JP2002050942A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which can prevent peeling of a lead terminal from the bottom plate of an enclosure form case as well as is capable of deal with the miniaturization of the electronic devices. SOLUTION: An electronic component which is composed of a resin made enclosure form case 1 with a bottom plate 3 and a sidewall 5 and opened at the top and housing an electronic device A, and a plurality of belt form lead terminals 7a attached by integral molding to the lower side of the plate 3 of the case 1. A bonding reinforcement part 7b is formed on each facing side of the terminal 7a of both ends, and a tip part 7c of the part 7b is derived to the upper side of the plate 3 and is connected electrically to the device A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an electronic component,
In particular, a resin-made housing-like case including a bottom plate and a side wall, in which electronic elements are accommodated, and a plurality of housing-like cases provided at predetermined intervals and in contact with the outer surface of the bottom plate of the housing-like case by integral molding. And an electronic component having the lead terminal.

[0002]

2. Description of the Related Art Conventionally, microcomputers and the like have been frequently used for communication equipment and electronic equipment, and a clock oscillation circuit has been connected to the microcomputer.

In this oscillation circuit, two load capacitance components C ₁ and C ₂ are connected between both ends of a piezoelectric vibrator 51 and a ground potential, as in the equivalent circuit shown in FIG. The feedback resistor 55 and the inverter 56 were connected between both ends of the 51.

In order to generate a clock signal by this oscillation circuit, the amplification factor in the amplifier circuit including the inverter 56 and the feedback resistor 55 is α, the phase shift amount is θ _1, and the piezoelectric vibrator 51 is connected to the load capacitance. When the feedback ratio in the feedback circuit composed of the components C ₁ and C ₂ is β and the phase shift amount is θ ₂ , the loop gain is α × β ≧ 1, and the phase shift amount is θ ₁ +
It is necessary that θ ₂ = 360 ° × n (where n = 1, 2,...).

In general, a feedback resistor 55 and an inverter 56
Is built in the microcomputer. In order to obtain stable oscillation without causing non-oscillation or oscillation stop, the loop gain must be increased. In order to increase the loop gain, it is necessary to increase the P / V value of the piezoelectric vibrator that determines the gain of the feedback ratio β.

Conventionally, as a ceramic resonator using a piezoelectric vibrator, there is a type having a built-in load capacitor with a built-in capacitor element having two capacitance components. Further, the mounting forms are roughly classified into two types: a lead pin type and a surface mounting type. At present, from the high-density automatic mounting technology on a printed wiring board, a surface mounting type capable of performing reflow soldering together with other electronic components on the printed wiring board has become mainstream.

[0007] The surface-mounted ceramic oscillator is covered with an outer case so as not to hinder the oscillation operation of the piezoelectric oscillator, and how the size can be reduced while maintaining the P / V value of the piezoelectric oscillator large. Is important. In addition, P /
The V value is represented by 20 log (Ra / Rb).
a is defined as the anti-resonance impedance, and Rb is defined as the resonance impedance.

[0008] As a conventional surface mount type piezoelectric oscillator, as shown in FIG. 8, a resin-made casing-like case 71 and a plurality of lead terminals integrally provided on a bottom plate 73 of the casing-like case 71. There is known an electronic device including an electronic element A housed in a housing case 75 and a metal lid 77 bonded to an opening of the housing case 71. The plurality of lead terminals 75 are integrally provided on the bottom plate 73 of the housing case 71 by molding so that the lower surfaces thereof are exposed.

In such a surface mount type piezoelectric oscillator, through holes 78 provided in the plurality of lead terminals 75 are provided.
In addition, the conductive paste is filled in the through-hole 79 provided in the bottom plate 73 of the case 71 and connected to the electrodes of the electronic element A in the case 71.

[0010] Then, such a surface mount type piezoelectric oscillator is arranged on a substrate and reflowed, so that the lead terminals are bonded to electrodes on the printed wiring board by soldering and mounted.

[0011]

However, in recent years, there has been a strong demand for miniaturization of the surface mount type piezoelectric oscillator, and even in the above-mentioned conventional surface mount type piezoelectric oscillator, the size of the lead terminal 75 has to be reduced. The width between the lead terminals 75 and the bottom plate 73 of the housing case 71 has been reduced to 1 mm or less.
And the bonding strength of the lead terminal 75 to the housing 71 is low. For example, when a surface mount type piezoelectric oscillator is arranged on a substrate and reflow soldered,
There is a problem that a force acting from the solder joint acts on the lead terminal 75 due to an impact or thermal deformation applied in a mounted state, and the lead terminal 75 is easily peeled from the bottom plate 73 of the housing 71.

Further, in order to prevent short circuit failure due to reflow soldering, it is necessary to secure a certain interval between lead terminals. On the other hand, electronic devices themselves are required to be more and more miniaturized in response to the recent increase in frequency, and if the spacing between lead terminals is narrowed in response to the miniaturization of electronic devices, other factors may occur during reflow soldering. If the electrodes are short-circuited and conversely, the spacing between the lead terminals is to be ensured, connection with the electronic element becomes difficult.

The present invention has been devised to solve the above-mentioned problems, and it is possible to prevent the lead terminals from peeling off from the bottom plate of the housing-like case and to cope with the miniaturization of the electronic element. The purpose is to provide.

[0014]

An electronic component according to the present invention comprises a bottom case and side walls, an upper opening, and a resin-made case housing an electronic element. An electronic component comprising a plurality of band-shaped lead terminals provided integrally with the bottom surface of the bottom plate by integral molding, wherein the lead terminals at both ends are formed with an adhesive reinforcing portion on each of the opposing sides thereof, and The tip of the adhesive reinforcing portion is led out to the upper surface of the bottom plate and is electrically connected to the electronic element.

In other words, a resin-made housing-like case, which is formed of a bottom plate and a side wall, is open at the top and houses electronic elements, and has a predetermined interval formed integrally with the outer surface of the bottom plate of the housing-like case. An electronic component comprising a plurality of lead terminals placed and in contact with each other, wherein a part of the lead terminal in contact with a bottom plate is provided with an adhesion reinforcing portion for reinforcing an adhesive force with the bottom plate, The tip of the adhesive reinforcing portion is bent toward the inside of the housing-shaped case to be exposed on the inner surface of the bottom plate, and the tip of the adhesive reinforcing portion and the electronic element are provided. Are electrically connected to each other.

According to the present invention, the lead terminals at both ends are formed with an adhesive reinforcing portion on each of the opposing sides thereof, so that the adhesive reinforcing portion increases the bonding area with the bottom plate of the casing-like case. The adhesive strength of the lead terminals to the bottom plate of the housing case can be reinforced.

Further, since the front end of the adhesive reinforcing portion is bent toward the inside of the housing case and exposed to the inner surface of the bottom plate, the so-called anchor effect of the front end portion allows the bottom plate of the housing case of the lead terminal to be formed. Adhesive strength to the substrate can be improved.

Further, since the electrode of the electronic element is connected to the tip of the adhesive reinforcing portion exposed on the inner surface of the bottom plate, the conductive paste is not externally filled. Stopping performance can be improved.

Further, since the adhesive reinforcing portion is provided so as to protrude toward the other lead terminal side, the front end portion can be brought closer to the center portion side of the casing-like case.
With the distance between the lead terminals secured to some extent, the size of the electronic element housed in the housing case can be reduced, and as a result, the size of the electronic component can be reduced.

Therefore, in order to reduce the size of the electronic component, the width of the lead terminals is reduced and the distance between the lead terminals is set to 1 mm.
Even below, the bonding strength between the lead terminal and the housing case is increased because the bonding area between the housing reinforcement case and the bottom plate of the housing case is large due to the adhesion reinforcing portion. For example, a surface mount type piezoelectric oscillator is arranged on the substrate. Also, even when a force acting from the solder joint acts on the lead terminal due to an impact or thermal deformation applied during reflow soldering or in a mounted state, the lead terminal is prevented from peeling from the bottom plate of the housing-like case. be able to.

The adhesive reinforcing portion is formed into a complicated shape such as a zigzag shape, a meander shape, a star shape and the like, for example, so that the bonding area with the bottom plate of the housing case can be increased by the adhesive reinforcing portion. By the effect of anchoring to the bottom plate, the adhesive strength of the lead terminal to the bottom plate of the housing-like case can be improved.

The electronic component of the present invention comprises a bottom plate and side walls, an upper opening, and a resin-made case in which electronic elements are accommodated, and a lower surface of the bottom plate of the case-like case. An electronic component comprising a plurality of band-shaped lead terminals provided side by side by integral molding, wherein the lead terminals at both ends are formed with bent portions bent toward respective opposite sides thereof, and The distal end of the bent portion is led out to the upper surface of the bottom plate and is electrically connected to the electronic element.

In other words, a resin-made case, which is formed of a bottom plate and a side wall, is open at the top, and accommodates electronic elements, and a predetermined interval is formed integrally with the outer surface of the bottom plate of the case-like case. An electronic component having a plurality of lead terminals placed and in contact with each other, wherein a portion of the lead terminal that contacts the bottom plate is bent toward another lead terminal side to form a bent portion. And a tip portion of the bent portion is bent toward the inside of the housing-like case to be exposed on the inner surface of the bottom plate, and the tip portion of the bent portion is electrically connected to the electronic element.

As described above, since the lead terminals at both ends are formed with the bent portions bent toward the respective opposite sides thereof, the lead terminals abutting on the bottom plate become longer, and the bottom plate of the housing-like case becomes longer. The area of adhesion to the bottom plate of the lead terminal becomes large, and the portion of the lead terminal that comes into contact with the bottom plate has an uneven shape. Due to the anchor effect at the tip, the adhesive strength of the lead terminal to the bottom plate of the housing-like case can be improved, and even if an external force acts, the lead terminal is prevented from peeling from the bottom plate of the housing-like case. can do.

Further, since the conductive paste is not filled from the outside, the sealing property of the casing-like case can be improved, and as described above, the gap between the lead terminals is secured. It can respond to miniaturization of elements.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface mounted piezoelectric oscillator which is an electronic component of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of a surface mount type piezoelectric oscillator of the present invention, FIG. 2 is a longitudinal sectional view thereof, and FIG. 3 is a transverse sectional view thereof.

In FIG. 1, reference numeral 1 denotes a housing-like case made of a resin material having excellent heat resistance, such as a liquid crystal polymer. This housing-like case 1 is shown in FIGS. 2 and 3. Thus, the bottom plate 3 and the side wall 5 are integrated,
The upper part is open, and a storage area (internal space) for the piezoelectric oscillator is formed therein. On the outer peripheral surface of the housing-like case 1, three lead terminals 7a made of a metal member such as nickel-white or phosphor bronze are provided side by side at predetermined intervals.
These lead terminals 7a are molded into the casing case 1 and are integrated, and the lower surfaces thereof are exposed.

As shown in FIGS. 2 to 4, the lead terminal 7a has a band shape, and an adhesive reinforcing portion 7b is formed on each of opposing sides. In other words, a portion contacting the knitted bottom plate 3 has Adhesion reinforcing portions 7b projecting toward other adjacent lead terminals 7a are formed, and lead terminals 7a at both ends are formed.
Then, the tip 7c of the adhesive reinforcing portion 7b is
Is bent toward the inside of the bottom plate, led out to the upper surface of the bottom plate, and exposed to the inner surface of the bottom plate.

The central lead terminal 7a has a projection 9 projecting toward the inside of the housing 1 at the center thereof, and the surface of the projection 9 is exposed to the inner surface of the bottom plate 3. .

The lead terminal 7a, the adhesive reinforcing portion 7b, the tip portion 7c, and the protruding portion 9 are provided integrally with the case 1. That is, after arranging the lead terminal 7a having the adhesive reinforcing portion 7b and the tip portion 7c formed in a predetermined molding die, a resin material is poured therein, and the lead terminal 7a, the adhesive reinforcing portion 7b, and the tip portion 7c are formed into a casing-like case. It is united with one.

It is desirable that the adhesion reinforcing portion 7b has a complicated shape such as a zigzag shape, a meander shape, a star shape and the like, which are severely uneven. With such a complicated shape, the bonding area between the lead terminal 7a and the adhesive reinforcing portion 7b and the bottom plate 3 of the housing-like case 1 can be increased, and the lead terminal 7a The adhesive strength of the housing case 1 to the bottom plate 3 can be improved.

An electronic element A is housed in the case 1. As shown in FIG. 5, the electronic element A has vibrating electrodes 15 and 16 on both main surfaces of a rectangular piezoelectric substrate 13. Each of the formed piezoelectric resonance element 17 and a capacitor element 23 that forms two capacitance components and has three connection electrodes 21 formed on one main surface of a rectangular dielectric substrate 19 are connected to each other.
23 are electrically connected via conductive connecting members 25 disposed at both ends of the opposing surfaces.

The piezoelectric substrate 13 is made of PT (lead titanate), P
It is composed of a piezoelectric ceramic material such as ZT (lead zirconate titanate) or a single crystal material such as quartz, lithium tantalate, lithium niobate, or lithium tetratrate.

A vibration electrode 15 formed from the center to the right end of the upper surface of the upper surface of the piezoelectric substrate 13 is
3, extending to the lower surface side main surface end via the right side surface,
An extraction electrode 15a is formed at the right end of the lower main surface.
On the lower main surface of the piezoelectric substrate 13, a vibrating electrode 16 formed from the center to the left end extends from the left side surface of the piezoelectric substrate 13 to the upper main surface end, and is connected to the upper main surface. An extraction electrode 16a is formed at the left end of the surface. That is, the vibrating electrode 15 is formed on the conductor film 1 formed on the right side of the piezoelectric substrate 13.
5b is connected to the extraction electrode 15a through the vibration electrode 16a.
Is connected to the extraction electrode 16a via a conductor film 16b formed on the left side surface of the piezoelectric substrate 13.

The vibrating electrodes 15, 16 and the extraction electrode 15
a and 16a are formed of, for example, a thin film conductor film mainly composed of an Ag-based material, and the conductor films 15b and 16b are formed of, for example, A
It is formed of an Ag-based thin film formed by printing, thermosetting, sputtering, or the like of a conductive paste mainly containing a g-based material.

The capacitor element 23 is made of PT (lead titanate), PZT (lead zirconate titanate), BaTiO ₃
It is formed of a rectangular dielectric substrate 19 made of a dielectric ceramic material such as (barium titanate) and a plurality of connection electrodes 21 for forming two capacitance components.
In the figure, two electrodes 2 are provided on the upper surface side of a dielectric substrate 19.
0a and 20b form a capacitance component on the lower side, which is one main surface of the dielectric substrate 19, and at the same time, externally (lead terminals 7).
a) three connection electrodes 21a to achieve a connection with
21b and 21c are formed.

The upper electrode 20 a and the lower connection electrode 21 a are connected to the conductor film 22 on one end face of the dielectric substrate 19.
The electrode 20b on the upper surface and the connection electrode 21b on the lower surface are connected via the conductor film 22b on the other end surface of the dielectric substrate 19. Further, the electrodes 20 a and 20 b on the upper surface side of the dielectric substrate 19 partially face the connection electrodes 21 c on the lower surface of the dielectric substrate 19.

That is, when the connection electrode 21c on the lower surface of the dielectric substrate 19 is viewed as a center, a predetermined capacitance component is formed between the dielectric substrate 19 and the electrode 20a on the upper surface through the thickness of the dielectric substrate 19. predetermined capacity is formed between the electrode and 20a connecting electrode 21a, both capacitive component is a first load capacitance component C ₁ is constructed. Also, the connection electrode 21c and the electrode 20
b, a second load capacitance component C ₂ is obtained in between the electrode 20b connecting electrode 21b.

The above-described piezoelectric resonance element 17 and capacitor element 23 are mechanically joined and electrically connected to each other by a conductive connection member 25 at a predetermined interval. Thereby, the electronic element A is configured. The connection electrodes 21a, 21b, and 21c of the electronic element A are exposed on the inner surface of the bottom plate 3 of the housing-like case 1, and are the lead terminals 7a at both ends.
Is connected to the central protruding portion 9.

In the above example, the electronic element A composed of the piezoelectric resonance element 17 and the capacitor element 23 is
Although the example in which the piezoelectric resonance element is accommodated in the inside has been described, only the piezoelectric resonance element may be accommodated.

The opening of the case 1 is sealed by fitting the peripheral wall 33 of the cap-shaped metal lid 31 to the side wall 5 of the case 1. The metal lid 31 is formed of a stainless plate having a thickness of about 40 to 100 μm. That is, on the outer peripheral surface of the side wall 5 of the casing-like case 1, an inclined portion 37 inclined toward the inside of the casing-like case 1 is formed, and between the inclined portion 37 and the peripheral wall 33 of the metal lid 31. By filling the adhesive 39 made of an epoxy resin or the like,
A metal lid 31 is fixed to the case 1.

In the surface-mount type piezoelectric oscillator configured as described above, the portion of the lead terminal 7a that contacts the bottom plate 3 is
Since the adhesive reinforcing portion 7b for reinforcing the adhesive force with the bottom plate 3 is provided so as to protrude toward the other lead terminal 7a, the adhesive reinforcing portion 7b increases the bonding area of the casing-like case 1 with the bottom plate 3. Thus, the adhesive strength of the lead terminals 7a to the bottom plate 3 of the housing-like case 1 can be reinforced.

Further, since the front end 7c of the adhesive reinforcing portion 7b is bent toward the inside of the casing-like case 1 and is exposed on the inner surface of the bottom plate 3, the so-called anchor effect of the front end 7c allows the lead terminal 7a to be connected. The adhesive strength of the housing case 1 to the bottom plate 3 can be improved.

Further, since the connection electrode of the electronic element A is connected to the tip portion 7c of the adhesive reinforcing portion 7b exposed on the inner surface of the bottom plate 3, the conductive paste is not externally filled. The sealing performance of the body case 1 can be improved.

Further, since the adhesive reinforcing portion 7b is provided so as to protrude toward the other lead terminal 7a, the tip portion 7c can be brought closer to the central portion of the casing-like case 1. , The downsized electronic element A and the lead terminal 7a
Can be electrically connected to each other, and in a state where the distance between the lead terminals 7a is secured to some extent, the size of the electronic element A housed in the housing case 1 can be reduced. Parts can be reduced in size.

Therefore, in order to reduce the size of the electronic component, even if the width of the lead terminals 7a is reduced and the interval between the lead terminals 7a is set to 1 mm or less, the connection between the lead terminals 7a and the bottom plate 3 of the housing-like case 1 is made possible by the adhesive reinforcing portions 7b. Since the bonding area is large, the bonding strength of the lead terminal 7a to the casing-like case 1 is increased. For example, when a surface mount type piezoelectric oscillator is arranged on a substrate and subjected to reflow soldering or an impact applied in a mounted state. Even if a force acting on the lead terminal acts on the lead terminal due to thermal deformation or the like, it is possible to prevent the lead terminal 7 a from peeling off from the bottom plate 3 of the housing-like case 1.

FIG. 6 shows the bottom surface of a case-like case of another electronic component of the present invention. In this example, the lead terminals 87 at both ends have bent portions 91 bent toward the opposing sides. In other words, the portions of the lead terminals 87 at both ends that contact the bottom plate 89 are bent toward the center lead terminal 87 side in the outer surface of the bottom plate to form bent portions 91.
The distal end 93 of the bent portion 91 is bent toward the inside of the casing-like case, is led out to the upper surface of the bottom plate 89, is exposed to the inner surface of the bottom plate 89, and is electrically connected to the distal end 93 of the bent portion 91. The elements are connected as shown in FIGS. 2 and 3 as in the above-described example. Further, the lead terminal 87 at the center is formed in the same manner as in the above example, and is connected to the electronic element.

In this example, the lead terminal 87 at the portion in contact with the bottom plate 89 of the housing-like case is replaced with the central lead terminal 87.
By providing the bent portion 91 by bending toward the side, the length of the lead terminal 87 in contact with the bottom plate 89 is increased, the bonding area with the bottom plate 89 of the housing-like case is increased, and the bottom plate 89 of the lead terminal 87 is formed. Since the portion in contact with the base plate has an uneven shape, the distal end portion 93 of the bent portion 91 is bent toward the inner side of the casing-like case and exposed to the inner surface of the bottom plate 89 due to the anchor effect on the bottom plate 89. Therefore, the adhesive force of the lead terminal 87 to the bottom plate 89 of the housing-like case can be improved by the anchor effect of the distal end portion 93,
Even if an external force acts, it is possible to prevent the lead terminals 87 from peeling off from the bottom plate 89 of the housing case.

Further, since the conductive paste is not filled from the outside, the sealing property of the housing-like case can be improved, and the lead terminals 87 can be formed as described above.
It is possible to cope with the miniaturization of electronic components in a state where the interval is secured.

[0050]

According to the electronic component of the present invention, the adhesive reinforcing portion for reinforcing the adhesive force with the bottom plate is provided at the portion of the lead terminal that comes into contact with the bottom plate so as to protrude toward the other lead terminal. The bonding reinforcing portion increases the bonding area with the bottom plate of the housing-like case, thereby enhancing the adhesive force of the lead terminal to the bottom plate of the housing-like case, and the tip of the bonding reinforcing portion is formed in a housing-like shape. Since it is bent to the inside of the case and exposed to the inner surface of the bottom plate, the adhesive force of the lead terminal to the bottom plate of the housing-like case can be improved by the so-called anchor effect by the tip.

Further, since the electrode of the electronic element is connected to the tip of the adhesive reinforcing portion exposed on the inner surface of the bottom plate,
Since the conductive paste is not filled from the outside, the sealing property of the housing case can be improved. Further, since the adhesive reinforcing portion is provided so as to protrude toward the other lead terminal side, the tip portion can be brought closer to the center portion side of the housing-like case, and the distance between the lead terminals can be reduced. With a certain degree of security, the size of the electronic element housed in the case can be reduced, and as a result, the size of the electronic component can be reduced. Therefore, even if the width of the lead terminals is reduced and the distance between the lead terminals is reduced to 1 mm or less in order to reduce the size of the electronic component, the bonding area between the lead terminals and the bottom plate of the housing-shaped case is large due to the adhesive reinforcing portion. Increases the bonding strength to the housing-like case. For example, when a surface-mount type piezoelectric oscillator is arranged on a substrate and reflow soldering is performed, or when a shock or thermal deformation applied in the mounting state acts from the solder bonding portion. Even if a force acts on the lead terminal, it is possible to prevent the lead terminal from peeling off from the bottom plate of the housing case.

The adhesive reinforcing portion is formed into a complicated shape such as a zigzag shape, a meander shape, and a star shape, for example, in which the adhesive reinforcing portion can increase the bonding area with the bottom plate of the casing-like case. By the effect of anchoring to the bottom plate, the adhesive strength of the lead terminal to the bottom plate of the housing-like case can be improved.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing a surface mount type piezoelectric oscillator of the present invention.

FIG. 2 is a longitudinal sectional view taken along line aa of FIG.

FIG. 3 is a cross-sectional view taken along the line bb of FIG. 2;

FIG. 4 is a bottom view of FIG. 2;

FIG. 5 is an exploded perspective view of the piezoelectric oscillator of FIG. 2;

FIG. 6 is a bottom view of another electronic component of the present invention.

FIG. 7 is an oscillation circuit diagram of the surface mount type piezoelectric oscillator.

FIG. 8 shows a conventional surface mount type piezoelectric oscillator.
(A) is a sectional view, and (b) is a bottom view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Case-like case 3 ... Bottom plate 5 ... Side wall 7a, 87 ... Lead terminal 7b ... Adhesion reinforcement part 7c ... Tip part of adhesion reinforcement part 91 ... Bending part 93 ... Tip of bent part A ... Electronic element (piezoelectric oscillator)

Claims (2)

[Claims] 1. A resin-made case comprising a bottom plate and a side wall, which is open at the top and in which an electronic element is accommodated, and a plurality of resin cases integrally provided on the lower surface of the bottom plate of the case-like case. An electronic component having a band-shaped lead terminal, wherein the lead terminals at both ends are formed with an adhesive reinforcing portion on each of opposing sides thereof, and a tip end of the adhesive reinforcing portion is formed on an upper surface of the bottom plate. And electronically connected to the electronic element. 2. A resin case comprising a bottom plate and a side wall, which is open at the top and in which an electronic element is accommodated, and a plurality of resin cases integrally provided on the lower surface of the bottom plate of the case case. An electronic component comprising a band-shaped lead terminal, wherein the lead terminals at both ends are formed with a bent portion bent toward each of the opposing sides thereof, and the tip portion of the bent portion is An electronic component, which is led to an upper surface of a bottom plate and is electrically connected to the electronic element.