JP2002066989A - Printed board cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board cutting device for manufacturing small printed boards in the same shape by cutting a substrate material in lattice, capable of cutting with high precision without requiring much labor. SOLUTION: A cut substrate material is placed on a device as it is, and an image of its cut line is recognized by a camera 8 to obtain an off-set amount of the cutting plane line from a target. The off-set amount is used as a correcting value in subsequent machining time. Also, a bottom of a clearance groove 6a of a substrate stage 4a is formed to be a mirror surface, so that an image of an edge of the cutting plane line is more clearly recognized. A nozzle 19 is placed under a cameral 8, so that the cut portion is blown by high pressure air and remaining cutting water is blown off, thereby realizing exact recognition of an image of the edge of the cutting plane line.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board cutting apparatus for cutting a large printed circuit board material (hereinafter referred to as a substrate material) in a grid pattern and cutting out a large number of small printed circuit boards therefrom. The present invention relates to a printed circuit board cutting device which has the same circuit pattern, has the same outer dimensions at the same time, and can cut with high dimensional accuracy.

[0002]

2. Description of the Related Art A printed circuit board, on which electronic components such as ICs and capacitors are mounted on a plastic substrate, which is a main material, and a wiring pattern for associating the electronic components is printed, forms one electric circuit. Today it is used in all electrical and industrial products. Some of the printed circuit boards have chamfers on the edges,
It is generally rectangular and may vary in size, such as a small one built into a mobile phone or a medium size built into a computer.

[0003] These printed boards are not provided with a wiring pattern or an electronic component insertion hole in a small shape from the beginning. A large number of printed circuit board elements (wiring patterns and electronic component insertion holes), which are final products, are processed into a large board material, and are finally divided one by one.

[0004] The elements of the large number of printed circuit boards are provided at equal pitches in the vertical and horizontal directions. That is, they are laid out in a grid pattern. Therefore, if the original large substrate material is cut into a lattice shape, a large number of printed boards having the same shape can be formed.

[0005] A printed circuit board cutting apparatus for cutting a substrate material in a lattice shape generally has the following structure. This will be described with reference to FIG. Cutting is performed by the spindle 1. The spindle 1 rotates at a high speed exceeding 5000 rpm at the tip,
It has a cutting blade 2 (thin blade whetstone) having a thickness of about 1 mm. The spindle 1 is fixed to a Y-axis slider 3, and can move in the Y-axis (front-back) direction together with the Y-axis slider 3. At the same time, the spindle 1 can also move in the Z-axis (vertical) direction. On the other hand, the substrate stage 4 is fixed to the X-axis slider 5 and can move in the X-axis (left and right) directions together with the X-axis slider 5. Also,
The portion to which the substrate stage 4 is fixed is also movable in the θ-axis (rotation) direction. Therefore, the substrate stage 4 has the X axis and θ
It is movable in the axial direction. Here, on the upper surface of the substrate stage 4, there are provided a plurality of cutting relief grooves 6 provided in a lattice shape and a large number of suction holes 7 for sucking the substrate material. Naturally, the X and Y axis pitches of the cutting relief grooves 6 are the same as the X and Y axis pitches when cutting the substrate material. Then, the cut printed board is slightly larger than the rectangular portion surrounded by the cutting escape groove 6 on the board stage 4.

A camera 8 is fixed to the Y-axis slider 3 beside the spindle 1. This camera 8
Is installed so that the upper surface of the substrate stage 4 and the substrate material placed thereon can be captured in the field of view. In addition, a ring-shaped light guide 9 is provided directly below the camera 8, and the illumination light emitted downward therefrom makes the image in the field of view clearer. The positional relationship between the field of view of the camera 8 and the cutting line cut by the cutting blade 2 will be described below. When a part of the corner of the substrate material is subjected to shallow test cutting, and the cutting line at that time is captured by the camera 8 and displayed on the monitor 11, the cutting line is usually displaced from the X-axis hairline of the camera 8 by a certain amount in the Y-axis direction. ing. In particular, when the spindle 1 is replaced or the cutting blade 2 is replaced, it can be said that the deviation always changes. Therefore, in such a case, the X of the camera 8
Align the axis hairline with the cutting line that has been test-cut (now align the X-axis hairline with the upper edge of the cutting line). Here, the camera 8 main body is installed on a precision slide unit (not shown) that can finely move and fix in the Y-axis direction, and its rail is fixed to the Y-axis slider. Therefore, after the X-axis hairline of the camera 8 is adjusted to an appropriate position, it can be fixed there. As will be described in detail with reference to FIG. 8, these are a cutting line projected on a monitor and a camera reference line (X-axis hairline). Immediately after the test cut, the upper edges of the X-axis hairline and the cutting line do not match as shown in the figure.
Therefore, the X-axis hairline (toward the camera) is moved in the direction of the arrow to match them, and the camera is fixed there.

At the time of cutting, at a predetermined position where the cutting line fits into the cutting escape groove 6, the spindle 1 descends while cutting the blade 2 at high speed to cut the substrate material.
In this state, the substrate stage 4 is moved in the X-axis direction to cut one cutting line. When one cutting line is completed, the spindle 1 moves up, moves one pitch in the Y-axis direction, and then descends again. Then, the substrate stage 4 is moved in the X-axis direction to make a second cutting line. By repeating this, a predetermined number of cutting lines are inserted in the X-axis direction. When it is completed, the cutting table is rotated by 90 °, and cut lines are inserted at a predetermined pitch in the direction orthogonal to the cut lines that have been inserted so far. A large number of substrates can be cut out.

[0008]

However, the conventional cutting apparatus described above has the following problems. That is, the position of the cutting line was not stable. Specifically, as described above with reference to FIG.
Even if the upper edge of the axis hairline and cutting line are aligned,
Immediately after cutting the next time, there was a case where a gap occurred between the two.
That is, one or both of them move in the Y-axis direction, and such a phenomenon occurs.

[0009] This factor is considered as follows.
First, the cutting line moves, which means that the cutting blade 2 moves back and forth (Y-axis direction) due to the expansion and contraction of the spindle 1 itself. The spindle 1 has a built-in motor for rotating the cutting blade 2 at a high speed. In particular, cutting a printed circuit board requires a high load to cut, so a high-output motor of several kW is generally required. When the motor starts rotating, it generates a considerable amount of heat. Then, the heat is transmitted to the spindle 1 having a long cylindrical front portion, and the spindle 1 mainly extends forward. On the other hand, when cutting starts, the cutting water is cooled by being applied to the cutting blade 2,
The front end of the spindle shrinks slightly. Then, after the cutting is completed and the rotation of the motor is stopped, after a while, the spindle 1 is cooled again and further contracted.

The movement of the X-axis hairline is caused by the movement of the camera 8 itself. This phenomenon is caused by spindle 1
Although not as large as the amount of expansion and contraction, the motor of the spindle and other electrical components installed on the Y-axis slider 3 generate heat, which is transmitted from the Y-axis slider 3 to the camera mount 12, and the camera mount Twelve was going to grow.

For this reason, relying on the X-axis hairline,
Even when the substrate material is moved to the position where the cutting line is to be cut and the cutting is started, the actual cutting line will enter a position different from the target position (target eye). On the other hand, for printed circuit boards, recently, high cutting accuracy (the amount of deviation of the inner circuit pattern from the outline after cutting) has been required,
It is very severe within ± 0.02 mm. The reason is that the cut printed circuit board is positioned and mounted on the basis of the outer shape (line) in a later process, where electronic components such as ICs and capacitors are inserted without checking the position of the circuit pattern. That's why. This is because, since a very short processing time is required in this step, there is no room to take the trouble of, for example, recognizing a circuit pattern and re-positioning the circuit pattern with accuracy as a reference. Therefore, it was necessary to find a way to solve this problem.

The following method has been adopted as one of the solutions. After one substrate material has been cut, the printed circuit board is removed, and the position of the cutting line is measured with a measuring microscope. The measurement location will be described with reference to FIG. This is an enlarged view showing the printed circuit board in a state immediately after cutting and still being sucked by the apparatus. Of the board material, a circuit pattern that finally becomes one printed board usually has fiducial marks 13 at four corners. Then, the reference marks 13a, 13a located on the adjacent printed circuit boards and adjacent to each other are provided.
The printed circuit board having the same shape is cut out by cutting the center between b with a predetermined groove width. Therefore, the dimensions d1 and d2 from the reference marks 13a and 13b of the printed circuit board after cutting to the edge of each cutting line are measured, and the lengths are compared. You can see if it is off.

After the measurement, the amount of this deviation is determined by Y
Include it as a correction value in the axis setting value. In other words, this is to know the degree of expansion and contraction of the spindle 1 and the camera mount 12 at the present time, and use that as a correction value for the next processing. Such measurements have been performed on several cut-line units. However, this measurement work
Since the printed circuit boards that were separated after cutting were taken out and measured using a microscope, it was a very time-consuming operation. Therefore, there has been a need to develop a printed circuit board cutting apparatus capable of cutting with high accuracy that satisfies the required accuracy without any trouble.

[0014]

SUMMARY OF THE INVENTION Accordingly, the present invention is a printed circuit board cutting device proposed to solve the above-mentioned problems. The first feature is that there is a memory operation unit that stores and calculates the information captured by the camera. The camera captures the cutting line of the printed circuit board material immediately after cutting, and the amount of deviation of the cutting line from the target. Is calculated on the basis of a reference mark provided at a predetermined position in the printed circuit board material, and the amount of deviation is used as a correction value of the feed pitch of the Y-axis at the time of cutting after the next time. That is, the cut printed circuit board is captured by the camera on the apparatus without being removed from the apparatus, the deviation amount of the cutting line is read, and the deviation amount from the predetermined value is used for the next cutting.

The next feature is that the bottom surface of the cutting escape groove provided on the substrate stage is mirror-like. Thereby, the edge of the cutting line captured by the camera can be clearly seen, and the image can be accurately processed. In addition, when the camera captures the cutting line, it also has a nozzle that blows air where it enters the field of view, which blows off the cutting water attached to the substrate material, which also sharpens the edge of the cutting line.

As a measure for further improving the cutting accuracy, the camera mounting base for fixing the camera is provided with a groove on the mounting surface for the Y-axis slider, and the mounting surface is not uniformly flat. For this reason, it becomes difficult for heat to be transmitted from the Y-axis slider to the camera mount, thereby preventing the camera mount from expanding and contracting. In addition, the Y-axis slider is equipped with a sensor that reads the amount of expansion and contraction of the spindle in the Y-axis direction, constantly monitors the amount of expansion and contraction of the spindle, and adds the read value to the correction value of the Y-axis feed pitch. And

[0017]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a printed circuit board cutting apparatus according to the present invention. Note that the same components as those of the conventional example are denoted by the same reference numerals.

[0018]

Embodiment 1 FIG. 1 is a view mainly showing a front view of a principal part of a printed circuit board cutting apparatus according to Embodiment 1 of the present invention. This is the content of claims 1 to 3. First, the electric processing system is as follows. The image captured by the camera 8 is sent to the image recognition unit 16 where the image is recognized. The storage operation section 17 is built therein, and information obtained by the image recognition section 16 is stored and operated. The storage operation unit 17 is connected to a drive control unit 18 that drives the spindle 1 and the substrate stage 4. Based on a signal issued from the storage operation unit 17, the spindle 1 and the substrate stage 4 a move in the Z-axis, X A predetermined operation such as θ-axis movement can be performed. At the same time, on the monitor 11, the upper surface of the substrate stage 4 and the substrate material captured by the camera can be seen as in the related art.

Regarding the mechanical components, a nozzle 19 for performing air blowing is provided below the camera 8, and the bottom surface of the cutting escape groove 6a of the substrate stage 4a is mirror-finished. These will be described with reference to a detailed view such as a partially enlarged view in the following detailed description.

Next, the operation will be described. When the cutting line in the Y-axis direction has been cut into the board material at a predetermined pitch, the Y-axis slider 3 and the X-axis slider 5 move, and the reference marks 13a and 13b in the printed board adjacent in the Y-axis direction.
The cutting line obtained by cutting the printed circuit board is put in the field of view of the camera 8. FIG. 2 shows an image captured in the visual field at this time. As is clear from FIG. 2, comparing the distance from the reference mark to the edge of the cutting line, d1 <d2, and the cutting line is shifted upward (Y axis + side). The image recognizing unit 16 first receives the reference marks 13a, 13b
After recognizing the position of the center line CLM, the storage operation unit 17 sets the center line CLM of both reference marks 13a and 13b, and stores the position data of the center line CLM. Subsequently, the image recognition unit 16
After the edge of the printed circuit board is recognized by the
, The center line CLS of the cutting line is set, and this center line CL is set.
The position data of S is stored. Then, the two center lines CL
The shift amount YH between M and CLS in the Y-axis direction is calculated. The shift amount YH is used as a correction value for the set value of the Y axis, and the drive control unit 1
Reference numeral 8 operates a Y-axis slider and an X-axis slider.

Then, when performing the next cutting operation,
This deviation amount YH is used as a correction value for the set value of the Y axis. Specifically, the input value of the Y-axis set before the start of cutting is (previous input value-YH). This eliminates the need for removing the printed circuit board from the apparatus and measuring the dimensions d1 and d2.

Here, in the present invention, the substrate stage 4
Since the bottom surface of the cutting escape groove 6a is mirror-finished, the measurement accuracy is improved. This will be described with reference to FIG.
FIG. 3 shows that the substrate material immediately after cutting is still in the substrate stage 4a.
It is in a state of being adsorbed on the upper side. (Here, the substrate material and the substrate stage 4a are drawn considerably larger than the camera 8 for easy understanding.)
A ring-shaped light guide 9 illuminating the ED is attached to illuminate the upper surface of the substrate material. The reflected light is captured by the camera 8 and the image is recognized. Here, if the bottom surface of the cutting relief groove 6a is not subjected to any special treatment, and is only a rough surface processed by a milling machine (processing device), the reflectance there is not high. On the other hand, the reflectance of the upper surface of the substrate material is not so high, and there is usually no noticeable difference between the two reflectances. Therefore, the edge of the cutting line is usually not easy to see (image is easy to recognize). However, when the bottom surface of the cutting escape groove 6a is made into a mirror surface as in the present invention, the reflectance here is clearly increased, and accordingly, the edge of the cutting line is clearly distinguished. Therefore, the accuracy of edge recognition is improved.

By the way, a method of making the bottom surface of the cutting escape groove 6a mirror-like is possible. After the reflector is inserted into the cutting escape groove 6a, it may be adhered to the cutting escape groove 6a. It may be sufficient to just perform precision processing to the extent that the blade is hardly creased.

Further, as means for improving measurement accuracy,
In the present invention, a nozzle for performing air blowing is provided. The description will be continued with reference to FIGS. A manifold 23 is fixed to the light guide mounting plate 22, and a two-branched nozzle 19 emerges from the manifold 23. On the other hand, an input side elbow 24 is fixed to the back of the manifold 23, and an air tube 26 is connected to an end thereof. Further, a supply source of high-pressure air is connected to the end of the air tube 26 via an electromagnetic valve or the like (not shown).

The nozzle 19 has such a shape that the tip of the nozzle 8 can be blown in the field of view of the camera 8. When the cutting line is captured by the camera 8 after cutting, the solenoid valve is opened and high-pressure air can be blown from the nozzle 19.

When cutting the substrate material, since the cutting water is applied to the cutting blade 2 and the substrate material, a large amount of the cutting water remains on the substrate material even after the cutting. In the remaining water, many fine cutting debris are also mixed. Therefore, conventionally, since the cutting water remains in the edge of the cutting line and also in the recognition mark 13, it has been difficult to recognize the image accurately. However, according to the printed board cutting device of the present invention, since the residual water is blown off cleanly by the nozzle 19, such a defect is eliminated, and accurate image recognition can always be performed.

The invention according to claims 1 to 3 has been described above. Here, particularly with respect to claim 1, the effect of utilizing data after a certain cutting as a correction value at the time of the next and subsequent cuttings will be mentioned to some extent. FIG. 4 shows a change in the shift amount (Y-axis direction) of the cutting line from the target with the elapse of time. The horizontal axis is the elapsed time since the start of the device,
The vertical axis is the shift amount. It is known that there is almost such a tendency. It is also known that most of the displacement is governed by the amount of expansion and contraction of the spindle 1. As described above, at the beginning of the start-up, the deviation amount increases almost constantly, saturates after a certain elapsed time (T1 in the figure), and then repeats a minute increase and decrease.

Referring to FIG. 4, it can be seen from FIG. 4 that the vehicle is kept idle (idling) until the time T1 elapses.
It is considered that cutting should be started after the deviation amount becomes almost stable. It is true, however, that the change in the deviation amount is not uniform depending on the device, and even if the same device is used, the change slightly varies due to an external influence (for example, the temperature of a work place).
In addition, the elapsed time T1 is not always a stable numerical value, and may be long in some cases. Therefore,
The processing side often showed reluctance to start cutting after waiting for a certain period of idling.
Naturally, the operation rate of the apparatus is reduced by the amount of time spent waiting, which has become a handy factor, and this is also one of the disliked factors. Therefore, even before the elapsed time T1, a method of starting the cutting and taking the best measure in the cutting has been sought. The printed circuit board cutting device of the present invention provides a method for executing the above-mentioned operations without bothering the operator and obtaining accurate data.

[0029]

Embodiment 2 The following embodiment 2 relates to claim 4 and will be described mainly with reference to FIG. FIG. 5 is a side view (a view as viewed from the direction A in FIG. 1), and particularly illustrates the entire camera mount 12a. As a feature, a groove is provided on a mounting surface to the Y-axis slider 3. As described above, in the printed circuit board cutting device, the spindle motor and other electrical components installed on the Y-axis slider 3 generate heat, which is transmitted from the Y-axis slider 3 to the camera mounting table 12a, and the temperature change thereof. This causes a phenomenon that the camera mount 12a extends. However, heat conduction from the Y-axis slider 3 can be reduced by providing the groove 21 on the bottom surface of the camera mount 12a serving as a contact surface and reducing the contact area as in the second embodiment. Therefore, the camera hardly moves, and the amount of deviation between the cutting line and the target can be reduced.

The grooves 21 may be inserted in only one direction, but may be arranged in two directions. When fixed to the Y-axis slider 3, a shape that reduces the contact area may be selected as long as there is no problem in the seating of the camera mount 12a. As for the material of the camera mount 12a, a metal member having high workability and being inexpensive will usually be adopted,
If ceramics having a low coefficient of thermal expansion are used, the effect is further enhanced.

[0031]

Third Embodiment The third embodiment relates to the fifth aspect of the present invention and will be described mainly with reference to FIG. FIG.
FIG. 2 is a plan view and a side view illustrating a spindle portion. A band 28 provided with a slit block 27 is fixed to a position substantially corresponding to the tip of the spindle 1. Also,
A sensor mounting base 29 is fixed to the Y-axis slider 3, and a sensor 31 is fixed to a tip thereof. The sensor 31 has a detection surface facing the slit block 27, and can detect the position of the slit provided on the surface of the slit block 27. That is, the fixed sensor 31 can always read the amount of expansion and contraction of the spindle 1 in the Y-axis direction. In addition,
The sensor 31 is connected to the storage operation unit 17 (not shown), and the read value is sent to the storage operation unit 17.

Therefore, the amount of expansion and contraction of the spindle 1 can always be known. Therefore, all the cutting lines are inserted in the Y-axis direction of the substrate material, and the amount of expansion / contraction can be added to the correction value of the Y-axis set value before starting the next cutting, or It is also possible to read the amount of expansion and contraction at each pitch for each cutting line during processing and add it to the correction value.

The spindle 1 is usually made of a stainless steel material because it does not like the generation of rust and requires low cost and high workability. On the other hand, the front cylindrical portion of the spindle 1 has a length of 500 mm and the motor output of the spindle is as high as several KW. Therefore, although the cooling water is circulated inside, the possibility of temperature change is high, and as a result, the tip of the spindle 1 is often expanded and contracted by 5 to 10 μm. Therefore, reading the amount of expansion and contraction of the spindle 1, which is the largest factor causing the cutting line to deviate from the target, and utilizing it in the next processing plays a very important role in improving the cutting accuracy of the printed circuit board.

Here, a supplementary explanation will be given on the sensor mounting base 29. Like the spindle 1, this also protrudes from the Y-axis slider 3 and must be elongated in the Y-axis direction. However, this sensor mounting base 29 itself is
It doesn't do anything if easily stretched by the surrounding heat. Therefore, this also reduces the contact area by forming a groove in the mounting surface to the Y-axis slider 3 to reduce the amount of heat conduction from the Y-axis slider 3, or selects a material having a small coefficient of thermal expansion. Should.

As a result, when the substrate material was cut by the prototype machine according to the fifth aspect, the cutting accuracy of the completed printed circuit board was all within ± 0.02 mm, and the required accuracy was sufficiently reduced. I was satisfied.

[0036]

As described above, according to the printed circuit board cutting device of the present invention, after the substrate material is cut, the displacement of the cutting line is automatically measured on the device, and the displacement is used for the next cutting. Can be utilized as a correction value. At the same time, the cut escape groove of the substrate stage has a high reflectance or a nozzle for blowing air to the cut portion of the substrate material is provided, so that the shift amount can be more accurately image-recognized. Further, since the camera mount has a structure in which heat from the Y-axis slider is hardly transmitted, a phenomenon in which the camera is slightly moved is suppressed. In addition, the amount of expansion and contraction of the spindle is always read by a sensor, and the value can be added to the correction value of the next cutting one by one. For this reason, it is possible to cut the printed board with higher accuracy while greatly reducing the labor of the operator.

[Brief description of the drawings]

FIG. 1 is an image diagram mainly showing a front view of a printed circuit board cutting apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing a board material immediately after cutting captured by a camera in the printed board cutting apparatus according to the embodiment;

FIG. 3 is an enlarged side view showing a substrate material in a state of being adsorbed to a substrate stage after cutting by the printed circuit board cutting apparatus according to the embodiment;

FIG. 4 is a graph showing a state in which a cutting line shifts from a target with time elapsed after the start of operation, which is usually seen in a printed circuit board cutting device.

FIG. 5 is a side view showing a camera mount fixed to a Y-axis slider in a printed circuit board cutting apparatus according to another embodiment of the present invention.

FIG. 6 is a plan view and a side view illustrating a spindle part in a printed circuit board cutting apparatus according to still another embodiment of the present invention.

FIG. 7 is a plan view and a front view illustrating a conventional printed circuit board cutting apparatus.

FIG. 8 is a diagram showing a cutting line projected on a monitor and a camera reference line (X-axis hairline) in a conventional printed circuit board cutting device.

FIG. 9 is a plan view showing a printed circuit board in a state immediately after cutting and still being adsorbed to the apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Spindle 2 Cutting blade 3 Y-axis slider 4, 4a Substrate stage 5 X-axis slider 6, 6a Cutting escape groove 7 Suction hole 8 Camera 9 Light guide 11 Monitor 12, 12a Camera mounting base 13 Reference mark 16 Image recognition unit 17 Storage operation Unit 18 Drive control unit 19 Nozzle 21 Groove 22 Light guide mounting plate 23 Manifold 24 Input elbow 26 Air tube 27 Slit block 28 Band 29 Sensor mounting base 31 Sensor

Claims (5)

[Claims] 1. A cutting device for cutting a printed circuit board material into a lattice, comprising: a spindle mounted on a Y-axis slider movable in the Y-axis direction and having a cutting blade for cutting while rotating at a high speed; A substrate stage provided with a lattice-shaped cutting escape groove, an X-axis slider mounted on the substrate stage and capable of moving the substrate stage in the θ-axis direction and capable of itself moving in the X-axis direction, and a substrate stage or a substrate stage. A camera mounted on the Y-axis slider capable of recognizing an image of the mounted printed circuit board material, a storage operation unit configured to store and calculate information captured by the camera, and a drive control unit configured to drive the spindle and the substrate stage. The cutting line of the printed circuit board material immediately after the cutting is completed is captured by the camera, and the amount of deviation of the cut line from the intended position is determined by a predetermined position in the printed circuit board material. Is calculated based on the fiducial mark provided at the position, and the deviation amount is set to Y
A printed circuit board cutting device, wherein a correction value of a feed pitch of a shaft is used. 2. The printed circuit board cutting device according to claim 1, wherein the bottom surface of the cutting escape groove provided on the substrate stage is mirror-like. 3. The printed circuit board cutting device according to claim 1, further comprising a nozzle that blows air at a position in the field of view when the camera captures the cutting line. 4. A camera mount for fixing the camera,
4. The printed circuit board cutting device according to claim 3, wherein a groove is provided in a mounting surface for the Y-axis slider, and the mounting surface is not uniformly flat. 5. The Y-axis slider is provided with a sensor for reading the amount of expansion and contraction of the spindle in the Y-axis direction, and the read value is added to the correction value of the Y-axis feed pitch. Printed circuit board cutting equipment.