JP2002064255A - Structure of interlayer connection hole, method of manufacturing the interlayer connection hole and printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure of an interlayer connection hole, a method of manufacturing the interlayer connection holes and a printed wiring board which lowers the inductance of a connecting conductor composed of a leading line and a led line on a printed circuit board for processing signals at a high speed, thereby stabilizing operation of a signal processor circuit. SOLUTION: The inner wall of an interlayer connection hole composed of an interstitial via or a via or a through-hole and a land are divided into a plurality of electrodes, the divided electrodes are disposed closely with keeping them insulated, and lead lines and lines led are wired to the respective electrodes to lower than inductance of a connection conductor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for forming, for example, a power supply layer of a printed circuit board for performing high-speed signal processing, and to reduce the inductance of connection conductors such as the power supply layer to stabilize a signal processing circuit. Measure the operation.

[0002]

2. Description of the Related Art FIG. 9 shows an interlayer connection structure of a power supply layer in a conventional example. FIG. 9 (z) is a schematic perspective view, and FIG.
(C), (e) are top views, and (b), (d),
(F) shows a cross-sectional view.

[0003] In the figure, reference numeral 51 denotes an interlayer connection hole;
This is a means for electrically connecting conductors between different layers by conductors formed on the inner wall 55 of the hole. Reference numeral 52 denotes an interstitial via hole, which is a kind of an interlayer connection hole 51, in which a lead wire of a component is not inserted and a conductor between different layers is formed on the inner wall 55 of the hole without penetrating the printed wiring board 60. It is a means to connect to each other. Numeral 53 denotes a via hole, which is a kind of interlayer connection hole 51 in which a lead wire of a component is not inserted, and which is electrically connected by a conductor which penetrates the printed wiring board 60 and forms a conductor between different layers on the inner wall 55 of the hole. It becomes a means to do. Reference numeral 54 denotes a through hole, which is a kind of the interlayer connection hole 51 and in which a lead wire of a component may be inserted. Also, it is a means for electrically connecting conductors between different layers through the printed wiring board 60 by conductors formed on the inner wall 55 of the hole. Reference numeral 55 denotes an inner wall, which indicates a wall around the interlayer connection hole 51. Reference numeral 56 denotes a land, which is generally a ring-shaped conductor that forms a conductor extending from the inner wall 55 around the hole of the interlayer connection hole 51. Reference numeral 57 denotes an electrode made of a conductor such as the inner wall 55 of the interlayer connection hole 51 and the land 56. Reference numeral 58 denotes an active conductor, for example, a power supply layer or a signal conductor, which serves as a power supply or a signal supplied to a load. Reference numeral 59 denotes a feedback conductor, for example, a ground conductor for a power supply or a signal supplied to a load or a signal return conductor. Reference numeral 60 denotes a printed wiring board, on which a conductor for connecting components constituting a predetermined electric circuit is formed on the surface or inside of the insulating plate made of resin. Reference numeral 61 denotes a connection conductor, which includes an active conductor 58, a return conductor 59, and a conductor that connects components constituting a predetermined electric circuit.

A conventional example of an interlayer connection structure of a power supply layer is, for example,
When an interlayer connection is required for the active conductor 58 such as a power supply layer, an interlayer connection hole 51 composed of an interstitial via hole 52 or a via hole 53 or a through hole 54 is formed at an arbitrary position on the printed wiring board 60. Instead of dividing the land 56 into the plurality of electrodes 57, the plurality of interlayer connection holes 51 are merely usually arranged based on the current capacity of the circuit.

[0005] The setting is performed by paying attention to the direction in which the current flows, without considering the approach of the conductor through which the feedback current flows to the feedback conductor 59 such as a ground line.

However, since the power supply interlayer connection hole and the ground interlayer connection hole of the conventional example do not have an inductance, the generation of the interfering radio wave from the interlayer connection hole 51 or the connection conductor 61 where the inductance is locally increased is considered. The high-frequency noise may cause a malfunction of the high-speed signal processing circuit.

Further, the emission environment of other electronic equipment may cause deterioration of the installation environment of the electronic equipment.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to solve the following problems in the above-mentioned conventional interlayer connection structure.

1) When an interlayer connection is required for an inductive line such as a power supply layer, it is only necessary to arrange an interlayer connection hole at an arbitrary position on a printed wiring board and a plurality of interlayer connection holes based on the current capacity of the circuit. Are not set so as to be interconnected by the interlayer connection hole.

2) The approach of a conductor to be inductively coupled to a guided line such as a ground line is not considered.

3) Since the induction line such as the power supply layer and the guided line such as the ground line do not consider the mutual inductive coupling due to the approach between the induction line and the guided line as described above, the induction line is locally formed. The high-speed signal processing circuit malfunctions due to the generation of jamming radio waves and high-frequency noise from the interlayer connection hole where the inductance has increased, and the emission environment of other electronic devices causes the deterioration of the installation environment of the electronic devices. There are cases.

[0012]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a structure of an interlayer connection hole of a connection conductor formed of a guide line and a guided line of a printed circuit board for performing high-speed signal processing. The inner wall and the land of the interlayer connection hole consisting of a via hole or a via hole or a through hole and a land are divided into a plurality of electrodes, the divided electrodes are brought close to each other while maintaining insulation, and a guide line and a guided line are provided for each electrode. And a wiring configured to reduce the inductance of the connection conductor.

By this means, the divided electrodes are brought close to each other while maintaining the insulation, and the guide lines and the guided lines are respectively wired. Therefore, the guide lines and the guided lines are formed at the interlayer connection holes having locally increased inductance. In the mutual inductive coupling state by approaching the induction line, the currents cancel each other out, which can reduce the inductance of the connection conductor and enable the signal processing circuit to operate stably. Provided are a structure, a method for manufacturing an interlayer connection hole, and a printed wiring board.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, as shown in FIG. 1, the structure of an interlayer connection hole according to the present invention comprises an interlayer wall 1 of an interlayer via hole 2 or a via hole 3 or a through hole 4 and a land. 6 is divided into a plurality of electrodes 7, and the divided electrodes 7 are approached while maintaining insulation,
A guide line 8 and a guided line 9 are wired to each of the electrodes 7 to reduce the inductance of the connection conductor 11.

By this means, the guide line and the guided line are routed close to the divided electrode, so that the guided line and the guided line are brought close to each other at the interlayer connection hole where the inductance is locally increased. In the mutual inductive coupling state, currents cancel each other out,
The effect of reducing the inductance of the connection conductor is obtained.

Next, as shown in FIG. 2, the structure of the interlayer connection hole of the present invention has a structure in which the circumference of the inner wall 5 and the land 6 is divided into an even number.

By this means, the circumference of the land between the inner wall of the interlayer connection hole and the land is divided into an even number, so that the balance of the current flowing through the guide line and the guided line is improved, and the extent to which the currents cancel each other is increased. As a result, the effect of reducing the inductance of the connection conductor is obtained.

As shown in FIG. 3, in the structure of the interlayer connection hole of the present invention, the interlayer connection hole 1 composed of the interstitial via hole 2 or the via hole 3 or the through hole 4 is arranged while maintaining insulation. The guide line 8 and the guided line 9 are alternately wired in the respective interlayer connection holes 1 so as to reduce the inductance of the connection conductor 11.

By this means, the interlayer connection holes are arranged close to each other, and the guide line and the guided line are respectively wired. Therefore, the connection is made in a mutual inductive coupling state by bringing the inner walls of the respective interlayer connection holes close to each other. The effect of reducing the inductance of the conductor is obtained.

Further, as shown in FIG. 4, in the structure of the interlayer connection hole of the present invention, a plurality of interlayer connection holes are arranged concentrically, and a guide line 8 and a guided line 9 are wired in each interlayer connection hole 1. .

By this means, the concentric interlayer connection holes are respectively connected to the guide line and the guided line, so that a large mutual inductive coupling obtained by bringing the inner walls of the respective interlayer connection holes close to each other. In this state, an effect of reducing the inductance of the connection conductor is obtained.

Next, as shown in FIG. 5, in the method for manufacturing an interlayer connection hole according to the present invention, the inner wall 5 of the interlayer connection hole 1 is divided into circumferences by a plating adhesion preventing process in a pre-plating process. And

By this means, the inner wall of the interlayer connection hole is
Since the circumference is divided by the plating adhesion prevention process in the pre-plating process, the circumference can be divided in the initial stage of the manufacturing process of the printed wiring board, and the state can be maintained until the final stage of the manufacturing process.

Further, as shown in FIG. 6, in the method for manufacturing an interlayer connection hole according to the present invention, the inner wall 5 of the interlayer connection hole 1 is formed by cutting the circumference by cutting after the conduction process. I made it.

By this means, the inner wall of the interlayer connection hole is
Since the circumference is divided by the cutting process in the process after the conduction process, the function of dividing the circumference at the final stage of the manufacturing process of the printed wiring board is obtained.

As shown in FIG. 7, the printed wiring board according to the present invention comprises an inner wall 5 of an interlayer connection hole 1 comprising an interstitial via hole 2 or a via hole 3 or a through hole 4 and a land 6 formed by a plurality of electrodes. 7, the divided electrodes 7 are brought close to each other while maintaining insulation, and a guide line 8 and a guided line 9 are wired to each electrode 7, and an interlayer connection hole 1 for reducing the inductance of the connection conductor 11 is formed.
It was assumed to be provided.

By this means, the guide line and the guided line are routed close to the divided electrode, so that the guide line and the guided line are brought close to each other at the interlayer connection hole where the inductance is locally increased. In the mutual inductive coupling state, currents cancel each other out,
The printed wiring board can reduce the inductance of the connecting conductor.

As shown in FIG. 8, in the printed wiring board of the present invention, the interlayer connection hole 1 composed of the interstitial via hole 2 or via hole 3 or through hole 4 is arranged close to each other while maintaining insulation. The guide line 8 and the guided line 9 are alternately wired in each of the interlayer connection holes 1, and the interlayer connection holes 1 for reducing the inductance of the connection conductor 11 are provided.

By this means, the interlayer connection holes are arranged close to each other, and the guide line and the guided line are alternately wired respectively. In the state of mutual inductive coupling caused by approaching the line, currents cancel each other out, so that the printed wiring board has an effect of reducing the inductance of the connection conductor.

[0030]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention; FIG. In the following, the same portions are denoted by the same reference numerals, and detailed description may be omitted.

In FIG. 1, reference numeral 1 denotes an interlayer connection hole, which serves as means for electrically connecting conductors between different layers by conductors formed on the inner wall 5 of the hole. Reference numeral 2 denotes an interstitial via hole, which is a kind of an interlayer connection hole 1 which does not insert a lead wire of a component, and which is electrically connected to a conductor which forms a conductor between different layers on an inner wall 5 of the hole without penetrating a printed wiring board. Means to connect to 3 is a via hole,
It is a kind of interlayer connection hole 1 which does not insert a lead wire of a component and also serves as a means for penetrating a printed wiring board and electrically connecting conductors between different layers by conductors formed on the inner wall 5 of the hole. Reference numeral 4 denotes a through hole, which is a kind of interlayer connection hole 1 and in which a lead wire of a component is sometimes inserted. Also, it is a means for electrically connecting conductors between different layers through the printed wiring board by conductors formed on the inner wall 5 of the hole. Reference numeral 5 denotes an inner wall, which indicates a wall around the interlayer connection hole 1. Reference numeral 6 denotes a land, which is generally a ring-shaped conductor that forms a conductor extending from the inner wall 5 around the hole of the interlayer connection hole 1. Reference numeral 7 denotes an electrode, which is made of a conductor such as the inner wall 5 of the interlayer connection hole 1 and the land 6. Reference numeral 8 denotes an induction line, for example, a power supply layer or a signal conductor, which is a conductor to be inductively coupled to the guided line 9. Reference numeral 9 denotes a guided line, for example, a ground line or a signal return conductor, which is a conductor to be inductively coupled to the guide line 8. 11 is a connection conductor,
It is composed of a guide line 8, a guided line 9, and a conductor for connecting components constituting a predetermined electric circuit.

FIG. 1 is a principle view of the present invention. FIG. 1 (z) is a schematic perspective view, and FIGS. 1 (a), 1 (c) and 1 (e) are top views. (B), (d), and (f) of FIG.

Referring to FIG. 3, a case where the interlayer connection hole 1 is divided into two parts will be described. As a means of mutual inductive coupling between an inductive line such as a power supply layer and a guided line such as a ground line, an interstitial via shown in FIGS. The inner wall 5 and the land 6 of the hole 2 or the via hole 3 shown in FIGS. 3C and 3D or the through hole 4 shown in FIGS. 3E and 3F Were divided into two electrodes 7, and the divided electrodes 7 were brought close to each other while maintaining insulation g corresponding to a potential difference between conductors approaching each other, and a guide line 8 and a guided line 9 were wired respectively. That is, the interstitial via hole 2 or via hole 3 or through hole 4
The inner wall 5 of the interlayer connection hole 1 and the land 6 are divided into a plurality of electrodes 7, and the divided electrodes 7 are brought close to each other while maintaining insulation, and a guide line 8 and a guided line 9 are connected to the respective electrodes 7. Are arranged to reduce the inductance of the connection conductor 11.

In this way, since the guide line and the guided line are routed close to the divided electrode, the guide line and the guided line are brought close to each other at the interlayer connection hole where the inductance is locally increased. In the mutual inductive coupling state, currents cancel each other out,
The inductance of the connection conductor can be reduced.

FIG. 2 is a diagram showing an embodiment of the present invention. FIG. 2 (z) is a schematic perspective view, FIG. 2 (a), FIG. 2 (c) and FIG. (B), (d), and (f) of FIG.

Referring to FIG. 3, a case where the interlayer connection hole 1 is divided into four parts will be described. As a means of mutual inductive coupling between an inductive line such as a power supply layer and a guided line such as a ground line, an interstitial via shown in FIGS. The inner wall 5 and the land 6 of the hole 2 or the via hole 3 shown in FIGS. 3C and 3D or the through hole 4 shown in FIGS. 3E and 3F Were divided into four electrodes 7, and the divided electrodes 7 were brought close to each other while maintaining insulation g corresponding to a potential difference between conductors approaching each other, and a guide line 8 and a guided line 9 were wired respectively. That is, the interlayer connection hole 1 is configured such that the circumference of the inner wall 5 and the land 6 is divided into an even number.

As a result, since the circumference between the inner wall of the interlayer connection hole and the land is divided into an even number, currents cancel each other in a mutual inductive coupling state in which the guide line and the guided line are always brought close to each other. Thus, the inductance of the connection conductor can be reduced.

FIG. 3 is a diagram showing another embodiment of the present invention and shows a top view.

In the figure, for example, four interlayer connection holes 1
Will be described. As a means of mutual inductive coupling between an inductive line such as a power supply layer and a guided line such as a ground line, an interlayer connecting hole 1 made up of an interstitial via hole or a via hole or a through hole so as to reduce the inductance of the connecting conductor 11. Are maintained close to each other while maintaining insulation g that can cope with the potential difference between the approaching conductors.
And were wired alternately. That is, a plurality of interlayer connection holes 1 composed of the interstitial via holes 2, via holes 3, or through holes 4 are arranged while maintaining insulation, and a guide line 8 and a guided line 9 are provided in each interlayer connection hole 1. The wiring is alternately arranged to reduce the inductance of the connection conductor 11.

With this arrangement, since the interlayer connection holes are arranged close to each other and the guide line and the guided line are respectively wired, the joining is performed in a mutual inductive coupling state by approaching the inner walls of the respective interlayer connection holes. The inductance of the conductor can be reduced.

FIGS. 4A and 4B show another embodiment of the present invention. FIG. 4A is a top view and FIG. 4B is a sectional view.

Referring to FIG. 5, a case where via holes 3 and through holes 4 having different diameters are formed concentrically will be described. Via holes 3 and through holes 4 having different diameters are formed concentrically so as to reduce the inductance of the connection conductor 11 and approach each other as a means of mutual inductive coupling between an induction line such as a power supply layer and a guided line such as a ground line. The insulation g that can cope with the potential difference between the conducting conductors is maintained close to each other, and the induction line 8 and the guided line 9 are respectively connected.
And wired. That is, a plurality of the interlayer connection holes 1 are arranged concentrically, and a guide line 8 and a guided line 9 are wired in each of the interlayer connection holes 1.

With this arrangement, the concentric interlayer connection holes are connected to the guide line and the guided line, respectively, so that a large mutual inductive coupling obtained by bringing the inner walls of the respective interlayer connection holes close to each other. In this state, the inductance of the connection conductor can be reduced.

FIGS. 5A and 5B show another embodiment of the present invention. FIG. 5A is a sectional view of the via hole 3 and FIG. 5B is a sectional view of the through hole 4.

Referring to FIG. 5, a method for manufacturing via holes 3 and through holes 4 will be described. As a means of mutual inductive coupling between an inductive line such as a power supply layer and a guided line such as a ground line, the via hole 3 shown in FIG. As means for preventing the electroless plating from adhering in the initial manufacturing process of the printed wiring board so that the inner wall 5 of the interlayer connection hole 1 constituted by the through hole 4 shown can be divided, for example, an electroless plating resist is sprayed on the interlayer connection hole. 1 was applied to the inner wall 5. That is, the inner wall 5 of the interlayer connection hole 1 has a manufacturing process configuration in which the circumference is divided by a plating adhesion preventing process in a pre-plating process.

Thus, the inner wall of the interlayer connection hole is
Since the circumference is divided by the plating adhesion preventing process in the pre-plating process, the circumference can be divided in the initial stage of the manufacturing process of the printed wiring board, and this state can be maintained until the final stage of the manufacturing process.

FIGS. 6A and 6B show another embodiment of the present invention. FIG. 6A is a sectional view of the via hole 3 and FIG. 6B is a sectional view of the through hole 4.

Referring to FIG. 5, a method of manufacturing via holes 3 and through holes 4 will be described. As a means of mutual inductive coupling between an inductive line such as a power supply layer and a guided line such as a ground line, the via hole 3 shown in FIG. As means for dividing the conductor of the inner wall 5 of the interlayer connection hole 1 in the manufacturing process of the printed wiring board so as to divide the inner wall 5 of the interlayer connection hole 1 formed by the through hole 4 shown, for example, a rotating cutter or the like is used. The conductor attached to the inner wall 5 of the interlayer connection hole 1 was cut. That is, the inner wall 5 of the interlayer connection hole 1 has a manufacturing process configuration in which the circumference is divided by a cutting process in a process after the conduction process.

As a result, the inner wall of the interlayer connection hole becomes
Since the circumference is divided by the cutting process in the post-process of the conduction process, the inner wall of the interlayer connection hole can be divided at the final stage of the manufacturing process by the cutting process in the process after the conduction process. .

FIG. 7 is a view showing another embodiment of the present invention. FIG. 7 (z) is a schematic perspective view, and FIG. 7 (a), FIG.
(E) is a top view, and (b), (d), and (f) are cross-sectional views. In FIG. 1, reference numeral 10 denotes a printed wiring board, and a conductor for connecting components constituting a predetermined electric circuit is formed on an insulating plate made of resin on the surface or inside of the insulating plate.

Referring to FIG. 5, the case where the interlayer connection hole 1 is divided into two will be described. As a printed wiring board 10 provided with a mutual inductive coupling means between an inductive line such as a power supply layer and a guided line such as a ground line, a connection conductor 11
As shown in FIG.
In the interstitial via hole 2 shown in FIG. 3B, the via hole 3 shown in FIGS. 3C and 3D, or the through hole 4 shown in FIGS. 3E and 3F. The inner wall 5 and the land 6 of the interlayer connection hole 1 are divided into two electrodes 7, and the divided electrodes 7 are brought close to each other while maintaining an insulation g corresponding to a potential difference between conductors approaching each other. 8 and the guided line 9 were wired. That is, the inner wall 5 of the interlayer connection hole 1 composed of the interstitial via hole 2 or the via hole 3 or the through hole 4 and the land 6 are divided into a plurality of electrodes 7, and the divided electrodes 7 are approached while maintaining insulation. Then, the guide line 8 and the guided line 9 are wired to the respective electrodes 7 and the connection conductor 1 is connected.
1 is provided with an interlayer connection hole 1 that reduces the inductance.

In this way, since the guide line and the guided line are routed close to the divided electrode, the guide line and the guided line are made to approach each other at the interlayer connection hole where the inductance is locally increased. In the mutual inductive coupling state, currents cancel each other out,
The printed wiring board can reduce the inductance of the connection conductor.

FIG. 8 is a top view of another embodiment of the present invention.

In the figure, for example, four interlayer connection holes 1
Will be described. As a printed wiring board 10 provided with mutual inductive coupling means between an inductive line such as a power supply layer and a guided line such as a ground line, the conductors approaching the interlayer connection hole 1 so as to reduce the inductance of the connection conductor 11. The induction line 8 and the guided line 9 were alternately wired, respectively, while maintaining and approaching the insulation g corresponding to the potential difference. That is, the interlayer connection holes 1 formed by the interstitial via holes 2 or the via holes 3 or the through holes 4 are arranged close to each other while maintaining the insulation, and the guide lines 8 and the guided lines 9 are provided in the respective interlayer connection holes 1. And an interlayer connection hole 1 for reducing the inductance of the connection conductor 11 is provided.

As a result, the interlayer connection holes are arranged close to each other, and the guide line and the guided line are alternately wired respectively. In a mutual inductive coupling state by approaching the line, currents cancel each other out, so that a printed wiring board that can reduce the inductance of the connection conductor can be obtained.

[0056]

According to the present invention described above, the following effects can be expected.

First, the inner wall of the interlayer connection hole formed of the interstitial via hole or the via hole or the through hole and the land are divided into a plurality of electrodes, and the divided electrodes are brought close to each other while maintaining the insulation. In addition, a guide line and a guided line are wired to reduce the inductance of the connection conductor.

In this way, since the guide line and the guided line are routed close to the divided electrode, the guide line and the guided line are made to approach each other at the interlayer connection hole where the inductance is locally increased. In the state of mutual inductive coupling, the currents cancel each other out, reducing the inductance of the connection conductors, making it possible to provide an interlayer connection hole for stable operation of the signal processing circuit, and to provide a conventional interlayer connection hole. Connection holes required for each of the guide line and the guided line are combined into one, the number of connection holes can be reduced, and the processing of the printed wiring board can be reduced.

Next, the interlayer connection hole has a configuration in which the circumference of the inner wall and the land is divided into an even number.

Thus, the circumference of the land between the inner wall of the interlayer connection hole and the land is divided into an even number. In addition to the above-described effects, in the mutual inductive coupling state in which the guide line and the guided line are always brought close to each other, The mutual cancellation of the currents can reduce the inductance of the connecting conductor, and reduce the inductance of the connecting conductor in a state where multiple induction lines and guided lines are mutually inductively coupled with one interlayer connection hole. In addition, the number of connection holes can be reduced, and processing of the printed wiring board can be reduced.

Further, a plurality of interlayer connection holes consisting of interstitial via holes or via holes or through holes are arranged while maintaining insulation, and a guide line and a guided line are alternately wired in each interlayer connection hole. In addition, the configuration is such that the inductance of the connection conductor is reduced.

With this arrangement, the interlayer connection holes are arranged close to each other, and the guide line and the guided line are respectively wired. Therefore, in addition to the above-described effects, the mutual connection by bringing the inner walls of the respective interlayer connection holes close together is achieved. In the inductive coupling state, the inductance of the joint conductor can be reduced, and particularly in the relationship between the power supply layer and the ground line, the capacitance of the electrostatic coupling can be increased, and the impedance of the power supply layer can be further reduced.

Further, a plurality of the interlayer connection holes are arranged concentrically, and a guide line and a guided line are wired in each interlayer connection hole.

With this arrangement, since the concentric interlayer connection holes are respectively connected to the guide line and the guided line, in addition to the above-described effects, the inner wall of each interlayer connection hole can be made closer. In the large mutual inductive coupling state obtained, the inductance of the connection conductor can be reduced.Especially, in the relationship between the power supply layer and the ground line, the electrostatic coupling capacitance is greatly increased, and the impedance of the power supply layer is further reduced. Can be.

Next, the inner wall of the interlayer connection hole was formed in a manufacturing process configuration in which the circumference was divided by a plating adhesion preventing process in a pre-plating process.

In this way, the circumference of the inner wall of the interlayer connection hole is divided by the plating adhesion preventing process in the pre-plating process, so that in addition to the above-mentioned effects, the circumference can be reduced in the initial stage of the printed wiring board manufacturing process. The printed circuit board can be divided and maintained in this state until the final stage of the manufacturing process, and can be manufactured without largely changing the manufacturing process of a normal printed wiring board.

The inner wall of the interlayer connection hole is formed in a manufacturing process in which the circumference is divided by a cutting process in a process after the conduction process.

As a result, since the inner wall of the interlayer connection hole is divided by the cutting process in the post-step of the conduction process, the inner wall of the interlayer connection hole is formed in the step after the conduction process. The circumference can be divided by the cutting process, and the circumference can be divided at the final stage of the manufacturing process of the printed wiring board, and can be performed at the final stage of the manufacturing process without changing the normal manufacturing process of the printed wiring board. It can be manufactured by adding a cutting process.

Further, the inner wall of the interlayer connection hole consisting of the interstitial via hole or the via hole or the through hole and the land are divided into a plurality of electrodes, and the divided electrodes are brought close to each other while maintaining the insulation. In addition, a guide line and a guided line are connected to each other, and an interlayer connection hole that reduces the inductance of the connection conductor is provided.

In this way, since the guide line and the guided line are routed close to the divided electrode, in addition to the above-described effect, the induction line and the guided line are formed at the interlayer connection hole where the inductance is locally increased. In a state of mutual inductive coupling by approaching the line, the current cancels each other out, reducing the inductance of the connection conductor and making the printed circuit board a stable operation of the signal processing circuit. be able to.

Further, an interlayer connection hole composed of an interstitial via hole or a via hole or a through hole is arranged close to each other while maintaining insulation, and a guide line and a guided line are wired in each interlayer connection hole. An interlayer connection hole for reducing the inductance of the connection conductor is provided.

With this arrangement, the interlayer connection holes are arranged close to each other, and the guide line and the guided line are respectively wired. Therefore, in addition to the above-described effects, the induction is provided by the interlayer connection holes having locally increased inductance. In a mutual inductive coupling state where the line and the guided line are brought close to each other, the currents cancel each other out, thereby reducing the inductance of the connection conductor, and in particular, stabilizing the signal processing circuit in which the impedance of the power supply layer is reduced. The printed wiring board can perform the above operation.

[Brief description of the drawings]

FIG. 1 is a principle diagram of the present invention.

FIG. 2 is an embodiment diagram of the present invention.

FIG. 3 is another embodiment of the present invention.

FIG. 4 is another embodiment of the present invention.

FIG. 5 is another embodiment of the present invention.

FIG. 6 is a view showing another embodiment of the present invention.

FIG. 7 is another embodiment of the present invention.

FIG. 8 is another embodiment of the present invention.

FIG. 9 is a diagram showing an example of a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 interlayer connection hole 2 interstitial via hole 3 via hole 4 through hole 5 inner wall 6 land 7 electrode 8 guide line 9 guided line 10 printed wiring board 11 connection conductor

Claims (8)

[Claims] 1. A structure of an interlayer connection hole of a connection conductor comprising a guide line and a guided line of a printed circuit board for performing high-speed signal processing, comprising: an interstitial via hole (2), a via hole (3), or a through hole. The inner wall (5) of the interlayer connection hole (1) made of (4) and the land (6) are divided into a plurality of electrodes (7), and the divided electrodes (7) are approached while maintaining insulation, and A structure in which an induction line (8) and a guided line (9) are wired to the electrode (7) to reduce the inductance of the connection conductor (11). 2. The structure of an interlayer connection hole according to claim 1, wherein said interlayer connection hole (1) is formed by dividing the circumference of an inner wall (5) and a land (6) into an even number. 3. A structure of an interlayer connection hole of a connection conductor comprising a guide line and a guided line of a printed circuit board for performing a high-speed signal processing, comprising: an interstitial via hole (2), a via hole (3), or a through hole. A plurality of interlayer connection holes (1) consisting of (4) are arranged while maintaining insulation, and a guide line (8) and a guided line (9) are alternately wired in each interlayer connection hole (1), The structure of the interlayer connection hole, characterized in that the inductance of the connection conductor (11) is reduced. 4. A plurality of interlayer connection holes (1) are concentrically arranged, and a guide line (8) and a guided line (9) are wired in each interlayer connection hole (1). The structure of the interlayer connection hole according to claim 3, wherein 5. A method of manufacturing an interlayer connection hole of a connection conductor comprising a guide line and a guided line of a printed circuit board for performing high-speed signal processing, wherein an inner wall of the interlayer connection hole is subjected to a plating adhesion preventing process in a pre-plating process. A method of manufacturing an interlayer connection hole, comprising: dividing a circumference by: 6. A method of manufacturing an interlayer connection hole of a connection conductor comprising a guide line and a guided line of a printed circuit board for performing high-speed signal processing, wherein an inner wall of the interlayer connection hole is cut in a post-step of a conduction processing step. A method of manufacturing an interlayer connection hole, comprising dividing a circumference by processing. 7. An inner wall of an interlayer connection hole formed of an interstitial via hole or a via hole or a through hole and a land are divided into a plurality of electrodes. A printed wiring board, further comprising an interlayer connection hole for wiring an induction line and a guided line to reduce inductance of a connection conductor. 8. An interlayer connection hole composed of an interstitial via hole or a via hole or a through hole is arranged close to each other while maintaining insulation, and a guide line and a guided line are respectively inserted into each interlayer connection hole (1). A printed wiring board having an interlayer connection hole for wiring and reducing inductance of a connection conductor.