JP2002088136A5 - - Google Patents

Download PDF

Info

Publication number
JP2002088136A5
JP2002088136A5 JP2000277236A JP2000277236A JP2002088136A5 JP 2002088136 A5 JP2002088136 A5 JP 2002088136A5 JP 2000277236 A JP2000277236 A JP 2000277236A JP 2000277236 A JP2000277236 A JP 2000277236A JP 2002088136 A5 JP2002088136 A5 JP 2002088136A5
Authority
JP
Japan
Prior art keywords
parts
weight
general formula
represented
alkali
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000277236A
Other languages
Japanese (ja)
Other versions
JP2002088136A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2000277236A priority Critical patent/JP2002088136A/en
Priority claimed from JP2000277236A external-priority patent/JP2002088136A/en
Publication of JP2002088136A publication Critical patent/JP2002088136A/en
Publication of JP2002088136A5 publication Critical patent/JP2002088136A5/ja
Pending legal-status Critical Current

Links

Description

【特許請求の範囲】
【請求項1】 一般式(I)で示される光重合性不飽和樹脂:
【化1】

Figure 2002088136
ここで、Xは一般式(Ia)で示される単位であり、
【化2】
Figure 2002088136
Rは水素原子またはC1〜5の直鎖または分岐アルキル基、Yは酸無水物の残基、Zは酸二無水物の残基であり、そしてnは0から20までの整数を示す。
【請求項2】 請求項1の一般式(I)で表される光重合性不飽和樹脂の製造方法であって、
次の一般式(II)で示されるビスフェニルフェノールフルオレン型エポキシ化合物にアクリル酸を反応させて、
【化3】
Figure 2002088136
Rは水素原子またはC1〜5の直鎖または分岐アルキル基である)、一般式(III)で示されるビスフェニルフェノールフルオレン型エポキシアクリレート化合物を得る工程:
【化4】
Figure 2002088136
Rは水素原子またはC1〜5の直鎖または分岐アルキル基である);
該ビスフェニルフェノールフルオレン型エポキシアクリレート化合物に、一般式(IV)で示されるテトラカルボン酸二無水物を反応させる工程:
【化5】
Figure 2002088136
(ここで、Zはテトラカルボン酸二無水物の残基である);および
一般式(V)で示されるジカルボン酸無水物を反応させる工程:
【化6】
Figure 2002088136
(ここで、Yはジカルボン酸無水物の残基である)
を包含する方法。
【請求項3】 請求項1の一般式(I)で表される光重合性不飽和樹脂を含有する感光性樹脂組成物。
【請求項4】 (A)請求項1の一般式(I)で表される光重合性不飽和樹脂、
(B)エポキシ基を有する化合物、
(C)光重合開始剤、および
(D)顔料、
を含有するアルカリ可溶型感光性着色樹脂組成物。
【請求項5】 前記光重合性不飽和樹脂(I)100重量部に対して、前記エポキシ基を有する化合物、光重合開始剤、および顔料がそれぞれ5〜50重量部、0.1〜30重量部、および10〜200重量部の割合で含有される、請求項4に記載のアルカリ可溶型感光性着色樹脂組成
【請求項6】 さらに光重合性のモノマーおよびオリゴマーでなる群から選択される少なくとも1種を、光重合性不飽和樹脂(I)100重量部に対して、50重量部以下の範囲で含有する、請求項5に記載のアルカリ可溶型感光性着色樹脂組成物。
【請求項7】 基板上に着色層がパターン形成されているカラーフィルターであって、該着色層が、請求項4から6のいずれかに記載のアルカリ可溶型感光性着色樹脂組成物を光硬化させて得られる着色層である、カラーフィルター。
【請求項8】 請求項4から6のいずれかに記載のアルカリ可溶型感光性着色樹脂組成物を基板上に塗布し感光性の着色層を形成する工程、
該着色層をパターン露光し、露光部分の感光性着色樹脂組成物を光硬化させる工程、および
該パターン露光した着色層を現像して未露光部分の着色層を除去し、該光硬化した着色層を基板上にパターンとして残す工程、を包含する、
カラーフィルターの製造方法。
【請求項9】 希アルカリ水溶液により現像を行なう、請求項8に記載の製造方法。 [Claims]
1. A photopolymerizable unsaturated resin represented by the general formula (I):
Embedded image
Figure 2002088136
Here, X is a unit represented by the general formula (Ia),
Embedded image
Figure 2002088136
R is a hydrogen atom or a C1-5 linear or branched alkyl group, Y is a residue of an acid anhydride, Z is a residue of an acid dianhydride, and n is an integer from 0 to 20.
2. A method for producing a photopolymerizable unsaturated resin represented by the general formula (I) according to claim 1, wherein
By reacting acrylic acid with a bisphenylphenol fluorene type epoxy compound represented by the following general formula (II),
Embedded image
Figure 2002088136
R is a hydrogen atom or a C1-5 linear or branched alkyl group), and a step of obtaining a bisphenylphenol fluorene type epoxy acrylate compound represented by the general formula (III):
Embedded image
Figure 2002088136
R is a hydrogen atom or a C1-5 linear or branched alkyl group);
A step of reacting the bisphenylphenol fluorene type epoxy acrylate compound with a tetracarboxylic dianhydride represented by the general formula (IV):
Embedded image
Figure 2002088136
(Where Z is a residue of a tetracarboxylic dianhydride); and a step of reacting a dicarboxylic anhydride represented by the general formula (V):
Embedded image
Figure 2002088136
(Where Y is the residue of a dicarboxylic anhydride)
A method comprising:
3. A photosensitive resin composition containing the photopolymerizable unsaturated resin represented by the general formula (I) according to claim 1.
(A) a photopolymerizable unsaturated resin represented by the general formula (I) of claim 1,
(B) a compound having an epoxy group,
(C) a photopolymerization initiator, and (D) a pigment,
An alkali-soluble photosensitive colored resin composition containing:
5. The compound having an epoxy group, the photopolymerization initiator and the pigment are each 5 to 50 parts by weight, 0.1 to 30 parts by weight, based on 100 parts by weight of the photopolymerizable unsaturated resin (I). parts and 10 to 200 are contained in a proportion of parts, the alkali-soluble photosensitive colored resin composition of claim 4.
6. The photopolymerizable unsaturated resin (I) further contains at least one selected from the group consisting of photopolymerizable monomers and oligomers in a range of 50 parts by weight or less based on 100 parts by weight of the photopolymerizable unsaturated resin (I). The alkali-soluble photosensitive colored resin composition according to claim 5.
7. A color filter in which a colored layer is formed in a pattern on a substrate, wherein the colored layer is formed by applying the alkali-soluble photosensitive colored resin composition according to claim 4 to light. A color filter, which is a colored layer obtained by curing.
8. A step of applying the alkali-soluble photosensitive colored resin composition according to any one of claims 4 to 6 on a substrate to form a photosensitive colored layer;
Pattern exposure of the colored layer, photo-curing of the photosensitive colored resin composition in the exposed portion, and developing the pattern-exposed colored layer to remove the unexposed portion of the colored layer, the photo-cured colored layer Leaving a pattern on the substrate,
Manufacturing method of color filter.
9. The production method according to claim 8, wherein development is performed using a dilute aqueous alkaline solution.

さらに、この光重合性不飽和樹脂をベースとし、これにエポキシ化合物と、光重合開始剤と、顔料とを含む組成物を用いることにより、解像度の高く、かつ光照射後の耐熱性、透明性、密着性、硬度、耐溶剤性、耐アルカリ性に優れたカラーフィルターが得られることを見出し、本発明を完成するに至った。 Furthermore, by using a composition containing an epoxy compound, a photopolymerization initiator, and a pigment based on the photopolymerizable unsaturated resin , high resolution, heat resistance after light irradiation, and transparency are obtained. It has been found that a color filter having excellent adhesion, hardness, solvent resistance and alkali resistance can be obtained, and the present invention has been completed.

好適な実施態様においては、上記アルカリ可溶型感光性着色樹脂組成物においては、光重合性不飽和樹脂(I)100重量部に対して、上記エポキシ基を有する化合物、光重合開始剤、および顔料がそれぞれ5〜50重量部、0.1〜30重量部、および10〜200重量部の割合で含有される。 In a preferred embodiment, in the alkali-soluble photosensitive colored resin composition, the compound having an epoxy group, a photopolymerization initiator, and 100 parts by weight of the photopolymerizable unsaturated resin (I). The pigments are contained in proportions of 5 to 50 parts by weight, 0.1 to 30 parts by weight, and 10 to 200 parts by weight, respectively.

さらに好適な実施態様においては、上記アルカリ可溶型感光性着色樹脂組成物においては、上記各成分に加えて光重合性のモノマーおよびオリゴマーでなる群から選択される少なくとも1種が、光重合性不飽和樹脂(I)100重量部に対して、50重量部以下の範囲で含有される。 In a further preferred embodiment, in the alkali-soluble photosensitive colored resin composition, at least one selected from the group consisting of a photopolymerizable monomer and an oligomer in addition to the above-mentioned components includes a photopolymerizable monomer and an oligomer. It is contained in an amount of 50 parts by weight or less based on 100 parts by weight of the unsaturated resin (I).

本発明の組成物は、好適にはアルカリ可溶型感光性着色樹脂組成物であり、(A)光重合性不飽和樹脂(I)、(B)エポキシ基を有する化合物、(C)光重合開始剤、および(D)顔料を含有する(以下、これらをA〜D成分と言う場合がある)。 The composition of the present invention is preferably an alkali-soluble photosensitive colored resin composition, wherein (A) a photopolymerizable unsaturated resin (I), (B) a compound having an epoxy group, and (C) photopolymerization. It contains an initiator and a pigment (D) (hereinafter, these may be referred to as AD components).

この混合液は白濁していたがそのまま徐々に昇温し、120℃に加熱することにより完全に内容物が溶解した溶液が得られた。これは次第に透明で粘性のある溶液になったがそのまま攪拌を続け、経時的に酸価の測定を行なった。酸価が2.0mgKOH/g未満になるまで加熱攪拌を継続した。酸価が目標に達するまで12時間を要した。その後、室温まで冷却し、主成分が式(VI)で表されるビスフェノールフルオレン型エポキシアクリレート樹脂の無色透明なPGMEA溶液を得た。 Although this mixture was cloudy, the temperature was gradually raised as it was and heated to 120 ° C. to obtain a solution in which the contents were completely dissolved. This gradually became a transparent and viscous solution, but stirring was continued as it was, and the acid value was measured over time. Heating and stirring were continued until the acid value was less than 2.0 mgKOH / g. It took 12 hours for the acid value to reach the target. Thereafter, the mixture was cooled to room temperature to obtain a colorless and transparent PGMEA solution of a bisphenolfluorene-type epoxy acrylate resin whose main component is represented by the formula (VI).

このようにして得られたビスフェノールフルオレン型エポキシアクリレート樹脂303gに、プロピレングリコールモノメチルエーテルアセテート600gを加えて溶解させた。これにベンゾフェノンテトラカルボン酸二無水物80.5gおよび臭化テトラエチルアンモニウム1gを加えて混合し、徐々に昇温して110〜115℃で4時間反応させた。酸無水物基の消失を確認した後、1,2,3,6−テトラヒドロ無水フタル酸38.0gを加えて混合し、90℃で6時間反応させ、一般式(IX)で示される樹脂(Y/Z=50/50(モル比))。酸無水物の消失は、IRスペクトルより確認した。 The thus obtained bisphenol fluorene type epoxy acrylate resins 3 03G, was dissolved by adding propylene glycol monomethyl ether acetate 600 g. To this, 80.5 g of benzophenonetetracarboxylic dianhydride and 1 g of tetraethylammonium bromide were added and mixed, and the mixture was gradually heated and reacted at 110 to 115 ° C for 4 hours. After confirming the disappearance of the acid anhydride group, 38.0 g of 1,2,3,6-tetrahydrophthalic anhydride was added, mixed and reacted at 90 ° C. for 6 hours to obtain a resin represented by the general formula (IX) ( Y 2 / Z 2 = 50/ 50 ( molar ratio)). The disappearance of the acid anhydride was confirmed from the IR spectrum.

Figure 2002088136
Figure 2002088136

得られたカラーフィルター用インクおよびカラーフィルターの性能を以下の方法で評価した。評価結果を表2に示す。後述の比較例の結果も併せて表2に示す。 The performance of the obtained color filter ink and color filter was evaluated by the following method. Table 2 shows the evaluation results. Table 2 also shows the results of Comparative Example 2 described below.

JP2000277236A 2000-09-12 2000-09-12 Photopolymerizable unsaturated resin and photosensitive resin composition containing the resin Pending JP2002088136A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000277236A JP2002088136A (en) 2000-09-12 2000-09-12 Photopolymerizable unsaturated resin and photosensitive resin composition containing the resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000277236A JP2002088136A (en) 2000-09-12 2000-09-12 Photopolymerizable unsaturated resin and photosensitive resin composition containing the resin

Publications (2)

Publication Number Publication Date
JP2002088136A JP2002088136A (en) 2002-03-27
JP2002088136A5 true JP2002088136A5 (en) 2007-08-16

Family

ID=18762596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000277236A Pending JP2002088136A (en) 2000-09-12 2000-09-12 Photopolymerizable unsaturated resin and photosensitive resin composition containing the resin

Country Status (1)

Country Link
JP (1) JP2002088136A (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002145999A (en) * 2000-11-15 2002-05-22 Nagase Kasei Kogyo Kk Photopolymerizable unsaturated resin and photosensitive resin composition containing the resin
JP2004069754A (en) * 2002-08-01 2004-03-04 Tokyo Ohka Kogyo Co Ltd Photopolymerizable black composition and black pattern forming method
JP4484479B2 (en) * 2002-09-27 2010-06-16 大阪瓦斯株式会社 Fluorene derivatives and photoactive compounds
JP4311102B2 (en) * 2003-07-17 2009-08-12 住友化学株式会社 Radiation sensitive resin composition
TW200625002A (en) * 2005-01-12 2006-07-16 Chi Mei Corp Photosensitive resin composition for color filter
TW200702932A (en) * 2005-05-11 2007-01-16 Toppan Printing Co Ltd Alkali development-type photosensitive resin composition, substrate with protrusions for liquid crystal split orientational control and color filter formed using the same, and liquid crystal display device
JP4855006B2 (en) * 2005-08-10 2012-01-18 東京応化工業株式会社 Method for producing unsaturated group-containing compound
JP2007119720A (en) * 2005-09-29 2007-05-17 Dainippon Printing Co Ltd Curable resin composition
JP5347212B2 (en) * 2006-03-17 2013-11-20 東洋インキScホールディングス株式会社 Polyester resin and method for producing the same
CN101450992B (en) * 2007-12-07 2010-12-22 比亚迪股份有限公司 Polymer and preparation method thereof and conducting resin containing the same
JP5224130B2 (en) * 2008-03-10 2013-07-03 ナガセケムテックス株式会社 Liquid repellent resin composition
JP5222624B2 (en) 2008-05-12 2013-06-26 富士フイルム株式会社 Black photosensitive resin composition, color filter, and method for producing the same
JP5112948B2 (en) * 2008-05-15 2013-01-09 凸版印刷株式会社 Colored alkali-developable photosensitive resin composition, color filter using the same, liquid crystal split alignment control projection-provided substrate, and liquid crystal display device including the substrate
JP5315106B2 (en) * 2009-03-25 2013-10-16 新日鉄住金化学株式会社 Alkali-soluble resin, method for producing the same, and photosensitive resin composition using alkali-soluble resin
JP5782281B2 (en) * 2011-03-29 2015-09-24 大阪ガスケミカル株式会社 (Meth) acrylate with fluorene skeleton
JP5843604B2 (en) * 2011-12-22 2016-01-13 東京応化工業株式会社 Photosensitive resin composition for black column spacer, black column spacer, display device, and method for forming black column spacer
CN106574999B (en) * 2014-08-12 2019-03-22 Dnp精细化工股份有限公司 Colored filter colored resin composition, colored filter and display equipment
JP6435226B2 (en) * 2015-04-01 2018-12-05 大阪ガスケミカル株式会社 Epoxy resin having fluorene skeleton and method for producing the same
TWI702204B (en) 2016-02-03 2020-08-21 日商田岡化學工業股份有限公司 Bisphenol having fluorene skeleton and a method for manufacturing the same, and polyarylate resin, (meth)acrylate compound and epoxy resin derived from the bisphenol
CN116041235B (en) * 2023-01-10 2024-05-14 阜阳欣奕华材料科技有限公司 Thiol-modified fluorene resin oligomer, method for producing same, photosensitive resin composition, color filter, and image display device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707534A (en) * 1986-12-09 1987-11-17 Minnesota Mining And Manufacturing Company Glycidylethers of fluorene-containing bisphenols
JP2575572B2 (en) * 1992-06-19 1997-01-29 新日本製鐵株式会社 Alkali-developing photosensitive color filter ink and color filter using the same
JP3447768B2 (en) * 1993-06-17 2003-09-16 新日鐵化学株式会社 Thermosetting resin composition, cured product thereof and color filter material
JP3599866B2 (en) * 1995-01-05 2004-12-08 ダイセル化学工業株式会社 Photosensitive coloring composition for color filter, color filter and method for producing the same
JPH09268220A (en) * 1996-03-29 1997-10-14 Nippon Kayaku Co Ltd Production of epoxy resin, epoxy resin composition and its cured material

Similar Documents

Publication Publication Date Title
JP2002088136A5 (en)
JP4382978B2 (en) Photo-curing / thermosetting resin composition
TWI548665B (en) Negative photosensitive resin composition and cured product of the same
JP2004083855A (en) Fluorene-containing resin
JP2009185270A (en) Resin having ring-fused structure
KR100736294B1 (en) Photosensitive resin composition, cured products thereof and spacer made from these cured products for display panel
JP5491541B2 (en) Fluorene resin polymer and photosensitive resin composition containing the same
JP2005325331A (en) New fluorene-containing resin
WO2009038290A1 (en) Photosensitive resin, method for preparing the resin, photosensitive resin composition and cured product of the resin composition
KR100633794B1 (en) Resins curable with actinic energy ray, process for the production thereof, and photocurable and thermosetting resin composition
KR20030044860A (en) A photo-polymerizable unsaturated resin, a method for producing the same, and an alkali-soluble radiation sensitive resin composition comprising the same
JP2004051876A (en) Resin composition and protective film
JP2002145999A (en) Photopolymerizable unsaturated resin and photosensitive resin composition containing the resin
JP2009073871A (en) Thermosetting resin composition, method for forming protective film of color filter, and protective film of color filter
CN1800979B (en) Solder resist composition of light-curing single liquid style and printing circuit board use same
TWI782107B (en) Photoacid generator, curable composition, cured body, photoresist composition, and method for producing resist pattern
JP2006343709A (en) Radiation sensitive resin composition, microlens and process for forming the same, and liquid crystal display device
JP4942893B2 (en) Unsaturated monocarboxylic acid ester compound, method for producing the same, and active energy ray-curable composition
JPH11109620A (en) Positive photosensitive resin composition
KR20170062273A (en) Photo-sensitive Composition, Cured Film Prepared Therefrom, and Device Incoporating the Cured Film
JP3893587B2 (en) Photopolymerizable unsaturated resin, process for producing the same, and alkali-soluble radiation-sensitive resin composition using the same
JP2003128725A (en) Method for manufacturing curable resin and composition containing curable resin
WO2021187324A1 (en) Negative photosensitive resin composition, pattern structure and method for producing patterned cured film
JP2010126693A (en) Asymmetric type multifunctional hydroxyl group-containing condensed ring structure compound and condensed ring structure-containing resin
TWI239947B (en) Oxetane-modified compounds and photocuring compounds derived therefrom, processes for preparation of both and curing compositions containing the photocuring compounds