JP2002067081A - Resin mold structure of molded part and method for manufacturing molded part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the structure of a small-size resin mold which can be configured for molded parts without the generation of burrs on the side in the resin molding process of electronic parts which are long in one direction using a molding material, and also provide a method for manufacturing the molded parts. SOLUTION: This resin mold structure for the molded parts 10 obtained by inserting the electronic parts 11 between lead frames 13 and 14 arranged at both ends and molding a resin for the electronic parts 11 comprises the lead frames 13 and 14 provided in such a manner that they jut out inwardly from the outer periphery part 21b of the mold of such a shape as to surround the electronic parts 11 and a gap into which mold forces 33 and 34 for molding the resin can be insetted between the electronic part 11 side and the outer periphery part 21b under such a state that the electronic parts 11 are junctioned to the lead frames 13 and 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method for manufacturing a molded component in which an electronic component is resin-molded.

[0002]

2. Description of the Related Art In recent years, small-sized information devices such as HDDs (hard disk drives), mobile computers, and IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems have been developed. As electronic components such as piezoelectric vibrators and piezoelectric oscillators used for them are remarkably reduced in size and thickness, many products suitable for automatic mounting are manufactured because of their high performance and the convenience of mounting work. That is, for example, a piezoelectric vibrator, which is one of the electronic components, contains a crystal vibrating piece, which is a very thin plate-shaped piezoelectric material, in a package. In such a quartz vibrating piece, an electrode film made of a metal film is formed in a predetermined pattern on both surfaces of a plate shape, and by applying a predetermined driving voltage to this electrode film, an inherent film dependent on its thickness is formed. It is designed to vibrate at the vibration frequency. Then, the vibration is electrically extracted and used for a predetermined clock signal of a device to be incorporated.

[0003] In such a piezoelectric vibrator, if the shape of the package accommodating the piezoelectric vibrating reed is special or if the positions of the electrode terminals to be connected to the mounting substrate are different from those of other types of electronic components, the automatic mounting machine is not provided. Cannot be used. For this reason, molded parts have been manufactured in which a package is molded with resin and electrode terminals are provided by a lead frame so as to be compatible with mechanical mounting using an automatic mounting machine.

[0004]

The conventional molded parts have the following problems in the molding process.

A conventional molding process will be described. As shown in FIG. 44, a resin molded portion 115 is formed inside a space 121a of a terminal forming frame 121 by molding a package 11 as an electronic component with a molding material.

In this case, the outer peripheral portion 121b of the terminal forming frame 121 is, as shown in FIG.
The molding is performed while being sandwiched between the lower mold 133 and the lower mold 133. Specifically, FIG. 45 which is a sectional view taken along line dd of FIG.
, The contact portion 133a formed on the upper surface of the lower die 133
The molding material is injected into the mold in a state where the package 11 is sandwiched and held between an eject pin 134a that moves up and down inside the upper mold 134 and the resin mold 115 as shown in FIG. Is formed.

In this case, the width of the resin mold portion 115 as the mold resin and the size shown in FIG.
As described in FIG. 45, the upper mold 134 and the lower mold 1 for molding are used.
33, the outer peripheral portion 121b of the terminal forming frame 121.
As a result, burrs 115 a and 115 a are formed in the gap between the upper mold 134 and the lower mold 133. Therefore, as shown by b in FIG. 46, there is a problem that the piezoelectric vibrator 100 having an unnecessarily large outer shape is formed.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, and to provide a small-sized molded component resin without forming burrs on the side surfaces in a step of resin-molding an electronic component having a long shape in one direction with a molding material. An object of the present invention is to provide a structure of a mold and a manufacturing method thereof.

[0009]

SUMMARY OF THE INVENTION The object of the present invention is to provide an electronic apparatus comprising: a molded part obtained by inserting an electronic component between lead frames disposed at both ends and resin-molding the electronic component. The respective lead frames are provided so as to protrude inward from an outer peripheral portion of a shape surrounding the electronic component in a mold structure, and the electronic component is bonded to the lead frame, and the electronic component side surface and the This is achieved by a resin molded structure of a molded part in which a space is provided between the outer peripheral portion and a mold for resin molding.

According to the first aspect of the present invention, each lead frame is provided so as to protrude inward from an outer peripheral portion having a shape surrounding the electronic component, and the electronic component is joined to the lead frame. A large space is formed between the outer peripheral portion and the side surface of the electronic component. Thereby, the mating surface of the upper mold and the mating surface of the lower mold for molding can completely enter between the outer peripheral portion and the side surface of the electronic component. As a result, burrs based on the gap generated by the upper mold and the lower mold not matching the opposing surfaces are not formed on the side surfaces of the electronic component. Can be.

[0011] Further, the object of the present invention is a method of manufacturing a molded component in which an electronic component is inserted between lead frames disposed at both ends and the electronic component is resin-molded. In the molding step of forming the resin mold, the electronic component was joined to an outer peripheral portion having a shape surrounding the electronic component and the lead frame provided with each of the lead frames so as to protrude inward from the outer peripheral portion. In this state, prepare a terminal forming frame provided with a space where a mold for resin molding can enter between the side surface of the electronic component and the outer peripheral portion, and form a frame for molding between the side surface of the electronic component and the outer peripheral portion. This is achieved by a method for manufacturing a molded part, in which molding is performed such that the mating surface of the mold enters.

According to the second aspect of the present invention, the outer peripheral portion is provided by using a terminal forming frame provided with a space between the side surface of the electronic component and the outer peripheral portion where a mold for resin molding can enter. And between the electronic component side surface,
The mating surface of the upper mold and the mating surface of the lower mold for molding are completely inserted. For this reason, for the same reason as in claim 1, no burr is formed on the side surface of the electronic component due to a gap caused by the upper mold and the lower mold not matching the opposing surfaces. Can be formed smaller than before.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 4 show the configuration of a piezoelectric vibrator as an embodiment of a molded part to which the present invention is applied. FIG. 1 is a schematic plan view of the piezoelectric vibrator of the present embodiment, and FIG.
1 is a schematic sectional view taken along line CC of FIG. 1, FIG. 3 is a schematic bottom view thereof, and FIG. 4 is a schematic sectional view taken along line DD of FIG.

FIGS. 1 and 2 of these drawings show the internal structure of a transparent mold resin for convenience of understanding.

In these figures, the piezoelectric vibrator 10
A package 11 called a quartz tube is built in. The package 11 is formed of a metal cylindrical bottomed cylinder, and has an enlarged diameter portion 11c on the opening side. A piezoelectric vibrating reed 12 joined to the inner lead is housed in the package. The piezoelectric vibrating reed 12 is formed by a piezoelectric action.
As a piezoelectric material that vibrates at a predetermined frequency when a driving voltage is applied, for example, a crystal piece that is a thin vibrating piece of crystal is used, and on the surface thereof, a driving voltage is applied to the crystal to cause a predetermined vibration. By forming electrodes (not shown) necessary for this, a quartz vibrating piece is obtained. As the piezoelectric vibrating reed 12, besides quartz, for example, LiTaO
3, a piezoelectric vibrating reed may be formed using a piezoelectric material such as LiNbO3.

The inner lead 12a joined to the drive electrode of the crystal vibrating reed 12 is
Through the plug 11d made of an insulating material, which is mounted on the package 11, and is drawn out as the outer leads 12b, 12b, and is exposed to the outside of the package 11,
13. The electrode terminals 13 are exposed to the outside from one end of the resin mold portion 15.

That is, the entire package including the crystal resonator element 12 and the outer leads 12b, 12b is made of a predetermined molding material, for example, a resin material such as an epoxy molding material, as described later. By being molded, it is a molded part.

One end of each of the electrode terminals 13, 13 is connected to the inside of the resin mold portion 15 so that the electrode terminals 13, 13 are exposed from one end of the resin mold portion 15. The outer leads 12b, 12b on the side of the crystal vibrating piece 12 are joined and electrically connected, and are bent in a crank shape as shown in FIG. Is exposed.

On the other hand, dummy terminals 14, 14 not connected to the crystal vibrating piece 12 side are exposed from the other end of the resin mold portion 15 by insert molding. It is formed.

The electrode terminals 13, 13 are formed such that the corners of the resin mold portion 15 are formed on tapered inclined surfaces 19, 19 so as to be exposed from the inclined surfaces. This is the same on the lead frame 14 side.

Further, as shown in FIGS. 1 and 2 of the piezoelectric vibrator 10, concave portions 16 and 17 formed by eject pins formed at the time of molding the resin mold portion 15 are provided at positions from the left and right ends, respectively. Is provided. On the lower surface (bottom surface) of the piezoelectric vibrator 10, a recess 18 for a positioning pin of the package 11 is formed inside the recess 17 formed by the eject pin. For these,
This will be described in detail in a molding step described later.

Since the piezoelectric vibrator 10 is formed as a molded part by molding the package 11 containing the piezoelectric vibrating piece 12 by the resin mold part 15, it is automatically mounted similarly to other molded parts such as semiconductor parts. The parts can be mechanically mounted by a machine. Then, the electrode terminals 13, 13 and the dummy terminals 14, 14 are placed on lands (not shown) on a predetermined mounting substrate to be mounted, and are fixed by soldering. Thereby, in the mounting equipment, the outer lead 12b and the inner lead 12a are connected to the crystal vibrating piece 12 via the substrate and the electrode terminals 13 and 13.
When a drive voltage is applied to the device, the device oscillates at a predetermined oscillation frequency. Then, this vibration can be electrically extracted and used for a predetermined clock signal or the like of a device to be incorporated.

<Method of Manufacturing Piezoelectric Vibrator> Next, a method of manufacturing the piezoelectric vibrator 10 will be described.

FIG. 5 is a flowchart simply showing a method of manufacturing the piezoelectric vibrator 10, and first, these steps will be schematically described.

A polishing and cutting process is performed on a predetermined piezoelectric material, for example, a quartz wafer to form a quartz piece for each product, and an electrode film necessary to operate as a vibrating piece on the front and back surfaces. Is formed to form the piezoelectric vibrating reed 12. After sealing the piezoelectric vibrating reed in the package 11, the outer leads 12b, 12b are connected to the electrode terminals 13, 1
3 (ST)
1).

Next, the package 11 is resin-molded with a predetermined molding material (ST2) to provide a resin mold portion 15.

Subsequently, through a step (ST3) of forming a groove in the lead frame to be the electrode terminals 13, 13 and the dummy terminals 14, 14, the lead frame is plated with solder (ST4).

Next, the individual molded parts supported by the lead frame are dropped out (ST5), and the completed product is mounted on a mounting board using solder (ST6).

Each of these steps will be described in detail below.

<Joining Step of Outer Lead to Lead Frame (ST1)> FIGS.
The outer leads 12b, 12b of the crystal unit, also called a cylinder type crystal unit, in which the electrode leads 1 are connected.
It is a drawing for explaining a process of joining to lead frames Nos. 3 and 13.

First, in order to understand the present embodiment, a conventional process will be described. FIG. 6 (A) is a perspective view and FIG.
As shown in the side views of FIG. 7B, the terminal forming frame 121 is a frame body in which a rectangular window-like space 121a larger than the package 11 is partitioned by an outer peripheral portion 121b. As shown, each section 12
1a is provided in plurality vertically and horizontally.

Lead frames 113 and 11 extending inward are provided at both ends in the longitudinal direction of the space 121a.
4 are formed, and at least one of the lead frames protrudes inward side by side as two lead frames 113 and 113. The lead frames 113, 113 function as electrodes of the piezoelectric vibrator. The lead frame 114 serves as the above-mentioned dummy terminal.

As shown in FIG. 6B, each lead frame 113 serving as an electrode terminal is connected to a terminal forming frame 121.
A portion 113a extending substantially horizontally from the space 121a of the
An upright portion 113b extending substantially vertically and integrally from the inside of the horizontally extending portion 113a;
And a lead terminal joining portion 113c extending horizontally from the upper end of the lead terminal.

The lead frame 114 has an upright portion 114b on the inside, and extends outward from the upright portion 114b integrally with the terminal forming frame 113, that is, outwardly. Extending portion 114a
have. After the resin molding, the distal end of the outwardly extending portion 114a becomes a horizontal portion that extends horizontally from the resin molded portion to form a dummy terminal.

In this joining step, the package 11 as an electronic component is inserted between the lead frames 113 and 114, and is properly aligned, and the outer leads 12b, 12b, which are the lead terminals of the package 11, are connected to the lead frame 113, 114. 113 lead terminal joining portion 113c,
The substrate is put on the substrate 113c and sandwiched by electrodes as described later, and a welding voltage is applied to perform joining.

As shown in FIG. 7, the terminal forming frame 121 is provided with positioning through-holes 122 at regular intervals along both ends. On the other hand, an electrode block 124 for supplying a drive voltage for welding used for joining the lead frames to the terminal forming frame 121 is aligned from below the terminal forming frame 121. Electrode block 1
24 is provided with an electrode (not shown).

Positioning pins 123 are provided along both end edges of the electrode block 124 so as to stand at regular intervals corresponding to the positioning through holes 122 of the terminal forming frame 121. By inserting the positioning pins 123 into the positioning through holes 122 of the terminal forming frame 121, the electrode block 1
24 and the terminal forming frame 121 are aligned.

Next, the package 11 is provided with an R surface corresponding to the cylindrical side surface of the package 11, and a predetermined transfer jig 22 capable of holding the package 11 by suction or the like.
Accordingly, the connection is carried into each space portion 121a inside the outer peripheral portion 121b of the terminal forming frame 121, and the bonding described with reference to FIG. 6B is performed.

However, as shown in FIG. 8, according to such a method, the electrode block 124 and the lead frames 113 can be positioned relative to each other. Is difficult, and the position may be shifted in the direction of the arrow in FIG. Therefore, the outer leads 12b, 12b, which are the lead terminals of the package 11, are
There is a disadvantage that it is not possible to correctly position and join the lead terminal joining portions 113c, 113c of the 3,113 lead terminals.

Therefore, in the present embodiment, FIGS.
The positions of the electrode block 124, the lead frames 113, 113 and the package 11 are determined by the method shown in FIG.

FIG. 9 is a view for explaining the joining method of the present embodiment. The terminal forming frame 21 is a frame body in which a rectangular window-like space 21a larger than the package 11 is partitioned by an outer peripheral portion 21b. And each section 2
1a is provided in plurality vertically and horizontally.

At both ends of the space 21a in the longitudinal direction,
Lead frames 13 and 14 extending inward are formed, and at least one of the lead frames 13 and 13 protrudes inward as two lead frames. This one lead frame is lead frame 1
Reference numerals 3 and 13 function as electrodes of the piezoelectric vibrator. Further, the lead frame 14 serves as the above-described dummy terminal.

As shown in FIG. 12, each lead frame 13 serving as an electrode terminal is provided in the space 2 of the terminal forming frame 21.
There is provided a portion 13a extending substantially horizontally from 1a, a rising portion 13b extending substantially vertically integrally from the inside of the horizontally extending portion 13a, and a lead terminal joining portion 13c extending horizontally from the upper end of the rising portion 13b.

The lead frame 14 has an upright portion 14b on the inside, and extends integrally from the upright portion 14b and is connected to the terminal forming frame 13, that is, outward. It has an extending portion 14a. After the resin molding, the distal end of the outwardly extending portion 14a becomes a horizontal portion extending horizontally from the resin molded portion to form a dummy terminal.

As shown in FIG. 9, the terminal forming frame 21 is provided with positioning through-holes 122 at regular intervals along both edges. On the other hand, the electrode block 23 for supplying a drive voltage for welding used for joining the lead frame to the terminal forming frame 21 is aligned from below the terminal forming frame 21. In the electrode block 23,
An electrode (not shown) is provided.

As positioning means for the terminal forming frame along the both ends of the electrode block 23, positioning pins 23 are provided at regular intervals corresponding to the positioning through holes 122 of the terminal forming frame 21. The electrode block 23 and the terminal forming frame 121 are aligned by inserting the positioning pins 123 into the positioning through holes 122 of the terminal forming frame 121. .

The configuration up to this point is the same as that of the conventional joining method, but an electronic component holding means 24 is formed on the upper surface of the electrode block 23. The electronic component holding means 24 is formed according to the shape of the corresponding electronic component so as to function as a positioning means for the electronic component. For this reason, the electrode block 23 of the present embodiment includes positioning means for both the terminal forming frame 21 and the package 11. Specifically, the electronic component holding means includes:
In this embodiment, a convex portion is formed on the upper surface of the electrode block 23, and the upper surface 24a of the convex portion is an R surface corresponding to the cylindrical side surface of the package 11. As a result, FIG.
As shown in FIG.
3 and 13 can be positioned with respect to each other, and the package 11 can be positioned on the upper surface 2 of the electronic component holding means 24.
By being placed on 4a, there is no risk of lateral displacement or the like, and positioning is performed correctly.

That is, the package 11 has a predetermined transfer jig 2 having an R surface corresponding to the cylindrical side surface of the package 11 and capable of holding the package 11 by suction or the like.
2 by moving into the respective space portions 21a inside the outer peripheral portion 21b of the terminal forming frame 21 according to FIG.
As shown in (1), the plurality of packages 11 can be easily positioned with respect to the terminal forming frame 21.

Here, there is the following problem in the joining step.

Conventionally, after the lead frames 113, 113 and the package 11 are positioned on the electrode block 124, as shown in a partially enlarged view of FIG.
Weld by applying the voltage at the joint of No. 3.

In this case, with the outer leads 12b mounted on the lead frame 113, the lower electrode 31 is applied to the lead frame 113 from below, and the upper electrode 32 is placed from above.
Is applied to the outer lead 12b, a voltage is applied between the upper electrode 32 and the lower electrode 31 while being sandwiched and pressed.

However, from the upright portion 113b of the lead frame 113, the lead terminal joining portion 113
Since c extends, the lower electrode 31 may come into contact with the bent corner portion 113d, and a gap 113e may be generated. When such a gap 113e is generated, there is a problem that the applied current is not sufficiently transmitted and the joining is not performed well.

Further, following the joining, as shown in FIG. 14, the package 11 is sandwiched between the upper mold 34 and the lower mold 33, and a molding material is injected by transfer molding to perform resin molding. Substantially horizontally extending portions 113a and 113 of frame 113 and lead frame 114
If each 4a has a slope that rises slightly inward, gaps 33a and 33b may occur, respectively.

For this reason, the molding material may enter the gaps 33a and 33b and generate burrs, which may degrade the product quality.

When the package 11 as an electronic component is inserted between the lead frames 113 and 114,
As shown by the solid line in the enlarged view of FIG. 15, when the upright portion 114b of the lead frame 114 on the dummy terminal side rises vertically, when the position of the package 11 is slightly displaced in the longitudinal direction, the dummy terminal side Lead frame 1
In some cases, the upright portion 114 b of the package 14 and the end of the package 11 abut and interfere with each other, so that the package 11 as an electronic component cannot be inserted between the lead frames 113 and 114.

In particular, in the case of performing mechanical processing using the transfer jig 22, in such a situation, the subsequent steps cannot be appropriately advanced.

Therefore, in this embodiment, first, the lead frame on the electrode terminal side is configured as shown in FIG.

That is, as shown in the figure, with respect to the lead frame 13 serving as an electrode terminal, at least the lead terminal joining portion 13c is in a state of being attached to the terminal forming frame 21 (see FIG. 9) in FIG. It is made to fall, that is, the inside is inclined downward. In this case, the lead terminal joining portion 13c of the lead frame 13 and the space 21 of the terminal forming frame 21 are formed.
In the case where the portion 13a extending substantially horizontally from "a" is formed substantially in parallel, the lead terminal joining portion 13c and the portion 13a extending horizontally are formed so that the inside is inclined downward.

As a result, as shown in FIG. 16, the lower electrode 31 is connected to the lower corner 13 at the tip of the lead terminal joining portion 13c.
d, and is pressed between the upper electrode 32 contacted from above the outer lead 12b so as to be horizontally corrected as shown by the dotted line. The lower surface of the terminal joining portion 13c is prevented from coming into contact with the entire surface to form a gap as shown in FIG. Thereby, by appropriately applying a voltage to the outer lead 12b and the lead terminal joining portion 13c, the joining is ensured.

Further, in the present embodiment, as shown in FIG. 17, the angle θ formed by the horizontally extending horizontal portion 14a and the upright portion 14b of the lead frame 14 serving as the dummy terminal is 90 degrees.
It is designed to be less than degrees.

As a result, as shown by the solid line in FIG. 15, when the package 11 is inserted, it can be easily inserted without interfering with its end.

FIG. 17 shows the terminal forming frame 21.
Although the lead frame 14 attached to the lead frame 14 is omitted from the terminal forming frame 21 for the sake of easy understanding, a portion of the lead frame 14 extending outside the horizontal portion 14a is a resin The parts 14c, 14c exposed from the mold part extend in a state of being divided into two parts with the concave part 14d interposed therebetween.

As described above, as shown in FIG. 18, when the upper mold 34 and the lower mold 34 are moved in the closing direction in a state where the package 11 is accommodated in a molding step described later, the upper mold 34 and the lower mold 34 are moved. When the is still open, both the substantially horizontally extending portions 13a and 14a of the lead frame 13 and the lead frame 14 have a slight downward slope inward.

When the upper mold 34 and the lower mold 34 are closed as shown in FIG. 19, the portions 13a and 14a are straightened horizontally. In this state, even if the molding material is injected into the mold, As described with reference to FIG.
a is slightly inclined and no gap is generated. For this reason, it is possible to effectively prevent the molding material from entering into such gaps to generate burrs and impair the product quality.

Thus, as shown in FIG. 20, the package 11 as an electronic component is properly positioned and inserted between the lead frames 13 and 14 provided on the terminal forming frame 21 by the above-described method, and the outer leads are formed. 12b
And the lead frame 13 are accurately joined.

<Molding Step of Resin Molding Section 15 (ST
2)> Next, as shown in FIG. 21, the upper mold 34 and the lower mold 34 are closed with the package 11
The process of injecting a molding material from above and molding the resin mold portion 15 as shown in FIG. 22 will be described.

Here, in this embodiment, FIG.
As described with reference to FIG. 5, not only the formation of burrs, which is a problem in the conventional molding process, but also the problem as shown in FIG. 23 is solved.

That is, as shown in FIG.
The holding state of the package 11 is incomplete because the package 11 is merely in contact with the contact portion 133a formed on the upper surface of the lower mold 133 and the eject pin 134a that moves up and down inside the upper mold 134. Positioning could not be performed accurately, resulting in a position shift. In this case, FIG.
When a large displacement occurs in the arrow method of FIG.
Side protrudes from the resin mold part 115.

Further, the bottom surface of the package 11 is exposed by the abutting portion 133a which abuts on the lower surface of the package 11, without the molding material covering the bottom surface of the package 11, and the package 11 and the circuit pattern of the substrate come into contact with each other. In some cases, this is not preferable.

Further, when the contact portion 133a and the eject pin 134a sandwich the package 11 at the same vertical position,
The power is concentrated on one part of the package 11, and the package 11
May be deformed.

In consideration of these points, in the present embodiment,
The molding is performed by the following method.

That is, as shown in FIG.
The outer peripheral portion 21b of the terminal forming frame 21 made of a conductive metal frame such as a copper-based alloy is
The resin molded portion 15 is formed by molding a package 11 as an electronic component with a molding material.

In this case, as shown in FIG. 25 which is a sectional view taken along the line ee in FIG. 24, the outer peripheral portion 21b of the terminal forming frame 21 is formed at the edge of the upper mold 34 and the lower mold 33 for molding. The molding is performed in a state of being sandwiched therebetween.

That is, as shown in FIG.
The mating surface 34a of the upper mold 34 and the mating surface 33a of the lower mold 33
Completely penetrates inside the outer peripheral portion 21b.
That is, the outer peripheral portion 21b of the terminal forming frame 21 of the present embodiment is configured to have a space 21a large enough to allow the mating surface 34a of the upper mold 34 and the mating surfaces 33a, 33a of the lower mold 33 to enter. ing.

As a result, as shown in FIG. 26, the piezoelectric vibrator 10 as a molded part is
Since no burrs are formed on the side surfaces, the outer shape is in a state of a dimension c, and the outer shape can be formed smaller than in the related art.

Further, on the upper surface of the lower die 33, an electronic component positioning means 36 is provided instead of the conventional contact portion. That is, the positioning means 36 has a positioning function, in particular, in FIG.
, For example, protrudes from the upper surface of the lower mold 33 in a pin shape, and the abutment surface 36 a of the R is formed along the cylindrical side surface of the package 11.
It is formed as a concave surface. As a result, the package 11 is held by the concave surface of the contact surface 36a in a state of being sandwiched between the eject pin 37 that moves up and down inside the upper die 34 and the positioning means 36, and thus, the package 11 extends in the lateral direction. There is no deviation and no side exposure from the resin mold portion 15 after molding.

More preferably, as shown in an enlarged manner on the right side of FIG.
A concave portion 36b may be formed near the center.

As a result, as shown in FIG. 27, the molding material enters the concave portion 36b during molding,
Since the recess 36c on the bottom surface of the piezoelectric vibrator 10 is surely covered with the mold resin 36d,
Even if it comes into contact with the upper conductive pattern 52, it can be reliably insulated.

Further, in this embodiment, preferably, as shown in FIG.
Two eject pin holes 37a, 37a are formed from both ends in the longitudinal direction of the upper surface of 5, and the recess 36c formed by the above-described positioning means on the bottom surface side is disposed inside these.

Therefore, since the eject pin 37 described in FIG. 25 at the time of molding abuts on a relatively structurally strong position near the end of the package 11 which is long in one direction, it is effective to deform the tubular package 11. Is prevented. Moreover, since the eject pin 37 and the positioning means 36 are not formed at the same position in the vertical direction in FIG. 25 as in the related art, the package 11 is sandwiched between the eject pin 37 and the positioning means 36, It is possible to effectively prevent a situation in which a force is concentrated on one place and deformed.

Next, other features of the molding method according to the present embodiment will be described. FIG. 28 is a diagram for explaining a conventional process for the sake of understanding.

FIG. 28A shows the terminal forming frame 12.
1 to cover the package 11 with resin
15 shows a case where a molding gate 135 is provided in the vicinity of the lead frame 114 on the dummy terminal side when molding is performed.

In this case, the lead frame 114 is at a height near the bottom surface of the resin mold portion 115 and is exposed to a horizontal portion 114a exposed outside the resin mold portion 115.
Is a single flat plate. For this reason, FIG.
Since the gate 135 interferes with the horizontal portion 114a of the single-plate lead frame 14, as shown in the ff line sectional view of FIG. I have. For this reason, the distance from the upper end of the gate 135 to the upper end of the resin mold portion 15 has only a dimension indicated by a.

Here, the piezoelectric vibrator 100 is an extremely small component, and for example, the height of the resin mold portion 15 shown in FIG. 28A is about 1.3 mm in total. For this reason, if the height of the resin mold portion is only the dimension a above the gate 135 in FIG. 28B, cracks may occur in this portion when the gate is cut, and the product quality is impaired. .

Therefore, in the present embodiment, such a situation is prevented by adopting a configuration as shown in FIG.

In this embodiment, as described with reference to FIGS. 12 and 17, the lead frame 14 has an upright portion 14b inside, and the lead frame 14 is integrally formed from the upright portion 14b.
It has a portion that extends outward and is connected to the terminal forming frame 13, that is, a portion 14a that extends outward.
The tip of the outwardly extending portion 14a constitutes a dummy terminal exposed from the resin mold portion 15 after the resin molding. That is, the portions 14c, 14c exposed from the resin mold portion 15 are formed as shown in FIG.
The divided dummy terminal is formed to extend in a state of being divided into two parts with 4d interposed therebetween. In FIG. 29A, a gate 35 is provided in a region 14e between the divided dummy terminals 14c, 14c exposed from the mold portion 15 corresponding to the concave portion 14d.
Is provided. This gate 35 is shown in FIG.

As a result, as shown in FIG. 29B, which is a cross-sectional view taken along the line gg of FIG. 29A, the gate 35 enters the region 14e between the divided dummy terminals 14c, 14c. Compared to the case of FIG. 28B, the height b of the horizontal portion 114a is lower than that of the horizontal portion 114a, and the dimension b above the gate 35 is equal to the height t of the horizontal portion 114a in FIG. Is larger than the distance a.

As a result, the size of the resin mold portion 15 can be sufficiently increased above the gate 35, so that it is possible to effectively prevent the occurrence of cracks in this portion at the time of mold release in the molding step.

Thus, as shown in FIG. 30, the molding step of covering the package 11 with the resin mold portion 15 using the terminal forming frame 21 is completed.

<Step of Forming Groove in Lead Frame (ST)
3) and solder plating step (ST4)> The outer leads 1 are attached to the lead frames 13, 13 of the terminal forming frame 21.
2b and 12b are joined, and after the molding step of performing resin molding is completed, the outer peripheral portion 21b of the terminal forming frame 21
Grooves are formed in the lead frames 13 and 14 that connect the lead frame 13 and the resin mold portion 15 as an electronic component.

The formation of the groove is necessary mainly for removing the product, which is a subsequent process, and for improving the mounting performance when the product is mounted on the substrate.

Specifically, for example, a groove is formed as shown in FIG. FIG. 31 is a diagram showing the terminal forming frame 21 of FIG. Resin mold portion 15 in which package 11 is covered with molding material
Are joined to the outer periphery 21b of the terminal forming frame 21 by the lead frames 13 and 14 at both ends.
For example, in the case of the present embodiment, the portions 13a, 13a that are exposed to the outside of the resin mold portion 15 of the lead frames 13, 13 and extend horizontally with respect to the outer peripheral portion 21b, and the resin mold portion 15 of the lead frame 14, Are connected at portions 14c, 14c which are exposed to the outside and extend horizontally.

Between the horizontally extending portions 13a, 13a, 14c and 14c, which are the joining portions of the lead frames, and the outer peripheral portion 21b, a V-shape or a U-shape as shown in FIG. Grooves 41, 41,
42, 42 are formed.

The grooves 41, 41, 42, 42 are
For example, in the former molding step, the lower mold 33
May be formed by providing projections corresponding to these grooves 41, 41, 42, 42. After the forming step, the grooves 41, 41, 42, 42 are formed.
Alternatively, a mold having projections corresponding to 42, 42 may be pressed to form. It can also be formed when a lead frame is created.

After forming such grooves, solder plating is applied to each of the lead frames 13 and 14 as described later.

FIGS. 32 to 34 are diagrams for explaining one of the problems of the conventional piezoelectric vibrator 100 in which such a groove 41, 41, 42, 42 is not provided in the lead frame.

As shown in FIG. 32, in a state where the lead frames 113 and 114 are connected to the terminal forming frame, a solder plating 141 is provided on each lead frame. Next, as shown in FIG.
3, 114 are cut off from the terminal forming frame, and as shown in FIG. 34 (A), solder 53 is applied on the conductive pattern 52 of the mounting substrate 51, and the lead frame 113 serving as an electrode terminal is formed. And mount it. FIG.
(B) is an enlarged view of this mounting location.

As shown in FIG. 34 (B), the solder 53 does not adhere to the outer (right) side surface 113g in the drawing of the lead frame 113 and rises.

That is, since the inner (left) side surface 113f in the drawing of the lead frame 113 is plated with solder, the wettability with the mounting solder 53 is good, and the solder 53 adheres to this side surface 113f. However, since it does not adhere to the outer (right) side surface 113g in the drawing of the lead frame 113, there is a problem that the mounting strength is reduced accordingly.

Therefore, in the present embodiment, since the grooves are formed in the lead frames 13 and 14 after the molding step, the above-described problem does not occur at the time of mounting after the product drop-out step, as described later. It is like that.

This point will be described in detail in the mounting process.
In order to explain another advantage of forming the groove in No. 4, a step of extracting a product will be described.

<Product Drop-Out Step (ST5)> FIG.
Numeral 5 shows a part of a manufacturing process of a conventional molded part, and schematically shows a method of cutting a lead frame and extracting a product.

FIG. 35 (A) shows a molded part 1 before being dropped out.
00, a plan view in the center, and aa
A cross-sectional view taken along a line, and a cross-sectional view taken along a line bb below are shown.

In the figure, a molded part 100 is, for example,
The figure shows a piezoelectric vibrator, in which a predetermined crystal vibrating piece or the like is housed in a cylindrical package (not shown), and its electrode terminals are joined to lead frames 113, 113, 114, 114 to form a predetermined mold. The resin molded portion 115 is molded using a molding material made of synthetic resin.

From this state, as shown in FIG. 35 (B), each lead frame 113, 113, 114, 114
The frame-shaped die 106 is arranged below the lead frame 113, and the lead frames 113, 113, 114, 114 are fixed on the die 106. Next, a pressing means 105 smaller than the inner circumference of the die 106 is applied to the resin mold portion 115, and the resin mold portion 115 is pushed toward the die 106, thereby all of the lead frames 113, 113, 114, 114 are removed. The part is cut so as to be torn off, and the molded part 100 is pulled out as shown in FIG.

However, according to such a drop-out method, cracks may occur in the molding material of the resin mold portion 115 formed in the previous step. FIG.
Due to the impact of the cutting operation in FIG. 5 (B), for example, the package breaks inside the resin mold portion 115, and the CI (crystal impedance) value of the crystal vibrating piece (not shown) increases, and the oscillation of the crystal vibrating piece increases. The performance characteristics may be degraded, for example, may stop.

In order to avoid such an adverse effect, in the present embodiment, the following product drop-out step is performed.

FIG. 36 shows a part of the manufacturing process of the molded part of the present embodiment, and schematically shows a method of cutting out the product by cutting the lead frame.
Although the fine shapes of the lead frames 13 and 14 do not match with the other drawings, there are restrictions on the drawings, and the configuration is the same as that shown in the other drawings.

FIG. 36 (A) shows the piezoelectric vibrator 10 as a molded component before being dropped out, a plan view in the center, a cross-sectional view taken along the line hh above, and a cross-sectional view taken along the line ii in the lower part. FIGS. 36A to 36C show the configuration of FIG.
The same applies to (D).

In FIG. 36 (A), the piezoelectric vibrator 10 after the molding step is connected to lead frames 13, 13, 14, and 14.
With this structure, the lead frame 13 is supported by the outer peripheral portion 21b of the terminal forming frame 21.
The grooves 41 and 42 are formed in the grooves 4 and 14, respectively. In this state, the above-described solder plating on the lead frame is also performed after forming the grooves.

From this state, as shown in FIG. 36B, one lead frame 1 is used as a first cutting step.
Cut off 3,13.

In this case, first, as shown in the lower part of FIG. 36B, a base 61 is disposed below the resin mold portion 15. The base 61 is mounted on the resin mold 1
5 has a flat upper surface which is larger than the outer periphery of the lead frame 13 and has a width as shown in the drawing.
The positions of the grooves 41 and 41 are substantially the same.

Next, the discharging means 62 descends onto the resin mold portion 15. The discharging means 62 can move up and down in the thickness direction of the terminal forming frame 21, and
5 is received from above, and after the lead frame is cut, the piezoelectric vibrator 10 as a molded component can be pulled downward by the lowering operation of the discharging means 62. The width of the discharging means 62 is, as shown in FIG.
The positions almost coincide with the positions of the bases 61 and 41.

A pair of cutting blades 6 as first cutting blades operable at the same or different timing as the discharging unit 62 in the same direction as the operation direction of the discharging unit 62 is provided outside the discharging unit 62.
3, 63 are provided. The pair of cutting blades 63, 63, which are the first cutting blades, have cutting edges of the lead frames 13, 1, respectively.
3 is set to match the position of the grooves 41, 41,
In this first cutting step, the discharging means 62 comes into contact with the resin mold part 15 from above the resin mold part 15 supported on the base 61 and slides along the side surface of the discharging means. A pair of cutting blades 63, 63 as blades descend.
Thereby, the pair of cutting blades 63 and 6 that are the first cutting blades are formed.
3 cuts the positions of the grooves 41, 41 of the lead frames 13, 13 from the opposite side, and separates the lead frames 13, 13 at the positions of the grooves 41, 41.

In the first cutting step, unlike the conventional case, since a cutting blade is used, the impact at the time of cutting can be smaller than that in the case of tearing. Further, since the positions of the grooves 41, 41 of the lead frames 13, 13 are cut, the cutting area is smaller than that of the conventional cutting process,
This also reduces the impact at the time of cutting.

Next, a second cutting step is performed. That is, as shown in FIG.
The discharging means 62 descends to hold the resin mold portion 15 on the base 61. A pair of cutting blades 64, 64, which are second cutting blades operable at the same or different timing as the discharge unit 62 in the same direction as the operation direction of the discharge unit 62, are provided outside the discharge unit 61. The pair of cutting blades 64, 64, which are the second cutting blades, are set so that the cutting edges match the positions of the grooves 42, 42 of the lead frames 14, 14.

Thus, in the second cutting step, the discharge means 62 comes into contact with the resin mold part 15 from above the resin mold part 15 supported on the base 61, and slides along the side surface of the discharge means. A pair of cutting blades 64, 64, which are moving second cutting blades, descend. Thus, the pair of cutting blades 64, 64, which are the second cutting blades, are connected to the lead frame 14,
14 is cut from the opposite side to the position of each groove 42, 42, and the lead frame 14, 14 is cut into each groove 42, 4
Cut off at position 2.

In the second cutting step, as in the first cutting step, the impact is much smaller than the impact in the conventional cutting.

Then, as shown in FIG.
At the same time as the lead frames 14 and 14 are cut off by the cutting step, the discharging means 62 pushes the resin mold portion 15 into the base 61 side. If the base 61 is removed, the piezoelectric vibrator 10 becomes as shown in FIG. It will be extracted as shown.

That is, in FIG. 37, the deepest row shows a state in which the lead frame has not been cut yet, and the second row from the back shows the above-mentioned second cutting step by hatching. The indicated lead frame is cut. In the third row from the back, the second cutting step is performed by cutting the lead frame indicated by oblique lines, and in the fourth row from the back, that is, in the frontmost row,
The piezoelectric vibrators 10, 10 are extracted.

As described above, in the product withdrawal step (ST5) in this embodiment, each of the lead frames 13, 14 is removed.
Are cut using a cutting blade, and are cut in a plurality of stages, in the above example, in two stages, so that the cutting is remarkably performed as compared with the conventional cutting process. The impact at the time can be reduced, and the impact transmitted to the product can be greatly reduced. Note that the number of cutting steps is not limited to two steps, and may be further divided into more steps as necessary.

In addition, as described above, by providing the grooves 41 and 42 in the lead frames 13 and 14,
In the next mounting step, the following effects can be exhibited.

<Mounting Step (ST6)> FIGS. 38 and 39
38 shows a step before the mounting step. First, in FIG. 38, as described above, the grooves are formed in the lead frames 13 and 14 while the lead frames 13 and 14 are connected to the terminal forming frame 21. (See FIG. 31).

Next, as shown in FIG. 39, a solder plating 61 is provided on each lead frame.

Next, as shown in FIG. 40, the lead frames 13 and 14 are cut off from the terminal forming frame 21 and cut off from the terminal forming frame 21 by the above-described product dropping step (FIG. 37).
41), and as shown in FIG.
The solder 53 is applied on the conductive pattern 52, and the lead frame 13 serving as an electrode terminal is mounted. FIG.
(B) is an enlarged view of this mounting location.

As shown in FIG. 41 (B), the solder 53 for mounting is not only wetted on the bottom surface of the lead frame 13 but also on the inner (left) side surface 13f on which the solder plating 61 is formed. Based on the adhered. Further, in the drawing of the lead frame 13, an outer (right) side surface 13e
Has a conventional structure, in which a groove 41 is formed at a lower portion. Since the groove 41 is also plated with solder 61, this portion also has good wettability with respect to the solder 53 for mounting.
Adheres.

Therefore, unlike the conventional case, the solder 53 adheres to the outer (right) side surface 13e in the drawing of the lead frame 13 at the time of mounting, so that the mounting strength is improved by that much and the electrical connection is further improved. Be certain.

The method of manufacturing the molded part according to the present embodiment is as described above. The piezoelectric vibrator 10 which is the molded part described with reference to FIGS. Add.

FIG. 43 schematically shows the left end of FIG. 1 of the piezoelectric vibrator 10, and FIG.
FIG. 44 is a schematic plan view showing a portion corresponding to FIG. 43 with respect to 0. 42, in the conventional piezoelectric vibrator 200, the corners of the resin mold portion 215 are substantially vertical, and the electrode terminals 213 and 213 are exposed so as to be exposed in both the width direction and the length direction of the resin mold portion 215. Is provided. This is because if the electrode terminals 213 and 213 are not exposed to the outside from the resin mold portion 215, they cannot be mounted on the mounting substrate. In particular, since the lands on the substrate are generally quadrangular, the width is particularly small. In the direction, the dimension d on each outer side is larger than the resin mold portion 15,
For this reason, the mounting pattern to be formed on the mounting substrate becomes larger than the size of the product (the resin mold portion 215).

On the other hand, in the configuration of FIG. 43 according to the present embodiment, the electrode terminals 13
Are formed as tapered inclined surfaces 19, 19, and are exposed from the inclined surfaces. The same applies to the lead frame 14 (not shown) provided at the other end.

As a result, the electrode terminals are exposed from the inclined surfaces 19, 19, which are inclined inward toward the ends, thereby exposing the quadrangular electrodes with a width smaller than the width of the resin mold portion 15. The width of the exposed electrode terminals 13 can be made smaller than the width of the resin mold portion 15 by the dimension e. As a result, if the size of the product (resin mold portion 15) is the same as that of the related art, the pitch of the mounting pattern to be formed on the mounting substrate can be narrowed accordingly, and the mounting area can be reduced. The invention is not limited to the embodiments described above.

The present invention can be applied not only to piezoelectric vibrators but also to various molded parts obtained by resin-molding electronic parts.

Further, for example, the order of the manufacturing process can be changed, and further, each condition and each configuration of the above-described embodiment can be appropriately omitted, or a part thereof can be combined with each other. .

[0135]

As described above, according to the present invention, in a step of resin-molding an electronic component having a long shape in one direction with a molding material, a compact component which can be formed in a small size without generating burrs on the side surfaces. A structure of a resin mold and a method of manufacturing the same can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a piezoelectric vibrator as an embodiment of a molded part according to the present invention.

FIG. 2 is a schematic cross-sectional view of the piezoelectric vibrator of FIG. 1 taken along line CC.

FIG. 3 is a schematic bottom view of the piezoelectric vibrator of FIG. 1;

FIG. 4 is a schematic cross-sectional view of the piezoelectric vibrator of FIG. 1 taken along line D-D.

FIG. 5 is a flowchart simply showing a manufacturing process of the piezoelectric vibrator of FIG. 1;

6A and 6B are views for explaining a conventional joining process of an outer lead and a lead frame, wherein FIG. 6A is a perspective view thereof, and FIG. 6B is a front view thereof.

FIG. 7 is an exploded perspective view for explaining a conventional joining process between an outer lead and a lead frame.

FIG. 8 is a partially enlarged view of the joining step of FIG. 7;

FIG. 9 is an exploded perspective view for explaining a joining step between the outer lead and the lead frame according to the embodiment.

FIG. 10 is a partially enlarged view of the bonding step in FIG. 9;

FIG. 11 is a schematic perspective view showing a state in which the outer leads are joined to the terminal forming frame in the joining step of the outer leads and the lead frame according to the embodiment.

FIG. 12 is a side view showing a state where a package is inserted between lead frames at both ends according to the embodiment;

FIG. 13 is a partially enlarged view showing a state in which an outer lead and a lead frame are joined in a conventional manufacturing process.

FIG. 14 is a schematic cross-sectional view showing a state where an outer lead and a lead frame are put into a molding die after joining in a conventional molding process.

FIG. 15 is a partially enlarged view showing a state where a package is inserted between lead frames in a conventional manufacturing process.

FIG. 16 is a partially enlarged view showing a state in which an outer lead and a lead frame are joined in the embodiment.

FIG. 17 is a partial perspective view showing a configuration of a lead frame 14 according to the embodiment.

FIG. 18 is a schematic cross-sectional view showing a state in which the outer lead and the lead frame are put into a molding die after being joined in the molding step of the embodiment.

FIG. 19 is a schematic cross-sectional view showing a state in which the outer lead and the lead frame are joined to each other in a molding die and then closed in the molding step of the embodiment.

FIG. 20 is a schematic perspective view showing a state in which an outer lead and a lead frame are joined in the embodiment.

FIG. 21 is a schematic cross-sectional view showing a state in which the outer lead and the lead frame are put into a molding die after joining in the molding step of the present embodiment, and the position of the gate is shown.

FIG. 22 is a schematic perspective view showing a state where resin molding is performed in a molding step of the embodiment.

FIG. 23 is a schematic sectional view showing a state of a package in a mold in a conventional molding step.

FIG. 24 is a schematic plan view showing a terminal forming frame used in the manufacturing process of the present embodiment in relation to a resin mold part.

FIG. 25 is a schematic sectional view taken along line ee of FIG. 24;

FIG. 26 is a schematic cross-sectional view showing a piezoelectric vibrator formed by the manufacturing process of the embodiment.

FIG. 27 is a schematic sectional view showing another example of the piezoelectric vibrator formed by the manufacturing process of the embodiment.

28 (A) is a partial perspective view showing the vicinity of a lead frame 114, and FIG. 28 (B) is a partial sectional view showing the vicinity of a lead frame 114. FIG.

29A and 29B are views showing a gate position in a molding step of the present embodiment, FIG. 29A is a partial perspective view near the lead frame 14, and FIG. 29B is a partial cross-sectional view near the lead frame 14.

FIG. 30 is a schematic perspective view showing a state where resin molding is performed in the molding step of the embodiment.

FIG. 31 is a schematic perspective view for explaining a groove forming step of the present embodiment.

FIG. 32 is a schematic sectional view showing a state of solder plating on a lead frame of a conventional molded part.

FIG. 33 is a schematic sectional view showing a state in which a lead frame of a conventional molded part is cut.

FIG. 34 shows a mounting state of a conventional molded part, and FIG.
(A) is a schematic sectional view, FIG.34 (B) is the elements on larger scale.

FIG. 35 is a process diagram showing a conventional product withdrawal process for molded parts.

FIG. 36 is a process chart showing a product withdrawal process of the embodiment.

FIG. 37 is a schematic perspective view showing a state in which a product is removed in a product removal step of the embodiment.

FIG. 38 is a schematic cross-sectional view showing how grooves are formed in a lead frame in the present embodiment.

FIG. 39 is a schematic sectional view showing a state of solder plating on a lead frame in the present embodiment.

FIG. 40 is a schematic sectional view showing a state in which the lead frame according to the embodiment is cut.

FIG. 41 (A) shows a mounted state of a molded component in the present embodiment, and FIG. 41 (A) is a schematic sectional view thereof, and FIG. 41 (B).
Is a partially enlarged view of FIG.

FIG. 42 is a partial schematic plan view showing a relationship between an end shape of a conventional molded part and an electrode terminal.

FIG. 43 is a partial schematic plan view showing the relationship between the end shape of the molded part of the present embodiment and the electrode terminals.

FIG. 44 is a schematic plan view showing a terminal forming frame used in a conventional manufacturing process in relation to a resin mold portion.

FIG. 45 is a schematic sectional view taken along line dd of FIG. 23;

FIG. 46 is a schematic sectional view showing a piezoelectric vibrator formed by a conventional manufacturing process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Piezoelectric vibrator 11 Package 12 Piezoelectric vibrating piece 13, 13 Electrode terminal (lead frame) 14 Dummy terminal (Lead frame) 15 Resin mold part 21 Terminal formation frame 21a Space part 21b Outer part 22 Transfer jig 23 Electrode block 24 Electronic component holding means 35 Gate 36 Positioning means 41, 42 Groove 51 Mounting board 52 Conductive pattern 53 Soldering for mounting

Claims (2)

[Claims] An electronic component is inserted between lead frames disposed at both ends and a resin molded structure of a molded component obtained by resin-molding the electronic component. The respective lead frames are provided so as to protrude, and an interval at which a mold for resin molding can enter between a side surface of the electronic component and the outer peripheral portion in a state where the electronic component is bonded to the lead frame. A resin molded structure of a molded part, characterized by being provided. 2. A method of manufacturing a molded component in which an electronic component is inserted between lead frames disposed at both ends and the electronic component is resin-molded. In the state where the electronic component is bonded to an outer peripheral portion of a surrounding shape and the lead frame provided with the respective lead frames so as to protrude inward of the outer peripheral portion,
Prepare a terminal forming frame provided with a space between the side of the electronic component and the outer peripheral portion where a mold for resin molding can enter, and align the molding die between the side of the electronic component and the outer peripheral portion. A method for producing a molded part, characterized in that molding is performed so that a surface enters.