JP2002063976A - Socket for electric parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for electric parts which can raise transfer efficiency of an actuation force from an operating component to a slide plate by removing a sliding friction resistance between the slide plate and a base section. SOLUTION: In an IC socket 11 in which a contact pin 14 connected or disconnected to a terminal of electric parts is arranged in a base section 15, a slide plate 16 which can be freely transferred in an approximately horizontal direction at the upper side of the base section 15, is arranged, and the operating component 18 transferring the slide plate 16, is arranged in free movement in up and down direction, the slide plate 16 is supported floating by the contact pin 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical component socket for removably housing an electrical component such as a semiconductor device (hereinafter referred to as an "IC package"). The present invention relates to an electrical component socket provided with a slide plate that is elastically deformed.

[0002]

2. Description of the Related Art Conventionally, as this kind of "electric component socket", for example, there is an IC socket which removably accommodates an IC package which is an "electric component".

In this IC socket, a contact pin is provided on a base portion of the socket body so as to be separated from and connected to a terminal of the IC package. When an operation member is lowered, a slide plate is moved in a substantially horizontal direction. The contact pins are elastically deformed and displaced. A top plate is provided above the slide plate, and the IC package is accommodated on the top plate. Terminals protruding below the IC package are inserted into a large number of insertion holes formed in the top plate, and contact portions of contact pins for sandwiching the terminals are inserted.

[0004]

However, in such a conventional apparatus, when the slide plate is moved in a substantially horizontal direction, the slide plate moves while being in contact with the base portion. However, there is a problem that the sliding friction resistance is increased and the operation efficiency is deteriorated.

Accordingly, the present invention provides an electrical component socket which can eliminate the sliding frictional resistance generated between the slide plate and the base portion and improve the efficiency of transmitting the operating force from the operating member to the slide plate. The challenge is to do.

[0006]

In order to achieve the above object, according to the first aspect of the present invention, a contact pin which is separated from and connected to a terminal of an electric component is provided on a base portion, and a contact pin is provided above the base portion. An electrical component socket in which a slide plate that is movable in a substantially horizontal direction is provided, and an operation member that moves the slide plate is vertically movably disposed.
The slide plate is a socket for an electrical component supported in a state of being floated by the contact pins.

According to a second aspect of the present invention, in addition to the first aspect, the contact pin has a movable elastic piece which is displaced by being pressed by the movement of the slide plate. An engaging portion is formed, and the engaged portion formed on the slide plate is engaged with the engaging portion to support the slide plate.

[0008] The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the configuration described above, the contact pin has the movable-side elastic piece and the fixed-side elastic piece, and a terminal of the electric component is sandwiched by a contact portion formed at a tip portion of each of the elastic pieces. It is characterized by the following.

[0009]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 24 show a first embodiment of the present invention.

First, the structure will be described.
An IC socket as an “electric component socket”. The IC socket 11 is used for performing a performance test of the IC package 12 as an “electric component”.
The second is to electrically connect the solder ball 12b as a "terminal" of No. 2 to a printed wiring board (not shown) of a measuring instrument (tester).

This IC package 12 is a so-called BG
This is called an A (Ball Grid Array), and a large number of solder balls 12b protrude from the lower surface of a rectangular package body 12a, and these solder balls 12b are arranged in a matrix.

On the other hand, the IC socket 11 has a socket body 13 arranged on a printed wiring board. The socket body 13 has a base 15 to which a contact pin 14 is attached. A slide plate 16 is slidably arranged on the upper side, and further,
On top of this slide plate 16 is a top plate 17
Are arranged. The IC package 12 is accommodated on the top plate 17.

The slide plate 16 is supported by contact pins 14 which will be described in detail below, and is supported above the base portion 15 so as to be movable in a diagonal direction indicated by an arrow in FIG. The contact pins 14 arranged on the socket body 13 are elastically deformed and displaced by moving the 16 by a “moving means” described later.

A rectangular frame-shaped operating member 18 is provided on the socket body 13 so as to be vertically movable substantially vertically with respect to the slide plate 16, and the operating member 18 is moved up and down. The slide plate 16 is laterally moved by the "moving means".

More specifically, the contact pin 14 is
As shown in FIG. 22, it is formed of a plate material having spring properties and excellent conductivity, and is press-fitted and fixed in a press-fitting hole 15 a of a base portion 15, and a lead portion 14 extends downward from the base portion 15.
a is projected, and the lead portion 14a is electrically connected to the printed wiring board. The contact pin 14 has a fixed-side elastic piece 14b and a movable-side elastic piece 14c.
By the contact portions 14d and 14e formed at the tip of c,
The solder balls 12b of the IC package 12 are sandwiched and electrically connected.

As shown in FIGS. 20 to 22, the movable elastic piece 14c is formed with a pair of locking pieces 14f protruding laterally as "locking portions". The stepped portion 16g as a “locked portion” formed on the slide plate 16 is hooked on the slide plate 16f, so that the slide plate 16
It is supported in a floating state.

The movable-side elastic piece 14c is locked by a locking portion 16f of the slide plate 16, and by moving the slide plate 16, the movable-side contact portion 14c is elastically deformed. The space between 14d and 14e is configured to expand as shown in FIGS. 22 and 23 (b).

The "moving means" for moving the slide plate 16 includes a lever member 21 rotated by the operating member 18 and a "rotating member" rotatably provided on the lever member 21 via a shaft 22. Is a circular gear 2
And 3. The lever member 21 and the gear 23 are arranged in four sets around the slide plate 16 (see FIGS. 1 and 4).

The pair of lever members 21 and the gears 23 are disposed between the socket body side locking portion 15b formed on the socket body 13 and the slide plate side locking portion 16b formed on the slide plate 16. Has been interposed.

The socket body side locking portion 15b and the slide plate side locking portion 16b have rolling surfaces 15 respectively.
c, 16c are formed on the rolling surfaces 15c, 16c. The teeth 23a of the gear 23 or the curved surface portion 21 of the lever member 21 are formed on the rolling surfaces 15c, 16c.
a is configured to roll. Each of these rolling surfaces 1
Lock projections 15d, 16d are respectively formed on 5c, 16c, and these lock projections 15d, 16d are locked between the locking recesses 21b formed on the lever member 21 or the respective teeth 23a of the gear 23. It has become so.

The opposing rolling surface 15c and rolling surface 1
6c is not parallel, but is formed so that the interval becomes narrower toward the inside of the socket.

Further, as shown in FIGS. 6 and 7, a tapered surface 18a formed on the operating member 18 slides on the end 21c of each lever member 21, and the operating member 18 is lowered. Each lever member 21 is set to be rotated in the direction of the arrow in FIG.

When the operating member 18 is lowered, the operating force of the operating member 18 causes the lever member 21 to rotate about the locking portion of the locking concave portion 21b, thereby forming the shaft 22. Is displaced toward the inside of the socket, and the lever member 21 and the gear 23 roll with respect to the locking portions 15b and 16b, so that the socket body side locking portion 15b
The projecting force acts between the slide plate 16 and the slide plate side locking portion 16b, so that the slide plate 16 is moved as shown in FIG.

The top plate 17 has a substantially rectangular plate shape, has an insertion hole 17a into which the contact pin 14 is inserted, and is provided on the slide plate 16 so as to be movable in the same direction as the slide plate 16. 4 is urged in the direction of arrow a in FIG. As shown in FIGS. 4 and 8, a pair of long holes 17b are formed in the top plate 17 along the moving direction.
The pressing projection 16e protruding from is inserted. The positional relationship between the pressing protrusion 16e and the long hole 17b is such that after the slide plate 16 is moved by a predetermined amount due to the lowering of the operating member 18, the pressing protrusion 16e abuts on one inner peripheral wall of the long hole 17b. The top plate 17 is configured to be pressed by the protrusion 16e and moved by a predetermined amount. Moreover, guide portions 17c for guiding the respective corners of the IC package body 12a are formed at the respective corners of the square of the top plate 17.

On the other hand, as shown in FIG. 1, the operating member 18 has an opening 18 of a size into which the IC package 12 can be inserted.
b, the IC package 12 is inserted through the opening 18b and the top plate 17
The operation member 18 is disposed on the socket body 13 so as to be vertically movable. As shown in FIG. 14, the operation member 18 is urged upward by a coil spring 24 as an “elastic member” disposed between the operation member 18 and the socket body 13.

More specifically, the upper side of the coil spring 24 is accommodated in a cylindrical portion 25 a of an upper holder 25, and the lower side of the coil spring 24 is accommodated in a cylindrical portion 26 a of a lower holder 26.

The upper holder 25 is rotatably provided on the operating member 18 by a shaft 25b.
The base portion 15 of the socket body 13 is rotatably provided by a shaft 26b, and the tubular portion 26a of the lower holder 26 is slidably inserted into the tubular portion 25a of the upper holder 25. The coil spring 24 is disposed obliquely with respect to the vertical direction, and has an upper end portion rotatably disposed with respect to the operation member 18 and a lower end portion rotatably disposed with respect to the socket body 13. When the operating member 18 is lowered, the coil spring 24 is configured to fall down.

As shown in FIG. 14 and the like, a pair of pressing members 27 are rotatably provided on the base portion 15 of the socket body 13 so as to be able to open so-called double-opening.
The pressing member 27 is provided with a heat sink 29 which is in contact with the chip portion of the IC package 12 to dissipate the heat at the center of the substantially gate-shaped rotating arm 28. The heat sink 29 is made of, for example, aluminum die-cast and has good thermal conductivity.

Further, as shown in FIG. 14 and the like, the pivot arm 28 has its fulcrum portion pivoted by a pivot shaft 30 to the base portion 15.
And a circular arc-shaped long hole 28 is provided at a portion opposite to the central portion when viewed from the fulcrum portion.
a is formed, and the pressing shaft 18c of the operating member 18 is inserted and pressed into the elongated hole 28a.
When the operating member 18 is at the upper limit position, as shown in FIG. 14, the pressing shaft 18c is higher than the rotating shaft 30, and when the operating member 18 is at the lower limit, as shown in FIG. The pressing shaft 18c is configured to be lower than the rotating shaft 30. By doing this,
The speed immediately before the closing of the pressing member 27 is completed is lower than the speed during the previous closing, and the speed immediately before the opening is completed is also lower than the speed during the previous opening. .

In the IC socket 11 having such a configuration,
The mounting of the IC package 12 on the socket body 13 is performed as follows.

First, the operating member 18 is pushed down by an automatic machine, for example, against the urging force of the coil spring 24. As a result, the pressing shaft 18c of the operating member 18 presses the rotating arm 28 while moving in the elongated hole 28a of the rotating arm 28 of the pressing member 27, so that the pressing member 27 moves the rotating shaft 30. Rotate to the center.

Here, the turning operation of the pressing member 27 will be described. First, as shown in FIG. 17A, the operation member 1 is moved from the state where the operation member 18 is at the upper limit position.
8, the pressing shaft 18 c of the operating member 18 presses the turning arm 28 while moving in the long hole 28 a of the turning arm 28 of the pressing member 27. The member 27 rotates around the rotation shaft 30 and opens. When moving from (a) of FIG. 17 to (a) of FIG. 18, since the pressing shaft 18c approaches the rotating shaft 30, it is assumed that the descending speed of the operating member 18 is constant. The rotation speed of the pressing member 27 increases.

Further, when the operating member 18 is further lowered, the pressing shaft 18c which was located at the upper position of the rotating shaft 30 is shifted to the lower position, and as the operating member 18 is lowered, the pressing shaft 18c is rotated. Go away from 30. As a result, the rotation speed of the operation member 18 decreases. Moreover, since the long hole 28a has an arc shape, the pressing shaft 18
When c moves from (a) to (c) in FIG. 18, the long hole 28a has a linear shape,
The rotation speed of the pressing member 27 decreases.

As described above, since the rotating speed of the pressing member 27 is lower immediately before the completion of the opening than during the opening, the impact of the inertia force on the stopper mechanism of the pressing member 27 at the completion of the opening can be reduced.

When the pressing member 27 is fully opened, as shown in FIG. 16, the pressing member 27 extends substantially in the vertical direction, and is retracted from the IC package 12 insertion range.

On the other hand, as the operating member 18 is lowered, each tapered surface 18a slides and pushes the end 21c of each lever member 21 from the state shown in FIGS. 6 and 7 to the state shown in FIGS. 11 and 12. By doing so, the lever member 21 is rotated in the direction of the arrow in FIG. At this time, each lever member 21 is moved from the state shown in FIG.
, The shaft 22 is displaced toward the inside of the socket. With the displacement of the shaft 22, the gear 23 rolls on the rolling surfaces 15c, 16c of the socket body side locking portion 15b or the slide plate side locking portion 16b toward the socket inside. Then, the distance between the opposing rolling surfaces 15c and 16c is reduced toward the inside of the socket, and the shaft 22 is displaced in the narrowing direction. A tension force acts between the main body side locking portion 15b and the slide plate side locking portion 16b, and the slide plate 16 is moved as shown in FIG.

As a result, the slide plate 16 is
When it is moved rightward in the figure from the state shown in FIG. 0 to the state shown in FIG. 22, the movable contact part 14c of the contact pin 14 is pushed by the locking part 16f of the slide plate 16 and elastically deformed. A predetermined amount of space is opened between the pair of contact portions 14d and 14e (see FIGS. 22 and 23B).

As described above, since the operating force from the operating member 18 is converted into the moving operation of the slide plate 16 by the rotation operation of the lever member 21 and the gear 23, the slide plate 16 is made The force pressing against the portion 15 can be reduced, the operating friction of the slide plate 16 and the like can be suppressed, smooth operation can be performed, the wear of the slide plate 16 and the like can be reduced, and the operation member 18 can be pressed with a small force.

When the slide plate 16 is slid, the slide plate 16 is supported by the contact pins 14 in a floating state. As the slide plate 16 slides, the movable elastic pieces of the contact pins 14 are moved. 14c is elastically deformed, the sliding friction force generated between the contact pin 14 and the slide plate 16 is much smaller than the conventional sliding friction force generated between the slide plate and the base portion.
As a result, the operation efficiency can be significantly improved.

Further, when the slide plate 16 moves by a predetermined amount, the pressing protrusion 1 of the slide plate 16 is moved.
By 6e, the top plate 17 is moved in the same direction by a distance substantially half of the moving amount of the slide plate 16.

In this state, the IC package 12 is mounted on the top plate 17 by being guided by the respective guide portions 17c, so that the solder balls 1 of the IC package 12 are formed.
2b is a pair of open contact portions 1 of the contact pin 14.
4b and 14c.

In this case, since the top plate 17 is slightly moved in the direction in which the contact pin movable side elastic piece 14c opens, the size of the insertion hole 17a of the top plate 17 can be made smaller than in the conventional case, and the insertion hole is accordingly reduced. Since the wall thickness of the partition between the portions 17a can be increased, the strength of the top plate 17 can be improved.

Next, when the pressing force on the operating member 18 is released, the operating member 18 is raised by the urging force of the coil spring 24, so that the pressing of the lever member 21 by the operating member tapered surface 18a is released. Then, the slide plate 16 returns to the original position by the elastic force of the plurality of contact pins 14 and the urging force of a spring (not shown).

When the slide plate 16 returns,
The movable elastic piece 14c returns to the original position, and the solder balls 12b of the IC package 12 are sandwiched and electrically connected at the two contact portions 14d and 14e.
In this pinched state, the fixed-side elastic piece 14b is displaced by the elastic force of the movable-side elastic piece 14c, and the two contact portions 14d,
The position where the elastic force of 14e is balanced, that is, the position where the solder ball 12b of the IC package 12 is centered, is clamped. FIG. 24A shows a state in which a solder ball 12b having a maximum diameter is sandwiched, and FIG.

When the slide plate 16 returns, the pressing force on the top plate 17 is released, and the top plate 17 also returns to its original position. Therefore, even if the fixed side elastic piece 14b is slightly elastically deformed. The fixed-side contact portion 14b does not interfere with the partition 17d of the top plate 17.

Therefore, the contact portion 14 of the contact pin 14
In the state where d and 14e are in contact with the solder balls 12b of the IC package 12, the moving pressure of the slide plate 16 and the top plate 17 does not act on the contact pins 14, and
Since the solder ball 12b can be brought into contact with only the repulsive force generated by the deflection of the contact pin 14, the deformation of the solder ball 12b can be prevented without applying abnormal pressure to the contact pin 14.

Further, when the operating member 18 is lifted, the pressing shaft 18c rises while sliding in the long hole 28a of the rotating arm 28, so that the pressing member 27 rotates in the closing direction around the rotating shaft 30. In the state shown in FIG. 14, the heat sink 29 provided on the pressing member 27 is brought into contact with the chip portion of the IC package main body 12a to press the IC package 12 and release heat from the chip portion. Will be done.

When the pressing member 27 is closed, it moves in a direction opposite to that when the pressing member 27 is opened, and FIGS. 18 (c), (b) and (a) and FIGS. 17 (c), (b) and (a). ) As shown in FIG.
7 is closing. 17 (c), (b),
As shown in (a), the rotation speed of the pressing member 27 decreases as the pressing shaft 18c moves away from the rotation shaft 30, and the long hole 28a curves upward as the pressing shaft 18c moves away from the rotation shaft 30. Also, the rotation speed of the pressing member 27 is reduced.

As described above, since the rotation speed of the pressing member 27 is reduced during the closing, the speed immediately before the completion of the closing can be reduced, so that the impact acting on the IC package 12 from the pressing member 27 can be reduced. .

The coil spring 24 for urging the operating member 18 upward is disposed obliquely with respect to the up and down direction, and the upper end is rotatably provided with respect to the operating member 18 by the upper holder 25. And the lower end is the lower holder 2
6 so as to be rotatable with respect to the socket body 13, by lowering the operation member 18,
As shown in FIGS. 14, 15 and 16, the coil spring 24 falls down.

Therefore, when the operating member 18 is at the raised position, the amount of the coil spring 24 falling is small, so that the component force P1 along the vertical direction is large and the component force P2 along the horizontal direction is small. Therefore, a force for urging the operation member 18 upward is secured, and a pressing force for pressing the IC package 12 by the pressing member 27 is secured. Operation member 1
When the coil spring 8 is lowered, since the coil spring 24 falls down, the component force P2 along the horizontal direction increases as shown in FIG. 16, and the component force P1 along the vertical direction decreases accordingly. Therefore, by releasing the pressure of the coil spring 24 in the lateral direction, the maximum operating force is reduced, and an increase in the repulsive force at the lower limit position of the operating member 18 is suppressed.
Operability can be improved.

That is, when the pressure for urging the operation member 18 upward is required, the pressing member 27
2 is to be pressed, and in order to release the pressing member 27, the smaller the pressure, the better.
By releasing the pressure in the lateral direction, the maximum operating force can be reduced.

As described above, the coil spring 2
When the coil spring 4 is housed in the cylindrical portions 25a and 26a of the holders 25 and 26, the coil spring 24 can be prevented from coming off and dust can be prevented from being caught.

In each of the above embodiments, the present invention is applied to the IC socket 11 as the “electric component socket”. However, the present invention is not limited to this and can be applied to other devices. In each of the above embodiments, a contact pin having one pair of contact portions for holding a terminal of an IC package or a solder ball has one contact portion fixed and the other contact portion movable. Although the description has been given above, the present invention is not limited to this, and may have only a movable contact portion, or may have both of a pair of contact portions movable and displaced. Good. Further, the mechanism for moving the slide plate is not limited to the one described in the above embodiment, but may be moved using an X-shaped link or the like. Also, B
Not limited to GA type IC packages, but PGA (Pin Gri
The present invention can also be applied to an IC socket for a (d Array) type IC package.

[0056]

As described above, according to the first aspect of the present invention, since the slide plate is supported in a state of being floated by the contact pins, when the slide plate is moved, the slide plate and the base are moved. It is possible to eliminate sliding friction resistance between the operating member and the sliding plate, and it is possible to improve the efficiency of transmitting the operating force from the operating member to the slide plate.

According to the second aspect of the present invention, in addition to the above-described effects, the slide plate has a simple structure in which a locking portion is formed on the movable elastic piece of the contact pin and a locked portion is formed on the slide plate. Can be supported.

According to the third aspect of the present invention, in addition to the above effects, in the contact pin having the movable side elastic piece and the fixed side elastic piece, the slide plate is supported by the movable side elastic piece. The operation of the slide plate can be performed smoothly without generating large sliding frictional resistance between the slide plate and the fixed-side elastic piece.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to Embodiment 1 of the present invention.

FIG. 2 is a front view of the IC socket according to the first embodiment.

FIG. 3 is a schematic sectional view showing a heat sink and the like according to the first embodiment.

FIG. 4 is a plan view of the IC socket according to the first embodiment in a state where an operation member is removed.

FIG. 5 is a plan view showing a slide plate, a moving unit, and the like according to the first embodiment.

FIG. 6 is a schematic cross-sectional view of the IC socket according to the first embodiment taken along line AA in FIG. 4; In addition, the operation member is also shown for convenience of explanation.

FIG. 7 is a schematic sectional view of the IC socket according to the first embodiment, taken along line BB in FIG. 4; In addition, the operation member is also shown for convenience of explanation.

FIG. 8 is a cross-sectional view of the IC socket according to the first embodiment, taken along line CC in FIG. 4;

FIG. 9 is a plan view of the IC socket according to the first embodiment in a state where an operation member is removed.

FIG. 10 is a plan view showing a slide plate, a moving unit, and the like according to the first embodiment.

FIG. 11 is a schematic sectional view of the IC socket according to the first embodiment, taken along line DD in FIG. 9; In addition, the operation member is also shown for convenience of explanation.

FIG. 12 is a schematic sectional view of the IC socket according to the first embodiment, taken along line EE in FIG. 9; In addition, the operation member is also shown for convenience of explanation.

FIG. 13 is a sectional view of the IC socket according to the first embodiment, taken along line FF in FIG. 9;

FIG. 14 is a diagram showing a state in which a pressing member of the IC socket according to the first embodiment is closed.

FIG. 15 is a view showing the IC socket according to the first embodiment in the middle of opening and closing of a pressing member.

FIG. 16 is a diagram showing a state where a pressing member of the IC socket according to the first embodiment is opened.

FIG. 17 is an explanatory diagram illustrating a state in which the pressing member according to the first embodiment, from which the heat sink is omitted, is in a state from a closed state to a halfway opening state.

FIG. 18 is an explanatory diagram showing a state in which the pressing member without the heat sink according to the first embodiment is being opened until the opening is completed;

FIG. 19 is a sectional view showing the slide plate according to the first embodiment.

FIG. 20 is a view showing an arrangement state of contact pins according to the first embodiment, wherein (a) is a plan view and (b) is a longitudinal sectional view.

FIG. 21 is a view showing an arrangement state with the contact pin closed according to the first embodiment, and is a longitudinal sectional view in a direction different from FIG. 20 (b).

FIGS. 22A and 22B are diagrams showing an arrangement state of the first embodiment with the contact pins opened, wherein FIG. 22A is a plan view and FIG.
Is a longitudinal sectional view.

23A and 23B are enlarged cross-sectional views of the contact pin tip side according to the first embodiment, wherein FIG. 23A shows a state where the contact pin is closed, and FIG. 23B shows a state where the contact pin is opened.

FIG. 24 is an enlarged cross-sectional view of a state in which a solder ball is held between the contact pins according to the first embodiment, where (a) shows a state where a solder ball having a maximum diameter is held, and (b) shows a state where a solder ball having a minimum diameter is held. This shows a state of being pinched.

[Explanation of symbols]

 11 IC socket (electric component socket) 12 IC package (electric component) 12a Package body 12b Solder ball (terminal) 13 Socket body 14 Contact pin 14b Fixed elastic piece 14c Movable elastic piece 14d, 14e Contact area 14f Lock piece (Locking part) 15 Base part 16 Slide plate 16g Step part (locked part) 17 Top plate 18 Operating member

Claims (3)

[Claims] An operation member for moving a slide plate is provided on a base portion, wherein a contact pin which is separated from and connected to a terminal of an electric component is provided on a base portion, and a slide plate movable in a substantially horizontal direction is provided above the base portion. Wherein the slide plate is supported by the contact pins so as to be floated by the contact pins. 2. The contact pin has a movable elastic piece which is pressed and displaced by the movement of the slide plate, and a locking portion is formed on the elastic piece. The electrical component socket according to claim 1, wherein the slide plate is supported by locking the formed locked portion. 3. The contact pin has the movable side elastic piece and the fixed side elastic piece, and a contact portion formed at a tip portion of each of the elastic pieces so that a terminal of the electric component is held therebetween. The socket for an electric component according to claim 1, wherein the socket is used.