JP4651789B2 - Printed circuit board cutting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed circuit board cutting apparatus that cuts a large printed board material (hereinafter referred to as a board material) into a lattice pattern, and cuts out a large number of small printed boards therefrom, and among them, each small printed board has the same circuit pattern. Further, the present invention relates to a printed circuit board cutting apparatus capable of cutting with high dimensional accuracy.
[0002]
[Prior art]
Electronic boards such as ICs and capacitors are mounted on a plastic board, which is the main material, and a wiring pattern that links these electronic parts is printed to form a single electric circuit. Used in industrial products. Although some of the printed circuit boards have chamfers at the edges, they are generally rectangular, which is a small one built into a mobile phone or a medium built into a computer. There are various sizes, such as those of size.
[0003]
These printed circuit boards are not provided with a wiring pattern or an electronic component insertion hole with a small shape from the beginning. A large number of printed circuit board elements (wiring patterns and electronic component insertion holes), which will be the final product, are processed in a large substrate material, and finally divided one by one.
[0004]
The elements of the large number of printed circuit boards are provided at equal pitches in the vertical and horizontal directions.
That is, it is laid out in a grid pattern. Therefore, if the original large substrate material is cut into a lattice shape, a large number of printed circuit boards having the same shape can be obtained.
[0005]
A printed circuit board cutting apparatus for cutting a substrate material in a lattice shape has the following structure. This will be described with reference to FIG.
Cutting is performed by the spindle 1. The spindle 1 has a cutting blade 2 (thin blade grindstone) having a thickness of about 1 mm that rotates at a high speed exceeding 5000 rpm at the tip. The spindle 1 is fixed to a Y-axis slider 3 and can move in the Y-axis (front-rear) direction together with the Y-axis slider 3. At the same time, the spindle 1 is also movable in the Z-axis (up and down) direction.
On the other hand, the substrate stage 4 is fixed to an X-axis slider 5 and can move in the X-axis (left and right) direction together with the X-axis slider 5. Further, the portion to which the substrate stage 4 is fixed is also movable in the θ axis (rotation) direction. Therefore, the substrate stage 4 can move in the X-axis and θ-axis directions.
Here, on the upper surface of the substrate stage 4, there are provided a number of cutting relief grooves 6 provided in a lattice shape and a plurality of suction holes 7 for sucking the substrate material. Naturally, the X and Y axis pitch of the cutting clearance groove 6 is the same as the X and Y axis pitch when the substrate material is cut. Then, the cut printed circuit board is slightly larger than the rectangular portion surrounded by the cutting escape groove 6 on the substrate stage 4.
[0006]
A camera 8 is fixed to the Y-axis slider 3 on the side of the spindle 1. The camera 8 is installed so that the substrate stage 4 and the upper surface of the substrate material placed thereon can be captured in the field of view. In addition, a ring-shaped light guide 9 is installed immediately below the camera 8, and the image in the field of view is made clearer by illumination light emitted downward therefrom. The positional relationship between the visual field of the camera 8 and the cutting line entered by the cutting blade 2 will be described below.
When a part of the corner of the substrate material is test cut shallowly and the cutting line at that time is captured by the camera 8 and displayed on the monitor 11, the cutting line is usually shifted by a certain amount in the Y-axis direction from the X-axis hairline of the camera 8. ing. In particular, when the spindle 1 is replaced or the cutting blade 2 is replaced, it can be said that the amount of deviation always changes. Therefore, in such a case, the X-axis hairline of the camera 8 is aligned with the cut line that has been cut by test (now, the X-axis hairline is aligned with the upper edge of the cutting line). Here, the camera 8 body is installed on a precision slide unit that can be finely moved and fixed in the Y-axis direction (not shown), and its rail is fixed to the Y-axis slider. Therefore, after the X-axis hairline of the camera 8 is adjusted to an appropriate position, it can be fixed there.
This will be described in detail with reference to FIG. 8, which are a cutting line projected on the monitor and a reference line (X-axis hairline) of the camera. Immediately after the test cut, the X-axis hairline and the upper edge of the cutting line do not match as shown in the figure. Therefore, the X-axis hairline (camera direction) is moved in the direction of the arrow to match them, and the camera is fixed there.
[0007]
When cutting, the spindle 1 descends and cuts the substrate material while rotating the cutting blade 2 at a predetermined position where the cutting line fits into the cutting relief groove 6, and in this state, the substrate stage 4 is moved in the X-axis direction. Move it and put one cutting line. When one cutting line has been inserted, the spindle 1 rises, moves one pitch in the Y-axis direction, and then descends again. Then, the substrate stage 4 is moved in the X-axis direction to enter a second cutting line. By repeating this, a predetermined number of cutting lines are entered in the X-axis direction.
When it is finished, the cutting table is rotated 90 °, and cutting lines are inserted at a predetermined pitch in the direction perpendicular to the cutting lines that have been put so far, so that a small rectangular print of the same shape is made from one substrate material. A large number of substrates can be cut out.
[0008]
[Problems to be solved by the invention]
However, the conventional cutting apparatus described above has the following problems.
That is, the position of the cutting line is not stable. Specifically, as described above with reference to FIG. 8, even if an initial test cut is performed and the upper edge of the X-axis hairline and the cutting line are aligned, there may be a deviation between the two immediately after the next cutting. It was. That is, either or both of them moved in the Y-axis direction, and this phenomenon occurred.
[0009]
This factor is considered as follows.
First, the cutting line moves. This is because the cutting blade 2 moves back and forth (Y-axis direction) due to the expansion and contraction of the spindle 1 itself. The spindle 1 has a built-in motor for rotating the cutting blade 2 at a high speed. Especially, since cutting a printed circuit board is a heavy load, a high output motor of several KW is generally required. When the motor starts to rotate, it generates a considerable amount of heat. Then, the heat is transmitted to the spindle 1 having a long cylindrical front portion, and the spindle 1 mainly extends forward. On the other hand, when the cutting starts, the cutting water is cooled by being applied to the cutting blade 2, and the front end of the spindle is somewhat contracted. When the cutting is finished and the rotation of the motor is stopped for a while, the spindle 1 is cooled again and further contracted.
[0010]
The phenomenon that the X-axis hairline moves is that the camera 8 itself moves. Although this phenomenon is not as large as the amount of expansion and contraction of the spindle 1, the spindle motor and other electrical components installed on the Y-axis slider 3 generate heat, which is transmitted from the Y-axis slider 3 to the camera mount 12. This happened because the camera mount 12 was extended.
[0011]
For this reason, even if the substrate material is moved to the position where the cutting line is inserted using the X-axis hairline and cutting is started, the actual cutting line will enter a position different from the target position (target eye). It was.
On the other hand, with respect to printed circuit boards, recently, high cutting accuracy (amount of deviation of the circuit pattern inside with respect to the outline after cutting) is required, which is extremely severe within ± 0.02 mm. The reason is that the cut printed circuit board is positioned and mounted in the subsequent process with reference to the outer shape (line), and an electronic component such as an IC or a capacitor is inserted without confirming the position of the circuit pattern. Because. This is because, in this process, a very short processing time is required, so that there is no room for time and effort such as, for example, recognizing an image of a circuit pattern and accurately positioning it again based on the circuit pattern.
Therefore, it was necessary to find a way to solve this problem.
[0012]
The following method was taken as one of the solution methods.
After cutting one substrate material, the printed circuit board is removed, and the position of the cutting line is measured with a measuring microscope. The measurement location will be described with reference to FIG. This is an enlarged view showing the printed circuit board just after being cut and still adsorbed to the apparatus. Among the circuit board materials, a circuit pattern that finally becomes one printed circuit board usually has reference marks 13 at four corners. And the printed circuit board of the same shape is cut out by cut | disconnecting the center between the reference marks 13a and 13b which are in the adjacent printed circuit board and adjoin each other with a predetermined groove width.
Therefore, if the dimensions d1 and d2 from the reference marks 13a and 13b of the printed circuit board after cutting to the edges of the cutting lines are measured and their lengths are compared, how much the cutting line is on which side of the Y-axis direction? You can see if they are misaligned.
[0013]
After the measurement, this deviation amount is included as a correction value in the set value of the Y axis at the next cutting. That is, this is to know the degree of expansion / contraction of the spindle 1 and the camera mount 12 at present and to use it as a correction value for the next processing. Such measurements have been performed on several cut line units.
However, this measurement work is very troublesome because it takes out the printed circuit boards that have been separated after cutting and measures them using a microscope.
Therefore, it has been necessary to develop a printed circuit board cutting apparatus that can cut with high accuracy that satisfies the required accuracy without taking time and effort.
[0014]
[Means for Solving the Problems]
Therefore, the present invention is a printed circuit board cutting apparatus proposed for solving the above-described problems. The first feature is that there is a storage calculation unit that stores and calculates the information captured by the camera, and the cutting line of the printed board material immediately after cutting and the reference mark provided at a predetermined position in the printed board material the captured by the camera, setting the center line of said cutting line of both the reference mark of the printed circuit board material adjacent in the storage operation unit, the amount of deviation from the target eye of the cutting line, of the reference mark The calculation is based on the center line, and the amount of deviation is used as a correction value for the feed pitch of the Y-axis at the next and subsequent cuts. In other words, the cut printed circuit board is captured by the camera on the apparatus without being removed from the apparatus, the deviation amount of the cutting line is read, and the deviation amount from the predetermined value is utilized for the next cutting.
[0015]
The next feature is that the bottom surface of the cutting relief groove provided in the substrate stage is mirror-like. As a result, the edge of the cutting line captured by the camera can be seen clearly, and the image can be accurately processed. In addition, when the camera captures the cutting line, it also has a nozzle that blows the air that enters the field of view, and it blows away the cutting water on the substrate material, which also sharpens the edge of the cutting line.
[0016]
As a measure for further improving the cutting accuracy, the camera mounting base for fixing the camera is provided with a groove on the mounting surface with respect to the Y-axis slider, and the mounting surface is not uniformly flat. This makes it difficult for heat to be transferred from the Y-axis slider to the camera mount, and prevents the camera mount from expanding and contracting. Further, the Y-axis slider is provided with a sensor for reading the amount of expansion / contraction of the spindle in the Y-axis direction, and the amount of expansion / contraction of the spindle is constantly monitored, and the read value is added to the correction value of the Y-axis feed pitch. It is said.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a printed circuit board cutting apparatus according to the present invention will be described in detail below with reference to the accompanying drawings. In addition, about the same component as a prior art example, the same sign as a prior art example is used.
[0018]
[Example 1]
FIG. 1 is a front view of a main part of the printed circuit board cutting apparatus according to the first embodiment of the present invention. In addition, this is the content regarding Claims 1-3.
First, the electrical processing system is as follows. The image captured by the camera 8 is sent to the image recognition unit 16 for image recognition. A storage calculation unit 17 is built therein, and information obtained by the image recognition unit 16 is stored and calculated. The storage calculation unit 17 is connected to a drive control unit 18 that drives the spindle 1 and the substrate stage 4. Based on a signal generated from the storage calculation unit 17, the spindle 1 and the substrate stage 4 a are moved along the Z axis,・ Predetermined motion such as θ-axis motion can be performed. At the same time, the monitor 11 can see the substrate stage 4 and the upper surface of the substrate material captured by the camera as in the conventional case.
[0019]
As for mechanical components, a nozzle 19 for performing air blowing is provided below the camera 8, and the bottom surface of the cutting relief groove 6a of the substrate stage 4a is mirror-like. These will be described using detailed drawings such as a partially enlarged view in the detailed description to be given later.
[0020]
Next, the operation will be described.
When the cutting lines in the Y-axis direction have been put into the substrate material at a predetermined pitch, the Y-axis slider 3 and the X-axis slider 5 move to move the reference marks 13a and 13b in the printed circuit board adjacent in the Y-axis direction and the A cutting line obtained by cutting the printed board is placed in the field of view of the camera 8. FIG. 2 shows an image captured at this time. As is apparent from FIG. 2, when the distance from the reference mark to the edge of the cutting line is compared, it is found that d1 <d2, and the cutting line is shifted upward (Y axis + side).
The image recognition unit 16 first recognizes the positions of the reference marks 13a and 13b, and then sets the center line CLM of both the reference marks 13a and 13b in the storage calculation unit 17 and stores the position data of the center line CLM. . Subsequently, after the image recognition unit 16 recognizes the edge of the printed circuit board, the storage calculation unit 17 sets the center line CLS of the cutting line and stores the position data of the center line CLS.
Thereafter, a deviation amount YH in the Y-axis direction between the center lines CLM and CLS is calculated. The drive control unit 18 operates the Y-axis slider and the X-axis slider using the deviation amount YH as a correction value for the Y-axis setting value.
[0021]
When the next cutting operation is performed, the deviation amount YH is used as a correction value for the set value of the Y axis. Specifically, the Y-axis input value set before the start of cutting is (previous input value−YH).
This eliminates the need to remove the cut printed circuit board from the apparatus and measure the dimensions d1 and d2.
[0022]
Here, in the present invention, since the bottom surface of the cutting relief groove 6a of the substrate stage 4a is mirror-like, the measurement accuracy is improved. This will be described with reference to FIG.
FIG. 3 shows a state in which the substrate material immediately after cutting is still adsorbed on the substrate stage 4a. (Here, for the sake of easy understanding, the substrate material and the substrate stage 4a are drawn on a considerably larger scale than the camera 8.) A ring-shaped light guide 9 that uses LEDs as illumination is attached immediately below the camera 8. The top surface of the substrate material is illuminated. The reflected light is captured by the camera 8 and the image is recognized.
Here, if the special condition is not given to the bottom face of the cutting relief groove 6a and the surface state is simply roughed by a milling machine (processing device), the reflectance is not high. On the other hand, the reflectance of the upper surface of the substrate material is not so high, and there is usually no significant difference between the reflectances of the two. Accordingly, the edge of the cutting line is not usually easy to see (easy to recognize an image). However, when the bottom surface of the cut-off groove 6a is mirror-like as in the present invention, the reflectance here is clearly increased, and accordingly, the edge of the cut line is clearly highlighted. Therefore, the accuracy of recognizing edges is improved.
[0023]
By the way, although it is the method of making the bottom face of the cutting relief groove 6a into a mirror surface, it may be bonded after inserting the reflector into the cutting relief groove 6a. You may just give precision processing to such an extent that eyes hardly come out.
[0024]
Further, as a means for improving the measurement accuracy, the present invention is provided with a nozzle for air blowing. The description will be continued with reference to FIGS.
A manifold 23 is fixed to the light guide mounting plate 22, and a nozzle 19 that is bifurcated from the manifold 23. On the other hand, an input-side elbow 24 is fixed to the back of the manifold 23, and an air tube 26 is connected to the tip. Furthermore, a supply source of high-pressure air is connected to the tip of the air tube 26 via a solenoid valve or the like (not shown).
[0025]
The nozzle 19 has such a shape that a portion that enters the field of view of the camera 8 can be blown with air at its tip. Further, when the cutting line is captured by the camera 8 after cutting, the electromagnetic valve can be opened and high pressure air can be blown from the nozzle 19.
[0026]
When cutting the substrate material, cutting water is applied to the cutting blade 2 and the substrate material, so that a large amount of the cutting water still remains on the substrate material even after cutting. In addition, the residual water contains a lot of fine cutting waste. Therefore, conventionally, the cutting water remains on the edge of the cutting line and the recognition mark 13, and it has been difficult to accurately recognize them.
However, with the printed circuit board cutting apparatus of the present invention, the remaining water is blown off cleanly by the nozzle 19, so that such a problem is eliminated and accurate image recognition can always be performed.
[0027]
Although the invention relating to claims 1 to 3 has been described above, the effect of utilizing data after a certain cutting as a correction value at the next and subsequent cuttings will be referred to a little with respect to claim 1 in particular.
FIG. 4 shows the change in the amount of deviation (in the Y-axis direction) from the target of the cutting line over time. The horizontal axis is the elapsed time since the start of the apparatus startup, and the vertical axis is the amount of deviation. It turns out that there is almost such a tendency. It is also known that most of the displacement is governed by the amount of expansion / contraction of the spindle 1.
Thus, at the beginning of the start-up, the amount of deviation increases substantially constant, saturates after a certain elapsed time (T1 in the figure), and thereafter repeats slight increases and decreases.
[0028]
FIG. 4 shows that it is only necessary to wait until the time T1 elapses in the idling state and start cutting after the amount of deviation is almost stabilized. However, this change in the amount of deviation is not uniform depending on the device, and even with the same device, it varies slightly due to external influences (for example, the temperature of the workplace). In addition, the elapsed time T1 is not necessarily a stable value, and may be a long time depending on circumstances. Therefore, from the processing side, it is often difficult to start cutting after idling for a certain period of time. Naturally, the operating rate of the equipment will be reduced by the amount of waiting, which became a handy and one of the factors disliked.
Therefore, even before the elapsed time T1, a method for starting cutting and taking the best measures among them has been sought.
The printed circuit board cutting apparatus of the present invention provides a method for executing this without disturbing the operator's hand and obtaining accurate data.
[0029]
[Example 2]
The second embodiment is an invention relating to claim 4 and will be described mainly with reference to FIG. FIG. 5 is a side view (viewed from the direction A in FIG. 1), and particularly shows the entire camera mount 12a.
As a feature, a groove is provided on the attachment surface to the Y-axis slider 3.
As described above, in the printed circuit board cutting apparatus, the spindle motor and other electrical components installed on the Y-axis slider 3 generate heat, which is transmitted from the Y-axis slider 3 to the camera mounting base 12a, and the temperature changes. This causes a phenomenon that the camera mount 12a extends. However, as in the second embodiment, the heat conduction from the Y-axis slider 3 can be reduced by providing the groove 21 on the bottom surface of the camera mount 12a serving as the contact surface to reduce the contact area. Therefore, the camera hardly moves, and the amount of deviation between the cutting line and the target eye can be reduced.
[0030]
Regarding the way of inserting the groove 21, only one direction may be used, but two directions may be used. What is necessary is just to select the shape which reduces a contact area in the range which does not have a problem in the seating property of the camera mounting base 12a when it fixes to the Y-axis slider 3. FIG.
As the material for the camera mount 12a, a metal member that is highly workable and inexpensive will normally be used. However, if a ceramic having a low thermal expansion coefficient is used, the effect is further enhanced.
[0031]
[Example 3]
The third embodiment is an invention relating to claim 5 and will be described mainly with reference to FIG. FIG. 6 is a plan view and a side view depicting the spindle portion.
A band 28 provided with a slit block 27 is fixed at a position substantially contacting the tip of the spindle 1. A sensor mounting base 29 is fixed to the Y-axis slider 3, and a sensor 31 is fixed to the tip thereof. The sensor 31 has a detection surface facing the slit block 27 and can detect the position of the slit provided on the surface of the slit block 27. That is, the fixed sensor 31 can always read the expansion / contraction amount of the spindle 1 in the Y-axis direction. The sensor 31 is connected to the storage calculation unit 17 (not shown), and the read value is sent to the storage calculation unit 17.
[0032]
For this reason, the expansion / contraction amount of the spindle 1 can always be known. Therefore, it is possible to put all the cutting lines in the Y-axis direction of the substrate material and add this expansion / contraction amount to the correction value of the Y-axis setting value before starting the next cutting, It is also possible to read the amount of expansion / contraction at every pitch for each cutting line during processing and add it to the correction value.
[0033]
The spindle 1 is usually made of a stainless steel because it is apt to rust and is inexpensive and requires high workability. On the other hand, the front cylindrical portion of the spindle 1 has a length of 500 mm, and the motor output of the spindle is as high as several KW. Therefore, of course, although cooling water is circulated inside, there is a high possibility of temperature change, and as a result, the tip of the spindle 1 often expands and contracts by 5 to 10 μm.
Therefore, reading the expansion / contraction amount of the spindle 1 which is the largest factor that causes the cutting line to deviate from the target and using it for the next processing plays a very important role in improving the cutting accuracy of the printed circuit board.
[0034]
Here, the sensor mounting base 29 will be supplemented. As with the spindle 1, this also protrudes first from the Y-axis slider 3, and must be long in the Y-axis direction. However, nothing will happen if the sensor mount 29 itself is easily stretched by the surrounding heat. Therefore, this also reduces the contact area by inserting a groove in the mounting surface to the Y-axis slider 3 and reduces the amount of heat conduction from the Y-axis slider 3, or selects a material with a low coefficient of thermal expansion. Should.
[0035]
As a result of the above, when the substrate material was cut with the prototype of the form of claim 5, the cutting accuracy of the printed circuit board was all within ± 0.02 mm, which sufficiently satisfies the required accuracy. Met.
[0036]
【The invention's effect】
As described above, with the printed circuit board cutting apparatus of the present invention, after cutting the substrate material, the amount of deviation of the cutting line is automatically measured on the apparatus, and the amount of deviation is used as a correction value for the next cutting. be able to. At the same time, the cutting clearance groove of the substrate stage has a high reflectivity, or a nozzle for air blowing the cut portion of the substrate material is provided, so that the amount of deviation can be recognized more accurately.
Furthermore, since the camera mounting base has a structure in which the heat from the Y-axis slider is difficult to be transmitted, a phenomenon in which the camera moves slightly is suppressed. Further, the amount of expansion / contraction of the spindle can always be read by a sensor, and the value can be added to the correction value for the next cutting one by one.
Therefore, it is possible to cut the printed circuit board with higher accuracy while greatly reducing the labor of the operator.
[Brief description of the drawings]
FIG. 1 is an image diagram mainly showing a printed circuit board cutting apparatus according to an embodiment of the present invention in a front view. FIG. 2 shows a substrate material immediately after cutting captured by a camera in the printed circuit board cutting apparatus according to the embodiment. Fig. 3 is an enlarged side view showing a substrate material that is adsorbed to the substrate stage after cutting in the printed circuit board cutting apparatus according to the embodiment. Fig. 4 is an operation start that is usually seen in the printed circuit board cutting apparatus. FIG. 5 is a side view showing a camera mounting base fixed to a Y-axis slider in a printed circuit board cutting apparatus according to another embodiment of the present invention. 6 is a plan view and a side view illustrating a spindle portion in a printed circuit board cutting apparatus according to still another embodiment of the present invention. FIG. 7 is a plan view illustrating a conventional printed circuit board cutting apparatus. Front view and front view [Fig. 8] A diagram showing the cutting line projected on the monitor and the camera reference line (X-axis hairline) in the conventional printed circuit board cutting device. [Fig. 9] Immediately after cutting, it is still adsorbed by the device. Plan view showing printed circuit board
DESCRIPTION OF SYMBOLS 1 Spindle 2 Cutting blade 3 Y-axis slider 4, 4a Substrate stage 5 X-axis slider 6, 6a Cutting relief groove 7 Suction hole 8 Camera 9 Light guide 11 Monitor 12, 12a Camera mount 13 Reference mark 16 Image recognition part 17 Memory calculation Unit 18 Drive control unit 19 Nozzle 21 Groove 22 Light guide mounting plate 23 Manifold 24 Input side elbow 26 Air tube 27 Slit block 28 Band 29 Sensor mounting base 31 Sensor

Claims (5)

In a cutting device for cutting a printed circuit board material provided with a reference mark at a predetermined position into a lattice shape,
A spindle mounted on a Y-axis slider that has a cutting blade for cutting while rotating at high speed and is movable in the Y-axis direction, a substrate stage having a lattice-shaped cutting relief groove on the upper surface, and the substrate stage An X-axis slider that can be mounted and operated on the θ-axis and can move in the X-axis direction, and a substrate stage or a printed board material placed on the substrate stage can be image-recognized and installed on the Y-axis slider A storage operation unit that stores and calculates information captured by the camera, and a drive control unit that drives the spindle and the substrate stage,
The cutting line and the reference mark of the printed circuit board material immediately after cutting are captured by the camera, and the center line of both the reference marks of the adjacent printed circuit board material and the center line of the cutting line are set in the storage operation unit. The amount of deviation from the target of the cutting line is calculated with reference to the center line of the reference mark, and the amount of deviation is used as a correction value for the feed pitch of the Y axis at the next and subsequent cuttings. Printed circuit board cutting device. 2. The printed circuit board cutting apparatus according to claim 1, wherein the bottom surface of the cutting relief groove provided on the substrate stage is mirror-like. 3. The printed circuit board cutting apparatus according to claim 1, further comprising a nozzle that blows air at a portion that enters a visual field when the camera captures a cutting line. 4. The printed circuit board cutting device according to claim 3, wherein the camera mounting base for fixing the camera is provided with a groove on a mounting surface with respect to the Y-axis slider, and the mounting surface is not uniformly flat. 5. A printed circuit board cutting apparatus according to claim 4, wherein a sensor for reading the amount of expansion and contraction of the spindle in the Y-axis direction is installed on the Y-axis slider, and the read value is added to a correction value for the feed pitch of the Y-axis. .

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