JP2002043628A - Fixing device for mounting optical semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixing device for mounting an optical semiconductor element in which a plurality of elements or a single element can be mounted, as required, regardless of the orientation of the optical path with respect to a circuit board. SOLUTION: Vertical grooves 4, 5 for guiding the lead L of an optical semiconductor S are made in one face of a base 1 provided with legs 2, 3 being secured to a circuit board B on the lower end side. Furthermore, a receiving part 8 abutting at least against the lead L of the optical semiconductor S is provided to form a step allowing the semiconductor S to project forward while riding over the lead L of the optical semiconductor positioned at the upper end of the base 1. Bottom face of the optical semiconductor S is supported (II) at the upper end 1a of the base 1 or the lead L is supported (III) at the upper end 8a of the receiving part 8 thus positioning the optical semiconductor element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a light emitting diode,
The present invention relates to a fixture for mounting a laser diode, a photodiode, and the like at a predetermined position on a circuit board.

[0002]

2. Description of the Related Art A display element for easily recognizing an operation state of a circuit from the outside and a light receiving element for detecting light from the outside to execute a predetermined operation are provided with respect to an opening of a cover such as a case. The leads of these elements are mounted on the printed circuit board by soldering so as to be at predetermined positions. The leads of these elements are originally rigid enough to not be deformed by the weight of the element body and are self-supporting,
In view of the external force received when the circuit board is accommodated in the case, as shown in JP-A-10-247770 and JP-A-11-265160, a circuit is provided via a fixing member that also serves as a reinforcing member and a positioning member. Mounted on the board.

[0003]

According to these, the object can be achieved when the device is mounted so that the optical path of the element is perpendicular to the substrate, but the lead is bent so that the optical path is parallel to the substrate. When installing, it is necessary to secure the specified bending allowance with a jig etc., bend it, and then remove the jig, which complicates the mounting process and fixes it to each element Since there is a need for a component, there is a problem that the manufacturing process is also complicated when a plurality of elements are arranged and mounted on the same substrate. The present invention has been made in view of such a problem, and an object of the present invention is to provide a single circuit board having a plurality of elements irrespective of the direction of an optical path with respect to the circuit board. An object of the present invention is to provide a fixture for mounting an optical semiconductor element that can be mounted on a semiconductor device.

[0004]

In order to achieve the above object, according to the present invention, an optical semiconductor lead is provided on one surface of a base provided with fixing means fixed to a circuit board on a lower end side. A vertically extending groove is formed to guide the optical semiconductor lead, and at least a step is formed which abuts the optical semiconductor lead and allows the semiconductor to protrude forward beyond the optical semiconductor lead positioned at the upper end of the base. The bottom of the optical semiconductor is supported at the upper end of the base, or the lead is supported and positioned at the upper end of the receiver.

[0005]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention. FIGS. 1 and 2 show an embodiment of a fixture for a fixture for mounting an optical semiconductor element, wherein a base 1 can be engaged with a mounting hole of a circuit board B on a lower end side. Legs 2 and 3 having claws are provided on both sides, and a pair of upper and lower grooves 4 and 5 for guiding optical semiconductor leads are formed on one surface, and a pair of upper and lower convex portions are formed on both sides. 6 and 7 are formed. A plurality of optical semiconductors are formed at a constant pitch so that a plurality of optical semiconductors can be attached.

The base 1 has a receiving portion 8 at least contacting a lead wire below the main body of the optical semiconductor, and an opening 9 at a position facing the back surface thereof. A step ΔH is provided between the upper end 1a of the base 1 and the upper end 8a of the receiving portion 8 such that the upper end 1a of the base 1 is at the top. When the optical semiconductor lead positioned at the upper end of the base 1a is bent using the upper end 8a of the receiving portion 8 as a fulcrum, the step ΔH allows the semiconductor to protrude forward beyond the upper end of the receiving portion 8. It is set as follows.

[0007] Further, a relief portion formed of a slope portion 8b is formed on the front side of the upper end of the receiving portion 8 so that the lead can be reliably bent at a right angle.

In this embodiment, the legs 2 and 3 of the fixture of the base 1 are fixed to the circuit board B, and the leads L and L of the optical semiconductor S are connected to the convex portions 67 as shown in FIG. Is inserted into the through-hole of the circuit board B so that the grooves 4, 4, 5, and 5 in the area partitioned by are used as guides.

Next, the bottom surface of the semiconductor S is connected to the upper end 1 of the base 1.
Then, the leads L, L are fixed to the circuit board B by soldering after they are positioned at a predetermined height by abutting (a).
In this state, the semiconductor S is inserted into the receiving portion 8 as shown by the arrow in the figure.
When pushed down, the leads L, L are bent with the upper end 8a as a fulcrum (III). Thus, the optical path of the semiconductor S can be positioned so as to be horizontal with respect to the circuit board B.

Needless to say, even in the state shown in FIG. 3 (I), the bottom surface of the semiconductor S is supported by the upper end 1a of the base 1, and the leads L are supported by the base 1 and the receiving portion 8. Therefore, it can be used in a state where the optical path is perpendicular to the circuit board B.

In the above-described embodiment, a window is formed on the back surface of the base to reduce the weight and save the material. However, if this is not forgotten, the opening 9 becomes unnecessary.

Further, the base 1 can be cut at an arbitrary position in the longitudinal direction, for example, only the grooves 6 and 7 corresponding to the cut positions are selectively formed deeply, or a break slit or the like is formed. By doing so, the size can be easily adjusted according to the number of mounting steps.

[0013]

According to the present invention, a vertically extending groove for guiding leads of an optical semiconductor is formed on one surface of a base provided with a fixing means fixed to the circuit board B on the lower end side. Abuts against the lead, and has a receiving portion that forms a step that allows the semiconductor to protrude forward beyond the semiconductor lead positioned at the upper end of the base, supporting the bottom surface of the optical semiconductor at the upper end of the base, or Since the lead is supported and positioned at the upper end of the receiving portion, a plurality of elements can be mounted as a single unit as required, regardless of the direction of the optical path with respect to the circuit board.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a fixture for mounting an optical semiconductor element of the present invention.

FIG. 2 is a view showing a cross-sectional structure of the fixing device.

FIGS. 3 (I) to (III) are diagrams showing steps of attaching an optical semiconductor to a circuit board using the same fixtures, respectively.

[Explanation of symbols]

 Reference Signs List 1 base 1a upper end 2,3 leg 4,5 groove 6,7 convex part 8a upper end 8b slope 9 opening B circuit board L lead S optical semiconductor ΔH step

Continued on front page F-term (reference) 4E353 AA07 AA16 AA17 AA24 BB05 CC01 CC13 CC14 CC33 DR17 DR22 DR49 EE01 GG09 5E336 AA01 AA12 AA13 BB01 CC11 CC57 DD22 DD30 DD37 DD38 EE01 EE15 EE17 EE18 GG25 DC24 DC24 5F088 AA01 BA16 BA20 BB10 JA20

Claims (2)

[Claims] 1. A vertically extending groove for guiding leads of an optical semiconductor is formed on one surface of a base provided with fixing means fixed to a circuit board on a side serving as a lower end, and at least the optical semiconductor has Abutting against a lead, and comprising a receiving portion forming a step that allows the semiconductor to protrude forward beyond the lead of the optical semiconductor positioned at the upper end of the base;
An optical semiconductor element mounting fixture for supporting a bottom surface of an optical semiconductor at an upper end of a base or supporting and positioning a lead at an upper end of the receiving portion. 2. The mounting fixture for an optical semiconductor element according to claim 1, wherein the groove is separated by a projection to form a plurality of mounting regions in a longitudinal direction of the base.