JP2002075601A - Heating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simple-structured heating device which does not require a complicated heater control, and wherein uniformity of temperature of a heating surface is very superior. SOLUTION: The heating device is prepared so that the heat conductivity in a heating surface direction looked from a heat generating element 1 becomes higher than that in the other direction looked from the heat generating element body 1, and the heating device is obtained wherein a very high thermal homogeneity can be realized than before.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating device used for application of heat to an adhesive for surface mounting components in semiconductor production, heat treatment after bonding or cream solder reflow, and heating for a high temperature operation test.

[0002]

2. Description of the Related Art A heating device called a so-called block heater is basically composed of a block made of stainless steel or the like having excellent heat resistance, and a heater serving as a heat source embedded in the block. In this block heater, the temperature of the entire block is raised by a heater, and the heat heats and cures the surface mount component adhesive and the like.

What is particularly important in such a heating apparatus is to precisely and uniformly raise the temperature of the entire heating area. If the heating area of the heating device has unevenness, for example, when it is used for applying heat to the surface mount component adhesive, it causes unevenness in curing of the resin and appears as distortion of the product.
The distortion of the product due to such uneven temperature not only adversely affects the properties of the product, but also causes cracks to be generated from the distorted portion, and in extreme cases, may cause damage to the product.

As a means for solving such problems and obtaining a uniform surface temperature, for example, a special heater having a temperature distribution capable of setting a calorific value for each small area is used as a heater. An apparatus for obtaining uniform heating by repeating trial and error has been conventionally known. In addition, there is a device in which an auxiliary heater is added to the end of the block, which is likely to be lower in temperature than the center of the heating area, and the auxiliary heater is operated to adjust the divided temperature to forcibly obtain a uniform temperature. Furthermore, an apparatus or the like for securing heat mobility using a heat pipe has already been proposed. There is also a heating device proposed and filed by the applicant of the present application and disclosed as Japanese Patent Application Laid-Open No. 8-335490, which is provided inside a block body made of stainless steel for uniform heating made of copper or the like having excellent thermal conductivity. It has a configuration in which an enclosure is embedded.

[0005]

However, in a heater capable of setting a heat generation amount for each area and providing a temperature distribution, it is necessary to repeat re-production until the conditions are satisfied. Cost. Further, even if a uniform heating state is obtained by the adjustment, the stability over time is poor, and it is necessary to manufacture again. On the other hand, in an apparatus using an auxiliary heater, a dedicated space becomes large and a control system becomes complicated. In an apparatus using a heat pipe, there are restrictions on a mounting direction and a used temperature.

The main reason why a uniform heating surface cannot be obtained without such a complicated structure and control is that stainless steel having poor heat conductivity is used as a medium for transmitting the heat generated by the heater to the heating surface. Because it is used. However, since it is absolutely necessary that the material of the block body has high heat resistance and oxidation resistance in order to be used in the atmosphere, stainless steel has been conventionally used. For example, copper can be used if only the thermal uniformity is considered, but it cannot be used in the air because an oxide is generated on the surface. It is also conceivable to use a noble metal such as silver or gold in order to secure heat uniformity and at the same time realize oxidation resistance.
In this case, the wear of the surface becomes a problem and the durability deteriorates, which is not practical. And it's not realistic because the price would be too high. Further, in a heating device manufactured by processing aluminum into a block shape, a device having good temperature uniformity in a heating region is obtained. It cannot be used in a high temperature range.

On the other hand, in the heating device proposed in Japanese Patent Application Laid-Open No. 8-335490, the distribution of the surface temperature has been considerably improved. However, since the flow of heat generated by the heater is not sufficiently controlled, there is room for further improvement in terms of temperature uniformity in the heating area.

Accordingly, an object of the present invention is to provide a heating device having a simple structure and extremely excellent temperature uniformity in a heating region without requiring complicated heater control.

[0009]

The present inventor has conducted intensive studies to solve the above-mentioned problems. As a result, the present inventors have found that the thermal conductivity in the direction of the heating surface as viewed from the heating element (heater) is different from that observed from the heating element. It has been found that by using a heating device having a thermal conductivity higher than that in the direction of the above, a heating device capable of realizing a much higher temperature uniformity than before can be manufactured.

That is, the present invention relates to a heating device having a heating element therein, wherein the thermal conductivity in the direction of the heating surface when viewed from the heating element is such that the thermal conductivity in the other direction as viewed from the heating element is different. Rate.

In such a configuration, a heat equalizing block having a material having a high thermal conductivity relative to all other members may be arranged in the direction of the heating surface when viewed from the heating element. .

A heating device having a heating element therein, wherein a heat insulating material made of a material having a relatively low thermal conductivity with respect to all other members in a direction opposite to a heating surface when viewed from the heating element. It is good also as a heating device characterized by the fact that the application block is arranged.

[0013] Further, there is provided a heating device having a heating element therein, wherein the heating apparatus is provided with a material having a relatively high thermal conductivity relative to all other members in the direction of the heating surface when viewed from the heating element. The heating device may be characterized in that a block is arranged and a heat insulating block made of a material having a relatively low thermal conductivity is arranged in a direction other than the heating surface direction when viewed from the heating element.

More specifically, as described in Embodiments 1 to 21, by changing the various structures shown in FIGS. 1 to 21 and the constituent materials of each part, the structure can be viewed from the heating element (heater) in various ways. It is possible to manufacture a heating device in which the thermal conductivity in the direction of the heating surface becomes higher than the thermal conductivity in the other direction viewed from the heating element. Then, as can be seen from the results of Examples 1 to 21, the thermal conductivity in the direction of the heating surface viewed from the heating element (heater) is higher than the thermal conductivity in the other direction viewed from the heating element. It can be seen that by manufacturing a heating device, a heating device with very good heat uniformity can be manufactured. Example 1
Comparing the results of Nos. 21 to 21 with Comparative Examples 1 and 2, it can be seen that the heating device according to the present invention has a very good uniformity of the heating surface.

As shown in Embodiment 1, a heat equalizing block 2 made of a material having a relatively good thermal conductivity is used so that the heat generated by the heating element 1 is quickly transmitted to the heating surface. By doing so, good heat uniformity can be realized.

Further, as shown in Embodiment 2, by contacting the heat equalizing block 2 made of a material having relatively high thermal conductivity with the heating element 1, heat flow in the direction of the heating surface is improved. In this way, the heat uniformity can be improved.

Further, as shown in Embodiment 3, if the heat flow in the direction of the heating surface is made faster than the heat flow in the opposite direction, good heat uniformity can be secured.

Further, as shown in Examples 4 to 6, the heat flow in the direction of the heating surface is made good, and the heat flow in the direction opposite to the heating surface is made worse by disposing the heat insulating block 4. Thereby, better heat uniformity can be secured.

Further, as shown in Examples 7 to 9, the heating element 1 may be arranged inside the heat equalizing block 2.

Further, as shown in Embodiments 10 and 11, even if a simple structure in which the block 2 for heat equalization, the structural support 3 and the block 4 for heat insulation are simply stacked, good heat uniformity can be obtained. It can be seen that can be secured.

Further, as shown in Example 13, in the heating device according to the present invention, even if the number of the heating elements 1 is reduced, better heat uniformity is obtained than in Comparative Examples 1 and 2. It can also be seen that there is an advantage that the manufacturing cost can be reduced by reducing the number of heating elements used.

Further, as shown in Embodiment 14, in the heating apparatus according to the present invention, even if the position where the heating element 1 is inserted is largely shifted, better heat uniformity can be obtained than in Comparative Examples 1 and 2. It is also clear that there is no need to strictly control the dimensional accuracy at the time of manufacturing and assembling, and there is an advantage that the manufacturing cost can be reduced.

Further, as shown in Embodiment 15, in the heating device according to the present invention, even if the position where the heating element 1 is inserted is not arranged on the same plane, a better uniformity than Comparative Examples 1 and 2 can be obtained. It can be seen that heat property is obtained. This means that there is a considerable degree of freedom in the place where the heating element 1 is arranged, and even if there is a restriction on the triangulation of a lead wire for supplying power to the heating element 1, good heat uniformity is obtained. This means that the heating device can be designed and manufactured, which proves to be advantageous as a heating device used in a place where space is limited.

Further, as shown in Embodiments 16 and 17, it can be seen that the heating apparatus according to the present invention can achieve good heat uniformity even when the shape of the heating surface is not flat.

Further, as shown in Examples 18 and 19, in the heating apparatus according to the present invention, when corrosion resistance of the heated surface and stability against chemicals are particularly required, chemically more stable alumina and dioxide are required. By coating a thin layer of silicon, other ceramics, or the like, corrosion resistance, chemical stability, and thermal uniformity can be simultaneously achieved. At this time, the thickness of the heat equalizing block 2 and the size of the corrosion resistance imparting layer 5 are determined so that the thermal conductivity in the direction of the heating surface does not become worse than the thermal conductivity in the direction opposite to the heating surface. It is necessary to design the size.

Further, as shown in Embodiment 20, good heat uniformity can be realized even if the structure is composed of only the heat equalizing block 2 and the heat insulating block 4 without using the structural support 3.

As shown in Example 21, even when the structure is constituted only by the heat equalizing block 2 and the heat insulating block 4 without using the structural support 3, the corrosion resistance imparting layer 5 is formed on the surface thereof. It can be seen that good soaking properties can be achieved.

As the structural support 3 according to the present invention, it is preferable to use an alloy which has excellent oxidation resistance even at high temperatures and has a certain level of mechanical strength, since there is a high need for using a heating device in the atmosphere. . Specifically, it is preferable to use various stainless steels, Inconel, nickel-base heat-resistant alloys, cobalt alloys, and the like. When an oxidation-resistant coating is applied to the outside of the heat-resistant metal block, a less expensive metal such as iron can be used. It is also possible to use ceramics, which are not metals but have excellent heat resistance and oxidation resistance, without any problem according to the principle of the present invention. As a material of the heat equalizing block, a material having a higher thermal conductivity than that of the structural support 3 must be used. As a specific material, the material that can be selected as the heat equalizing block 2 differs depending on what kind of material is selected for the structural support 3, for example, a pure metal or an alloy having good heat conductivity. , Ceramics and the like are candidate materials. Among them, copper, nickel, and the like are more preferable materials in consideration of economy, ease of production, and the like.

It should be noted that during manufacturing,
If heat is not uniformly transmitted within the heating device from the heating element 1 to the heating surface as designed, a uniform temperature distribution cannot be realized on the heating surface. In the heating device of the present invention, the uniformity of the heating surface is improved by making the heat conduction in the direction of the heating surface relatively good. Therefore, the joining between the heat equalizing block 2 and other components must be performed well and uniformly. That is, it is necessary to sufficiently control the manufacturing process at the time of manufacturing. In the case of manufacturing the heating device according to the present invention, it is preferable that in the joining step, the operation is performed in an atmosphere in which oxygen does not exist in the portion to be joined. For example, the heat treatment is preferably performed in an atmosphere such as an argon gas, a nitrogen gas, an inert gas, or a hydrogen gas.

As an additional effect of the present invention, when a heat insulating block is used, the power input to the heating element can be reduced, so that the running cost can be reduced.

[0031]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 20 are views for explaining the structure of the heating device manufactured in this embodiment. In each of the drawings, a vertical sectional view of FIG. The cross-sectional view of (b) shows a cross-sectional view when cut in the horizontal direction.

(Embodiment 1) FIG. 1 shows the structure of a heating device manufactured in Embodiment 1 of the present invention.

In the figure, a heating element 1 is incorporated in a block-shaped structural support 3 and a heat equalizing block 2 is arranged above the heating element 1. Structural support 3
Is a heating surface for heating the object, and the temperature distribution is required to be uniform. The actual size of the structural support 3 of the heating device manufactured in Example 1 was 300 mm in length, 300 mm in width, and 30 mm in thickness. In the drawings, the ratio of each part different from the actual size is shown for convenience of explanation.
A commercially available sheath heater (length: 290 mm, cross section: 6 mm × 6 mm), which efficiently generates heat by receiving power supply from the outside, is used for the heating element 1, and the structural support 3 has relatively good oxidation resistance. SUS304 which is inexpensive stainless steel
In addition, for the heat equalizing block 2 having relatively good thermal conductivity, nickel metal having good thermal conductivity about 10 times that of stainless steel and good oxidation resistance was used.

The size of the heat equalizing block 2 is 296 m in length.
m, width 296 mm, thickness 10 mm, and three heating elements 1 were arranged 2 mm apart from the heat equalizing block 2. Since the structural support 3 and the heat equalizing block 2 are preferably thermally and uniformly bonded, in the first embodiment, after the heat equalizing block 2 is incorporated into the structural support 3, an argon gas flow is performed. The two were joined by heating at 1200 ° C. for 10 hours while applying pressure. Thereafter, the heating surface was polished to obtain flatness, and the heating device 1 was assembled to complete the heating device.

In the heating device manufactured in the first embodiment, the heat transfer from the heating element 1 to the heat equalizing block 2 having good thermal conductivity is promoted, and the heat is induced to the upper heating surface. That is, it can be seen that the average thermal conductivity from the surface incorporating the heating element 1 to the heating surface is larger than the average thermal conductivity toward the bottom surface. Such promotion of heat transfer of the heat equalizing block 2 is described in the second embodiment described below.
The same applies to 〜21.

A heating test was carried out in the atmosphere by attaching thermocouples to the surface of the heating device of Example 1 thus manufactured at 50 locations at equal intervals as a whole. When the average temperature of the heating surface was controlled at 400 ° C., 600 ° C., and 800 ° C., and the temperatures of all 50 locations on the heating surface were measured,
The temperature of each part is 400 ± 1 ° C, 600 ± 2 ° C, 8
It was within the range of 00 ± 2 ° C., and it was confirmed that the heating surface of the heating device manufactured in Example 1 had very good heat uniformity. In addition, the thermal uniformity of such a heating device was also confirmed by a thermograph.

(Embodiment 2) FIG. 2 shows the structure of a heating device manufactured in Embodiment 2 of the present invention. In the present embodiment and the following examples, the same components shown in the first embodiment are indicated by common reference numerals.

The actual dimensions of the structural support 3 of the heating device manufactured in Example 2 are 300 mm long, 300 mm wide, and 3 mm thick.
0 mm. The heating element 1 is the same as that used in Example 1, and the structural support 3 is made of SUS310, which is stainless steel, which is relatively inexpensive and has good oxidation resistance. Pure copper (commercially-free oxygen-free copper) having very good thermal conductivity was used for the heat block 2. In the heating device manufactured in Example 1, the heat equalizing block 2 had a structure in which it was in direct contact with the atmosphere, so that it was necessary to use a material having oxidation resistance such as nickel metal. On the other hand, in the structure of the heating device manufactured in the second embodiment, the heat equalizing block 2 has a structure embedded in the structural support 3 and does not directly contact the atmosphere. Therefore, it is not necessary to consider oxidation resistance, and only good thermal conductivity and economy need to be considered. Therefore, pure copper having a higher thermal conductivity and lower material cost than nickel was used.

The size of the heat equalizing block 2 is 296 m in length.
m, width 296 mm, thickness 8 mm, and three heating elements 1 were arranged in contact with the heat equalizing block 2. Since it is preferable that the structural support 3 and the heat equalizing block 2 are thermally excellent and uniformly joined, in this embodiment, after the heat equalizing block 2 is incorporated into the structural support 3, it is heated at 1100 ° C. After heating for two hours, the two were joined. At that time, heat treatment was performed so that no oxide was generated at the interface between the heat equalizing block 2 and the structural support 3. After that, the heated surface is polished to obtain flatness,
The heating device was completed by incorporating the heating element 1.

In the heating device manufactured in the second embodiment, since the heating element 1 is in direct contact with the heat equalizing block having a high thermal conductivity, the average heat conduction from the assembled surface to the heating surface is performed. It can be seen that the degree is greater than the average thermal conductivity towards the bottom.

A heating test was carried out in the atmosphere by attaching thermocouples to the surface of the heating device thus manufactured at 50 locations at equal intervals. 400 ° C, 60 ° C
With the temperature controlled at 0 ° C and 800 ° C, all 50 temperatures on the heating surface were measured, and the temperature of any part was within the range of 400 ± 1 ° C, 600 ± 2 ° C, and 800 ± 2 ° C. Thus, it was confirmed that the uniformity of the heating surface of the heating device manufactured in Example 2 was very good. In addition, the thermal uniformity of such a heating device was also confirmed by a thermograph.

(Embodiment 3) FIG. 3 shows the structure of a heating apparatus manufactured in Embodiment 3 of the present invention. The upper side of the figure is a heating surface for heating the object. The actual dimensions of the structural support 3 of the heating device manufactured in Example 3 are 500 mm long and 400 mm wide.
mm and a thickness of 40 mm. A commercially available sheath heater (length: 480 mm, cross section: 10 mm × 10 mm) that efficiently generates heat by receiving electric power from the outside is used for the heating element 1, and the structural support 3 has relatively good oxidation resistance. SUS304, which is an inexpensive stainless steel, and the heat equalizing block 2 having relatively good thermal conductivity are about 10
A nickel metal with good thermal conductivity and good oxidation resistance was used.

The size of the heat equalizing block 2 is 500 m in length.
m, width 400 mm, thickness 20 mm, and three heating elements 1 were arranged 2 mm apart from the soaking block 2. Since the structural support 3 and the heat equalizing block 2 are preferably thermally and uniformly bonded, in the third embodiment, after the heat equalizing block 2 is incorporated into the structural support 3, an argon gas flow is performed. The two were joined by heating at 1200 ° C. for 10 hours while applying pressure. Thereafter, the heating surface was polished to obtain flatness, and the heating device 1 was assembled to complete the heating device.

In the heating device manufactured in the third embodiment, the average thermal conductivity from the surface incorporating the heating element 1 to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

A thermocouple was attached to the surface of the heating device of Example 3 thus manufactured at 50 locations at equal intervals as a whole.
A heating test was performed in the atmosphere. Average temperature of heated surface is 40
With the temperature controlled at 0 ° C, 600 ° C, and 800 ° C,
When the temperatures of all 50 locations on the heating surface were measured, the temperatures of all portions were 400 ± 1 ° C., 600 ± 2 ° C., 800
It was within the range of ± 3 ° C., and it was confirmed that the heating surface of the heating device manufactured in Example 3 had very good heat uniformity. In addition, the thermal uniformity of such a heating device was also confirmed by a thermograph.

(Embodiment 4) FIG. 4 shows the structure of a heating device manufactured in Embodiment 4 of the present invention. The actual size of the structural support 3 of the heating device manufactured in Example 4 is 300 mm long and 30 mm wide.
0 mm and a thickness of 30 mm. The heating element 1 is the same as that used in Example 1, and the structural support 3 is made of SUS30, which is an inexpensive stainless steel having relatively good oxidation resistance.
Pure copper (commercially-free oxygen-free copper) having very good heat conductivity was used for the heat equalizing block 2 having relatively good heat conductivity. On the opposite side of the heating surface with respect to the heating element 1, an alumina heat insulating block 4 having good heat insulating properties (poor heat conductivity) was arranged.

The size of the heat equalizing block 2 is 296 m in length.
m, width 296 mm, thickness 8 mm, and three heating elements 1 were arranged at a distance of 2 mm from the soaking block 2. The size of the heat insulation block is 280mm long, 280mm wide, 3m thick
m. Since it is preferable that the structural support 3 and the heat equalizing block 2 are thermally excellent and uniformly joined, in this embodiment, after the heat equalizing block 2 is incorporated into the structural support 3, it is heated at 1100 ° C. After heating for two hours, the two were joined. At that time, heat treatment was performed so that no oxide was generated at the interface between the heat equalizing block 2 and the structural support 3. Structural support 3
It is not particularly necessary to join the heat insulating block 4 and the heat insulating block 4 well. Thereafter, the heating surface was polished to obtain flatness, and the heating device 1 was assembled to complete the heating device.

In the heating device manufactured in the fourth embodiment, the average thermal conductivity from the surface incorporating the heating element 1 to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

A heating test was carried out in the atmosphere by attaching thermocouples to the surface of the heating device thus fabricated at 50 locations at equal intervals as a whole. 400 ° C, 60 ° C
When the temperature at all 50 points on the heating surface was measured while controlling the temperature at 0 ° C. and 800 ° C., the temperature at any point was 400 ± 0.5 ° C., 600 ± 1 ° C., 800 ± 1 ° C.
It was confirmed that the uniformity of the heating surface of the heating device manufactured in Example 4 was very good. In addition, the thermal uniformity of such a heating device was also confirmed by a thermograph.

A heat insulating block 4 is provided below the heating element 1.
Is arranged, the heat conductivity from the heating element 1 in the direction of the bottom surface (surface opposite to the heating surface) can be made small, and the amount of heat radiation to the bottom surface side can be suppressed. As a result, compared to Example 2, the average temperature of the heated surface was set to 800 ° C.
It was confirmed that the amount of power input required to maintain the power consumption could be reduced by about 20%. Note that suppression of heat radiation to the lower surface side by providing the heat insulating block 4 is the same in another embodiment described later.

(Embodiment 5) FIG. 5 shows the structure of a heating device manufactured in Embodiment 5 of the present invention. The actual size of the structural support 3 of the heating device manufactured in Example 5 is 300 mm long and 3 mm wide.
The thickness was set to 00 mm and the thickness to 30 mm. The heating element 1 is the same as that used in Example 1, and the structural support 3 is made of SUS3, which is an inexpensive stainless steel having relatively good oxidation resistance.
16 and the heat equalizing block 2 having relatively good thermal conductivity.
Used nickel metal. On the opposite side of the heating surface with respect to the heating element 1, an alumina heat insulating block 4 having good heat insulating properties (poor heat conductivity) was arranged.

The size of the heat equalizing block 2 is 296 m in length.
m, width 296 mm, thickness 10 mm, and three heating elements 1 were arranged 2 mm apart from the heat equalizing block 2. The size of the heat insulating block 4 was 300 mm long, 300 mm wide, and 3 mm thick. Since the structural support 3 and the heat equalizing block 2 are preferably thermally and uniformly joined,
In Example 5, the heat equalizing block 2 was assembled into the structural support 3 and then heated at 1200 ° C. for 10 hours to join them together. At that time, heat treatment was performed so that no oxide was generated at the interface between the heat equalizing block 2 and the structural support 3. Regarding the joining between the structural support 3 and the heat insulating block 4, it is not necessary to join them particularly well. Thereafter, the heating surface was polished to obtain flatness, and the heating device 1 was assembled to complete the heating device.

In the heating device manufactured in the fifth embodiment, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

A heating test was carried out in the atmosphere by attaching thermocouples to the surface of the heating device thus manufactured at 50 points at equal intervals as a whole. 400 ° C, 60 ° C
When the temperature at all 50 points on the heating surface was measured while controlling the temperature at 0 ° C. and 800 ° C., the temperature at any point was 400 ± 0.5 ° C., 600 ± 1 ° C., 800 ± 1 ° C.
It was confirmed that the uniformity of the heating surface of the heating device manufactured in Example 5 was very good. In addition, the thermal uniformity of such a heating device was also confirmed by a thermograph.

Further, as a result of the structure having a small thermal conductivity from the heating element 1 in the direction of the bottom surface (the surface opposite to the heating surface), the average temperature of the heating surface is maintained at 800 ° C. as compared with the first embodiment. It has been confirmed that the required power input can be reduced by about 20%.

(Embodiment 6) FIG. 6 shows the structure of a heating device manufactured in Embodiment 6 of the present invention. The actual dimensions of the structural support 3 of the manufactured heating device are 300 mm in length, 300 mm in width, and 30 mm in thickness. The heating element 1 is the same as that used in Example 1, and the structural support 3 is made of SUS304, which is a stainless steel which is relatively inexpensive and has low oxidation resistance, and a uniform material having relatively good thermal conductivity. Pure copper (commercially-free oxygen-free copper) having very good thermal conductivity was used for the heat block 2. Also,
A heat insulating block 4 made of alumina having good heat insulating properties (poor heat conductivity) was arranged on the opposite side of the heating surface with respect to the heating element 1.

The size of the heat equalizing block 2 is 296 m in length.
m, width 296 mm, thickness 8 mm, and three heating elements 1 were arranged at a distance of 2 mm from the soaking block 2. The size of the heat insulating block 4 is 300 mm long, 300 mm wide, and 3 mm thick.
mm. Others were manufactured similarly to Example 4.

In the heating device manufactured in the sixth embodiment, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

A thermocouple was attached to the surface of the produced heating device at 50 points at equal intervals as a whole, and a heating test was performed in the atmosphere. 400 ° C, 600 ° C, 8
With the temperature controlled at 00 ° C., the temperature at all 50 points on the heating surface was measured.
The values were within the ranges of 00 ± 0.5 ° C., 600 ± 1 ° C., and 800 ± 1 ° C., and it was confirmed that the heating surface of the heating device manufactured in Example 6 had very good heat uniformity. . In addition,
The thermal uniformity of such a heating device was also confirmed by a thermograph.

Further, as a result of having a structure in which the thermal conductivity from the heating element 1 to the bottom surface (surface opposite to the heating surface) is small, the average temperature of the heating surface is maintained at 800 ° C. as compared with the second embodiment. It has been confirmed that the required power input can be reduced by about 20%.

(Embodiment 7) FIG. 7 shows the structure of a heating device manufactured in Embodiment 7 of the present invention. The actual dimensions of the structural support 3 of the manufactured heating device are 300 mm in length, 300 mm in width, and 30 mm in thickness. The same heating element as that used in Example 1 is used as the heating element 1, a nickel base alloy Hastelloy C-276 having excellent oxidation resistance is used as the structural support 3, and a soaking element having relatively good thermal conductivity is used. The use block 2 was made of nickel metal.

The size of the heat equalizing block 2 is 296 m in length.
m, width 296 mm, thickness 20 mm, the bottom surface of the heating element 1 is 2 m from the joining surface of the structural support 3 and the block 2 for heat equalization.
m at a position above m. Others were manufactured similarly to Example 1.

In the heating device manufactured in the seventh embodiment, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

When the same evaluation as in Example 1 was performed,
Temperature of any part is 400 ± 1 ℃, 600 ± 1 ℃, 8
The temperature was in the range of 00 ± 2 ° C., and it was confirmed that the heating surface of the heating device manufactured in this example had a very good heat uniformity.

(Embodiment 8) FIG. 8 shows the structure of a heating device manufactured in Embodiment 8 of the present invention. The actual dimensions of the manufactured heating device are 300 mm in length, 300 mm in width, and 30 mm in thickness. The same heating element as that used in Example 1 is used as the heating element 1, a nickel-based alloy Inconel 600 having excellent oxidation resistance is used for the structural support 3, and a heat equalizing block having relatively good thermal conductivity is used. Pure copper (electrolytic copper) was used for 2.

The size of the heat equalizing block 2 is 296 m in length.
m, width 296 mm, thickness 20 mm, the bottom surface of the heating element 1 is 2 m from the joining surface of the structural support 3 and the block 2 for heat equalization.
m at a position above m. Others were manufactured similarly to Example 2.

In the heating device manufactured in the eighth embodiment, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

When the same evaluation as in Example 2 was performed,
Temperature of any part is 400 ± 1 ℃, 600 ± 1 ℃, 8
The temperature was in the range of 00 ± 2 ° C., and it was confirmed that the heating surface of the heating device manufactured in this example had a very good heat uniformity.

(Embodiment 9) FIG. 9 shows the structure of a heating apparatus manufactured in Embodiment 9 of the present invention. The actual dimensions of the manufactured heating device are 300 mm in length, 300 mm in width, and 30 mm in thickness. The same heating element as that used in Example 1 is used as the heating element 1, a nickel-based alloy Inconel 601 having excellent oxidation resistance is used for the structural support 3, and a heat equalizing block having relatively good thermal conductivity is used. For No. 2, nickel metal was used.

The size of the heat equalizing block 2 is 300 m in length.
m, width 300 mm, thickness 20 mm, the bottom surface of the heating element 1 is 2 m from the joining surface of the structural support 3 and the block 2 for heat equalization.
m at a position above m. Others were manufactured similarly to Example 1.

In the heating device manufactured in the ninth embodiment, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

When the same evaluation as in Example 1 was performed,
The temperature of each part is 400 ± 1 ° C, 600 ± 3 ° C, 8
It was within the range of 00 ± 3 ° C., and it was confirmed that the heating surface of the heating device manufactured in Example 9 had very good heat uniformity.

(Embodiment 10) FIG. 10 shows Embodiment 1 of the present invention.
0 shows the structure of the heating device manufactured in FIG. The actual dimensions of the heating device manufactured in Example 10 were 300 mm long and 300 m wide.
m and a thickness of 30 mm. The same heating element 1 as that used in Example 1 is used. Inconel 625 having good oxidation resistance is used for the structural support 3, and the heat equalizing block 2 having relatively good heat conductivity is used for the structural support 3. Nickel metal was used. On the opposite side of the heating surface with respect to the heating element 1, an alumina heat insulating block 4 having good heat insulating properties (poor heat conductivity) was arranged.

The size of the heat equalizing block 2 is 300 m in length.
m, width 300 mm, thickness 10 mm, and three heating elements 1 were arranged 2 mm apart from the heat equalizing block 2. The size of the heat insulating block 4 was 300 mm long, 300 mm wide, and 3 mm thick. Others were manufactured similarly to Example 5.

In the heating device manufactured in the tenth embodiment, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

When the same evaluation as in Example 1 was performed,
The temperature of each part is 400 ± 1 ° C, 600 ± 2 ° C, 8
The temperature was within the range of 00 ± 2 ° C., and it was confirmed that the heating surface of the heating device manufactured in Example 10 had very good heat uniformity. Further, as a result of having a structure in which the thermal conductivity from the heating element 1 in the direction of the bottom surface (the surface opposite to the heating surface) is small, it is necessary to maintain the average temperature of the heating surface at 800 ° C. as compared with the first embodiment. It was confirmed that the required power input could be reduced by about 20%.

(Embodiment 11) FIG. 11 shows Embodiment 1 of the present invention.
1 shows the structure of the heating device manufactured in 1. Heat equalizing block 2
The size of the vertical 300mm, horizontal 300mm, thickness 20mm
A heating device similar to that of Example 10 was used, except that.

In the heating apparatus manufactured in the eleventh embodiment, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

When the same evaluation as in Example 1 was performed,
Temperature of any part is 400 ± 1 ℃, 600 ± 1 ℃, 8
It was within the range of 00 ± 2 ° C., and it was confirmed that the heating surface of the heating device manufactured in Example 11 had very good heat uniformity. Further, as a result of having a structure in which the thermal conductivity from the heating element 1 in the direction of the bottom surface (the surface opposite to the heating surface) is small, it is necessary to maintain the average temperature of the heating surface at 800 ° C. as compared with the first embodiment. It was confirmed that the required power input could be reduced by about 20%.

(Embodiment 12) FIG. 12 shows Embodiment 1 of the present invention.
2 shows the structure of the heating device manufactured in 2. The actual dimensions of the prepared heating device are 300 mm long, 300 mm wide, and 30 m thick.
m. The heating element 1 is the same as that used in Example 1, and the structural support 3 is made of SUS304, which is a stainless steel which is relatively inexpensive and has low oxidation resistance, and a uniform material having relatively good thermal conductivity. The heat block 2 was made of nickel metal. Further, on the side opposite to the heating surface and on the side surface of the heating element 1, an alumina heat insulating block 4 having good heat insulating property (poor heat conductivity) was arranged.

The size of the heat equalizing block 2 is 280 m in length.
m, width 280 mm, thickness 10 mm, and three heating elements 1 were arranged 2 mm apart from the heat equalizing block 2. The thickness of the heat insulating block was 3 mm. Others were manufactured similarly to Example 5.

When the same evaluation as in Example 1 was performed,
Temperature of any part is 400 ± 1 ℃, 600 ± 1 ℃, 8
It was within the range of 00 ± 2 ° C., and it was confirmed that the heating surface of the heating device manufactured in Example 12 had very good heat uniformity. Further, as a result of having a structure in which the thermal conductivity from the heating element 1 in the bottom direction (the surface opposite to the heating surface) and in the side direction is small, the average temperature of the heating surface is 800 times higher than that in Example 1.
It was confirmed that the amount of electric power required to maintain the temperature in ° C. could be reduced by about 20%.

Embodiment 13 FIG. 13 shows Embodiment 1 of the present invention.
3 shows the structure of the heating device prepared in 3. Except that the heating treatment and the heating element 1 manufactured in Example 7 were all one, they all had the same structure, and were manufactured by the same manufacturing method.

When the same evaluation as in Example 1 was performed,
The temperature of each part is 400 ± 1 ° C, 600 ± 2 ° C, 8
The temperature is within the range of 00 ± 4 ° C, and the number of heating elements 1 is 1
Despite the reduction to the number of books, it was confirmed that the heating surface of the heating device manufactured in the thirteenth example had very good heat uniformity.

(Embodiment 14) FIG. 14 shows Embodiment 1 of the present invention.
4 shows the structure of the heating device prepared in 4. Except that the number of the heating device and the heating element 1 manufactured in Example 7 was five, they all had the same structure, and were manufactured by the same manufacturing method.

When the same evaluation as in Example 1 was performed,
The temperature of each part is 400 ± 1 ° C, 600 ± 2 ° C, 8
The temperature was within the range of 00 ± 2 ° C., and even when the insertion position (height) of the heating element 1 was slightly shifted (the height of each heating element 1 was shifted by 5 mm), the heating element was manufactured in Example 14. It was confirmed that the heat uniformity of the heating surface of the heating device was very good.

(Embodiment 15) FIG. 15 shows Embodiment 1 of the present invention.
5 shows the structure of the heating device manufactured in Step 5. Except that the number of the heating device and the heating element 1 manufactured in Example 7 were two, and that the heating elements 1 were further arranged orthogonally, they were all manufactured by the same structure and manufacturing method. When the same evaluation as in Example 1 was performed,
The temperature of each part is 400 ± 1 ° C, 600 ± 2 ° C, 8
The temperature is within the range of 00 ± 3 ° C, and the number of heating elements 1 is 2
It was confirmed that the heating surface of the heating device manufactured in Example 15 had a very good heat uniformity even though the number of insertions was different from that of the book and the insertion method was different.

(Embodiment 16) FIG. 16 shows the structure of a heating apparatus manufactured in Embodiment 16 of the present invention. Except that the shapes of the surfaces of the heating device and the heat equalizing block 2 manufactured in Example 1 were uneven, all were manufactured by the same structure and manufacturing method. The depth of the valley was 3 mm.

When the same evaluation as in Example 1 was performed,
The temperature of each part is 400 ± 1 ° C, 600 ± 2 ° C, 8
The temperature is within the range of 00 ± 2 ° C., and even if the shape of the heating surface is uneven, the peaks and the valleys have the same temperature, and the heating surface of the heating device manufactured in this example has the same temperature. It was confirmed that the heat uniformity was very good.

(Embodiment 17) FIG. 17 shows Embodiment 1 of the present invention.
7 shows the structure of the heating device manufactured in 7. Except that the shapes of the surfaces of the heating device and the heat equalizing block manufactured in Example 1 were uneven, all were manufactured by the same structure and manufacturing method. The depth of the valley was 3 mm.

When the same evaluation as in Example 1 was performed,
Temperature of any part is 400 ± 1 ℃, 600 ± 1 ℃, 8
The temperature was within the range of 00 ± 2 ° C., and even if the shape of the heating surface was uneven, the peaks and valleys had the same temperature, and the heating surface of the heating device manufactured in Example 17 was used. It was confirmed that the heat uniformity was very good.

(Embodiment 18) FIG. 18 shows Embodiment 1 of the present invention.
8 shows the structure of the heating device manufactured in FIG. The same heating device as in Example 7 was manufactured, and an alumina layer having a thickness of 100 μm was formed as a corrosion resistance imparting layer 5 on the heated surface by a thermal spraying method.

When the same evaluation as in Example 1 was performed,
The temperature of each part is 400 ± 1 ° C, 600 ± 2 ° C, 8
It is within the range of 00 ± 2 ° C., and even if the corrosion resistance imparting layer 5 is formed on the surface of the heating surface, the uniformity of the heating surface of the heating device manufactured in Example 18 may be very good. It could be confirmed.

(Embodiment 19) FIG. 19 shows Embodiment 1 of the present invention.
9 shows the structure of the heating device manufactured in 9. The same heating device as in Example 7 was manufactured, and an alumina layer having a thickness of 100 μm was formed as a corrosion resistance imparting layer 5 on the heated surface by a thermal spraying method.

When the same evaluation as in Example 1 was performed,
Temperature of any part is 400 ± 1 ℃, 600 ± 1 ℃, 8
It was within the range of 00 ± 2 ° C., and it was confirmed that even if the corrosion resistance imparting layer 5 was formed on the surface of the heating surface, the heating surface of the heating device manufactured in this example had very good heat uniformity. did it.

(Embodiment 20) FIG. 20 shows Embodiment 2 of the present invention.
0 shows the structure of the heating device manufactured in FIG. The upper part of the figure is a heating surface for heating the object, and it is required that the temperature distribution is uniform. The actual dimensions of the heating device manufactured in Example 20 were 1000 mm in length, 500 mm in width, and 30 mm in thickness.
And The heating element 1 has a commercially available sheath heater (900 m in length) that efficiently receives heat when supplied with electric power from the outside.
m, a cross section of 10 mm × 10 mm), and a nickel metal having relatively good heat conduction and good oxidation resistance was used for the heat equalizing block 2. A heat insulating block 4 made of glass wool having a thickness of 5 mm was arranged on the bottom surface.

The three heating elements 1 were arranged at a distance of 5 mm from the heat insulating block 4. Since the heat insulating block 4 does not need to be thermally satisfactorily joined to the heat equalizing block 1, there is no need to take any special action regarding the joining method.

In the heating apparatus manufactured in the twentieth embodiment, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is larger than the average thermal conductivity toward the bottom surface. You can see that it is.

A heating test was carried out in the atmosphere by attaching thermocouples to the surface of the heating device thus manufactured at intervals of 4 mm in length and width. 400 ° C, 60 ° C
When the temperature at all the measurement points on the heating surface was measured in a state where the temperature was controlled at 0 ° C and 800 ° C, the temperature of any portion was within the range of 400 ± 1 ° C, 600 ± 1 ° C, and 800 ± 2 ° C. It was confirmed that the uniformity of the heating surface of the heating device manufactured in Example 20 was very good.

(Embodiment 21) FIG. 21 shows Embodiment 2 of the present invention.
1 shows the structure of the heating device manufactured in 1. The same heating device as that of Example 20 was manufactured, and an alumina layer having a thickness of 100 μm was formed as a corrosion resistance imparting layer 5 on the heated surface and side surfaces thereof by a thermal spraying method.

When the same evaluation as in Example 20 was carried out, the temperature of each part was 400 ± 0.5 ° C. and 600 ± 0.5 ° C.
0.5 ° C, 800 ± 0.5 ° C. Even if the shape of the heating surface is uneven, the peaks and the valleys are at the same temperature. It was confirmed that the heat uniformity of the heating surface of the heating device was very good. In addition, as a result of having a structure in which the thermal conductivity from the heating element 1 to the direction other than the heating surface is small, the amount of power input required to maintain the average temperature of the heating surface at 800 ° C. is smaller than that in Example 20. It was confirmed that it could be reduced by about 25%.

Comparative Example 1 For comparison, a heating device according to a conventional method was manufactured. FIG. 22 shows the structure of the heating device manufactured in Comparative Example 1. The upper side of the figure is a heating surface for heating the object. The actual dimensions of the heating device manufactured in Comparative Example 1 were the same size as in Example 1, 300 mm long and 300 m wide.
m and a thickness of 30 mm. The same heating element 1 as in Example 1 is used, and the same SUS30 as in Example 1 is used for the structural support 3.
4 was used. The position of the heating element 1 is determined by using a simulation software for thermal analysis to move the block body to SUS.
Under the condition that three heating elements were used in the above-described size, the arrangement at which the temperature distribution on the heating surface (upper surface) was the most uniform was calculated, and the heating elements were arranged at positions considered to be optimal.

In the heating device manufactured in this comparative example,
The average thermal conductivity from the surface incorporating the heating element 1 to the heating surface is 4 times higher than the average thermal conductivity toward the bottom surface.
It has been reduced by about 30%.

Thermocouples were attached to the surface of the heating device of Comparative Example 1 thus manufactured at 50 locations at equal intervals throughout the heating device.
A heating test was performed in the atmosphere. Average temperature of heated surface is 40
With the temperature controlled at 0 ° C, 600 ° C, and 800 ° C,
When the temperature at all 50 points on the heating surface was measured,
± 20 ° C at 0 ° C, ± 35 ° C at 600 ° C
Temperature deviation. It can be seen that the heating surface of the heating device manufactured by the conventional method has poor heat uniformity.

Comparative Example 2 For comparison, a heating device according to a conventional method was manufactured. FIG. 23 shows the structure of the heating device manufactured in Comparative Example 2. The upper side of the figure is a heating surface for heating the object. The actual size of the heating device manufactured in Comparative Example 2 is the same as that of the heating device manufactured in Example 2 in the vertical direction.
0 mm, 300 mm in width, and 30 mm in thickness. Heating element 1
The same material as used in Example 2 was used for the structural support 3 and the heat equalizing block 2.

The size of the heat equalizing block 2 was 296 mm in length, 296 mm in width, and 8 mm in thickness, which were the same as those in Example 2. The upper surface of the heat equalizing block 2 was located at a position 2 mm below the heating surface. The heating element 1 was disposed so as to be exactly in the middle between the lower surface of the heat equalizing block 2 and the lower surface of the heating device. In this manner, in the heating device manufactured in this comparative example, the average thermal conductivity from the surface on which the heating element 1 is incorporated to the heating surface is 30% of the average thermal conductivity toward the bottom surface. It has become smaller. Otherwise, the heating device was completed in exactly the same manner as in Example 2.

Thermocouples were attached to the surface of the heating device of Comparative Example 2 thus produced at 50 locations at equal intervals throughout the device.
A heating test was performed in the atmosphere. Average temperature of heated surface is 40
With the temperature controlled at 0 ° C, 600 ° C, and 800 ° C,
When the temperature at all 50 points on the heating surface was measured,
± 6 ° C at 0 ° C, ± 10 ° C at 600 ° C,
At 800 ° C, there was a temperature deviation of ± 15 ° C. It can be seen that the heating device manufactured in Comparative Example 2 has a significantly improved uniformity than the heating device manufactured in Comparative Example 1.
However, it can be seen that the heating devices according to the present invention produced in Examples 1 to 21 can achieve even better heat uniformity.

[0109]

According to the present invention, it is possible to obtain a heating device which has a relatively simple structure, has good thermal efficiency and suppresses temperature unevenness on a heating surface. It can be suitably used for heat treatment after bonding, cream solder reflow, and heating for a high-temperature operation test.

[Brief description of the drawings]

FIG. 1 is a view showing a heating device according to a first embodiment of the present invention, wherein (a) is a longitudinal sectional view and (b) is a transverse sectional view.

FIGS. 2A and 2B are views showing a heating device according to a second embodiment of the present invention, wherein FIG. 2A is a longitudinal sectional view and FIG.

3A and 3B are views showing a heating device according to a third embodiment of the present invention, wherein FIG. 3A is a longitudinal sectional view and FIG. 3B is a transverse sectional view.

FIGS. 4A and 4B are diagrams showing a heating device according to a fourth embodiment of the present invention, wherein FIG. 4A is a longitudinal sectional view and FIG.

FIGS. 5A and 5B are diagrams showing a heating device according to a fifth embodiment of the present invention, wherein FIG. 5A is a longitudinal sectional view and FIG.

FIGS. 6A and 6B are views showing a heating device according to a sixth embodiment of the present invention, wherein FIG. 6A is a longitudinal sectional view and FIG.

7A and 7B are diagrams showing a heating device according to a seventh embodiment of the present invention, wherein FIG. 7A is a longitudinal sectional view and FIG. 7B is a transverse sectional view.

FIGS. 8A and 8B are views showing a heating device according to an eighth embodiment of the present invention, wherein FIG. 8A is a longitudinal sectional view and FIG. 8B is a transverse sectional view.

9A and 9B are diagrams showing a heating device according to a ninth embodiment of the present invention, wherein FIG. 9A is a longitudinal sectional view and FIG. 9B is a transverse sectional view.

FIGS. 10A and 10B are diagrams showing a heating device according to a tenth embodiment of the present invention, wherein FIG. 10A is a longitudinal sectional view and FIG.

11A and 11B are diagrams showing a heating device according to an eleventh embodiment of the present invention, wherein FIG. 11A is a longitudinal sectional view and FIG. 11B is a transverse sectional view.

FIGS. 12A and 12B are diagrams showing a heating device according to a twelfth embodiment of the present invention, wherein FIG. 12A is a longitudinal sectional view and FIG.

13A and 13B are diagrams showing a heating device according to a thirteenth embodiment of the present invention, wherein FIG. 13A is a longitudinal sectional view and FIG. 13B is a transverse sectional view.

14A and 14B are diagrams showing a heating device according to a fourteenth embodiment of the present invention, wherein FIG. 14A is a longitudinal sectional view and FIG. 14B is a transverse sectional view.

FIGS. 15A and 15B are views showing a heating device according to a fifteenth embodiment of the present invention, wherein FIG. 15A is a longitudinal sectional view and FIG.

FIGS. 16A and 16B are diagrams showing a heating device according to a sixteenth embodiment of the present invention, wherein FIG. 16A is a longitudinal sectional view and FIG.

17A and 17B are diagrams showing a heating device according to a seventeenth embodiment of the present invention, wherein FIG. 17A is a longitudinal sectional view, and FIG. 17B is a transverse sectional view.

FIGS. 18A and 18B are diagrams showing a heating device according to an eighteenth embodiment of the present invention, wherein FIG. 18A is a longitudinal sectional view and FIG.

19A and 19B are diagrams showing a heating device according to a nineteenth embodiment of the present invention, wherein FIG. 19A is a longitudinal sectional view and FIG. 19B is a transverse sectional view.

FIG. 20 is a view showing a heating device according to a twentieth embodiment of the present invention, wherein (a) is a longitudinal sectional view and (b) is a transverse sectional view.

FIGS. 21A and 21B are diagrams showing a heating device according to a twenty-first embodiment of the present invention, wherein FIG. 21A is a longitudinal sectional view and FIG.

FIGS. 22A and 22B are diagrams showing a heating device manufactured in Comparative Example 1 of the present invention, wherein FIG. 22A is a longitudinal sectional view, and FIG.

23A and 23B are diagrams showing a heating device manufactured in Comparative Example 2 of the present invention, wherein FIG. 23A is a longitudinal sectional view, and FIG. 23B is a transverse sectional view.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 heating element 2 block for soaking 3 structural support 4 block for heat insulation 5 layer for imparting corrosion resistance

Claims (5)

[Claims] 1. A heating device including a heating element therein, wherein a thermal conductivity in a heating surface direction as viewed from the heating element is higher than a thermal conductivity in another direction as viewed from the heating element. A heating device, characterized in that: 2. A heat equalizing block made of a material having a high thermal conductivity relative to all other members is disposed in a heating surface direction when viewed from the heating element. 1
The heating device as described. 3. A heating device having a heating element therein, wherein a heat insulating material made of a material having a relatively low thermal conductivity with respect to all other members in a direction opposite to a heating surface when viewed from the heating element. A heating block, wherein a heating block is arranged. 4. A heating device having a heating element therein, wherein the heating element is provided with a material having a relatively high thermal conductivity relative to all other members in a heating surface direction when viewed from the heating element. A heating device comprising: a block; and a heat insulating block made of a material having a relatively low thermal conductivity in a direction other than the heating surface direction when viewed from the heating element. 5. The heating device according to claim 2, wherein the heating element is in contact with the heat equalizing block which is a component having the highest thermal conductivity.