer (both are not shown). The inside of the firing furnace 30 is
The partition wall 32 divides the substrate into a heating zone A, a baking zone B, and a cooling zone C, and the hearth roller 35 transports the substrate in this order. In each band, a temperature controller (not shown) and a temperature monitor (not shown) are connected to the heater 33, respectively, so as to maintain a heat pattern as shown in FIG. 4, for example. Here, the rate of temperature rise and cooling can be appropriately selected. However, in order to bake the dielectric layer 14 or remove impurities inside the dielectric layer 14 described later,
The firing temperature is preferably in the range of 350 ° C. or more and 650 ° C. or less. In particular, it is preferable to set the temperature to 550 ° C. or more for sufficient firing of the dielectric layer 14. Further, a vacuum pump (not shown) for evacuating the inside of the furnace is connected via a valve to an exhaust port 36 provided in the baking furnace 30, and a gas supply port 37 is provided with a supply source of a decompression gas. Connected through.

The firing of the dielectric layer 14 using the firing furnace 30 is performed on the front glass substrate 11 after the printing of the dielectric layer 14 is completed.
After drying, the hearth roller 35 conveys the inside of the baking furnace 30 from the shutting door 31a to the shutting door 31b.

First, heating zone A, firing zone B,
Each part of the cooling zone C is adjusted to have a temperature distribution according to a predetermined heat curve. Next, when the front glass substrate 11 is conveyed from the shut-off door 31a into the firing furnace 30 by the hearth roller 35, the shut-off doors 31a and 31b
Is closed, the valve is opened and the exhaust port 36 communicates, and the inside of the firing furnace 30 is evacuated by a vacuum pump.

Here, the evacuation is performed until the pressure inside the firing furnace 30 becomes 1 × 10 ^-1 Pa or less. In general,
Such a reduced pressure state is called “vacuum”, and the pressure at that time is called a degree of vacuum. The reduced pressure atmosphere in the present invention refers to a vacuum state in which the pressure is equal to or lower than the atmospheric pressure (100 kPa), and at the same time, in the present invention, it is referred to as “high vacuum” in which the degree of vacuum is equal to or lower than 1 × 10 ⁻¹ Pa. Is desirable.

Next, the front glass substrate 11 is transported by the hearth roller 35 to each of the heating zone A, the firing zone B, and the cooling zone C. The front glass substrate 11 undergoes a process of heating, firing, and cooling under predetermined conditions while being transported. Thereby, the dielectric layer 14 is melted and recrystallized, and the resin binder contained in the dielectric layer 14 is released. When the front glass substrate 11 approaches the front of the shut-off door 31b, the valve is opened and the gas supply source communicates with the gas supply port 37, and a gas such as argon (Ar) or nitrogen (N ₂ ) is supplied from the gas supply source. And the pressure in the firing furnace 30 is restored. After that, the blocking door 31b is opened, and the front glass substrate 11 is carried out. The above is an example of the firing step of the dielectric layer 14.

Next, a protective film 15 made of magnesium oxide (MgO) is formed on the dielectric layer 14 to a thickness of 0.6 μm by using, for example, an electron beam evaporation method.

The first panel 10 thus manufactured
In this case, since the dielectric layer 14 is formed by recrystallization, it has few defects and high flatness. In addition, due to the high-temperature heat treatment of baking, the dielectric layer 14 hardly contains impurities such as a resin binder which is relatively easily separated.

Next, the second panel 20 is manufactured.

For example, an address paste 22 is formed on a back glass substrate 21 of high strain point glass or soda lime glass by applying an Ag paste in the form of stripes by a screen printing method, followed by baking.

Next, for example, a glass paste prepared by kneading and kneading powdery low-melting glass and a resin binder is applied by a screen printing method, and then baked to obtain a dielectric material having a thickness of 10 to 20 μm. The body layer 23 is formed. Here, baking in a reduced pressure atmosphere is performed in the same manner as the dielectric layer 14 of the first panel.

Next, a partition 24 is formed in a region on the dielectric layer 23 and between the address electrodes 22. For example, after the paste-like low-melting glass is applied and formed by a screen printing method, it is shaped into a stripe by a sand blast method, and then baked, whereby the partition wall 24 is formed. The height of the partition wall 24 is, for example, about 20 μm, and can be adjusted by polishing the top. Partition wall 2
4 can be fired in the same manner as the dielectric layer 23. However, the firing temperature needs to be about 470 ° C. or less regardless of the firing method so that the dielectric layer 23 thereunder does not melt. The firing of the dielectric layer 23 may be performed at the same time as the firing of the partition walls 24 here.

Next, the phosphor 2 is placed between the adjacent partition walls 24.
5 is formed. From the side surfaces of the adjacent partition walls 24 to the dielectric layer 23 therebetween, for example, slurries of three primary colors are sequentially printed so as to be periodically arranged and fired. The firing of the dielectric layer 23 may be performed simultaneously with the firing of the phosphor 25 here.

The second panel 20 thus manufactured
In this case, since the dielectric layer 23 is formed by recrystallization, defects are small and flatness is high. In addition, due to the high-temperature heat treatment of baking, the dielectric layer 23 hardly contains impurities such as a resin binder which is relatively easily separated.

Next, the first panel 10 and the second panel 20 are assembled. First, for example, by screen printing,
A sealing layer made of low-melting glass is formed on the periphery of the panel 20. Next, the first panel 10 and the second panel 20 are bonded together so that the directions of the sustain electrodes 12 and the address electrodes 22 are orthogonal to each other (see FIG. 1), and baked at a temperature of about 500 ° C. to harden the seal layer. Furthermore, two panels 1
The discharge space 26 provided between 0 and 20 and partitioned by the partition wall 24 is evacuated and filled with a mixed gas. The mixed gas is a mixture of an inert gas such as neon (Ne) and xenon (Xe), and these single gases can also be used.

The plasma display device thus manufactured operates, for example, as follows.

First, a pulse voltage higher than the discharge starting voltage V _bd is applied for a short time between one of the pairs of all sustain electrodes 12 and the address electrode 22. When a glow discharge occurs, wall charges due to dielectric polarization accumulate on the surface of the protective layer 15 near the sustaining electrode 12 on the voltage application side, and the apparent discharge start voltage decreases (address discharge). Next, in a discharge cell corresponding to a dot not to be displayed, an AC voltage is further applied between the sustain electrode 12 and the address electrode 22 that have previously performed the address discharge to perform a glow discharge, thereby erasing the accumulated wall charges. (Erase discharge). Furthermore,
When a predetermined AC pulse voltage is applied to all pairs of sustain electrodes 12, in the discharge cells in which the wall charges are accumulated, 2
The voltage between the two sustain electrodes 12 exceeds the discharge start voltage due to the superposition of the voltage due to the wall charges and the pulse voltage, and a surface discharge occurs here (sustain discharge). When the surface discharge occurs, the discharge gas in the discharge space 26 emits ultraviolet rays by plasma discharge, and the ultraviolet rays are applied to the phosphor 25 to excite the phosphor 25 and emit light in an emission color specific to the material. As a result, a dot is displayed.

In the present embodiment, the dielectric layer 14 on the first panel 10 side where surface discharge occurs is formed by recrystallization fired in a reduced-pressure atmosphere and has few defects and high flatness. In addition, cracks hardly occur in the protective layer 15 and abnormal discharge is also prevented. Also, the dielectric layer 14
Is substantially free of impurities which are relatively easily separated such as a resin binder, so that the gas purity in the discharge space 26 is improved. Thus, the life of the plasma display device can be extended.

Further, in the present embodiment, the dielectric layer 23 on the second panel 20 side where light emission occurs is also formed by recrystallization fired in a reduced-pressure atmosphere, and has a high flatness. Can be stabilized. In addition, since the dielectric layer 23 contains almost no impurities such as a resin binder, discharge due to the impurities released from the dielectric layer 23 does not easily occur. Therefore, the life of the device can be extended.

When the dielectric layers 14 and 23 are fired, the substrates 11 and 21 are fired in a reduced-pressure atmosphere, so that the substrates 11 and 21 have been exhausted before assembly. Therefore, in the plasma display device manufactured by combining the substrates 11 and 21, the degree of vacuum in the discharge space 26 is more reliably improved as compared with the conventional case where the discharge space is evacuated after combining the substrates. it can. Further, the time for the exhaust process can be reduced.

[0048]

Next, specific examples of the present invention will be described.

(Examples 1 and 2) A plasma display device was manufactured in the same manner as in the manufacturing method in the above embodiment. However, in Example 1, only the dielectric layer 14 of the first panel was fired, and in Example 2, only the dielectric layer 23 of the second panel was fired. The firing conditions were set at a firing temperature of 570 ° C. and a degree of vacuum of 1 × 10 ⁻² Pa.

Example 3 A plasma display device was manufactured in the same manner as in the manufacturing method in the above embodiment. However, only the dielectric layer 23 of the second panel was fired. FIG. 4 shows the temperature conditions at that time. The firing temperature was 450 ° C. and the degree of vacuum was 1 × 10 ⁻² Pa. Further, a part of the second panel was cut into a 10 mm square, and the amount of gas released from the sample was measured as ion current by a mass spectrometer. The measurement temperature range was from room temperature to 600 ° C., and the degree of vacuum at the time of measurement was 2 × 10 ⁻⁷ Pa.

(Comparative Example) A plasma display device was manufactured in the same manner as the manufacturing method in the above embodiment. However,
The firing of the dielectric layer 14 and the dielectric layer 23 was not performed. Further, a part of the second panel was cut into a 10 mm square, and the amount of gas released from the sample was measured as ion current by a mass spectrometer. The measurement temperature range at this time is from room temperature to 600 ° C., and the degree of vacuum at the time of measurement is 2
× 10 ⁻⁷ Pa.

In Examples 1 and 2, the dielectric layer 1
It was found that the crack source was reduced by firing and recrystallization of the dielectric layer 4 or the dielectric layer 23, and abnormal discharge during operation was reduced as compared with the comparative example. The discharge space 2
It was found that the gas purity in 6 was also improved as compared with the comparative example.

FIGS. 5 and 6 show the temperature dependence of the amount of gas released from the second panel in Example 3 and Comparative Example, respectively. Here, the mass number is 18, 44, 5 as the gas.
Four types of 5, 70 were detected, and in all cases, the release amount of Example 3 was generally smaller. In particular, a gas having a mass number of 55, 70 can be converted from room temperature to about
Almost no release was observed in the low temperature region of 50 ° C. or lower. The gas having a mass number of 18 contains water (H ₂ O), and the gas having a mass number of 44, 55, 70 is an organic gas containing carbon (C), hydrogen (H), and nitrogen (N). It is considered a compound. Therefore, when the dielectric layer is fired, the organic compounds contained in the dielectric layer are forcibly released from within the layer in advance,
The amount released into the device can be reduced.

As described above, the present invention has been described with reference to the embodiments and examples. However, the present invention is not limited to the above embodiments and examples, and can be variously modified. For example, in the above embodiments and examples, a typical surface discharge type plasma display device has been described.
It may be of a counter discharge type, or the partition wall 24 may have a cell shape instead of a stripe shape, regardless of the configuration, as long as it includes a dielectric layer.

In the above embodiments and examples, the firing of the dielectric layer 14 and the dielectric layer 23 is performed once, but the firing is not limited to this, and the firing may be repeated. Further, in the embodiment, the firing of the dielectric layer 14 and the dielectric layer 23 is performed immediately after the formation of each layer, or after the formation of the partition wall 24 or the phosphor 25 for the dielectric layer 23. In the present invention, it is sufficient that the dielectric is substantially fired. For example, the firing of the dielectric may be simultaneously performed in the other firing steps, and the order of the firing step of the dielectric and the other steps does not matter.

The temperature conditions for firing the dielectric layer 14 and the dielectric layer 23 are not limited to the trapezoidal heat pattern as shown in FIG. 4, but may be variously set by freely combining time and temperature. Is possible. Furthermore, the firing furnace is not limited to the continuous type as shown in FIG. 3, but may be a batch type furnace.

Further, in the above embodiment and examples,
Although the description has been given of the three-electrode surface discharge type plasma display device, the present invention is not limited to this. For example, the opposed discharge type or the two-electrode surface discharge type in which the sustain electrodes are provided on both the first panel 10 and the second panel 20. The present invention can be applied to a device provided with a dielectric layer among various types of AC driven plasma display devices.

[0058]

As described above, according to the AC-driven plasma display device of the present invention, since the dielectric layer is fired in a reduced pressure atmosphere, the dielectric layer has few defects. The flatness is high, cracks on the substrate surface facing the discharge space are reduced, and abnormal discharge is prevented. At the same time, impurities such as organic compounds contained in the dielectric layer are exhausted in advance, and the gas purity in the discharge space is maintained. Thus, the operation can be stabilized and the life of the device can be extended.

Further, according to the method of manufacturing an AC-driven plasma display device according to the present invention, after forming the dielectric layer, the method includes the step of firing the dielectric layer in a reduced pressure atmosphere. It is possible to form a dielectric layer with little flatness and to reduce cracks on the substrate surface and prevent abnormal discharge. At the same time, since impurities such as organic compounds contained in the dielectric layer are discharged in advance by firing, the gas purity in the discharge space is maintained. Accordingly, a plasma display device that can be driven stably and has a long life can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a schematic configuration of a plasma display device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the plasma display device shown in FIG. 1 taken along line II.

FIG. 3 is a cross-sectional view of a firing furnace used for firing a dielectric layer of the plasma display device shown in FIG.

FIG. 4 is a diagram showing a heat pattern in firing a dielectric layer of Example 3.

FIG. 5 is a diagram illustrating a measurement result of an impurity gas amount by a mass spectrometer in Example 3.

FIG. 6 is a diagram illustrating a measurement result of an impurity gas amount by a mass spectrometer in a comparative example.

[Explanation of symbols]

10: first panel, 11: front glass substrate, 12 (12
a, 12b) ... sustain electrode, 13 (13a, 13b) ... bus electrode, 14 ... dielectric layer, 15 ... protective layer, 20 ... second panel, 21 ... rear glass substrate, 22 ... address electrode, 2
DESCRIPTION OF SYMBOLS 3 ... Dielectric layer, 24 ... Partition, 25 ... Phosphor, 26 ... Discharge space, 30 ... Baking furnace, 31a, 31b ... Shut-off door, 32 ...
Partition wall, 33: heater, 34: muffle, 35: hearth roller, 36: exhaust port, 37: gas supply port

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] December 19, 2000 (200.12.
19)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0053

[Correction method] Change

[Correction contents]

FIGS. 5 and 6 show the temperature dependence of the amount of gas released from the second panel in Example 3 and Comparative Example, respectively. Here, the mass number is 18, 44, 5 as the gas.
Four types of 5, 70 were detected, and in all cases, the release amount of Example 3 was generally smaller. In particular, a gas having a mass number of 55, 70 can be converted from room temperature to about
Almost no release was observed in the low temperature region of 50 ° C. or lower. The gas having a mass number of 18 contains water (H ₂ O), and the gas having a mass number of 44, 55, 70 is an organic gas containing carbon (C), hydrogen (H), and oxygen (O). It is considered a compound. Therefore, when the dielectric layer is fired, the organic compounds contained in the dielectric layer are forcibly released from within the layer in advance,
The amount released into the device can be reduced.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroshi Mori 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Hajime Inoue 6-35 Kita Shinagawa, Shinagawa-ku, Tokyo 6-35 Sony Corporation F term (reference) 5C027 AA05 5C040 FA01 GB03 GB14 GD09 JA21 MA10 5C094 AA31 AA43 BA12 BA31 CA19 CA24 DA12 DA13 DB01 EA04 EA05 EA10 EB02 EC04 FA02 FB02 FB15 GA10 GB10 JA20

Claims (9)

[Claims] 1. A plasma display device comprising a dielectric layer provided on at least one of a first substrate and a second substrate disposed opposite to each other, wherein the dielectric layer is fired in a reduced-pressure atmosphere. An AC-driven plasma display device characterized in that: 2. The dielectric layer according to claim 1, wherein the dielectric layer is fired in a reduced pressure atmosphere of 1 × 10 ⁻¹ Pa or less at a temperature in a range of 350 ° C. to 650 ° C. AC driven plasma display device. 3. A discharge sustaining electrode is provided on the first substrate on a surface facing the second substrate, and the dielectric layer is provided on the discharge sustaining electrode. An AC-driven plasma display device according to claim 1. 4. An address electrode is provided on the second substrate on a surface facing the first substrate, and the dielectric layer is provided on the address electrode. 2. The AC-driven plasma display device according to 1. 5. A method of manufacturing an AC-driven plasma display device, comprising a dielectric layer on at least one of a first substrate and a second substrate disposed opposite to each other, wherein a dielectric is provided on the substrate. A method for manufacturing an AC-driven plasma display device, comprising a step of firing the dielectric layer in a reduced-pressure atmosphere after forming a layer. 6. The method according to claim 5, wherein the firing of the dielectric layer is performed in a reduced pressure atmosphere of 1 × 10 ⁻¹ Pa or less. 7. The sintering of the dielectric layer is performed at 350 ° C. or higher and 65 ° C.
6. The method for manufacturing an AC driven plasma display device according to claim 5, wherein the method is performed at a temperature within a range of 0 ° C. or less. 8. The AC-driven plasma display device according to claim 5, wherein said dielectric layer is provided on a sustaining electrode provided on said first substrate. Production method. 9. The manufacturing method of an AC-driven plasma display device according to claim 5, wherein said dielectric layer is provided on an address electrode provided on said second substrate. Method.