JP2002076579A - Pad seal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pad seal wherein an additional chip can be added to a place other than a mounting chip on a printed wiring board of an arbitrary pattern for shortest wiring length. SOLUTION: A pad for a chip is arranged on an insulating sheet, with an insulating adhesive part provided to the rear surface of the insulating sheet. The additional chip is added at the shortest wiring length to a place other than the mounting chip on the printed wiring board wired in an arbitrary pattern. The chip pad comprises a plurality of pads and pad intervals according to the function and profile of the chip. The chip pads where chips are added and wired are stacked when a plurality of chips are added for mounting in a limited space.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pad seal for adding a component on a printed wiring board.

[0002]

2. Description of the Related Art Generally, when a main unit is developed, there is an operation for evaluating whether a designed main board operates as designed. In order to correct the problems found during this evaluation, chips such as resistors and capacitors may need to be added and wired on the motherboard.

Japanese Patent Application Laid-Open No. 5-37117 discloses an example in which chip parts such as a resistor and a capacitor are added and wired to correct a defect on a motherboard.
According to Japanese Patent Application Laid-Open No. Hei 5-37117, it is developed for the purpose of improving the efficiency of a function change accompanying a component addition, and easily mounting a jumper wiring for the function change on a mounting surface side on which a mounted component is mounted. Have been. The configuration is such that the mounting component pad for mounting the additional surface mounting component is formed on the wiring pattern of the flexible PC board. By mounting the additional surface mounting component on the mounting component pad, the function with additional components is added. When a change occurs, there is no need to design a new PC board, and the function change can be efficiently handled. Also,
The invention has a configuration in which an opening corresponding to the surface-mounted component is formed at a position corresponding to the surface-mounted component mounted on the PC board in the flexible PC board. PC board is P
It is easily mounted on a C board.

However, it is desirable to satisfy the condition of minimizing the line length of the wiring when the wiring is performed in connection with the addition of the part. However, there is a problem in that a mounting space cannot be secured at a position satisfying this condition due to the pattern and the mounting components arranged in the above, and the wire length of the wiring is increased. In addition, in general, there is a case where a mounting space cannot be secured.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to make it possible to add an additional chip component to an arbitrary pattern on a printed wiring board other than the mounted chip component, thereby minimizing the wiring length. Is to develop a pad seal that can be used.

[0006]

The pad seal of the present invention is a pad seal having two pads for chip components arranged on an insulating sheet and having an insulating adhesive portion on the back surface of the insulating sheet. A chip component is soldered between pads of a pad seal, and an additional chip component is added with a shortest wiring length to a position other than the mounted chip component on the printed wiring board on which an arbitrary pattern is wired.

Further, the chip component pad has a plurality of pads according to the function of the chip component, and has a pad interval corresponding to the outer shape of the chip component.

The chip component pad is characterized in that, when a plurality of chip components are added, the chip component is mounted in a limited space by stacking the added and wired chip component pads. .

Further, the material of the chip component pad is a material which can be soldered for fixing the chip component, has conductivity for conducting electricity, and has heat resistance enough to withstand heat during soldering. It is characterized by.

[0010] The material of the insulating sheet is characterized by being electrically insulating even when it comes into contact with the pattern and having heat resistance during soldering.

Further, the material of the adhesive portion is characterized by a material having adhesive force and insulating property that does not peel off from the substrate during soldering and wiring of the chip component.

[0012]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a perspective view of a pad seal of the present invention, FIG. 2 is a view for explaining mounting of chip components on pads on a pad sheet, and FIG. 3 is arranged at a P position on a printed wiring board on which wiring is mounted. FIGS. 4A and 4B are diagrams showing a state where the chip components are arranged at the P position on the printed wiring board and wired.

As shown in the exploded perspective view of FIG. 1A, the pad seal of the present invention is composed of three layers, a sheet part 1, a pad part 2, and an adhesive part 3. As shown in the perspective view of FIG. 1B, the sheet portion 1, the pad portion 2, and the adhesive portion 3 are attached to each other to form a pad seal.

As shown in FIG. 2, the chip component 4 is soldered to the pad 2 on the sheet portion 1, attached to a printed wiring board on which the components are mounted and wired, and used for adding chip components and the like. You.

The shape and size of the sheet portion 1 are arbitrary shapes and sizes corresponding to chip components. The material of the sheet portion 1 is a material having an insulating property so that electricity does not flow even when it comes into contact with the pattern, and a heat-resistant material enough to withstand heat during soldering.

Two pad portions 2 are attached on a sheet so that soldering for fixing chip components can be performed. The shape and size are arbitrary depending on the size of the chip component, but the distance between the two pads is sufficient to prevent fusion by solder flow during soldering.
The material is made of a material having both conductivity for conducting electricity and heat resistance enough to withstand heat during soldering.

The adhesive portion 3 is made of a material having an adhesive force and an insulating property that does not peel off from the substrate due to a force applied during soldering and wiring of the chip component.

As shown in FIG. 3, when a chip component is added by wiring between the pin 6 of the chip 5 and the pin 8 of the chip 7, ideally, the chip component is placed at the position P in the center of FIG. Can minimize the line length.
However, there is a wiring pattern, and chip components cannot be directly placed as they are. Also, there is no space for placing chip components around the chips 5 and 7 because of the presence of wiring patterns and components. Although there is a space on the left side of the chip 5, if it is arranged at this position, the line length does not become the shortest.

In such a case, a pad seal, to which the chip component of the present invention is soldered, is attached at the position of the center P in FIG.
And the connection with the wiring 10, the line length of the wiring can be minimized.

When a plurality of chip components such as chip resistors are added, even if there is only one space, a plurality of chip components can be added and wired in a limited space by stacking.

Further, by increasing the number of pads on the pad seal or changing the arrangement according to the chip components to be added, it is possible to cope with various types of components. For example, a component such as the chip 5 in FIG. 3 can be handled by setting the number of pads on the pad seal to three and aligning the pad with the position of the PIN.

It is also possible to arrange differently shaped components together on the sheet, as long as the space for the pad seal allows.

[0023]

The first effect is that a chip component can be added to an arbitrary place. The reason is that the adhesive part on the back surface of the pad seal has an insulating property and does not cause an electrical short even when pasted on the pattern, so that chip components can be added on the pattern. In addition, it is also possible to add a chip component without worrying about a pattern in a place other than a place where another component is mounted.

The second effect is that the length of the wiring can be minimized. The reason is that even if there is a pattern in a place where the wire length of the wiring can be minimized, the pad seal of the present invention is stuck on the pattern so that the chip where the wire length is the shortest This is because parts can be added.

[Brief description of the drawings]

FIG. 1 is a perspective view of a pad seal of the present invention.

FIG. 2 is a diagram illustrating mounting of a chip component on a pad on a pad sheet.

FIG. 3 is a diagram illustrating a layout of chip components at a P position on a printed wiring board on which mounting wiring is performed;

FIG. 4 is a diagram showing a state in which chip components are arranged at a P position on a printed wiring board and wired.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sheet part 2 Pad part 3 Adhesive part 4 Chip component 5, 7 Chip 6, 8 pin 9, 10 Wiring

 ──────────────────────────────────────────────────続 き Continuing on the front page F term (reference) 5E319 AA03 AB05 AC01 AC11 CC22 CD26 GG15 5E336 AA04 AA11 BB01 BB12 BB16 CC31 DD17 DD19 DD22 DD32 DD38 DD39 EE01 GG30 5E343 AA02 AA11 AA33 BB67 BB69 DD65 ER51A344A01 GG BB04 BB13 CD12 CD27 CD38 DD14 DD16 EE06 EE13

Claims (7)

[Claims] 1. A pad seal having two pads for chip components arranged on an insulating sheet and having an insulating adhesive portion on the back surface of the insulating sheet, wherein the chip component is provided between pads of the pad seal. Characterized in that an additional chip component is added at a position other than a mounted chip component on a printed wiring board on which an arbitrary pattern is wired by a minimum wiring length. 2. The pad seal according to claim 1, wherein the chip component pad has a plurality of pads according to the function of the chip component. 3. The chip component pad has a pad interval corresponding to the outer shape of the chip component.
Pad seal as described. 4. The method according to claim 1, wherein the chip component pad adds a chip component when adding a plurality of chip components.
2. The pad seal according to claim 1, wherein the pad seal is mounted in a limited space by stacking padded chip component pads. 5. The material for the chip component pad is solderable for fixing the chip component, has conductivity for conducting electricity, and has heat resistance enough to withstand heat during soldering. The pad seal according to claim 1, wherein the pad seal is made of a material. 6. The pad seal according to claim 1, wherein the material of the insulating sheet is a material having an electrical insulating property even when in contact with a pattern and a heat resistance at the time of soldering. 7. The pad seal according to claim 1, wherein the material of the adhesive portion is a material having an adhesive force and an insulating property that does not peel off from a substrate during soldering and wiring of a chip component.