JP2002063975A - Socket for electric parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for electric parts which can raise operational performance by suppressing increase of repulsion of an operational component in the minimum limit. SOLUTION: An IC socket is constituted with, a contact pin 14 contacting a terminal of electric parts arranged in a socket body 13, an operating component 18 arranged so as to freely move up and down to the socket body 13, and a coil spring 24 as an 'elastic component' which biases the operating component 18 to an upper side, arranged between the operating component 18 and the socket body 13. While the coil spring 24 is arranged in slanting state to the up and down direction, its upper end part is arranged in free rotation to the operating component 18, and its lower end is arranged in free rotation to the socket body. It is constituted so that the coil spring 24 may fall in by descending the operating component 18.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical component socket for removably housing electrical components such as a semiconductor device (hereinafter referred to as an "IC package").

[0002]

2. Description of the Related Art Conventionally, as this kind of "electric component socket", for example, there is an IC socket which removably accommodates an IC package which is an "electric component".

[0003] This IC socket has an IC body attached to the socket body.
A contact pin detachable from a terminal of the package is provided, and a contact portion of the contact pin is inserted into an insertion hole of the top plate to contact a terminal of an IC package housed on the top plate. A pressing member for pressing the IC package is rotatably provided on the socket body, and an operating member for rotating the pressing member is provided on the socket body so as to be vertically movable. A coil spring for urging the operation member upward is provided along the vertical direction.

In such a device, the operating member is lowered against the urging force of the coil spring, whereby the pressing member is opened by being rotated, and in this state, the IC package is placed on the top plate. Is accommodated.

Then, the operating member is released by releasing the operating force on the operating member, and the operating member is raised by the urging force of the coil spring, whereby the pressing member is closed, and the pressing member is pressed at the highest position of the operating member. The member is completely closed, and the IC package is pressed downward by the pressing member. At the same time, the contact portion at the upper end of the contact pin is brought into contact with the IC package terminal with a predetermined pressing force to conduct.

[0006]

However, in such a conventional device, to apply a necessary pressure to the pressing member at the upper limit position of operation of the operating member, a relatively large repulsive force is required for the coil spring. is there. Therefore, when the operating member is lowered in order to release the pressing member, the upward biasing force of the coil spring is proportionally increased with respect to the moving amount of the operating member. There is a possibility that the repulsive force to the member increases and exceeds the ability of the automatic machine for operating the operation member.

In view of this, the present invention maintains the repulsive force at the upper limit position of the operating member as in the prior art, suppresses an increase in the repulsive force at the lower limit of the operating member, and improves the operability. It is an object to provide a socket for parts.

[0008]

According to a first aspect of the present invention, a contact pin for contacting a terminal of an electric component is provided on a socket body, and an operation member is provided on the socket body. An electrical component socket disposed between the operation member and the socket body, wherein the elastic member is disposed movably up and down with respect to the socket body, and further urges the operation member upward. The member is disposed obliquely with respect to the vertical direction, an upper end portion is rotatably disposed with respect to the operation member, and a lower end portion is rotatably disposed with respect to the socket body. It is characterized in that an electrical component socket is configured such that the elastic member falls down by lowering the operation member.

According to a second aspect of the present invention, a contact pin for contacting a terminal of an electric component is provided on a socket body, and a pressing member for pressing the electric component is rotatably provided on the socket body. An operating member for rotating the pressing member is vertically movable with respect to the socket body, and an elastic member for urging the operating member upward is provided between the operating member and the socket body. The elastic member is disposed obliquely with respect to the up and down direction, and the upper end portion is provided in the socket for the electric component in which the operating member is pressed by the pressing member at the upper limit position. Are movably disposed with respect to the operation member,
A lower end portion is movably disposed with respect to the socket main body, and the operating member is lowered so that the elastic member is configured to fall down so as to be an electrical component socket.

[0010] The invention described in claim 3 is the invention according to claim 1 or 2.
In addition to the configuration described above, the elastic member includes a coil spring and two upper and lower holders, an upper side of the coil spring is housed in a cylindrical portion of an upper holder, and a lower side of the coil spring is a cylinder of a lower holder. The upper holder is rotatably provided on the operating member, the lower holder is rotatably provided on the socket body, and one of the cylindrical portions of the upper holder or the lower holder is the other. It is characterized by being slidably inserted and fitted in the cylindrical portion.

The invention described in claim 4 is the first or second invention.
In addition to the configuration described above, the elastic member is a coil spring, and a convex portion is formed on the operating member and the socket main body, and the convex portion of the operating member rotates at an upper end portion of the coil spring, and the upper end portion rotates. And the protrusion of the socket body is fitted to the lower end of the coil spring such that the lower end rotates.

The invention described in claim 5 is the first or second invention.
In addition to the configuration described above, the elastic member is a coil spring, a mounting member is rotatably disposed on the operation member and the socket body, and a mounting member on the operation member side is fitted to an upper end of the coil spring. The mounting member on the socket body side is fitted to a lower end of the coil spring.

[0013]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 20 show a first embodiment of the present invention.

First, the structure will be described.
An IC socket as an “electric component socket”. The IC socket 11 is used for performing a performance test of the IC package 12 as an “electric component”.
The second is to electrically connect the solder ball 12b as a "terminal" of No. 2 to a printed wiring board (not shown) of a measuring instrument (tester).

This IC package 12 is a so-called BG
This is called an A (Ball Grid Array), and a large number of solder balls 12b protrude from the lower surface of a rectangular package body 12a, and these solder balls 12b are arranged in a matrix.

On the other hand, the IC socket 11 has a socket body 13 arranged on a printed wiring board. The socket body 13 has a base portion 15 to which a contact pin 14 is attached. A slide plate 16 is slidably arranged on the upper side, and further,
On top of this slide plate 16 is a top plate 17
Are arranged. The IC package 12 is accommodated on the top plate 17.

The slide plate 16 is disposed movably in a diagonal direction indicated by an arrow in FIG. 1, and is disposed on the socket body 13 by moving the slide plate 16 by "moving means" described later. The contact pin 14 is elastically deformed and displaced.

A rectangular frame-shaped operating member 18 is provided on the socket body 13 so as to be vertically movable substantially vertically with respect to the slide plate 16, and the operating member 18 is vertically moved. The slide plate 16 is laterally moved by the "moving means".

More specifically, the contact pin 14 is
As shown in FIG. 3, the lead portion 14a is formed of a plate material having spring properties and excellent conductivity, and is press-fitted and fixed in a press-fitting hole 15a of the base portion 15, and a lead portion 14a projects downward from the base portion 15. 14a is electrically connected to the printed wiring board. A fixed contact portion 14b and a movable contact portion 14c are formed above the contact pin 14, and these fixed contact portions 14b and 14c are formed.
Accordingly, the solder balls 12b of the IC package 12 are sandwiched and electrically connected.

The upper end 14d of the movable side contact portion 14c is inserted into the insertion hole 16a of the slide plate 16 and is locked by the locking portion 16f. Contact part 14c
Is elastically deformed so that the space between both contact portions 14b and 14c is expanded as shown in FIG.

The "moving means" for moving the slide plate 16 includes a lever member 21 rotated by the operating member 18 and a "rotating member" rotatably provided on the lever member 21 via a shaft 22. Gear 23
And Four sets of the lever member 21 and the gear 23 are arranged around the slide plate 16 (FIG. 1).
And FIG. 4).

A pair of the lever member 21 and the gear 23 is provided between the socket body side locking portion 15b formed on the socket body 13 and the slide plate side locking portion 16b formed on the slide plate 16. Has been interposed.

The socket body side locking portion 15b and the slide plate side locking portion 16b have rolling surfaces 15 respectively.
c, 16c are formed on the rolling surfaces 15c, 16c. The teeth 23a of the gear 23 or the curved surface portion 21 of the lever member 21 are formed on the rolling surfaces 15c, 16c.
a is configured to roll. Each of these rolling surfaces 1
5c, 16c are formed with locking projections 15d, 16d as "locking portions", respectively.
16d is a locking recess 21b formed in the lever member 21.
Alternatively, the gear 23 is locked between the teeth 23a.

The opposing rolling surface 15c and rolling surface 1
6c is not parallel, but is formed so that the interval becomes narrower toward the inside of the socket.

Further, as shown in FIGS. 6 and 7, a tapered surface 18a formed on the operating member 18 is brought into contact with the end 21c of each lever member 21, and the operating member 18 is lowered. Thus, each lever member 21 is set to be rotated in the direction of the arrow in FIG.

When the operating member 18 is lowered, the lever member 21 is rotated about the locking portion of the locking concave portion 21b by the operating force of the operating member 18, whereby the shaft 22 is rotated. Is displaced toward the inside of the socket, and the lever member 21 and the gear 23 roll with respect to the locking portions 15b and 16b, so that the socket body side locking portion 15b
The projecting force acts between the slide plate 16 and the slide plate side locking portion 16b, so that the slide plate 16 is moved as shown in FIG.

The top plate 17 has a substantially rectangular plate shape, has an insertion hole 17a into which the contact pin 14 is inserted, and is provided on the slide plate 16 so as to be movable in the same direction as the slide plate 16. 4 is urged in the direction of arrow a in FIG. As shown in FIGS. 4 and 8, a pair of long holes 17b are formed in the top plate 17 along the moving direction.
The pressing projection 16e protruding from is inserted. The positional relationship between the pressing protrusion 16e and the long hole 17b is such that after the slide plate 16 is moved by a predetermined amount due to the lowering of the operating member 18, the pressing protrusion 16e abuts on one inner peripheral wall of the long hole 17b. The top plate 17 is configured to be pressed by the protrusion 16e and moved by a predetermined amount. Moreover, guide portions 17c for guiding the respective corners of the IC package body 12a are formed at the respective corners of the square of the top plate 17.

On the other hand, as shown in FIG. 1, the operation member 18 has an opening 18 of a size into which the IC package 12 can be inserted.
b, the IC package 12 is inserted through the opening 18b and the top plate 17
The operation member 18 is disposed on the socket body 13 so as to be vertically movable. As shown in FIGS. 14 to 16, the operating member 18 is urged upward by a coil spring 24 as an “elastic member” disposed between the operating member 18 and the socket body 13.

More specifically, the upper side of the coil spring 24 is accommodated in a cylindrical portion 25a of an upper holder 25, and the lower side of the coil spring 24 is accommodated in a cylindrical portion 26a of a lower holder 26.

The upper holder 25 is rotatably provided on the operating member 18 by a shaft 25b.
The base portion 15 of the socket body 13 is rotatably provided by a shaft 26b, and the tubular portion 26a of the lower holder 26 is slidably inserted into the tubular portion 25a of the upper holder 25. The coil spring 24 is disposed obliquely with respect to the vertical direction, and the upper end is rotatably disposed with respect to the operation member 18 and the lower end is rotatably disposed with respect to the socket body 13. Then, by lowering the operation member 18, the coil spring 24 is configured to fall down.

As shown in FIG. 14 and the like, a pair of pressing members 27 are rotatably provided on the base portion 15 of the socket main body 13 so as to be able to open so-called double click.
The pressing member 27 is provided with a heat sink 29 which is in contact with the chip portion of the IC package 12 to dissipate the heat at the center of the substantially gate-shaped rotating arm 28. The heat sink 29 is made of, for example, aluminum die-cast and has good thermal conductivity.

Further, as shown in FIG. 14 and the like, the pivot arm 28 has its fulcrum portion pivoted by a pivot shaft 30 to the base portion 15.
And a circular arc-shaped long hole 28 is provided at a portion opposite to the central portion when viewed from the fulcrum portion.
a is formed, and the pressing shaft 18c of the operating member 18 is inserted and pressed into the elongated hole 28a.
When the operating member 18 is at the upper limit position, as shown in FIG. 14, the pressing shaft 18c is higher than the rotating shaft 30, and when the operating member 18 is at the lower limit position, as shown in FIG. , The pressing shaft 18c is located lower than the rotating shaft 30. By doing so, the speed immediately before the closing of the pressing member 27 is completed is lower than the speed during the previous closing, and the speed immediately before the completion of the opening is also lower than the speed during the previous opening. It is configured to be.

In the IC socket 11 having such a configuration,
The mounting of the IC package 12 on the socket body 13 is performed as follows.

First, the operating member 18 is pushed downward against the urging force of the coil spring 24 by, for example, an automatic machine. As a result, the pressing shaft 18c of the operating member 18 presses the rotating arm 28 while moving in the elongated hole 28a of the rotating arm 28 of the pressing member 27, so that the pressing member 27 moves the rotating shaft 30. Rotate to the center.

Here, the turning operation of the pressing member 27 will be described. First, as shown in FIG. 17A, the operation member 1 is moved from the state where the operation member 18 is at the upper limit position.
8, the pressing shaft 18 c of the operating member 18 presses the turning arm 28 while moving in the long hole 28 a of the turning arm 28 of the pressing member 27. The member 27 rotates around the rotation shaft 30 and opens. When moving from (a) of FIG. 17 to (a) of FIG. 18, since the pressing shaft 18c approaches the rotating shaft 30, it is assumed that the descending speed of the operating member 18 is constant. The rotation speed of the pressing member 27 increases.

Further, when the operating member 18 is further lowered, the pressing shaft 18c which is located at the upper position of the rotating shaft 30 shifts to the lower position, and as the operating member 18 is lowered, the pressing shaft 18c is rotated. Go away from 30. As a result, the rotation speed of the operation member 18 decreases. Moreover, since the long hole 28a has an arc shape, the pressing shaft 18
When c moves from (a) to (c) in FIG. 18, the long hole 28a has a linear shape,
The rotation speed of the pressing member 27 decreases.

As described above, since the rotation speed of the pressing member 27 is lower immediately before the completion of the opening than during the opening, the impact of the inertia force on the stopper mechanism of the pressing member 27 at the completion of the opening can be reduced.

When the pressing member 27 is fully opened, as shown in FIG. 16, the pressing member 27 extends substantially in the vertical direction and retreats from the IC package 12 insertion area.

On the other hand, when the operating member 18 is lowered, each tapered surface 18a presses the end 21c of each lever member 21 while sliding from the state shown in FIGS. 6 and 7 to the state shown in FIGS. By doing so, the lever member 21 is rotated in the direction of the arrow in FIG. At this time, each lever member 21 is moved from the state shown in FIG.
, The shaft 22 is displaced toward the inside of the socket. With the displacement of the shaft 22, the gear 23 rolls on the rolling surfaces 15c, 16c of the socket body side locking portion 15b or the slide plate side locking portion 16b toward the socket inside. Then, the distance between the opposing rolling surfaces 15c and 16c becomes narrower toward the inside of the socket, and the shaft 22 is displaced in the direction of the narrowing. A tension force acts between the main body side locking portion 15b and the slide plate side locking portion 16b, and the slide plate 16 is moved as shown in FIG.

As a result, the slide plate 16 is
0, the contact pin 14 is moved toward the left.
The movable side contact portion 14c is pushed by the locking portion 16f of the slide plate 16 and is elastically deformed.
A predetermined amount is opened between b and 14c (see FIG. 20 (b)).

As described above, since the operating force from the operating member 18 is converted into the moving operation of the slide plate 16 by the rotating operation of the lever member 21 and the gear 23, the slide plate 16 is made to be more base than the conventional one. The force pressing against the portion 15 can be reduced, the operating friction of the slide plate 16 and the like can be suppressed, smooth operation can be performed, the wear of the slide plate 16 and the like can be reduced, and the operation member 18 can be pressed with a small force.

Further, when the slide plate 16 slides by a predetermined amount, the top plate 17 is moved in the same direction by a distance approximately half the movement amount of the slide plate 16 by the pressing projection 16e of the slide plate 16.

In this state, the IC package 12 is guided and mounted on the top plate 17 by the respective guide portions 17c, so that the solder balls 1 of the IC package 12 are formed.
2b is a pair of open contact portions 1 of the contact pin 14.
4b and 14c.

In this case, since the top plate 17 is slightly moved in the direction in which the contact pin movable side contact portion 14c opens, the size of the insertion hole 17a of the top plate 17 can be made smaller than in the prior art, and the insertion hole is accordingly reduced. Since the wall thickness of the partition between the portions 17a can be increased, the strength of the top plate 17 can be improved.

FIG. 20 shows an embodiment of the present invention.
FIG. 21 shows a conventional example. In this conventional example, FIG.
As shown in FIG. 1A, a gap L1 is set between the fixed side contact portion 14b of the contact pin 14 and the top plate partition 17d in a state where the slide plate 16 is not moved. This is because the solder ball 12b is connected to both contact portions 14 as indicated by a two-dot chain line in FIG.
b, 14c, the fixed-side contact portion 14b does not interfere with the top plate partition 17d so that the gap L1
Is set. Further, between the movable side contact portion 14c and the top plate partition 17d, the movable side contact portion 1c is provided.
When the space 4c is elastically deformed and opened as shown in FIG. 21B, a gap L is formed so as not to interfere with the partition 17d.
2 is set. Therefore, as the pitch between adjacent contact pins 14 becomes smaller, the gaps L1, L
2, the thickness T1 of the partition wall 17d between the insertion holes 17a of the top plate 17 becomes thin.

On the other hand, in the embodiment of the present invention, as shown in FIG.
A gap L1 is set between the fixed side contact portion 14b of the contact pin 14 and the top plate partition 17d in a state where the member 6 is not moved, as in the related art. However, the gap between the movable contact portion 14c on the opposite side and the top plate partition 17d is smaller than the conventional gap L2, and the gap L between the fixed contact 14b and the partition 17d is smaller.
A gap L1 equal to 1 is set. This narrowing can be achieved when the movable contact portion 14c opens, as shown in FIG.
0 (b), the top plate 17 is moved to the left in the figure by this gap L1, and the partition 17d and the contact pin fixed side contact 14b are substantially in contact with each other. This is because, even if the gap is further narrowed, interference between the movable contact portion 14c and the partition wall portion 17d can be prevented.

As a result, the thickness T2 of the partition wall portion 17d can be made larger than the conventional thickness T1 by the extent that the gap can be narrowed, and the strength of the top plate 17 can be improved.

Next, when the pressing force on the operating member 18 is released, the operating member 18 is raised by the urging force of the coil spring 24, so that the pressing of the lever member 21 by the operating member tapered surface 18a is released. Then, the slide plate 16 returns to the original position by the elastic force of the plurality of contact pins 14 and the urging force of a spring (not shown).

When the slide plate 16 returns,
The movable contact portion 14c returns to the original position, and the solder balls 12b of the IC package 12 are sandwiched and electrically connected between the contact portions 14b and 14c.
In this sandwiching state, the fixed-side contact portion 14b is displaced by the elastic force of the movable-side contact portion 14c, and both contact portions 14b,
The position where the elastic force of 14c is balanced, that is, the position where the solder ball 12b of the IC package 12 is centered is sandwiched.

When the slide plate 16 returns, the pressing force on the top plate 17 is released, and the top plate 17 also returns to its original position. Therefore, even if the fixed contact portion 14c is slightly elastically deformed. The fixed side contact portion 14c does not interfere with the partition 17d of the top plate 17.

Therefore, the contact portion 14 of the contact pin 14
In the state where b and 14c are in contact with the solder balls 12b of the IC package 12, the moving pressure of the slide plate 16 and the top plate 17 does not act on the contact pins 14, and
Since the solder ball 12b can be brought into contact with only the repulsive force generated by the deflection of the contact pin 14, the deformation of the solder ball 12b can be prevented without applying abnormal pressure to the contact pin 14.

Further, when the operating member 18 is lifted, the pressing shaft 18c rises while sliding in the long hole 28a of the rotating arm 28, so that the pressing member 27 rotates in the closing direction around the rotating shaft 30. In the state shown in FIG. 14, the heat sink 29 provided on the pressing member 27 is brought into contact with the chip portion of the IC package main body 12a to press the IC package 12 and release heat from the chip portion. Will be done.

When the pressing member 27 is closed, the pressing member 27 moves in a direction opposite to that when the pressing member 27 is opened, and FIG.
(A), the pressing member 27 is closing as shown in (c), (b), and (a) of FIG. Then, (c) of FIG.
As shown in (b) and (a), the pressing shaft 18c is
The rotation speed of the pressing member 27 is also slow because the rotation speed of the pressing member 27 decreases as the distance from the rotation axis 0 increases, and the elongated hole 28a curves upward as the distance from the rotation shaft 30 increases. Become.

As described above, since the rotation speed of the pressing member 27 is reduced during the closing, the speed immediately before the completion of the closing can be reduced, so that the impact acting on the IC package 12 from the pressing member 27 can be reduced. .

The coil spring 24 for urging the operation member 18 upward is disposed obliquely with respect to the vertical direction, and the upper end is rotatably disposed with respect to the operation member 18 by the upper holder 25. And the lower end is the lower holder 2
6 so as to be rotatable with respect to the socket body 13, by lowering the operation member 18,
As shown in FIGS. 14, 15 and 16, the coil spring 24 falls down.

Therefore, as shown in FIG.
When 8 is at the upper limit position, since the amount of fall of the coil spring 24 is small, the component force P1 along the vertical direction is large,
The component force P2 along the horizontal direction is small. Therefore, the operating member 1
8 is secured, and a pressing force for pressing the IC package 12 by the pressing member 27 is secured. When the operation member 18 is lowered, the component force P2 along the horizontal direction increases as shown in FIG. 16 because the coil spring 24 falls down.
Since the component force P1 along the vertical direction is reduced, the maximum operating force is reduced by releasing the pressure of the coil spring 24 in the lateral direction, the increase in the repulsive force at the lower limit position of the operating member 18 is suppressed, and the operability is improved. Can be improved.

That is, when the pressure for urging the operation member 18 upward is required, the pressing member 27
2 is to be pressed, and in order to release the pressing member 27, the smaller the pressure, the better.
By releasing the pressure in the lateral direction, the maximum operating force can be reduced.

As described above, the coil spring 2
When the coil spring 4 is housed in the cylindrical portions 25a and 26a of the holders 25 and 26, the coil spring 24 can be prevented from coming off and dust can be prevented from being caught.

[Second Embodiment of the Invention] FIG. 22 shows a second embodiment of the present invention.

According to the second embodiment of the present invention, the convex portion 15e projecting upward is formed on the base portion 15 of the socket body 13, and the convex portion 18 projecting downward is formed on the operation member 18.
e is formed. These two convex portions 15e and 18e are set at positions offset in the vertical direction.

The projection 18e of the operating member 18
Is fitted to the upper end of the coil spring 24 so that the upper end is movable.
Is fitted to the lower end of the coil spring 24 so that the lower end is movable.

As described above, the coil spring 24 is disposed obliquely with respect to the vertical direction, and the coil spring 24 is set so as to fall down as the operation member 18 is lowered.

In such a structure, a simple structure in which the coil spring 24 is fitted to each of the projections 15e and 18e can be provided.

Other structures and operations are the same as those of the first embodiment.

[Third Embodiment of the Invention] FIG. 23 shows a third embodiment of the present invention.

Embodiment 3 of the present invention relates to the operation member 18
The upper mounting member 33 is rotatably disposed by a shaft 33a, and the lower mounting member 34 is rotatably disposed on the base portion 15 of the socket body 13 by a shaft 34a.

Then, the upper mounting member 33 on the operation member 18 side is fitted to the upper end of the coil spring 24,
The lower mounting member 34 of the socket body 13 is fitted to the lower end of the coil spring 24.

As described above, the coil spring 24 is disposed obliquely with respect to the vertical direction, and is set so that the coil spring 24 falls down as the operation member 18 is lowered.

In such a structure, a simple structure in which the coil spring 24 is fitted to each of the mounting members 33 and 34 can be provided.

Other structures and operations are the same as those of the first embodiment.

In the above-described embodiment, the present invention is applied to the IC socket 11 as the "socket for electric parts". However, the present invention is not limited to this, and can be applied to other devices. Further, in the above-described embodiment, the terminals of the IC package are sandwiched by the contact pins. However, the present invention is not limited to this, and the contact pins may be connected to the terminals of the IC package from below. Any method may be used to make contact with.

[0073]

As described above, according to the first aspect of the present invention, the elastic member between the socket body and the operating member is disposed obliquely with respect to the up-down direction, and the upper end portion is formed. The elastic member is disposed so as to be rotatable with respect to the operating member, and the lower end portion is rotatably provided with respect to the socket body. Therefore, at the upper limit position of the operation member, the repulsive force for returning the operation member and the slide plate to the original position and the pressing force for pressing the electric component are secured by the urging force from the elastic member, and the operation member is lowered. In this case, since the elastic member falls down, the pressure of the elastic member is released in the lateral direction to reduce the maximum operating force, suppress the increase in the repulsive force at the lower limit position of the operating member, and improve operability. It can be.

According to the third aspect of the present invention, in addition to the above effects, the coil spring is housed in the cylindrical portions of both holders. it can.

According to the fourth and fifth aspects of the present invention,
In addition to the above effects, the arrangement of the coil spring, which is an elastic member, can be easily performed.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to Embodiment 1 of the present invention.

FIG. 2 is a front view of the IC socket according to the first embodiment.

FIG. 3 is a schematic sectional view showing a heat sink and the like according to the first embodiment.

FIG. 4 is a plan view of the IC socket according to the first embodiment in a state where an operation member is removed.

FIG. 5 is a plan view showing a slide plate, a moving unit, and the like according to the first embodiment.

FIG. 6 is a schematic cross-sectional view of the IC socket according to the first embodiment taken along line AA in FIG. 4; In addition, the operation member is also shown for convenience of explanation.

FIG. 7 is a schematic sectional view of the IC socket according to the first embodiment, taken along line BB in FIG. 4; In addition, the operation member is also shown for convenience of explanation.

FIG. 8 is a cross-sectional view of the IC socket according to the first embodiment, taken along line CC in FIG. 4;

FIG. 9 is a plan view of the IC socket according to the first embodiment in a state where an operation member is removed.

FIG. 10 is a plan view showing a slide plate, a moving unit, and the like according to the first embodiment.

FIG. 11 is a schematic sectional view of the IC socket according to the first embodiment, taken along line DD in FIG. 9; In addition, the operation member is also shown for convenience of explanation.

FIG. 12 is a schematic sectional view of the IC socket according to the first embodiment, taken along line EE in FIG. 9; In addition, the operation member is also shown for convenience of explanation.

FIG. 13 is a sectional view of the IC socket according to the first embodiment, taken along line FF in FIG. 9;

FIG. 14 is a diagram showing a state in which a pressing member of the IC socket according to the first embodiment is closed.

FIG. 15 is a view showing the IC socket according to the first embodiment in the middle of opening and closing of a pressing member.

FIG. 16 is a diagram showing a state where a pressing member of the IC socket according to the first embodiment is opened.

FIG. 17 is an explanatory diagram illustrating a state in which the pressing member according to the first embodiment, from which the heat sink is omitted, is in a state from a closed state to a halfway opening state.

FIG. 18 is an explanatory diagram showing a state in which the pressing member without the heat sink according to the first embodiment is being opened until the opening is completed;

FIG. 19 is a sectional view showing the slide plate according to the first embodiment.

FIG. 20 is a cross-sectional view showing an operation state of the contact pin according to the first embodiment, where (a) shows a state where the contact pin is closed, and (b) shows a state where the contact pin is open.

FIGS. 21A and 21B are cross-sectional views corresponding to FIG. 20 according to a conventional example, showing an operating state of a contact pin, wherein FIG. 21A shows a state in which the contact pin is closed, and FIG.

FIG. 22 is a view showing an arrangement state of a coil spring according to Embodiment 2 of the present invention.

FIG. 23 is a view showing an arrangement state of a coil spring according to Embodiment 3 of the present invention.

[Explanation of symbols]

 11 IC socket (socket for electric parts) 12 IC package (electric parts) 12a Package body 12b Solder ball (terminal) 14 Contact pin 15 Base part 15e Convex part 18 Operating member 18e Convex part 24 Coil spring (elastic member) 25 Upper holder 26 Lower holder 25a, 26b Tube part 25b, 26b Shaft 27 Pressing member 33 Upper mounting member 34 Lower mounting member

Claims (5)

[Claims] A contact pin for contacting a terminal of an electric component is provided on the socket body, and an operation member is provided so as to be vertically movable with respect to the socket body;
An electrical component socket in which an elastic member for urging the operation member upward is disposed between the operation member and the socket body, wherein the elastic member is disposed obliquely with respect to a vertical direction, and has an upper end. A portion is rotatably disposed with respect to the operation member, and a lower end portion is rotatably disposed with respect to the socket main body. By lowering the operation member, the elastic member is moved. A socket for electrical components, characterized in that it is configured to fall down. 2. A contact pin for contacting a terminal of an electric component is provided on a socket body, and a pressing member for pressing the electric component is rotatably provided on the socket main body. An operating member for moving the operating member is vertically movable with respect to the socket body; and an elastic member for urging the operating member upward is provided between the operating member and the socket body. In an electric component socket in which a member is pressed by the pressing member at an upper limit position, the elastic member is disposed obliquely with respect to a vertical direction, and an upper end portion is provided with respect to the operation member. The elastic member is configured to be movably disposed, the lower end portion is movably disposed relative to the socket body, and the operating member is lowered so that the elastic member falls down. Socket for electrical parts according to claim. 3. The elastic member comprises a coil spring and two upper and lower holders, an upper side of the coil spring is housed in a cylinder of an upper holder, and a lower side of the coil spring is inside a cylinder of a lower holder. The upper holder is rotatably provided on the operating member, the lower holder is rotatably provided on the socket body, and one of the upper holder and the lower holder has the other cylinder. 3. The electrical component socket according to claim 1, wherein the electrical component socket is slidably inserted and fitted into the portion. 4. The elastic member is a coil spring, and a convex portion is formed on the operating member and the socket body,
The protrusion of the operating member is on the upper end of the coil spring,
The upper end portion is fitted so as to rotate, and the convex portion of the socket body is fitted to the lower end portion of the coil spring so that the lower end portion rotates. 3. The electrical component socket according to 1 or 2. 5. An elastic member is a coil spring, a mounting member is rotatably disposed on the operating member and the socket body, and a mounting member on the operating member side is fitted to an upper end of the coil spring. 3. The electrical component socket according to claim 1, wherein the mounting member on the socket body side is fitted to a lower end portion of the coil spring.