JP2002090314A - Defective position indicating method for substrate material, defective position marking device, mark detector, and substrate material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the operator's work load in an inspection and correction process, to eliminate errors in work and to secure high accuracy in indicating defective position. SOLUTION: This defective position indicating method has a defect detecting process or detecting a defect on the surface of a substrate material and outputting the defective position, a marking process for inputting the defective position and putting each of a pair of marks indicating the defective position, at each of two unparallel sides of the substrate material, and a mark detecting process for detecting the mark at each side of the substrate material to output the defective position. A defective position marking device, a mark detector and the substrate material are also provided applying the method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention belongs to the technical field of detecting and repairing defects in a substrate material. In particular, the present invention relates to a technique for achieving high-accuracy and high-accuracy transmission of defect position information between a substrate material inspection apparatus and a defect repair apparatus for a substrate material.

[0002]

2. Description of the Related Art In an inspection process, detected defect position coordinate data of a substrate material is recorded on paper or stored in a memory of a server as online data. In the correction step, defect position coordinate data corresponding to the substrate material to be corrected is retrieved from a plurality of papers on which defect position coordinates are recorded or a plurality of online data stored in a memory. Then, the searched defect position coordinate data is set in the control unit of the correction device. Thereby, the repair apparatus can recognize the defect position to be repaired in the substrate material.

[0003]

However, the work of setting the defect position coordinate data recorded on the paper in the control unit of the correction device requires manual input, so that the work load is large, and errors in the work are completely eliminated. Can not do. The paper on which the defect position coordinate data is recorded may be lost. Even in online data, since data is manually registered, searched, updated, and the like, it is not possible to completely eliminate errors such as mistaking or erasing data.

In addition, since the measuring device for the defect position coordinates in the inspection process and the indicating device for indicating the defect position in the repairing process are separate devices, there is an error between the devices, and it is necessary to obtain a high accuracy for the defect position. Can not. In addition, if there is a temperature difference between the inspection step and the repair step, the substrate material expands and contracts, and it is not possible to obtain a high accuracy for the defect position.

The present invention has been made to solve the above problems. SUMMARY OF THE INVENTION It is an object of the present invention to reduce the workload of an operator in an inspection process and a repair process, eliminate errors in the operation, and obtain high accuracy in defect positions. An object of the present invention is to provide a method for indicating a defect position of a substrate material, a defect position marking device, a mark detection device, and a substrate material.

[0006]

The above object is achieved by the present invention described below. That is, a defect position indicating method according to claim 1 of the present invention includes a defect detecting step of detecting a defect on a surface of a substrate material and outputting a defect position, and a pair of inputting the defect position and displaying the defect position. And a mark detecting step of detecting a mark on each side of the substrate material and outputting a defect position, and a marking step of attaching each of the marks to each of two non-parallel sides of the substrate material. It is.

According to the present invention, a defect on the surface of the substrate material is detected in the defect detection step and a defect position is output, and each of a pair of marks indicating the defect position is not parallel to the substrate material in the marking step. The mark is applied to each of the two sides, and in the mark detection process, a mark on each side of the substrate material is detected, and a defect position is output. That is, the defect position coordinate data is directly recorded as a mark on the side of the substrate, and the mark is detected to reproduce the defect position coordinate data. Therefore, the inspection process,
The work load of the operator in the repair process is reduced, errors in the work are eliminated, and high accuracy is obtained for the defect position.

According to a second aspect of the present invention, there is provided the defect position indicating method according to the first aspect, wherein the output of the defect position is such that a defect detector for detecting the defect detects the trueness of the defect in the substrate material. The input of the defect position is performed by detecting the position of the defect detector by a zero position method by moving a sensor integrated with a marker for marking. According to the present invention, many mechanical errors and errors in distance measurement can be eliminated, and extremely high accuracy can be obtained for defect positions.

According to a third aspect of the present invention, there is provided the defect position indicating method according to the first or second aspect, wherein a plurality of the pair of marks exist on the same substrate material corresponding to a plurality of defects. The mark is a mark in a form in which the correspondence between a pair in the presence of a plurality of marks can be specified. According to the present invention, the position coordinate data corresponding to each of the plurality of defects is directly recorded as a mark on the side of the substrate, and the mark is detected to reproduce the defect position coordinate data corresponding to each of the plurality of defects. .

According to a fourth aspect of the present invention, there is provided a defect position marking device for detecting a defect on a surface of a substrate material and outputting a defect position, and inputting the defect position and displaying the defect position. Marking means for applying each of a pair of marks to each of two non-parallel sides of the substrate material. That is, according to the present invention, the defect position coordinate data is directly recorded as a mark on the side of the substrate. Therefore, the workload of the operator in the inspection process and the repair process is reduced, errors in the work are eliminated, and high recording accuracy is obtained for the defect position.

According to a fifth aspect of the present invention, there is provided a mark detecting apparatus, wherein a pair of marks indicating a defect position on a surface is provided on each of two non-parallel sides of the pair of marks. Is detected and the defect position is output. That is, according to the present invention, the mark directly recorded on the side of the substrate is detected, and the defect position coordinate data is reproduced. Therefore, the inspection process,
The work load on the operator in the repairing process is reduced, errors in the work are eliminated, and high reproducibility of the defect position is obtained.

Further, the substrate material according to claim 6 of the present invention is:
A substrate material having two sides that are not parallel to each other, and having a pair of marks indicating a defect position attached to each of the sides. That is, according to the present invention,
Defect positions are indicated by marks recorded directly on the side of the substrate. Therefore, high accuracy can be obtained for the defect position.

[0013]

Next, an embodiment of the present invention will be described. An example of the configuration of the defect position marking device according to the present invention is schematically shown in FIG. In FIG. 1, 10 is an X-axis moving means, 11a and 11b are sensors, 12 is a writer, 20 is a Y-axis moving means, 21a and 21
b is a sensor, 22 is a writer, 30 is XY moving means, 31
Is a defect detector, 50 is a defect, and 100 is a substrate material.
Although not shown in FIG. 1, there is a frame of the defect position marking device, and each of the above-mentioned moving means is movably supported by the frame.

There is a stage supported by the frame. Further, the substrate material 100 is supported on the stage. At that stage, substrate material 1
The substrate material 100 is positioned by, for example, contacting two non-parallel sides of 00 with the contact member. Due to the positioning, one side of the substrate material 100 is parallel to the X-axis direction of the stage, and the other side is Y side of the stage.
Parallel to the axial direction. The stage is generally X-axis and Y
It has a rectangular shape with sides in the axial direction (perpendicular), but may have another shape.

The X-axis moving means 10 is a means for stopping the movement of the stage at an arbitrary position in the X-axis direction. That is, the devices and the like installed on the X-axis moving unit 10 stop moving together with the X-axis moving unit 10 to an arbitrary position in the X-axis direction of the stage. As shown in FIG.
The X-axis moving means 10 has an arm extending from one end of the stage to the other end above the stage. The sensor 11a is provided above the outside of the substrate material 100 at the end of the arm, and the sensor 11b is provided above the outside of the substrate material 100 at the original portion of the arm. Writer 12
Is provided at an outer position facing the side of the substrate material 100 at the original portion of the arm.

The sensors 11a and 11b are connected to the X-axis moving means 1.
This is a sensor for detecting whether or not the position on the X-axis of 0 coincides with the position of the defect detector 31 on the X-axis.
As the sensors 11a and 11b, it is possible to use a light emitting / receiving separated type optical sensor in which one is a light emitting unit and the other is a light receiving unit. When the defect detector 31 blocks the optical paths of the sensors 11a and 11b, the position of the X-axis moving means 10 on the X-axis matches the position of the defect detector 31 on the X-axis. If the defect detector 31 does not block the optical paths of the sensors 11a and 11b,
The position of the X-axis moving means 10 on the X-axis does not match the position of the defect detector 31 on the X-axis.

If the width of the optical path having sensitivity in the optical path of the sensors 11a and 11b, that is, the width of the optical path blocked by the defect detector 31 is larger than the substantial optical path width, the light is completely blocked. In this case, an error occurs in the position matching in a completely occluded range. On the other hand, when the width of the optical path blocked by the defect detector 31 is small, the light is not completely blocked. In this case, since the sensor has high sensitivity at the center of the optical path, high accuracy can be obtained by determining the coincidence of positions based on the minimum value of the light to be detected, that is, the maximum value of the amount of blocking.

Further, if the position coincidence is determined by the difference output of a pair of adjacent sensors becoming zero instead of detecting the minimum value of the light to be detected, high accuracy can be obtained. These methods are a kind of the zero rank method. The present invention is not limited to this example, and the zero-point method can be applied to the detection of position coincidence.

The writer 12 is a writer for marking a side of the substrate material 100 parallel to the X-axis direction. As the writer 12, a writer of an ink jet system, a laser system, or the like can be used. In the present invention, any type of marking may be used, and the present invention is not limited thereto.

Y-axis moving means 20, sensors 21a, 21
b, for the writer 22, the moving direction is Y from the X-axis direction.
Axial direction, and although there are differences related to the configuration,
The operation is basically the same as described above. In the above, X
Axis moving means 10 → Y-axis moving means 20, sensors 11a, 1
1b → sensors 21a and 21b, writer 12 → writer 2
2, X → Y, etc. need only be replaced.

The XY-axis moving means 30 moves the defect detector 31 at an arbitrary position in the X-axis direction and the Y-axis direction of the stage.
Means for stopping the movement. That is, the defect detector 31 can inspect the presence or absence of a defect at an arbitrary position on the surface of the substrate 100 on the stage.
In order to inspect the entire surface of the substrate 100 with the defect detector 31, the XY-axis moving means 30 moves the defect detector 31 to scan the entire surface of the substrate 100. When a defect is detected, the defect detector 31 stops at that location.

The defect detector 31 is, for example, a line sensor camera having a one-dimensional linear imaging region, an area sensor camera having a two-dimensional planar imaging region, or the like.
In the present invention, the type of the defect detector 31 may be any, and is not limited thereto. This will be described as an example for easy understanding. When a captured image of the surface of the substrate 100 is obtained by the defect detector 31, a process of extracting a defect from the captured image is performed. There are methods for extracting a defect, such as extracting as a difference from a reference image and extracting as a disorder of a periodic image. This processing is performed using a data processing device (not shown) such as a personal computer, an image processing system, or the like.

Next, the operation of the above-described defect position marking device will be described. FIG. 2 is a schematic diagram showing a flow of the operation in the defect position marking device. FIG. 2 shows only the X-axis moving means 10. First, the defect detector 31 captures an image of a defect on the surface of the substrate material 100, inputs the captured image, the data processing device extracts the defect, and outputs a defect detection. Enter it and X
The Y-axis moving means 30 stops the defect detector 31 immediately above the portion of the substrate material 100 where the defect exists (FIG. 2).
).

Next, the X-axis moving means 10 moves, and
It stops at the position where the defect detector 31 blocks the optical path of the sensors 11a and 11b provided in the axis moving means 10. At this time,
The position of the X-axis moving means 10 on the X-axis matches the position of the defect detector 31 on the X-axis (FIG. 2). Next, the writer 12 provided on the X-axis moving means 10
0 is marked on the side parallel to the X-axis direction (see FIG. 2).
).

Similarly, the Y-axis moving means 20 also moves,
It stops at a position where the optical path of the sensors 21a and 21b provided in the Y-axis moving means 20 is blocked by the defect detector 31. At this time, the position of the Y-axis moving means 20 on the Y-axis and the defect detector 3
1 coincides with the position on the Y-axis. Next, the writer 22 provided on the Y-axis moving means 20
Marking is performed on the side parallel to the axial direction (FIG. 2).
Either the operation of the X-axis moving means 10 or the operation of the Y-axis moving means 20 described above may be performed first, or they may be performed simultaneously.

FIG. 3 shows an example of the substrate material 100 on which marking has been performed as described above. In FIG.
50 is a defect, 100 is a substrate material, 110 is an X side, 11
1 is an X coordinate mark, 120 is a Y side, and 121 is a Y coordinate mark. As shown in FIG. 3, a defect 50 exists in the substrate material 100. The value of the X coordinate of the defect 50 is marked on the X side surface 110 of the substrate material 100 as an X coordinate mark 111. The value of the Y coordinate of the defect 50 is marked on the Y side surface 120 of the substrate material 100 as a Y coordinate mark 121.

The X coordinate mark 111 and the Y coordinate mark 121 shown in FIG. 3 are line segments in the thickness direction (Z axis direction) of the substrate material 100. When only one defect 50 is present in the substrate material 100, a mark having only this line segment may be used. However, when a plurality of defects are present, the X coordinate mark and the Y coordinate are used.
The correspondence relationship with the coordinate marks becomes unclear. Another example of the mark added to the substrate material is shown in FIG. The mark shown in FIG. 5 is the tip of an arrow in the thickness direction (Z-axis direction) of the substrate material 100, that is, a triangle “▲”. Furthermore, as a symbol for specifying the mark just below the triangle "▲",
In FIG. 5, numbers are given. With this number,
The correspondence between the X coordinate mark and the Y coordinate mark becomes clear.

In the above description, the X side surface 110 and the Y side surface 120 of the substrate material 100 are marked. However, when there is a margin near the side of the substrate material 100 where there is no problem in marking as a product. In this case, the portion to be marked may be any of the upper surface, the lower surface, and the side surface near the side.

Next, the mark detecting device according to the present invention will be described. A mark detection device is a device that detects a mark attached to a substrate material and outputs a defect position. The mark is a pair of marks indicating a defect position on the surface of the substrate material, and is a mark provided on each of two non-parallel sides of the substrate material. This mark detection device is a device used in a defect correction process. For example,
It is used by being incorporated into a device for correcting a defect in a substrate material.

When incorporated in a defect correction device, the mark detection device of the present invention can have a configuration similar to the above-described configuration example of the defect position marking device shown in FIG. That is, the defect detector 31 in the defect position marking device shown in FIG. 1 can be replaced with a defect corrector, and the writers 12, 22 can be replaced with readers. FIG. 4 is a schematic diagram showing a flow of the operation in the mark detection device. FIG. 4 is a diagram of a defect correction device corresponding to FIG. 2 described above, which is a diagram of a defect position marking device. In FIG. 4, 50 is a defect, 60 is an X-axis moving means,
61a and 61b are sensors, 62 is a reader, 81 is a defect corrector, and 100 is a substrate material. Although there is a Y-axis moving means, only the X-axis moving means 60 is shown in FIG.

First, the X axis moving means 60 moves.
The reader 62 provided in the X-axis moving means 60 detects a mark attached to a side parallel to the X-axis direction of the substrate material 100, and outputs a mark detection. As the reader 62,
For example, an area sensor camera and a data processing device can be used. Data processing is performed based on the image captured by the area sensor camera, and mark position data and symbol determination data for specifying a pair of marks are output.
By inputting this, the X-axis moving means 60 stops at a position directly facing the position indicated by the mark on the side surface (X side surface) of the substrate material 100 where the mark exists (FIG. 2).

Similarly, the Y-axis moving means moves, and the reader provided on the Y-axis moving means corresponds to the mark at the position where the X-axis moving means 60 has stopped, ie, the mark whose symbol discrimination data matches. And outputs the mark detection. Upon input of the mark, the Y-axis moving means stops at a position directly opposite to the position indicated by the mark on the side surface (Y side surface) of the substrate material 100 where the mark exists (FIG. 4).
).

Next, the XY moving means sets the defect corrector 81 to X
Move in the axial direction. Sensor 6 provided on X-axis moving means
When the defect correcting device 81 provided in the XY moving means interrupts the optical paths of 1a and 61b, sensors 61a and 6
The XY moving means inputs the output of 1b. The XY moving means connects the optical paths of the sensors 61a and 61b to the defect corrector 81.
Stop at the position where it blocks. At this time, the position of the X-axis moving means 60 on the X-axis, that is, the position indicated by the mark, matches the position of the defect corrector 81 on the X-axis.

Similarly, the XY moving means moves the defect corrector 81 in the Y-axis direction. When the defect corrector 81 provided in the XY moving means interrupts the optical path of the sensor provided in the Y-axis moving means, the XY moving means inputs the output of the sensor indicating that. Then, the XY moving unit stops at a position where the optical path of the sensor is blocked by the defect corrector 81. At this time, the position on the Y axis of the Y axis moving means, that is, the position indicated by the mark, matches the position of the defect corrector 81 on the Y axis (FIG. 4).

In this way, the defect corrector 81 stops just above the defect 50 on the surface of the substrate material 100 by the processes of FIG. In addition, the moving operation in the X-axis direction and the moving operation in the Y-axis direction in the above-described XY moving means are as follows.
Either one may operate first, or they may proceed simultaneously.

The present invention has been described above.
No specific mention was made of the substrate material. Although the present invention is not limited by the substrate material, the substrate material to which the present invention can be applied includes a printed circuit board,
Photomask, back panel of plasma display panel,
Examples include a color filter and a shadow mask of a liquid crystal display.

[0037]

As described above, according to the defect position indicating method according to the first aspect of the present invention, the work load of the operator in the inspection step and the correction step is reduced, errors in the operation are eliminated, and the defect is further reduced. High pointing accuracy can be obtained for the position. Further, according to the defect position indicating method according to the second aspect of the present invention, extremely high accuracy can be obtained for the defect position. According to the defect position indicating method according to the third aspect of the present invention, position coordinate data corresponding to each of the plurality of defects can be directly recorded as a mark on the side of the substrate. Defect position coordinate data corresponding to each of the defects can be reproduced. Further, according to the defect position marking apparatus according to the fourth aspect of the present invention, it is possible to reduce the workload of the operator in the inspection step and the correction step, eliminate errors in the operation, and obtain high recording accuracy for the defect position. According to the mark detection device of the fifth aspect of the present invention, the inspection step,
It is possible to reduce the work load of the operator in the repair process, eliminate errors in the work, and obtain high reproducibility of the defect position. Further, according to the substrate material of claim 6 of the present invention, it is possible to obtain high pointing accuracy of the defect position.

[Brief description of the drawings]

FIG. 1 is a diagram schematically illustrating an example of a configuration of a defect position marking device according to the present invention.

FIG. 2 is a schematic diagram showing a flow of an operation in the defect position marking device of the present invention.

FIG. 3 is a diagram illustrating an example of a substrate material on which marking is performed.

FIG. 4 is a diagram schematically showing a flow of an operation in the mark detection device of the present invention.

FIG. 5 is a diagram illustrating an example of a mark added to a substrate material.

[Explanation of symbols]

10, 60 X-axis moving means 11a, 11b, 21a, 21b, 61a, 61b Sensor 12, 22 Writer 20 Y-axis moving means 30 XY moving means 31 Defect detector 50 Defect 81 Defect correction device 100 Substrate material 110 X side surface 111 X Coordinate mark 120 Y side 121 Y coordinate mark

Claims (6)

[Claims] 1. A defect detecting step of detecting a defect on a surface of a substrate material and outputting a defect position, and inputting the defect position and setting a pair of marks indicating the defect position to be parallel to the substrate material. A method for indicating a defect position of a substrate material, comprising: a marking step for each of two sides; and a mark detection step for detecting a mark on each side of the substrate material and outputting a defect position. 2. The defect position indicating method according to claim 1, wherein the output of the defect position is performed by stopping a defect detector for detecting the defect just above the defect in the substrate material. A defect position indicating method, wherein the input is performed by detecting the position of the defect detector by a zero position method by moving a sensor integrated with a marker to be marked. 3. The defect position indicating method according to claim 1, wherein a plurality of said pair of marks are present on a same substrate material corresponding to a plurality of defects, and said pair of marks is a pair in the presence of a plurality of marks. A defect position indicating method, characterized in that the mark is in a form in which a correspondence between the marks can be specified. 4. A defect detecting means for detecting a defect on the surface of the substrate material and outputting a defect position, and inputting the defect position and setting a pair of marks for displaying the defect position to be parallel to the substrate material. A marking device for marking a defect position on a substrate material, comprising: marking means attached to each of two sides. 5. In a substrate material provided on each of two sides on which a pair of marks indicating a defect position on a surface are not parallel to each other, a mark on each side is detected and a defect position is output. Mark detection device. 6. A substrate material having two non-parallel sides, wherein the substrate material has a pair of marks indicating a defect position attached to each of the sides.