JP2002049404A - Positioning control method and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a positioning control method and device capable of selectively positioning the driving means of plural devices by one connector. SOLUTION: At the time of inputting data for positioning driving means to plural local controllers LCa-LCc for respectively controlling one or more driving means, one positioning terminal PT is connected to one connector 50 capable of performing branch communication which is connected to the plural local controllers LCa-LCc so that the local controllers LCa-LCc can be selected. Then, the data for positioning the driving means to be controlled by the selected local controllers LCa-LCc are set so that the driving means can be controlled based on the data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning control method and apparatus.

[0002]

2. Description of the Related Art In general, a cleaning system for cleaning a substrate to be processed such as a semiconductor wafer or an LCD substrate transports a container (carrier) accommodating a plurality of substrates to be processed and places the carrier at a predetermined position. A buffer unit (buffer system) for setting and transferring a substrate to be processed with respect to a carrier, aligning the substrate to be processed, and transferring the substrate to a transport unit, and transporting the substrate to the processing unit by the transport unit. A transport section (transport system), a cleaning section (processing system) for appropriately performing a cleaning process with a cleaning liquid such as a chemical solution or a rinsing liquid in the processing section, and a drying section (processing system) for drying the processed substrate to be processed are provided. Have been.

In the above-mentioned cleaning system, for example,
The transfer unit, for example, the transfer chuck is positioned so as to be able to hold a plurality of substrates to be processed at appropriate intervals, and transfers the substrates to a processing tank, a drying chamber, or the like provided in the processing unit. It is positioned for transferring a substrate to be transferred to a transfer means such as a boat.

The above-mentioned buffer section (buffer system), transport section (transport system), cleaning section / drying section (processing section)
In the above, the carrier and the substrate to be processed are
One or more drive means are provided which move in the Y direction, the vertical Z direction or the rotational direction, each of which is controlled by a local controller. Therefore, in order to efficiently perform the cleaning process on the substrate to be processed, it is necessary to perform positioning so that the driving units in the buffer unit, the transport unit, and the processing unit are moved to predetermined positions in advance.

Therefore, conventionally, as shown in FIG.
One-to-one communication connected via cables 1a to 1c to local controllers LCa to LCc that control driving means (not shown) of a buffer system control unit A, a transport system control unit B, and a processing system control unit C. (For example, RS-232C communication)
Possible terminals 2a to 2c have positioning terminals PT
To each of the local controllers LCa to LCc
The positioning data is input to the CPU, and the driving means is controlled based on the data.

[0006]

However, in the conventional positioning control, the local controllers LCa to LCa of the buffer system control unit A, the transfer system control unit B or the processing system control unit C for performing positioning with the positioning terminal PT.
The configuration of c is a one-to-one communication mode. That is, in the communication mode of this configuration, the buffer system control unit A and the transport system control unit B
Alternatively, when positioning the processing system control unit C, the connector 2 connected to the buffer system control unit A, the transport system control unit B, or the local controllers LCa to LCc of the processing system control unit C
It is necessary to input positioning data by connecting the positioning terminal PT to one of the connectors 2a to 2c, for example, the connector 2a connected to the local controller LCa of the buffer system controller A. Therefore, for example, another transport system controller B
When the positioning is performed, the positioning terminal PT must be reconnected to the connector 2b connected to the local controller LCb of the transport system controller B.

By the way, in principle, the positioning of the apparatus is performed by one positioning terminal PT per apparatus from the viewpoint of safety. The reason is that if a plurality of positions are positioned at the same time, an operator performing one position may be exposed to danger due to the movement of the driving means of the device at the other position. Therefore, for example, when positioning the drive means of the buffer system control unit A and the transfer system control unit B, the positioning mode is once exited on the maintenance screen of the positioning terminal PT, and the connection between the positioning terminal PT and the local controllers LCa to LCc is performed. After the change, the operation of entering the positioning mode on the maintenance screen of the positioning terminal PT is required again, and there is a problem that the workability is extremely poor.
Further, protection for preventing connection of two or more positioning terminals PT by hardware is required.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a positioning control method and a positioning control method capable of selectively positioning driving means of a plurality of devices by connecting them at one place. And

[0009]

According to a first aspect of the present invention, there is provided a positioning control method for inputting positioning data to a plurality of local controllers for controlling one or a plurality of driving means. In this case, the local controller is selected by one positioning terminal, and positioning data of the driving unit controlled by the selected local controller is set, so that the driving unit can be controlled based on the data. It is characterized by doing.

In the present invention, the positioning data of the positioning terminal includes at least one of a horizontal X, Y direction, a vertical Z direction, or a rotation direction in the driving means itself, and the positioning data between the driving means. (Claim 2). It is preferable that the local controller stores and saves the positioning data of the positioning terminal.

According to a fourth aspect of the present invention, there is provided a positioning control apparatus embodying the positioning control method according to the first aspect.
What is claimed is: 1. A positioning control device for inputting positioning data to a plurality of local controllers each controlling one or a plurality of driving means, comprising: a branching communication-capable connector connected to said plurality of local controllers; Wherein the positioning terminal has a function of selecting the local controller and a function of setting positioning data of the driving means controlled by the selected local controller. And

In the present invention, the driving means includes a container moving means for moving a container accommodating the substrate to be processed, a transport means for transporting the substrate to a processing system for cleaning and drying the substrate to be processed, There is provided a substrate elevating means for elevating the substrate to be processed in a processing system for cleaning and drying the substrate to be processed (claim 5). The driving means may include a driving means formed to be movable in at least one of the horizontal X and Y directions, the vertical Z direction and the rotation direction (claim 6). In addition, it is preferable that the positioning data of the positioning terminal is formed so that the local controller can store and store the data.

According to the present invention, one of the local controllers for controlling the driving means is selected by one positioning terminal, and the positioning data of the driving means controlled by the selected local controller is set. The driving means can be controlled based on the data. Therefore, there is no need to reconnect the positioning terminal to the local controller that controls the driving means of each block, and positioning can be performed simply and safely by a single connection.

In addition, the positioning of the driving means in the horizontal X and Y directions, the vertical Z direction or the rotating direction can be performed (claims 2 and 6), and the positioning between the driving means can be performed ( Claim 2).

[0015] In addition, by forming the positioning data of the positioning terminal so that the local controller can store and save the data, the control of the driving means can be surely performed, and the reliability of the device can be improved. (Claims 3 and 7).

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings. In this embodiment, a case will be described in which the positioning control method and apparatus according to the present invention are applied to a semiconductor wafer cleaning processing system.

As shown in FIGS. 1 and 2, the cleaning system includes a carrier 10 which is a container containing a plurality of, for example, 25 unprocessed objects, for example, semiconductor wafers W (hereinafter, referred to as wafers W). A loading section 11 loaded by a transport robot (not shown) and a loader (drive unit) {not shown} for removing wafers W from the carrier 10 loaded into the loading section 11 and a plurality of wafers W taken out of the carrier 10 are loaded. Interface unit 12A including a positioning mechanism (not shown) for aligning and positioning
A transfer chuck 20 (drive means) for receiving a plurality of wafers W in the interface section 12A, and a transfer section 20B having a transfer path 20A in which the transfer chuck 20 can move linearly, and partitioned along the transfer path 20A. Processing units 30, 31, and 32 for appropriately treating the wafer W by contacting the wafer W with a processing liquid, for example, a chemical solution such as aqueous hydrogen peroxide or hydrofluoric acid, or a rinsing liquid (pure water); And cleaning of the transport chuck 20
A processing unit 35 having a drying unit 34; a positioning mechanism (not shown) for aligning and positioning a plurality of wafers W processed in the drying unit 33 of the processing unit 35; An interface unit 12 </ b> B including an unloader (not shown) that carries the wafer 10 into the carrier 10, and an unloading unit 13 that mounts the carrier 10 containing the processed wafer W and transfers it to a transfer robot (not shown). ing. At the top of the cleaning system, a carrier stock unit 40 is provided which has a transfer mechanism for stocking the empty carrier 10 from which the wafer W has been taken out at the interface unit 12A and transferring it to the unloading unit 13.

The cleaning system configured as described above can be roughly classified into a carry-in section 11 and an interface section 12.
A, 12B, a buffer system control unit A including the unloading unit 13 and the carrier stock unit 40, a transfer system control unit B including the transfer unit 22, and a processing unit 35. Specifically, a cleaning processing unit, a drying processing unit ｝ (See FIG. 3). In the buffer system control unit A classified as described above, the moving position of the carrier 10, the carrier 1
Unloading or loading operation of wafer W with respect to wafer W
In the transfer system control unit B, the positioning for holding the wafer W by the transfer chuck 20 is performed, and in the processing system control unit C, the wafer W is received from the transfer chuck 20, for example. The position of a transfer arm (not shown) for transferring the wafer W to the transfer chuck 20 is determined by moving the carrier 10 and the wafer W to horizontal X and X directions.
One or a plurality of driving means such as a motor (not shown) moving in the Y direction, the vertical Z direction, or the rotating direction is used. The control is performed by a controller LCa, a local controller LCb for controlling a motor of the transfer chuck 20 of the transfer system control unit B, or a local controller LCc for controlling a motor of the processing system control unit C. Therefore, it is necessary to input positioning data to the local controllers LCa to LCc beforehand and control the driving means based on the data before performing the processing. Note that the local controllers LCa to LCa-L
Cc is formed, for example, by a central processing unit (CPU), and is formed so that data for positioning of the positioning terminal PT can be stored and stored. Further, the local controllers LCa to LCa-L
The positioning data for Cc is stored in the main controller MC.
Is also stored and stored inside.

Therefore, according to the present invention, as shown in FIG. 3, a plurality of local controllers LCa to LCc are provided.
Branch communication (for example, RS-422 or RS-
485 communication), the positioning terminal PT is formed so as to be connectable to one connector 50 capable of being connected, and the local controllers LCa to LC provided in the positioning terminal PT are provided.
The position of the driving means can be controlled by the function of selecting c and the function of setting the positioning data of the driving means controlled by the selected local controllers LCa to LCc. That is, the local controllers LCa to LCa-L are controlled by one positioning terminal PT.
One of Cc is selected, and positioning data of the driving means controlled by the selected local controllers LCa to LCc is set, so that the driving means can be controlled based on the data.

In this case, the positioning terminal PT
Is a screen 61 for displaying a control target, a control operation, etc.
Switches 62 such as an / OFF switch, a select switch for selecting a control target, and a mode changeover switch are provided. The positioning terminal PT has the following operation modes.

(1) Init mode A mode in which the positioning terminal PT itself is initialized immediately after the positioning terminal PT is connected to the connector 50. When initialization is completed normally, Idl
Shift to e-mode. If the operation ends abnormally, the operation is stopped at that point.

(2) Idle mode A mode for selecting a local mode to be subjected to positioning (teaching) work from the local mode in which the positioning terminal PT start operation is performed. After selecting the local mode to be taught, the mode shifts to the Jog mode depending on the state of the mode switch.

(3) Jog mode (adjustment operation) The adjustment operation of the teaching target axis (drive means) and the inter-position operation of the non-teaching target axis (drive means) can be performed.

(4) Origin mode (initialization) Initialization of a single axis (drive means) or all axes (multiple axes) {drive means} can be performed.

(5) Auto mode (confirmation operation) The teaching target axis (driving means) and the non-teaching target axis (driving means) can be operated between fixed positions.

(6) Memory mode (preset) A preset operation (storing of positioning data) of teaching data (positioning data) at a selected fixed position can be performed.

Hereinafter, the position control of the buffer system controller A, the transport system controller B, and the processing system controller C will be described in detail with reference to FIGS.

FIG. 4 shows the loading section 11 of the buffer system control section A.
FIG. 5 is a schematic perspective view illustrating a transport mechanism of the carrier 10 in the interface unit 12A, and FIG. 5 is a schematic perspective view illustrating a positioning operation of the carrier 10 by the transport mechanism. 4 and 5, reference numeral 70 denotes a mounting table having four stages P1, P2, P3, and P4 at appropriate intervals, and reference numeral 71 denotes a stage P1 of the mounting table 70 in which the carrier 10 accommodating the wafer W is mounted. , P2, P3, P4, by a driving means such as a slide arm, can be moved in the horizontal Y direction and the vertical Z direction, and can be rotated in the θ direction. Reference numeral 72 denotes a wafer hand for receiving the wafer W in the carrier 10.

The carrier 10 is placed on the stage P of the mounting table 70.
1, Carrier 1 for normal conveyance to P2, P3, P4
It is necessary to determine the position where 0 is transferred to each of the stages P1, P2, P3, P4. This positioning is described, for example, with respect to the operation of the carrier 10 transported from the stage P1 of the mounting table 70 to the stage P3. As shown in FIG. The carrier 10 is lifted up in the Z direction). In this state, after the slide arm 71 moves to the stage P2 (Y direction), it rotates 180 degrees (θ direction).
(See FIG. 5B). And the slide arm 7
After the rotation of 1 by 180 degrees, the slide arm 71 moves from the stage P2 to the stage P3 again (Y direction), and then the slide arm 71 descends (Z direction) to place the carrier 10 on the stage P3. Transport is completed (see FIG. 5).
(C)). After transporting the carrier 10, the slide arm 71 returns to the stage P1. The carrier 10 on the stage P2 is transported to the stage P4 by the same operation as described above. These series of positioning operations are performed by selecting a local controller LCa that controls the slide arm 71 of the buffer system control unit A by operating the positioning terminal PT.

The stage P of the mounting table 70 as described above
In order to take out the wafer W from the inside of the carrier 10 transported to P3 and P4, as shown in FIG. 6, a loader 7 having a base 73 which is placed on the carrier 10 and movable in the vertical Z direction is provided.
4 is used. The loader 74 includes an aligner 75 for determining a transfer position with respect to the carrier 10 and a transfer arm (not shown), a wafer counter 76 for counting the number of wafers W, and a sensor for detecting jumping out of the wafers W in the carrier 10. 77 etc. are provided. In order to take out the wafer W from the carrier 10, first, as shown in FIG. 7A, the base 73 descends in the Z direction and confirms that the wafer W has jumped out. After confirming that the wafer W has jumped out, the base 73 is further lowered. Next, the aligner 75 moves the front wafer W
And align the wafers W contained in the two carriers 10 (the operation position of the wafer counter 76). Next, the wafer counter 76 reciprocates between the near side and the far side to check the number of wafers W (see FIG. 7B). Wafer W
After checking the number of wafers, the aligner 75 further approaches the front wafer hand 72, stops at the transfer position of the transfer arm (not shown), and waits for wafer transfer (see FIG. 7C). These series of positioning operations are also performed by selecting a local controller LCa for controlling the base 73, the loader 74, the aligner 75, and the wafer counter 76 of the buffer system controller A by operating the positioning terminal PT.

Empty carrier 10 from which wafer W has been taken out
As shown in FIG. 8, is transported by a lifter 78 to the upper side of the cleaning system, then transported to a slider 79, and transported to a carrier stocker (not shown) on the unloading section 13 side by a liner 80 described later. In this case, as shown in FIG. 8, the lifter 78 is formed so as to be movable in the vertical Z direction and the horizontal X direction, and the pair of holding shafts 78a that grip the carrier 10 are moved in the contact and separation directions (F direction). It is formed so as to be movable. In order to transport the carrier 10 to the carrier stocker on the unloading unit 13 side, first, the lifter 78 moves in the horizontal X direction while holding the carrier 10, and then moves on the slider 79 which stands by in the ascending state (ascending in the Z direction). After moving the carrier 10, the holding shaft 78 a is opened (F direction), and the carrier 10 is received from the lifter 78. next,
The slider 79 moves to the front liner 80 side (moves in the Y direction) to convey the carrier 10 (see FIG. 9A).
When the slider 79 moves to the transfer position with the liner 80 (moves in the Y direction), the slider 79 descends (Z direction) and transfers the carrier 10 to the liner 80 (FIG. 9).
(B)). The slider 79 that has transferred the carrier 10 to the liner 80 returns to the rear, and the operation of the slider 79 ends. Positioning terminal P
The operation is performed by selecting the local controller LCa that controls the lifter 78, the slider 79, and the liner 80 of the buffer system control unit A by operating the T.

Next, the transport system controller B and the processing system controller C
The transfer chuck 20 that transfers the wafer W between the interface unit 12A and the interface unit 12B provided in the transfer unit 22 and the wafer boat 90 (substrate elevating means) provided in the processing unit 35. And the processing unit 35
A description will be given with reference to a wafer boat 90 for transferring (elevating) a wafer W into a cleaning chamber and a drying chamber (not shown) provided in the processing units 30, 31, and 32.

The transfer chuck 20 is shown in FIGS.
As shown in FIG. 1, a pair of arms 21 swinging openably and closably at a lower side comprising a pair of hanging pieces 21 b hanging from both ends of a pair of arm bases 21 a horizontally attached to a chuck driving unit (not shown), Two lower holding rods 22 provided between the lower ends of the hanging pieces 21b of the arms 21 and holding a plurality of lower holding grooves 22a for holding both lower sides of the wafer W, and an upper side of the lower holding rod 22 Hanging piece 2
1b, two side holding rods 23 in which a plurality of side holding grooves 23a for holding slightly lower sides on both sides of the wafer W are arranged.

In this case, the side holding groove 23a formed in the side holding rod 23 has a substantially Y-section as shown in FIG.
It is formed in the shape of a letter, and suppresses the wafer W from inclining in the plane direction and coming into contact with the adjacent wafer W. Further, as shown in FIG. 13A, the side holding rod 23 has a holding rod base 23.
The side holding groove 23a is formed to have a cross section as small as possible by cutting both sides. By making the side holding groove 23a as small as possible in cross section as described above, for example, the transport chuck 20 can be moved to the processing units 30 and 3.
When pulling up from the chemical solution stored in the cleaning tanks 1 and 32, the residual chemical solution that accumulates between the side holding groove 23a and the wafer W can be reduced. Therefore, it is possible to reduce particles generated by drying of the residual chemical solution, and to improve etching uniformity.

The lower holding groove 22a formed in the lower holding rod 22 is formed in a substantially V-shaped cross section to hold the wafer W, as shown in FIG. As shown in FIG. 13B, the lower holding rod 22 has an edge portion 22b formed at a lower end thereof, and the edge portion 22b runs out of a liquid such as a chemical solution or a rinsing liquid that adheres to the lower holding rod 22. Can be performed well.

The transport chuck 20 formed as described above
And a plurality of holding grooves 90a like the transport chuck 20.
It is necessary to align the wafer W with each groove position of the wafer boat 90 in which the wafers W are arranged. Conventionally, in order to perform this position adjustment, the wafer W is erected on the transfer chuck 20 and the wafer boat 90 and visually checked so that the respective groove positions are aligned. For this reason, the positioning of the transfer chuck 20 and the wafer boat 90 requires skill and also requires careful attention. In order to solve this problem, in the present invention, the positioning of the transfer chuck 20 and the wafer boat 90 is performed using an adjustment jig 100 described below.

As shown in FIG. 14, the adjusting jig 100 has a substantially boat-shaped jig main body 102 provided with a concave / convex groove 101 which is engaged with the holding groove 90a of the wafer boat 90, and a jig main body 102. Gauge 105 having a tracing stylus 104 mounted at two places on the left and right sides of the upper flat surface 103
And a jig body 10 for adjusting the level of the adjustment jig 100.
And a level 106 attached to the upper part of the two. In order to position the transfer chuck 20 and the wafer boat 90 using the adjustment jig 100, first, as shown in FIG. And the tracing stylus 104 is attached to the vertical reference plane 201 of the calibration jig 200.
, And pressed from behind by a pressing bolt 202 to adjust the scale of the dial gauge 105 to the “0” point. Then, as shown in FIGS. 15 to 17, the adjustment jig 100 is placed on the wafer boat 90 so as to be in a horizontal state by the level 106, and the uneven groove 301 is formed in the lower holding groove 23 a of the transport chuck 20. The chuck mounting jig 300 is gripped by the transport chuck 20 in the engaged state. In addition,
The level 303 is attached to the upper part of the chuck mounting jig 300, and when the chuck mounting jig 300 is gripped by the transport chuck 20, the level is adjusted. In this state, the tracing stylus 104 abuts on the vertical reference plane 302 of the chuck mounting jig 300, and the dial gauge 10
Positioning is performed so that the scale of 5 becomes the "0" point.

The positioning between the transport chuck 20 and the wafer boat 90 is performed as described above. This positioning is performed by selecting a local controller LCb for controlling the transport chuck 20 of the transport system controller B and a local controller LCc for controlling the wafer boat 90 of the processing system controller C by operating the positioning terminal PT.

The loading of the wafer W into the carrier 10 at the interface unit 12B and the unloading unit 13 of the buffer system control unit A is performed by the reverse operation of the unloading operation of the wafer W at the unloading unit 13 and the interface unit 12A. The positioning is performed respectively. The transport of the empty carrier 10 in the unloading section 13 is performed by the reverse operation of the transport of the empty carrier 10 in the loading section 11, and positioning is performed. here,
Although the wafer boat 90 is fixed to the processing tank, the wafer boat 90 is connected to driving means for moving up and down (elevating and lowering).
Can be moved up and down so that the wafer W
May be passed.

Next, the procedure of the positioning control of the present invention will be described. First, the positioning terminal PT is connected to the connector 50. Next, the switch of the positioning terminal PT is turned ON, and the buffer system control unit A, the transfer system control unit B or the processing system control unit C to be positioned is selected, and the driving means for positioning, for example, the slide arm 71, the transfer unit The local controllers LCa to LCc that control the chuck 20 or the wafer boat 90 are selected. Then, as described above, positioning is performed, and the positioning data is transferred to the local controllers LCa to LCa.
Enter c. At this time, the positioning data is stored and stored in the local controllers LCa to LCc.

As described above, a plurality of local controllers LCa-L are controlled by one positioning terminal PT.
It is possible to sequentially select Cc, set the positioning data of the driving means controlled by the selected local controllers LCa to LCc, and control the driving means based on the positioning data. Therefore, since the positioning of the driving means of a plurality of devices can be selected and selected by one connection, the positioning operation can be performed safely and easily.

In the above embodiment, the case where the positioning control method and the positioning control device according to the present invention are applied to a semiconductor wafer cleaning processing system has been described.
Of course, the present invention can be applied to cleaning of a substrate or the like or other processing systems.

[0043]

As described above, according to the present invention, because of the above-described configuration, the following excellent effects can be obtained.

(1) According to the first, fourth or fifth aspect of the present invention, one of the local controllers for controlling the driving means is selected by one positioning terminal, and is controlled by the selected local controller. Since the driving means can be controlled based on the data by setting the positioning data of the driving means, there is no need to reconnect the positioning terminal to the local controller controlling the driving means of each block. Positioning can be performed easily and safely by the connection.

(2) According to the second or sixth aspect of the present invention, the driving means can be positioned in the horizontal X and Y directions, the vertical Z direction or the rotation direction, and can be positioned between the driving means. It can be performed.

(3) According to the third or seventh aspect of the invention, the positioning terminal is formed so that the positioning data can be stored and stored, so that the control of the driving means can be performed reliably, and Reliability can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a semiconductor wafer cleaning processing system to which a positioning control method (apparatus) according to the present invention is applied.

FIG. 2 is a schematic plan view of the cleaning system.

FIG. 3 is a schematic configuration diagram showing a positioning control device according to the present invention.

FIG. 4 is a schematic perspective view showing a carrier positioning part of a carry-in part in the cleaning processing system.

FIG. 5 is a schematic perspective view showing the positioning of the carrier.

FIG. 6 is a schematic perspective view showing a wafer positioning unit of an interface unit in the cleaning processing system.

FIG. 7 is a schematic perspective view showing positioning when taking out a wafer from the carrier.

FIG. 8 is a schematic perspective view showing an empty carrier transport mechanism in the cleaning processing system.

FIG. 9 is a schematic perspective view showing the positioning of the transport section of the empty carrier 10;

FIG. 10 is a perspective view showing a main part of a transport chuck in the cleaning processing system.

FIG. 11 is a schematic sectional view of the transfer chuck.

12 is an enlarged sectional view (a) along the line II of FIG. 11 and an enlarged sectional view (b) along the line II-II of FIG. 11;

FIG. 13 is an enlarged sectional view of a side holding rod and a lower holding rod of the transport chuck.

FIG. 14 is a plan view (a), a front view (b), and a side view (c) showing an adjustment jig and a calibration jig used for positioning the transfer chuck and the wafer boat in the cleaning processing system.

FIG. 15 is a cross-sectional view showing a state in which the transfer chuck and the wafer boat are positioned using the adjustment jig.

FIG. 16 is a plan view showing a state in which the transfer chuck and the wafer boat are positioned using the adjustment jig.

FIG. 17 is a side view of FIG. 16;

FIG. 18 is a schematic configuration diagram showing a conventional positioning control device.

[Explanation of symbols]

 Reference Signs List A buffer system control unit B transfer system control unit C processing system control unit LCa to LCc local controller PT positioning terminal W semiconductor wafer 10 carrier 11 carry-in unit 12A, 12B interface unit 13 carry-out unit 20 carry chuck (drive unit) 20B carry unit 30, 31, 32 processing unit 33 drying processing unit 34 chuck cleaning / drying unit 35 processing unit 50 connector 71 slide arm (driving means) 72 wafer hand (driving means) 73 base (driving means) 74 loader (driving means) 75 aligner (driving means) 76 wafer counter (driving means) 78 lifter (driving means) 79 slider (driving means) 80 liner (driving means) 90 wafer boat (substrate lifting / lowering means; driving means)

Claims (7)

[Claims] When inputting positioning data to a plurality of local controllers each controlling one or a plurality of driving means, the local controller is selected by one positioning terminal, and the selected local controller is selected. A positioning control method comprising: setting positioning data of the driving unit controlled by the control unit; and allowing the driving unit to be controlled based on the data. 2. The positioning control method according to claim 1, wherein the positioning data of the positioning terminal is at least one of a horizontal X, Y direction, a vertical Z direction, or a rotation direction in the driving means itself. And positioning between the driving means. 3. The positioning control method according to claim 1, wherein positioning data of said positioning terminal is stored and stored in a local controller. 4. A positioning control device for inputting positioning data to a plurality of local controllers each controlling one or a plurality of driving means, wherein one of said plurality of local controllers capable of branch communication is connected to said plurality of local controllers. A positioning terminal is formed to be connectable to the connector. The positioning terminal has a function of selecting the local controller and a function of setting positioning data of the driving means controlled by the selected local controller. A positioning control device, comprising: 5. The positioning control device according to claim 4, wherein the driving means is a container moving means for moving a container accommodating the substrate to be processed, and a processing system for cleaning and drying the substrate to be processed. A positioning control device comprising: transport means for transporting a substrate; and substrate lifting means for lifting and lowering the substrate to be processed in a processing system for cleaning and drying the substrate to be processed. 6. The positioning control device according to claim 4, wherein the driving unit is formed so as to be movable in at least one of a horizontal X, Y direction, a vertical Z direction, or a rotation direction. A positioning control device. 7. The positioning control device according to claim 4, wherein said positioning data of said positioning terminal is formed so as to be stored and stored by a local controller. Control device.