JP2002030796A - Floor heating panel, peripheral panel laid on unheated floor section around heated floor section, and method for installing floor heating appliances using the panels - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide floor heating panels and peripheral panels laid on a unheated floor section on the periphery of a heated floor section, which reduce production costs thereof, save labor for installing the same, and are improved in installation convenience by imparting handling convenience thereto when they are carried into the construction field, and to provide a method for installing floor heating appliances. SOLUTION: A floor substrate 6 is laid on a floor portion 5, and the plurality of floor heating panels 8,... constituting the heated floor section 7 are directly laid on the floor substrate 6. Then, the plurality of peripheral panels are laid on the unheated floor section on the periphery of the heated floor section 7. Each peripheral panel is formed of almost the same material as that of the floor heating panel 8, to thereby have a thickness similar to the thickness of the floor heating panel 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention has a heating panel body laid on a floor heating section and a peripheral panel body laid on a non-floor heating section around the floor heating section to adjust the thickness. And a peripheral panel laid in a non-floor heating section around the floor heating section and a construction method using these panels.

[0002]

2. Description of the Related Art Conventional floor heating, in particular, floor heating, which heats a floor surface by passing hot water through a pipe using a hot water pipe, comprises assembling a hot water pipe or a metal thin film in a factory or the like in advance. The floor heating panel was carried into the construction site.

[0003] Since these floor heating panels are designed to be laid one by one in a room, one side of the floor heating panel may exceed 3 m depending on the size of the floor heating panel. It was difficult.

Furthermore, since there is no laminated structure on the contact surface side of the panel with the floor substrate so as to absorb unevenness (unevenness) of the floor substrate, a high fluidity is required before the floor heating panel is laid. It is necessary to cast self-leveling material typified by mortar, which is a factor that increases the time required to lay floor heating panels. In addition, since it is designed to be laid one by one in one room, the variety of heating panels becomes very large, which has been a factor of increasing the manufacturing cost of floor heating panels.

[0005] When many small-sized panels are to be constructed, since hot water pipes are buried in a factory or the like in advance, the number of parts and work to connect the hot water pipes of each panel at the construction site increases. The possibility of hot water leakage increases.

In order to solve these problems, Japanese Utility Model Publication No. 7-18897 discloses a floor heating panel which can be easily constructed on site and can be constructed without special skill.

In such a case, as shown in FIG.
The floor heating panel has a plurality of grooves 1b, 1b on one surface 1a.
And a plurality of second floor members 2 each having an arc-shaped groove 2b formed on one surface 2a.

On these floor members 1 and 2, a cold / hot water pipe 3 as a heating means is laid with an entrance 3a and an exit 3b close to each other.

Next, the operation of the conventional floor heating panel will be described.

In the conventional floor heating panel constructed as described above, the hot and cold water supplied from the inlet 3a of the cold / hot water pipe 3 is gradually cooled and drained from the outlet 3b.

The entrance 3a is heated by hot water of the highest temperature in the outward path and hot water of the lowest temperature flowing to the outlet 3b.

[0012]

However, in such a conventional apparatus, the floor heating panel includes a first floor member 1 having a plurality of grooves 1b formed on one surface 1a, and a first floor member 1 having a plurality of grooves 1b formed on one surface 1a. A second flooring section 2 having at least one arc-shaped groove 2b having an entrance at the same end on the surface 2a, and a first flooring section 1 and a second flooring section; 2 had to be manufactured completely separately, and there was a problem that it was costly to manufacture floor heating panels.

In the above-mentioned conventional floor heating panel, when the peripheral panel laid in the non-floor heating section uses plywood or the like having the same thickness as a commonly used floor heating panel, the thickness is 12 mm. In many cases, large front and rear plates were used, and in that case, the weight became heavy, and thus handling was very poor. Further, since it is necessary to use a saw or the like for the processing of the entrance angle or the like, the processing requires a very long time.

In order to solve the above-mentioned reason, a hard resin foam represented by Styrofoam may be used as the peripheral panel. In the case of hard resin foam, unlike plywood, processing such as entry and exit angles can be processed with a cutter knife, etc. Must be
The cost of the peripheral panel itself was increased.

[0015] The present invention reduces costs for manufacturing floor heating panels and peripheral panels, reduces labor for constructing floor heating panels and peripheral panels, and at the same time imparts ease of handling when the panels are carried in. It is an object of the present invention to provide a floor heating panel with improved construction simplicity, a peripheral panel laid in a non-floor heating section around the floor heating section, and a floor heating construction method using each panel.

[0016]

In order to solve the above-mentioned problems, according to the first aspect of the present invention, a plurality of floor heating sections are laid on a floor heating section to constitute a floor heating section, and the floor heating section. A hard resin foam and a non-woven absorbent layer are laminated on each of the panels, and the floor heating panel includes the hard resin foam. At the same time that the groove for burying the heating means is formed in the layer, the floor heating panel and the peripheral panel excluding the groove have the same material, shape, dimensions, lamination structure, and thickness, all having the same structure. It features a panel and a peripheral panel laid in a non-floor heating section around the floor heating section.

According to the first aspect of the present invention, since the floor heating panel and the peripheral panel are similarly configured, they can be manufactured on the same manufacturing line using substantially the same raw materials.

Therefore, an increase in manufacturing cost can be suppressed.

According to the second aspect of the present invention, a plurality of the floor heating panels are laid on a floor base, and a plurality of peripheral panels are laid around the floor heating panel. 2. The floor according to claim 1, wherein a heating means is embedded in the groove, a metal thin film is laminated on the upper surface of the floor heating panel, and a hard plate is laminated on the peripheral panel and the floor heating panel. It features a construction method using a heating panel and a peripheral panel laid in a non-floor heating section around the floor heating section.

According to the second aspect of the present invention, an increase in the number of construction steps is suppressed, and the construction time can be shortened.

According to a third aspect of the present invention, a plurality of the floor heating panels are laid on a floor base, and a heating means is buried in a groove of the floor heating panel, and a periphery of the floor heating panel is provided. The floor according to claim 1, wherein a plurality of peripheral panels are laid on the floor heating panel, a metal thin film is laminated on an upper surface of the floor heating panel, and a hard plate is laminated on the peripheral panel and the floor heating panel. It features a construction method using a heating panel and a peripheral panel laid in a non-floor heating section around the floor heating section.

According to the third aspect of the present invention, an increase in the number of construction steps is suppressed, and the construction time can be shortened.

Further, according to the fourth aspect, a surface decorative material is laminated on the hard plate.
Or a construction method using the panel described in 3.

According to the fourth aspect of the present invention, it is possible to obtain a floor portion using a floor heating panel having good appearance quality in a short time.

[0025]

First Embodiment A first embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1 to 8 show a first embodiment of the present invention.
It is to explain. Parts that are the same as or equivalent to those in the conventional example will be described with the same reference numerals.

First, the structure will be described. In the floor heating panel according to the first embodiment, as shown in FIG. 3, a plurality of floor heating sections 7 on a floor base 6 laid on the floor 5 are formed. Floor heating panels 8 are laid directly.

As shown in FIG. 4, the non-heating section 7a around the floor heating section 7 is made of substantially the same material as the floor heating panel 8 so as to have the same thickness as the floor heating panel 8. A plurality of panels 9 are laid. The floor heating panel 8 and the peripheral panel 9 are configured by laminating a hard resin foam 12 and an uneven absorption layer 13, and a surface 12 a of the floor heating panel 8 on the front side of the hard resin foam 12 is provided. A groove 12c for burying a hot water pipe 11 as a heating means is formed.

In the floor heating section 7, the metal thin film layer 1
0, a hot water pipe 11, a hard resin foam 12 as a floor heating panel 8, and an uneven absorption layer 13 are laminated.

Further, the non-heating section 7 around the floor heating section 7
A is provided with a plurality of peripheral panels 9 which are made of substantially the same material as the floor heating panel 8 and have the same thickness as the floor heating panel 8.

Further, a floor finishing material 15 is stuck on the metal thin film layer 10 and the hard resin foam 12 of the peripheral panel 9.

Next, specific configurations of the floor heating panel 8 and the peripheral panel 9 laid in the non-floor heating section around the floor heating section will be described.

[Hard Resin Foam] The hard resin foam 12 used for the floor heating panel 8 and the peripheral panel 9 according to the first embodiment is not particularly limited, and has a foaming ratio of 5 to 25 times. Polyurethane foam, expansion ratio is 1
A polystyrene foam of 0 to 30 times is mentioned,
A hard resin foam described in Japanese Patent Application No. 8-347997 (Japanese Patent Application Laid-Open No. 10-44178) previously submitted by the present applicant is preferably used. This is because the groove processing described later can be easily and accurately performed.

The thickness of the hard resin foam 12 is as follows.
If it is too thick, the thickness of the floor heating panel itself will be too thick. If the thickness is too thin, not only may the groove processing to be performed later become impossible, but also the diameter of the groove may be smaller than the diameter of the hot water pipe 11 to be buried. Not only does it worsen, but in the worst case it may not be possible to construct. Therefore, the thickness is 8 mm or more and 20 mm or less, more preferably 8 mm
It is 14 mm or less.

In the first embodiment, the floor heating panel 8 can be obtained by forming a groove 12 for embedding the hot water pipe 11 in the hard resin foam 21 of the peripheral panel by a processing method described later. This eliminates the need to separately manufacture the hard resin foam 12 used for the floor heating panel 8 and the peripheral panel 9, and can share the material, thereby reducing the manufacturing cost of these panels.

The groove 12 formed in the hard resin foam 12
The shape of c is not particularly limited as long as the hot water pipe 11 to be used is buried, but if it is larger than the outer diameter of the hot water pipe 11, it contacts the metal thin film layer 10 laminated on the upper surface of the hot water pipe 11. May be gone.

In this case, the heat radiation of the hot water pipe 11 is suppressed, and the floor heating function is not performed. If it is too small, the hot water pipe 11 will not enter during construction.

Therefore, the size of the hot water pipe 11 is preferably larger than the outer diameter of the hot water pipe 11 in the range of 0.1 mm to 0.5 mm. In this case, it is preferable that the thickness of the hard resin foam 12 below the groove is at least 2 mm or more.

When it is less than 2 mm, the hard resin foam 12
Not only the heat insulation performance of the floor heating panel 8 decreases, the amount of heat escaping to the floor base increases, but also the floor heating panel 8 may be broken at the groove 12c. In addition, when the hot water pipe 11 is buried, it is preferable from the viewpoint of workability that a process for preventing the hot water pipe 11 from jumping out of the groove is performed.

If the distance (groove pitch) between the grooves 12c formed in the hard resin foam 12 is too large, the heat uniformity may be reduced. If the distance is too small, it takes time to bury the hot water pipe 11, or in the worst case, The pipe 11 may be damaged. Therefore, the groove pitch is preferably 200 mm or less, more preferably 150 mm or less, and is substantially 50 mm or more.

The rigid resin foam 12 is manufactured through the following manufacturing steps.

First, 50 parts by weight of high-density polyethylene (manufactured by Nippon Polychem, trade name: HY340), 30 parts by weight of polypropylene (manufactured by Nippon Polychem, trade name: MA3),
20 parts by weight of crosslinkable silane-modified polypropylene (manufactured by Mitsubishi Chemical Corporation, trade name: XPM800HM), and azodicarbonamide (trade name: SO-20, manufactured by Otsuka Chemical Co., Ltd.) as a foaming agent
Decomposition temperature 210 ° C.) 3 parts by weight and a cross-linking catalyst dibutyltin dilaurate 0.1 part by weight
m) and melt-kneaded at 180 ° C.
A sheet-shaped foamable thermoplastic resin in a softened state is extruded by a 00 mm T-die.

One roll has a depth of 5 mm and a diameter of 4.0 m.
m concave portions are arranged in a zigzag pattern at intervals of 10 mm.
The sheet-like foamable thermoplastic resin was cooled while being shaped between two shaping rolls having a length of 00 mm and a surface length of 1500 mm, and then crosslinked in a steam at 115 ° C. and a pressure of 1.0 kgf / cm ² for 4 hours. After drying, a foamable thermoplastic resin sheet is obtained.

The foamable thermoplastic resin sheet thus obtained has foamable thermoplastic resin granules at portions corresponding to the concave portions of the shaping roll, and the granules are formed of foamable thermoplastic resin. It was connected on a thermoplastic resin thin film.

At this time, the height of the granular material was 3.9 mm, the diameter was 3.9 mm, and the thickness of the thin film was 300 μm.

The foamable thermoplastic resin sheet is placed on a pair of endless conveyor belts (made of fluorinated ethylene resin, having a thickness of 0.1 mm).
5 mm), and the foamable thermoplastic resin sheet was heated to 230 ° C. via a conveyor belt to decompose the foaming agent and foam.

Thereafter, the film is conveyed between the 10 pairs of cooling rolls (the clearance between the rolls is 8.8 mm) with the thin film side fixed, thereby being cooled via the endless conveyance belt.
Furthermore, it is cooled and solidified through a conveyor belt in a cooling furnace,
A hard resin foam 12 is obtained.

The thus obtained hard resin foam 1
No. 2 was a honeycomb-shaped flat hard resin foam which was filled by crushing the convex portion with a roll. Further, since the thickness was adjusted by the roll, the thickness was 8 mm.

Thereafter, both surfaces are subjected to a corona discharge machining treatment, and a vinyl acetate emulsion adhesive is applied to one surface of the hard resin foam 12 by a roll coater.

On the adhesive-coated surface, as a non-woven absorbent layer 13, a flexible polyurethane foam having a foaming ratio of 50 times (thickness:
3.5mm) are stacked, length 900mm, width 60
It is cut to 0 mm and left in an atmosphere of 80 ° C. for 2 hours to cure the vinyl acetate emulsion adhesive.

The laminate of the hard resin foam 12 and the non-woven absorbent layer 13 obtained through the above manufacturing process is used as it is for the peripheral panel 9 and is also used for the mold 60 shown in FIGS.
Is used as described below, and is also used as the hard resin foam 12 and the uneven absorption layer 13 of the floor heating panel 8.

That is, the mold 60 shown in FIG.
1, an iron pipe 62 (outer diameter:
6 mm) is fixed. After the temperature of the iron pipe 62 is raised to 210 ° C. using the mold 60, the peripheral panel 9 is heated.
On the hard resin foam 12.

After that, after cooling the iron pipe 62 to 80 ° C., the mold 60 is released, whereby the groove 12c is processed. By repeating the above operation multiple times,
Floor heating panel 8 having grooves 12c as shown in FIG.
Is obtained.

[Non-absorbent Absorbing Layer] The non-absorbent absorbing layer 13 of the first embodiment is not particularly limited as long as it is a material that absorbs unevenness (unevenness) of the floor substrate, but generally has a low compression elastic modulus. Materials are used. Specifically, the expansion ratio is 10 to 30 times crosslinked polyethylene foam, the expansion ratio is 20 to 40 times soft resin foam such as soft polyurethane foam, glass fiber, inorganic fiber such as carbon fiber and polypropylene fiber, Examples include nonwoven fabrics made of organic fibers such as polyester fibers.

The compressive modulus of the non-absorbent absorbent layer 13 is not particularly limited. However, if it is too small, the floor material may sink greatly when walking on the floor, causing a sense of incongruity called the so-called "sickness sickness phenomenon". If it is too large, the non-woven fabric absorbability is reduced, so that 0.2 to 3 kg / cm ² is preferable.

If the thickness of the non-woven absorbing layer 13 is too large, the above-mentioned uncomfortable feeling when walking on the floor may occur, and if it is too thin, the non-woven absorbing property decreases. Therefore, the thickness is preferably 2 mm or more and 9 mm or less, more preferably 2.5 mm or more and 5 mm or less.

The unevenness absorbing layer 13 may be provided with an uneven shape. As the surface to which the uneven shape is given,
Surface 13 a facing hard resin foam 12 and floor substrate 6
May be provided on both of the surfaces 13b opposed to.

However, if the back surface (non-absorbent layer surface) 12b of the hard resin foam 12 is provided with a concavo-convex shape, it is not preferable because the respective bonding areas decrease.

The non-woven absorbent layer 13 is previously laminated on the hard resin foam 12 at a factory or the like. Above-mentioned non-absorbent layer 1
When laminating 3 with the hard resin foam 12, there is no particular limitation, and examples thereof include various adhesives, adhesives, and double-sided tapes.

Among these, an adhesive is preferably used in terms of cost and adhesive strength. However, the soft resin foam 12
When a non-permeable material (for example, a cross-linked polyethylene foam) is used, it is not preferable to use an emulsion adhesive since it takes time to evaporate water.

However, when laminating an air-permeable material (for example, a soft polyurethane foam or non-woven fabric), an emulsion adhesive is preferably used from the viewpoint of an adhesive application device and work environment.

The non-woven absorbent layer 13 is preferably laminated on the entire surface of the hard resin foam 12 in order to prevent the walking sensation from being different depending on where the user walks.

[Shape of floor heating panel and peripheral panel]
The floor heating panel 8 and the peripheral panel 9 of the first embodiment are:
Except for the groove 12 for burying the heating means provided on the floor heating panel 10, the same material, the same shape, the same size, the same thickness, and the same laminated structure are exactly the same. That is, the panel before processing the groove 12c for burying the heating means in the floor heating panel 8 (tentatively, A
The hard resin foam 12) has the same material and shape as the hard resin foam 12 of the peripheral panel 9, and has the same dimensions and thickness. Also, the non-woven absorbent layer 13 laminated on the above A has exactly the same material, shape, size and thickness as the non-absorbent absorbent layer 13 laminated on the peripheral panel 9.

In order to realize the above, the groove 12c for burying the hot water pipe 11 is formed in the hard resin foam 12 of the peripheral panel 9 by a processing method described later.

[Method of Grooving Hard Resin Foam] The method of forming the groove 12c for embedding the hot water pipe 11 in the hard resin foam 12 of the peripheral panel 9 mainly includes 1) a desired groove shape and pattern. A foamable thermoplastic resin is filled in a mold processed into an uneven shape, and the foamable thermoplastic resin is foamed by decomposing the foaming agent by heating the mold to a foaming agent decomposition temperature or higher. Then, the mold is cooled to cool and solidify the resin foam (in-mold foaming); 2) A method of forming a groove in the hard resin foam 12 provided with the uneven shape with a cutting tool such as a router; 3) There is a method such as a method in which the hard resin foam 12 having the uneven shape is processed into a desired groove shape and pattern, a heated die is pressed, and then the die is cooled to cool the die. .

In the method 1), a large-scale apparatus is required, and the production cost is undesirably increased. In particular, when the dimensions of the panel increase, the size of the mold also increases, so not only time is required for heating and cooling the mold, but also the amount of energy required for heating and cooling increases, and the running cost for manufacturing the panel is extremely low. Bulky.

In the method 2), the cut surface becomes rough or cracks occur depending on the cutting conditions. In particular, in the case of a material with an uneven shape, stress concentration tends to occur during cutting, so cracks and chips are likely to occur on the cut surface,
Floor heating panels can be damaged or broken. Further, since chips are generated at the time of processing, not only the working environment is deteriorated, but also chip processing is required.

The method 3) does not require a large-scale apparatus as in the method 1), and does not generate chips or cracks as in the method 2). Also, since the hot-pressed portion, that is, the hard resin foam at the bottom of the groove is melted and pressed by heat, the foam density at that portion increases,
It will be cooled and solidified as it is.

As a result, since the foam under the groove 12c is strengthened, the risk that the floor heating panel 8 is broken from the groove 12c is reduced. Further, by using this method, the floor heating panel 8 can be obtained by forming a groove in the hard resin foam 12 for the peripheral panel 9 according to the present invention.

Therefore, it is not necessary to separately manufacture the hard resin foam for the floor heating panel and the hard resin foam for the peripheral panel, and the materials and the production line are shared, and the floor heating panel 8 is manufactured.
In addition, the manufacturing cost of the peripheral panel 9 can be reduced.

For the reasons described above, the method 3) described above is suitably used as a method for forming the groove of the hard resin foam 12.
For example, when the hard resin foam 12 is a thermosetting resin, for example, a hard polyurethane foam, the method 3) cannot be used. Further, when the hard resin foam 12 is a thermoplastic resin, for example, styrene foam, using the above-mentioned method 3) results in roughening of the grooved surface, and the desired accuracy cannot be obtained.

However, the hard resin foam described in Japanese Patent Application No. 10-269996 previously filed by the present applicant is:
By the method 3), the groove processing surface is not roughened, and the groove processing can be performed to a desired size. Therefore, from the viewpoint of groove processing, the hard resin foam 12 is also made of Japanese Patent Application No. 10-2699.
The hard resin foam described in No. 96 is suitably used.

Further, the above-mentioned groove processing method comprises the steps of:
Before or after lamination. However, due to the manufacturing process, the uneven absorbent layer 13 and the hard resin foam 1
If it is possible to continuously laminate the floor heating panels 8, it is possible to reduce the manufacturing cost of the floor heating panel 8 by performing the groove processing after the laminar absorption layer 13 is laminated.

[Construction of floor heating panel and peripheral panel]
Hereinafter, the floor heating panel according to the first embodiment of the present invention, the peripheral panel laid in the non-floor heating section around the floor heating section, and the method of performing floor heating using each panel will be described along the construction order. I do.

[Laying of Floor Heating Panel and Peripheral Panel on Floor Base] The floor heating panel 8 and the peripheral panel 9 of the first embodiment are installed directly on the floor base 6.

In the first embodiment, the work is carried out on a 3.6 × 2.7 m floor substrate 6 (made of reinforced concrete, unevenness of the floor substrate (roughness): about 2 mm) having a frontage of 1.9 × 0.7 m. did.

The floor base 6 to be constructed includes: 1) a floor slab of concrete such as an apartment or an apartment; 2) lightweight concrete (ALC) 3) plywood or particle board laid on a joist or a pillar. Can be On these floor bases 6, the floor heating panel 8 and the peripheral panel 9 of the present invention 1 are directly attached and constructed with various adhesives, adhesives, double-sided tape, and the like.

At this time, a plurality of floor heating panels 8 are installed in the floor heating section 50 and a plurality of peripheral panels 9 are installed in the non-floor heating section 51 shown in FIG.

However, the non-floor heating section 51 includes the floor heating section 5
There is a connecting portion 52 that connects the 0 hot water pipe 11 and a connecting portion 53 of a heat supply device 54 that supplies hot and cold water to the hot water pipe 11.

The connecting portion 52 needs to be embedded in the peripheral panel 9 laid on the peripheral portion 51. The method of embedding is as follows: 1) a method of processing a groove in which the connecting part 52 can be embedded in the hard resin foam 12 of the peripheral panel 9 laid near the connecting part 52 with a cutter knife or the like; In the vicinity, a floor heating panel 8 to be laid in the floor heating section 50 is laid, and the groove 12c is used as the connecting section 52. There are methods such as 1). Such a possibility is not so preferable. Therefore, the method 2) is preferable.

Normally, the floor heating section 50 is constructed at a rate of 60 to 70% of the area of the room to be constructed. The order of the floor heating panel 8 and the peripheral panel 9 is not particularly limited, but the floor heating panel 8 is usually installed first.

[Heating means and laying thereof] Embodiment 1
Instead of the hot water pipe 11, a linear electric heating element or the like may be used as the heating means used for the floor heating panel 8 of FIG.

If the outer diameter of the hard resin foam 12 increases, the groove diameter must be increased.
Must be thicker.

It is not preferable to make the rigid resin foam 12 thick because the floor heating panel 8 becomes thick. On the other hand, if the outer diameter is too small, the calorific value of the electric heating element is reduced, and the diameter of the hot water pipe is also reduced. Therefore, the outer diameter of the heating means is 4 m
m to 18 mm, more preferably 6 m
m or more and 12 mm or less.

The heating means such as the hot water pipe 11 is embedded in a groove 12 c formed in the floor heating panel 8. At this time, the hot water pipe 11 buried in the groove 12c
It is preferable that a process for preventing the protrusion from coming out of c is performed.

When the hot water pipe 11 is buried,
The connection of the hot water pipe 11 buried in the floor heating unit 50 and the heat supply device 54 for supplying heat to the hot water pipe 11 may be performed, although the peripheral panel 9 may or may not be installed in the peripheral panel 9. When the floor heating panel 8 is laid on the portion 52 communicating with the portion 53, it is preferable to construct the peripheral portion 51 first.

[Metal Thin Film and Its Laying] The material of the metal thin film 10 of the first embodiment is not particularly limited, but a metal having excellent thermal conductivity is used for the purpose of installing the metal thin film 10. It is preferable because it has a certain soaking property.

For the above reasons, the material is preferably an aluminum foil.

If the thickness is too large, not only does the workability deteriorate, but also the floor finishing material 15 laid on the floor heating panel 8 and the floor finishing material 15 laid on the peripheral panel 8 do not. There may be a step between them.

If the thickness is too small, the heat uniformity may be deteriorated. Therefore, the thickness is preferably 0.05 to 0.5 mm, and more preferably 0.1 to 0.3 mm.

The metal thin film 10 is hardened to a hard resin foam 12
When laminating, various adhesives, pressure-sensitive adhesives, double-sided tapes and the like are suitably used. However, if sufficient adhesiveness is ensured, it is preferable to use a metal tape typified by an aluminum tape in terms of working environment and simplicity.

Further, the metal thin film 10 is
It may be laminated only near the upper surface, but it is preferable to lay it on the entire surface of the floor heating panel 8, that is, on the entire surface of the floor heating unit 50, since there is a possibility that sufficient heat uniformity may not be secured.

Further, the metal thin film 10 is
Will be laid after installation.

[Floor Finishing Material and Its Laying] The floor finishing material 15 of the first embodiment is not particularly limited as long as the hard resin foam 12 and the hot water pipe 11 can be protected. Specifically, 1) Wood veneer, plywood, particle board, medium density fiberboard (MDF), high density fiberboard (HDF), hardboard,
Wood material such as parallel plywood (LVL), 2) Thermoplastic resin such as polyethylene, polypropylene, polyvinyl chloride, etc., resin material composed of thermosetting resin such as polyester, epoxy resin, phenol resin, etc., 3) Fiber reinforced thermoplastic Resin, a composite material (FRP) such as a fiber-reinforced thermosetting resin, and the like. In the case of the present invention, any of the above-mentioned materials can be used, but a material which does not cause deterioration, deformation, warping, etc. due to heat or the like is selected.

If the thickness of the floor finishing material 15 is too thin,
Since the effect as a protective member is lost, and if the thickness is too large, the thickness of the floor itself increases, so it is preferably 2 to 12 mm, more preferably 3 to 9 mm.

The floor finishing material 15 laid on the peripheral panel 9
The thickness of the floor finishing material 1 laid on the floor heating panel 8
The thickness obtained by subtracting the thickness of the metal thin film 10 from the thickness of 5 is most preferable.

However, if the thickness of the metal thin film 10 is small, it is preferable that the thickness is the same from the viewpoint of cost.
For the same reason, it is preferable that both have the same shape, size, material, and the like.

[0098] The floor finishing material 15 may have a groove extending in an arbitrary direction on the lamination surface of the hard resin foam 12. When forming the concave groove, the groove width of the concave groove is about 1 to 5 mm, and the groove depth is about 1 to 5 mm.

The floor finishing material 15 may be entirely or partially peripherally processed by a conventionally known joining method such as a claw or a claw.

For bonding the floor finishing material 15 with the metal thin film 10 and the floor finishing material 15, various adhesives and adhesives,
A double-sided tape is preferably used.

Of these, a double-sided tape is preferably used as long as sufficient adhesive strength is ensured. When double-sided tape is used, it is not necessary to apply tape to the entire back surface of the floor finishing material 15, that is, the entire surface of the floor heating unit 500 and the non-floor heating unit 51, and a portion where the floor finishing materials 15 and 15 are joined to each other. You can put a tape on it. Thereby, laying of the floor finishing material 15 is simplified.

However, when a sufficient adhesive strength cannot be secured with a double-sided tape, it is preferable to use an adhesive, and among the adhesives, a modified silicone adhesive having excellent heat resistance is suitably used.

[Surface Coating Material and Its Laying] The floor finishing material 15 may further be provided with the following surface cosmetic material as required.

1) Veneer, synthetic resin or synthetic resin foam sheet, decorative paper, synthetic resin impregnated sheet, etc. 2) Long vinyl chloride sheet, cushion floor, cork, tile, carpet, etc. Bonded to the floor finish 15 in advance,
It is preferable that the layers are stacked for the purpose of improving workability. In addition, in order to enhance the design, woody feel, and scratch resistance,
Printing, painting, coloring, coating, and the like may be performed.

The decorative material of the above 2) is the above-mentioned floor finish material 15
It is better in design and workability to laminate the surface protective material with an adhesive, a pressure-sensitive adhesive, a double-sided tape, etc., than to laminate and laminate the surface protective material in advance.

[0106]

EXAMPLES Hereinafter, Examples 1 and 2 and Comparative Examples 1 to 3 will be described in comparison.

[0107]

[Table 1]

In Example 1, the floor heating panel 8 and the peripheral panel 9 obtained by the above manufacturing process were used to lay and lay the floor base 6 as described below.

1. 12 floor heating panels (laying rate: 67
%) Was laid on the floor substrate with an adhesive.

[0110] 2. Peripheral panels were laid around the laid floor heating panels.

3. A hot water pipe made of cross-linked polyethylene (inner diameter 4 mm, outer diameter 6 mm) was laid in the groove of the laid floor heating panel.

4. Aluminum tape (width 300 mm, thickness 0.2 mm) was laid on the entire surface of the floor heating panel.

[0113] 5. High-density fiberboard (HDF, length x width x thickness = 900 x 145 x 4 mm, groove shape: U-shaped) with veneer attached on both sides and grooved parallel to the short side direction on one side , Groove width × depth × interval = 1 × 2 × 10 mm) as floor finishing material 15 and was laid on the entire surface of the floor heating panel and the peripheral panel.

When laying, double-sided tape (width × thickness = 50 × 0.1 mm) was used and floor finishing materials 15 and 15 were used.
The double-sided tape was adhered to the panel so that the double-sided tape came to the abutting part of the body, and the floor finishing material 15 was laid.

Further, the second embodiment is the same as the first embodiment except that the order of the “laying of the peripheral panel” of 2 and the “laying of the hot water pipe” of 3 is changed in the procedure of the first embodiment. I went to.

Further, in Comparative Example 1, a plywood (length × width × thickness = 1810) was used as the peripheral panel in Example 1.
X 303 x 12 mm), except that the procedure was the same as in Example 1.

In Comparative Example 2, plywood (length × width × thickness = 1810) was used as the peripheral panel in Example 2.
× 303 × 12 mm), except that the procedure was the same as in Example 2.

In Comparative Example 3, as the floor heating panel, a floor heating panel with a directly attached small joist (length × width × thickness = 2380 × 1470 ×) was previously provided with a hot water pipe and a metal thin film 10. 12mm) 2 sheets (laying rate: 72)
%) Was applied as described below on the floor substrate 6 using a polypropylene foam as the peripheral panel.

[0119] 1. In order to remove irregularities (unevenness) of the floor substrate 6, a self-leveling material was cast on the floor substrate.

[0120] 2. The floor heating panel was laid on the self-leveling material with an adhesive and concrete nails.

3. Peripheral panels were laid with an adhesive around the laid floor heating panels.

4. An adhesive and a floor finishing material 15 are fixed to a small joist installed on the floor heating panel by nailing on the floor heating panel portion, and a floor heating panel is fixed to the peripheral panel portion by an adhesive. By doing so, the floor finishing material 15 was laid.

Comparative Example 4 In Comparative Example 3, the self-leveling material was not cast.

The floor heating panels and the peripheral panels constructed by the methods of Examples 1 and 2 and Comparative Examples 1 to 4 were evaluated by measuring the number of persons and time required for construction.

When the construction was performed as in Examples 1 and 2 using the floor heating panel and the peripheral panel of the present invention 1,
The construction time is 150 minutes (2 hours 30 minutes), which is a very short floor heating total construction time.

On the other hand, in Comparative Examples 1 and 2 in which plywood was used as the peripheral panel, since the peripheral panel was a large plywood, it took time to process corners, exit angles, and entrance angles of the room. It took more than 5 hours to complete the floor heating.
Furthermore, since the uneven absorption layer was not laminated on the back surface of the plywood, a step was generated in the floor finishing materials 15, 15 on the upper surface of the peripheral panel.

Further, as in Comparative Example 3, the floor heating panel conventionally used must be provided with a self-leveling material before the panel is provided.

The self-leveling material can be applied in about 30 minutes by two people, but it takes at least about one week until the self-leveling material hardens (cures). In the meantime, not only floor heating panels but also any indoor work such as wall materials and fittings will not be possible.

Further, when the floor finishing material 15 is constructed, the floor material must be nailed to the small joist on the floor heating panel. Approximately twice as long. Therefore, compared to the first and second embodiments, the total floor heating construction time is longer.

As described above, since the curing of the self-leveling material takes one week or more, when the curing time is taken into consideration, the total floor heating heating time is shorter than that of Examples 1 and 2. And the construction time is enormously large.

Further, in Comparative Example 3, in order to reduce the time, Comparative Example 4 in which the self-leveling material was not placed was omitted.
Since the size of the floor heating panel is large and the unevenness absorbing layer 13 is not laminated on the back surface of the floor heating panel 8, the unevenness (unevenness) of the floor base 6 is not absorbed, and the floor heating panel itself Could not be constructed.

As described above, since the floor heating panel 8 can be manufactured using the peripheral panel 9, the floor heating panel 8 can be manufactured.
The peripheral panel 9 can be manufactured in the flow of the manufacturing process. Therefore, the floor heating panel and the peripheral panel can be manufactured using the same material and the same manufacturing line, and the manufacturing cost can be reduced.

Further, the total construction time of the floor heating equipment can be reduced.

[0134]

As described above, according to the first aspect of the present invention, since the floor heating panel and the peripheral panel are formed similarly, the same heating material can be used on the same production line. Can be manufactured.

Therefore, an increase in manufacturing cost can be suppressed.

According to the second aspect, an increase in the number of construction steps is suppressed, and the construction time can be shortened.

[0137] According to the third aspect,
The increase in the number of construction steps is suppressed, and the construction time can be reduced.

Further, according to the fourth aspect, a practically useful effect that a floor portion using a floor heating panel having good appearance quality can be obtained in a short time can be exhibited.

[Brief description of the drawings]

FIG. 1 shows a floor heating panel according to a first embodiment of the present invention, a peripheral panel laid in a non-floor heating section around a floor heating section, and a floor heating material laying method using the panels. It is sectional drawing explaining the structure of a floor heating panel before.

FIG. 2 shows a floor heating panel according to the first embodiment, a peripheral panel laid in a non-floor heating section around the floor heating section, and a floor heating construction method using each of the panels. It is sectional drawing explaining the structure of a panel.

FIG. 3 is a diagram showing a floor heating panel, a peripheral panel laid in a non-floor heating section around a floor heating section, and a floor heating method using each of the panels according to the first embodiment. It is sectional drawing explaining the structure of a heating part.

FIG. 4 shows a floor heating panel according to the first embodiment, a peripheral panel laid in a non-floor heating section around the floor heating section, and a floor heating construction method using each of the panels. It is sectional drawing explaining the structure of a floor heating part.

FIG. 5 is a room in which floor heating is performed by the floor heating panel, the peripheral panel laid in the non-floor heating section around the floor heating section, and the floor heating method using each of the panels. FIG. 3 is a schematic view of a floor portion of the vehicle viewed from above.

FIG. 6 is a top view of a mold used for manufacturing the floor heating panel of the first embodiment.

FIG. 7 is a side view of a mold used for manufacturing the floor heating panel of the first embodiment.

FIG. 8 is a top view of a hard resin foam used for the floor heating panel of the first embodiment.

FIG. 9 is a plan view of a floor section illustrating a configuration of a floor heating panel and a peripheral panel laid in a non-floor heating section around a floor heating section in a conventional example.

[Explanation of symbols]

 5 Floor 6 Floor underfloor 7 Floor heating 7a Non-floor heating 8 Floor heating panel 9 Peripheral panel 11 Hot water pipe (heating means) 12 Hard resin foam 12c Groove 13 Non-land absorption layer

Claims (4)

[Claims] 1. A floor heating panel laid on a floor heating part to form a floor heating part and a peripheral panel laid around the floor heating part, wherein both panels are made of hard resin foam. And a non-absorbent absorption layer are provided in layers. Of these, in the floor heating panel, a groove for burying heating means is formed in the hard resin foam layer, and at the same time, a floor excluding the groove is provided. The heating panel and the peripheral panel have the same material, shape, dimensions, laminated configuration, and thickness, all having the same configuration, and are characterized by a floor heating panel and a peripheral panel laid on a non-floor heating section around the floor heating section. . 2. A plurality of floor heating panels are laid on a floor base, a plurality of peripheral panels are laid around the floor heating panel, and a heating means is buried in a groove of the floor heating panel.
The floor heating panel and floor heating according to claim 1, wherein a metal thin film is laminated on the upper surface of the floor heating panel, and a hard plate is laminated on the peripheral panel and the floor heating panel. Construction method using peripheral panels laid in the non-floor heating area around the area. 3. A plurality of floor heating panels are laid on a floor base, and heating means is buried in a groove of the floor heating panel.
Laying a plurality of peripheral panels around the floor heating panel,
The floor heating panel and floor heating according to claim 1, wherein a metal thin film is laminated on the upper surface of the floor heating panel, and a hard plate is laminated on the peripheral panel and the floor heating panel. Construction method using peripheral panels laid in the non-floor heating area around the area. 4. A method according to claim 2, wherein a surface decorative material is laminated on the hard plate.