JP2002048649A5 - - Google Patents
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- JP2002048649A5 JP2002048649A5 JP2000238744A JP2000238744A JP2002048649A5 JP 2002048649 A5 JP2002048649 A5 JP 2002048649A5 JP 2000238744 A JP2000238744 A JP 2000238744A JP 2000238744 A JP2000238744 A JP 2000238744A JP 2002048649 A5 JP2002048649 A5 JP 2002048649A5
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- Prior art keywords
- temperature
- thermoelectric
- infrared
- measurement value
- banks
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Description
【0005】
【課題を解決するための手段】
本発明の測温計は、熱源から放射される赤外線を受光することにより、前記熱源の温度についての測温値を得る測温計であって、前記赤外線を受光する熱吸収体の温度に基づいて電圧を発生する熱電堆を複数有し、前記複数の熱電堆が同一の半導体基板の主面上に受光位置が互いに異なる所定の配置で形成された赤外線検出手段と、前記複数の各熱電堆からの各出力電圧に対応する複数の測温値候補のうちの最大値を、前記測温値として決定する測温値決定手段と、を備えたことを特徴とする。[0005]
[Means for Solving the Problems]
Temperature measuring meter of the present invention, by receiving the infrared radiation emitted from the heat source, a temperature measuring gauge obtain temperature measurement value for the temperature of the heat source, based on the temperature of the heat absorption body for receiving the infrared Infrared detection means having a plurality of thermoelectric banks generating a plurality of voltages , wherein the plurality of thermoelectric banks are formed at predetermined positions different from each other on the main surface of the same semiconductor substrate ; And D. temperature measurement value determination means for determining, as the temperature measurement value, the maximum value among the plurality of temperature measurement value candidates corresponding to the respective output voltages from T.4.
【0007】
また、上述の測温計において、前記赤外線を集光する赤外線レンズをさらに備えたことが好ましい。[0007]
Moreover, in the above-mentioned thermometer, it is preferable to further provide the infrared lens which condenses the said infrared ray.
【0009】
また、上述の測温計において、前記赤外線レンズは、バイナリレンズであることが好ましい。[0009]
Moreover, in the above-mentioned thermometer, it is preferable that the said infrared lens is a binary lens.
【0011】
また、上述の測温計において、前記赤外線レンズは、各熱電堆の熱吸収体に前記赤外線を集光する多段構成のバイナリエレメントを、前記複数の熱電堆に対応して複数有することが好ましい。[0011]
Further, in the above-described temperature gauge, preferably, the infrared lens has a plurality of binary elements of multi-stage configuration that condenses the infrared light on the heat absorbers of the thermoelectric banks, corresponding to the plurality of thermoelectric banks.
【0013】
また、上述の測温計において、前記複数の各熱電堆に対応する各バイナリエレメントは、その光学的中心と対応する各熱電堆の熱吸収体の中心とを結ぶ線が、各熱電堆の熱吸収体に集光する集光対象の赤外線の光軸と一致するように構成されたことが好ましい。[0013]
In the above-mentioned thermometer, each binary element corresponding to each of the plurality of thermoelectric banks has a line connecting the optical center thereof and the center of the heat absorber of each corresponding thermoelectric bank, the line representing the thermal center of each thermoelectric bank. It is preferable to be configured to coincide with the optical axis of the infrared light to be collected to be collected on the absorber.
【0015】
また、上述の測温計において、前記複数の各熱電堆に対応する各バイナリエレメントは、前記集光対象の赤外線の光軸が、前記半導体基板の主面からその法線方向に所定距離離れた同一点を通過するように構成されたことが好ましい。[0015]
Further, in the above-mentioned temperature gauge, each binary element corresponding to each of the plurality of thermoelectric elements is such that the optical axis of the infrared light to be collected is separated from the main surface of the semiconductor substrate by a predetermined distance in the normal direction It is preferable to be configured to pass through the same point.
【0017】
また、前記赤外線レンズを備えた上述の各測温計において、前記赤外線レンズは、半導体から成るレンズ基板をレンズとして加工形成したものであることが好ましい。[0017]
Further, in each of the above-described temperature detectors including the infrared lens, it is preferable that the infrared lens is formed by processing a lens substrate made of a semiconductor as a lens.
【0019】
また、上述の測温計において、前記レンズ基板は、シリコン基板であることが好ましい。[0019]
Further, in the above-described temperature gauge, the lens substrate is preferably a silicon substrate.
【0021】
また、前記赤外線レンズを備えた上述の各測温計において、前記赤外線レンズが、前記半導体基板の主面上に接合されたことが好ましい。[0021]
Further, in each of the above-described temperature gauges provided with the infrared lens, it is preferable that the infrared lens be bonded on the main surface of the semiconductor substrate.
【0023】
また、前記赤外線レンズを備えた上述の各測温計において、前記赤外線レンズは、受光する赤外線の波長を絞る赤外線コーティングが施されていることが好ましい。[0023]
Further, in each of the above-described temperature gauges provided with the infrared lens , it is preferable that the infrared lens be provided with an infrared coating that narrows the wavelength of infrared light to be received.
【0025】
また、前記赤外線レンズを備えた上述の各測温計において、前記複数の熱電堆のうち、中心に立てた法線が前記赤外線レンズの光学的中心を通る熱吸収体に基づく熱電堆を主熱電堆とし、その他の熱電堆を副熱電堆として、前記副熱電堆が前記主熱電堆の周辺に配置されたことが好ましい。[0025]
Further, in each of the above-described thermometers provided with the infrared lens , among the plurality of thermoelectric stacks, a thermoelectric normal based on a heat absorber which passes through the optical center of the infrared lens is the main thermoelectric It is preferable that the secondary thermoelectrics are disposed around the main thermoelectrics, with the other thermoelectrics as secondary thermoelectrics.
【0027】
また、上述した各測温計において、前記複数の各熱電堆の電圧出力の2極のうちの一方は、共通接続されていることが好ましい。[0027]
Further, in each of the above-described temperature gauges, it is preferable that one of the two electrodes of the voltage output of each of the plurality of thermoelectric transducers be connected in common.
【0029】
また、上述した各測温計において、前記半導体基板は、シリコン基板であることが好ましい。[0029]
Further, in each of the above-described temperature gauges, the semiconductor substrate is preferably a silicon substrate.
【0031】
また、上述した各測温計において、前記測温値決定手段は、前記複数の各熱電堆からの各出力電圧のうちの最大値を最大出力電圧として選択する最大出力電圧選択手段と、前記最大出力電圧に基づいて前記測温値を算出する測温値算出手段と、を有することが好ましい。[0031]
Further, in each of the above-described temperature gauges, the temperature measurement value determining means selects a maximum value among the output voltages from the plurality of thermoelectric banks as the maximum output voltage, and the maximum output voltage selecting means. It is preferable to have temperature measurement value calculation means for calculating the temperature measurement value based on an output voltage.
【0033】
また、上述した各測温計において、前記複数の各熱電堆からの各出力電圧に対応する測温値候補は、基準温度に前記各出力電圧に対応する温度の差分を加えた温度を示すことが好ましい。[0033]
Further, in each of the above-described temperature gauges, the temperature measurement value candidate corresponding to each output voltage from each of the plurality of thermopiles indicates a temperature obtained by adding the difference of the temperature corresponding to each of the output voltages to a reference temperature. Is preferred.
【0035】
また、上述の測温計において、前記基準温度を検出する基準温度検出手段をさらに備えたことが好ましい。[0035]
Preferably, the above-described temperature gauge further includes reference temperature detection means for detecting the reference temperature.
【0037】
また、上述の測温計において、前記基準温度は、前記複数の熱電堆の冷接点の温度であることが好ましい。[0037]
Moreover, in the above-mentioned thermometer, it is preferable that the said reference temperature is the temperature of the cold junction of several said thermoelectric elements.
【0039】
また、前記基準温度検出手段を備えた上述の各測温計において、前記基準温度検出手段の感温部が、前記複数の熱電堆を形成した半導体構造内に一体形成されたことが好ましい。[0039]
Further, in each of the above-described temperature gauges provided with the reference temperature detection means, it is preferable that the temperature sensing portion of the reference temperature detection means is integrally formed in a semiconductor structure in which the plurality of thermoelectric elements are formed.
【0041】
また、前記基準温度検出手段を備えた上述の各測温計において、前記基準温度検出手段は、その感温部として、入出力特性が前記基準温度の温度変化に応じて変化する半導体素子を複数有し、前記複数の半導体素子からの出力に基づいて、前記基準温度を検出することが好ましい。[0041]
Further, in each of the above-described temperature detectors including the reference temperature detection means, the reference temperature detection means, as its temperature sensitive portion, includes a plurality of semiconductor elements whose input / output characteristics change according to the temperature change of the reference temperature. Preferably, the reference temperature is detected based on outputs from the plurality of semiconductor elements.
【0043】
また、前記基準温度検出手段を備えた上述の各測温計において、前記基準温度検出手段の感温部は、前記半導体構造内においてダイオードとして機能するように構成されたことが好ましい。[0043]
Further, in each of the above-described thermometers provided with the reference temperature detection means, it is preferable that the temperature sensing portion of the reference temperature detection means is configured to function as a diode in the semiconductor structure.
【0045】
また、上述した各測温計において、前記熱源の温度が、人間の鼓膜温度であることが好ましい。[0045]
Further, in each of the above-described temperature gauges, it is preferable that the temperature of the heat source be a tympanic temperature of a human.
Claims (9)
前記赤外線を受光する熱吸収体の温度に基づいて電圧を発生する熱電堆を複数有し、前記複数の熱電堆が同一の半導体基板の主面上に受光位置が互いに異なる所定の配置で形成された赤外線検出手段と、
前記複数の各熱電堆からの各出力電圧に対応する複数の測温値候補のうちの最大値を、前記測温値として決定する測温値決定手段と、
を備えたことを特徴とする測温計。A thermometer which obtains a temperature measurement value of the temperature of the heat source by receiving infrared rays emitted from the heat source,
The plurality of thermoelectric banks that generate a voltage based on the temperature of the heat absorber that receives the infrared rays, the plurality of thermoelectric banks are formed in predetermined positions different from each other on the main surface of the same semiconductor substrate and the infrared detection means was,
Temperature measurement value determination means for determining, as the temperature measurement value, a maximum value among a plurality of temperature measurement value candidates corresponding to each output voltage from each of the plurality of thermoelectric elements;
A thermometer characterized by having.
前記複数の各熱電堆からの各出力電圧のうちの最大値を最大出力電圧として選択する最大出力電圧選択手段と、
前記最大出力電圧に基づいて前記測温値を算出する測温値算出手段と、
を有することを特徴とする、請求項1に記載の測温計。The temperature measurement value determining means
Maximum output voltage selection means for selecting as a maximum output voltage the maximum value among the output voltages from each of the plurality of thermoelectric elements;
Temperature measurement value calculation means for calculating the temperature measurement value based on the maximum output voltage;
The thermometer according to claim 1, characterized in that:
前記赤外線レンズは、各熱電堆の熱吸収体に前記赤外線を集光する多段構成のバイナリエレメントを、前記複数の熱電堆に対応して複数有することを特徴とする、請求項1または2に記載の測温計。It further comprises an infrared lens for collecting the infrared light ,
The infrared lens according to claim 1 or 2 , characterized in that the infrared lens has a plurality of binary elements in a multi-stage configuration that condenses the infrared light on the heat absorbers of the respective thermocouples, corresponding to the plurality of thermoelectric banks. Thermometer.
前記集光対象の赤外線の光軸が、前記半導体基板の主面からその法線方向に所定距離離れた同一点を通過するように構成されたことを特徴とする、請求項3に記載の測温計。In each binary element corresponding to each of the plurality of thermoelectric banks, a line connecting the optical center and the center of the heat absorber of each corresponding thermoelectric bank is a light collecting target for condensing on the heat absorber of each thermoelectric bank Coincides with the infrared light axis of the
The measurement according to claim 3 , characterized in that the optical axis of the infrared light to be collected passes through the same point separated by a predetermined distance in the normal direction from the main surface of the semiconductor substrate. Thermometer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2000238744A JP3733847B2 (en) | 2000-08-07 | 2000-08-07 | Thermometer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2000238744A JP3733847B2 (en) | 2000-08-07 | 2000-08-07 | Thermometer |
Publications (3)
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JP2002048649A JP2002048649A (en) | 2002-02-15 |
JP2002048649A5 true JP2002048649A5 (en) | 2005-03-03 |
JP3733847B2 JP3733847B2 (en) | 2006-01-11 |
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JP2000238744A Expired - Fee Related JP3733847B2 (en) | 2000-08-07 | 2000-08-07 | Thermometer |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4226985B2 (en) | 2003-10-06 | 2009-02-18 | 日本航空電子工業株式会社 | Manufacturing method of optical sensor |
JP4042707B2 (en) * | 2004-02-13 | 2008-02-06 | 株式会社デンソー | Infrared detector |
TW200936996A (en) * | 2008-02-18 | 2009-09-01 | Fortune Semiconductor Corp | Temperature sensing module |
JP5890261B2 (en) | 2012-06-21 | 2016-03-22 | アズビル株式会社 | Temperature detection range specifying device and method |
JP6773089B2 (en) * | 2013-02-21 | 2020-10-21 | 株式会社リコー | device |
JP6166150B2 (en) * | 2013-10-29 | 2017-07-19 | アルプス電気株式会社 | Receiver |
DE102013114202A1 (en) * | 2013-12-17 | 2015-06-18 | Endress + Hauser Wetzer Gmbh + Co. Kg | PYROMETER and method of temperature measurement |
CN111854959B (en) * | 2019-04-26 | 2023-10-24 | 肖殿清 | Earphone type far infrared continuous ear temperature and physiological parameter measuring device |
CN114858289B (en) * | 2022-07-07 | 2022-10-04 | 深圳市兆兴博拓科技股份有限公司 | Infrared sensing testing device |
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2000
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