JP2002029059A - Ink jet printing head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize facilitating and reducing costs of a manufacturing process for an ink jet printing head and also prevent product failures because of separation of a wiring pattern or the like in a post process. SOLUTION: A member 1 including discharge channels c and a member 2 including ink supply paths 2a and wiring pattern formation parts 2b are formed separately. A head base 3 is formed first by bonding the members 1 and 2. The member 1 is formed by attaching a lower member 1a machined by linear dicing and an upper member 1b formed by molding or the like. The member 2 is formed by molding or the like with the use of a general-purpose ceramics or the like. At this time, the wiring pattern formation parts 2b are formed in the shape of recesses to one face of a rectangular parallelopiped and moreover, grooves for constituting the ink supply paths 2 are formed to a bond face to the member 1. Subsequently, after an entire face of the head base 3 is plated by electroless plating, the face where the wiring pattern is formed and a surface of an ink discharge face (excluding the recesses) are polished to separate the plated part for each discharge channel, and electrodes in the discharge channels c and the wiring pattern connected to the electrodes are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink-jet printhead used in an ink-jet printer or the like and a method of manufacturing the same. More specifically, a plurality of discharge channels are formed by partition walls made of a piezoelectric member, and an electric field is applied to the partition walls. The present invention also relates to an ink jet print head for discharging ink by pressurizing the ink in the discharge channel by shearing and deforming the partition walls, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In a print head of an ink-jet printer, a plate-shaped piezoelectric member polarized in a thickness direction is formed with grooves, drive electrodes are formed on side walls of the plate-shaped piezoelectric member, and ink is formed by utilizing the shear deformation of the plate-shaped piezoelectric member. Is configured to discharge the ink. As a method of manufacturing such a print head, for example, a method described in Japanese Patent Application Laid-Open No. 7-276624 is known. In the method of manufacturing a print head described in the above publication, as shown in FIG. 6, first, a substrate 20 is formed by applying a resin-based low-rigid member 22 to one surface of a plate-shaped piezoelectric member 21 (a). Next, low rigidity member 2
Dicing is performed from the surface of the substrate 2 to a depth exceeding the bonding surface between the low-rigidity member 22 and the piezoelectric member 21 from the end to the middle of the substrate 20, and a plurality of grooves 23 are formed at predetermined intervals. (B). As a result, a side wall 24 having an upper side wall 24a made of the low-rigidity member 22 and a lower side wall 24b made of the piezoelectric member 21 is formed. Next, cleaning, catalyzing, and accelerating processes are performed as pretreatments for electroless plating. Thereby, the side wall 24
And the like, Pd serving as a catalyst nucleus is formed on the surface.

Subsequently, a mask is applied to the surface of the low-rigidity member 22 except for a portion where a wiring pattern is formed. That is, as shown in FIG. 6C, a dry film 25 is attached to the surface of the low-rigidity member 22, and
As shown in FIG. 6 (d), a resist mask 26 is placed thereon, and exposure and development are performed. As a result, FIG.
As shown in (e), a resist film 27 of a dry film 25 is formed on the surface of the low-rigid member 22 except for the portion where the wiring pattern is formed. As a result, the metalized Pd is exposed on the wiring pattern forming portion of the low rigidity member 22 and the inner surface of the groove 23. Next, the substrate 20 having been subjected to the above treatment is immersed in a plating solution to perform electroless plating. As a result, plating is formed using the metallized Pd as a catalyst nucleus, and electrodes 28 are formed on the surface on the side wall 24 side of the groove 23 and the bottom surface of the groove 23 as shown in FIG. On the surface of 22, a wiring pattern 29 following the electrode 28 is formed. Subsequently, as shown in FIG. 6G, the resist film 27 is peeled off from the surface of the low-rigidity member 22. Then, as shown in FIG. 6 (h), the top plate 30 is adhered to the surface of the low-rigidity member 22, and the nozzle plate 32 in which the ink discharge ports 31 are formed is fixed to the end face between the piezoelectric member 21 and the top plate 30. After that, an ink supply pipe 33 for supplying ink to each groove 23 from an ink supply unit (not shown) is attached to the top plate 30 to complete a print head.

[0004]

However, in the above-mentioned conventional method for manufacturing a print head, first, the piezoelectric member 21 is not provided.
And a low-rigidity member 22 to form a substrate 20 that constitutes the entire print head, and in order to form a discharge channel in this substrate, all shape processing including processing of the groove 23 must be performed by dicing. There is a problem that it is difficult to cope with a complicated shape, and the cost is increased due to an increase in the amount of expensive piezoelectric material used. Also, since the wiring pattern is formed by plating on a flat surface with masking,
Not only is the process complicated, but the wiring pattern portion has a convex shape protruding from a flat surface, and the wiring pattern may be peeled off in a later process. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to simplify the manufacturing process of an ink-jet printhead, reduce costs, and furthermore, product defects due to peeling of a wiring pattern in a later process. Is to prevent.

[0005]

In order to achieve the above object, the present invention is directed to a plurality of rectangular tubular members substantially perpendicular to an ink ejection surface, which is one surface of a substantially rectangular parallelepiped head substrate, and separating sidewalls. At least a part of which is constituted by a piezoelectric member and electrodes are formed on their side walls, and an ink supply formed so as to communicate from the upper surface of the head base material adjacent to the ink ejection surface to the ejection channel. And a wiring pattern that conducts from the top surface of the head base material to the electrode via the ink supply path. By applying an electric field to the electrode via the wiring pattern, the side wall is subjected to shear deformation. In the method of manufacturing an ink jet print head for discharging ink in the discharge channel from the ink discharge surface, at least the piezoelectric member A first member including a side wall portion that, the second comprising forming at least part of the wiring pattern
After the members are individually formed, the first member and the second member are formed.
And a method for manufacturing an ink jet print head characterized by being bonded to the above member. With such a configuration, it is possible to process only the grooves of the piezoelectric member of the first member by linear dicing, and to process the second member by molding or sandblasting using, for example, general-purpose ceramics. Therefore, a complicated concave shape such as an ink supply path can be easily formed. Further, since the piezoelectric member may be used only for the discharge channel portion, the expensive piezoelectric member is not wasted and the cost can be reduced.

Here, the side wall portion other than the piezoelectric element constituting the discharge channel may constitute the first member as shown in FIG. 2 or the first member as shown in FIG. Although it may be formed integrally as a member of 2,
In the former case, the first member needs to be further divided into two parts, so that the latter can reduce the number of parts. Further, a portion of the second member on which the wiring pattern is formed on the upper surface of the head substrate is formed in a concave shape,
After bonding the first and second members, a plating layer is formed on the entire surface thereof, and the upper surface of the head substrate and the ink discharge surface are polished to separate the wirings separated for each discharge channel. If it is configured to form a pattern and the above-mentioned electrodes, it is possible to perform processing such as masking without performing
Electrodes and wiring patterns can be easily formed only by mechanical processing. In addition, since the wiring pattern is formed by plating, it is possible to form the wiring pattern more reliably on the edge portion and the like than by vapor deposition or the like. Further, in the ink jet print head manufactured by this, since the wiring pattern is formed in the concave groove, it is possible to prevent a problem that the wiring pattern is peeled off in a later process, for example, by being scratched by a part of the processing apparatus. .

In addition, if an electric circuit component for controlling ink ejection is mounted so as to be connected to the wiring pattern on the upper surface of the head substrate, the number of lead lines drawn from the print head can be reduced. , Cost can be reduced. In addition, except for the piezoelectric member portion of the first member and the second member, a material having a lower relative dielectric constant than the piezoelectric member, for example, a general-purpose ceramic,
If it is made of a machinable ceramic, plastic, or the like, for example, it is possible to reduce the capacitance at the partition wall portion of the ink supply unit, and it is possible to suppress unnecessary power consumption. The concave shape of the first member is
For example, by using sand blasting or molding, it is possible to easily form even a complicated shape.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments and examples of the present invention will be described below with reference to the accompanying drawings to facilitate understanding of the present invention. The following embodiments and examples are mere examples embodying the present invention, and do not limit the technical scope of the present invention.

(Embodiment 1) A method of manufacturing an ink jet print head according to Embodiment 1 will be described with reference to a flowchart shown in FIG. 1 and explanatory diagrams shown in FIGS. (1. Processing for Forming Head Base Material 3) As shown in FIG. 1, in the method for manufacturing an ink jet print head according to the first embodiment, a member 1 (an example of a first member) including a discharge channel c, A member 2 (an example of a second member) including the ink supply path 2a and the wiring pattern forming portion 2b is separately formed, and the head base material 3 is first formed by bonding them. Here, the member 1 is formed by bonding a lower member 1a and an upper member 1b having substantially the same shape. First, after attaching the lower member 1a to the general-purpose ceramic plate 1aa and the piezoelectric member 1ab as shown in FIG. 2A (S1), the lower member 1a is attached to the piezoelectric material 1ab as shown in FIG. 2B. For example, it is formed by performing groove processing by dicing (S2). The upper member 1b
Is formed in a substantially same shape as the lower member 1a by a general-purpose ceramic plate using, for example, molding, sand blasting or the like (S3). Of course, it may be formed using dicing as in the case of the lower member 1a.

Next, as shown in the right figure of FIG. 2 (c), the upper member 1b and the lower member 1a which are individually formed are bonded together with their grooves facing each other. Is completed (S4). The above member 2
Is formed, for example, using general-purpose ceramics by molding, sandblasting, or the like (S5). As shown in the left diagram of FIG. 2C, the member 2 is provided on one surface of the rectangular parallelepiped (the member 1).
Wiring pattern forming portion 2b
Are formed in a concave shape, and a groove forming an ink supply path 2a is formed on the bonding surface with the member 1 so as to connect the wiring pattern forming portion 2b and the discharge channel c of the member 1. In addition, the wiring pattern forming portion 2b
Are formed on both sides of the IC mounting portion 2c for mounting the driver IC 4. Subsequently, as shown in FIG. 2C, the member 1 and the member 2 formed as described above are respectively combined with the end face of the ejection channel c of the member 1 and the formation surface of the ink supply passage 2a of the member 2. And glue them together
The head substrate 3 is formed (S6). As described above, since the separately formed member 1 and member 2 are bonded to form the head base material 3, only the groove processing of the piezoelectric member 1ab of the member 1 is performed by linear dicing, and the member 2 is formed. For example, since it is possible to mold using general-purpose ceramics or process using sand blasting or the like, a complicated concave shape such as the ink supply path 2a or the wiring pattern forming portion 2b can be easily formed. Further, since the piezoelectric member is used only in the discharge channel portion, the expensive piezoelectric member is not wasted and the cost can be reduced.

(2. Process of forming electrodes and wiring patterns)
Subsequently, a plating process is performed on the entire surface of the head substrate 3 by electroless plating (S7). To briefly explain the plating process, first, as a pretreatment for electroless plating,
Performs cleaning, catalyzing, and accelerating processing. The cleaning is performed for the purpose of activating the plating surface and making the catalyst solution, the accelerator solution and the plating solution hydrophilic so as to easily enter the grooves and the like. The catalizing treatment is performed for the purpose of immersing the member to be treated in a catalyst liquid as a pretreatment liquid composed of palladium chloride, stannous chloride, concentrated sulfuric acid and the like, and adsorbing a complex of Pd and Sn on the surface of each part. When the catalizing process is performed, the complex of Pd and Sn is adsorbed on the surface of each part. The accelerating process is performed to catalyze the complex adsorbed by the catalizing process, and the complex adsorbed on the surface of each part becomes metalized Pd as a catalyst core. Next, the member to be processed (head base material 3) that has been subjected to the above processing is immersed in a plating solution to perform electroless plating. The plating solution is
It comprises a main component consisting of a metal salt and a reducing agent, and auxiliary components consisting of a pH adjuster, a buffer, a complexing agent, an accelerator, a stabilizer, an improver and the like. When the member to be processed (the head substrate 3) is immersed in the plating solution, plating is generated on the entire surface including the groove portion using the metallized Pd as a catalyst nucleus.

When the plating process is performed on the surface of the head substrate 3 as described above, subsequently, as shown in FIG. 3, the upper surface 3a of the head substrate 3 (the wiring pattern forming portion 2b
And the ink discharge surface 3b (the surface on which the holes of the discharge channels c are formed) are wrapped, and the plating on the surface (excluding the concave portions) is removed (S8). It is not always necessary to perform a lapping process on other surfaces. As a result, the plating portion is separated for each discharge channel, and an electrode in the discharge channel c and a wiring pattern connected thereto are formed. As described above, the wiring pattern forming portion 2b
By forming a concave shape, it is possible to easily form electrodes and wiring patterns only by mechanical processing without performing processing such as masking. Further, since the wiring pattern formed on the upper surface 3a of the head base material 3 is formed in the wiring pattern forming portion 2b formed in a concave shape,
In the subsequent process, for example, a problem that the wiring pattern is peeled off by being scratched by a part of the processing apparatus can be prevented.

(3. Other Forming Process) When the electrodes and the wiring patterns are formed as described above, as shown in FIG. 3, the IC mounting portion 2c is connected to the wiring patterns on both sides thereof. Driver I for controlling ink ejection
C4 (an example of an electric circuit component) is attached (S9). The connection of the terminals of the driver IC 4 to the wiring pattern may be performed using low-temperature solder or conductive adhesive. still,
Although the number of wiring patterns on both sides of the driver IC 4 is the same in FIG. 2C, the number of wiring patterns on the upstream side (opposite side of the ejection channel) is reduced by mounting the driver IC 4 on the downstream side. It is possible to reduce it. As a result, the number of lead lines drawn from the print head can be reduced, and the cost can be reduced. Next, the ink flow path 5 connected to the ink tank is connected to the ink supply path 2a (S
10). Naturally, it is necessary to seal the concave portion of the wiring pattern forming portion 2b connected to the ink supply path 2a so that the ink does not leak. Finally, the orifice plate 6 having the ink discharge ports 6a is bonded to the ink discharge surface 3b of the head base material 3 (S11).

As described above, according to the method of manufacturing an ink jet print head according to the present embodiment, the separately formed member 1 and member 2 are bonded to each other to form the head base material 3.
Since only the groove processing of the piezoelectric member 1ab portion of the member 1 is performed by linear dicing, the member 2 can be processed by molding or sandblasting using, for example, general-purpose ceramics. A complicated concave shape such as the ink supply path 2a or the wiring pattern forming portion 2b can be easily formed. Further, since the piezoelectric member is used only in the discharge channel portion, the expensive piezoelectric member is not wasted and the cost can be reduced. Further, by forming the wiring pattern forming portion 2b in a concave shape, it is possible to easily form electrodes and wiring patterns only by mechanical processing without performing processing such as masking. In addition, since the wiring pattern is formed by plating, it is possible to form the wiring pattern more reliably on the edge portion and the like than by vapor deposition or the like. In addition, since the ink jet print head manufactured in this manner is formed in the wiring pattern forming part 2b in which the wiring pattern is formed in a concave shape, the wiring pattern is peeled off in a later process, for example, by being scratched by a part of the processing apparatus. Such troubles can be prevented. In addition, since the driver IC 4 is mounted on the ink jet print head, the number of wiring patterns on the upstream side (opposite side of the ejection channel) of the driver IC 4 can be reduced as compared with the number on the downstream side, and the driver IC 4 is pulled out from the print head. The number of lead lines to be used can be reduced, and the cost can be reduced.

(Embodiment 2) In Embodiment 1 described above,
The head substrate 2 was formed by dividing the member 1 and the member 2 between the ejection channel c and the ink supply path 2a, separately creating and bonding the members. However, in such a division method, it is necessary to separately form the lower member 1a and the upper member 1b for the above-mentioned member 1 and bond them together, which increases the number of parts. Here, since the same material as the member 2 such as general-purpose ceramics can be used for the upper member 1b, the upper member 1b may be formed integrally with the member 2 (FIG. 5).
(Refer to the member 2 'in (b)), the number of members can be reduced by one, and cost reduction and simplification of the assembling process can be expected. The manufacturing process according to the second embodiment shown in FIG. 4 is different from the above-described first embodiment only in the portion of the head base material 3 forming process. That is, the member 1 '(an example of the first member) is first bonded to the general-purpose ceramic plate 1aa and the piezoelectric member 1ab as shown in FIG.
1 ') and the piezoelectric material 1a as shown in FIG.
The groove b is formed by, for example, performing groove processing by dicing (S2 '). The member 2 '(an example of a second member) is formed by molding, sandblasting, or the like using, for example, general-purpose ceramics as shown in the left diagram of FIG. 5B (S5'). Then, as shown in FIG. 5 (b), the member 1 'and the member 2' formed respectively as described above are aligned with the grooves constituting the discharge channels of both members, and the ink supply of the member 2 'is further performed. The head substrate 3 is formed by bonding so that the groove portion of the path 2a is aligned with the end surface of the member 1 '(S6'). Subsequent processing is the same as in the first embodiment, and a description thereof will not be repeated. As described above, according to the manufacturing method according to the second embodiment, in addition to the same effects as in the first embodiment, it is possible to reduce the number of members by one, and to reduce the cost and the assembly process. Can be expected.

(Other Modifications) In the above example, general-purpose ceramics are used as a material other than the piezoelectric member, but other materials such as so-called machinable ceramics and plastics can also be used. If the relative permittivity of these materials is lower than that of the piezoelectric material, for example, the capacitance at the partition wall of the ink supply unit 2a can be reduced, and unnecessary power consumption can be reduced. .

[0017]

As described above, according to the present invention, at least a part of the side wall formed in a plurality of rectangular tubes substantially perpendicular to the ink ejection surface which is one surface of the substantially rectangular parallelepiped head base material is provided. And an ink supply passage formed from the upper surface of the head base material adjacent to the ink ejection surface to communicate with the ejection channel; A wiring pattern that conducts from the upper surface of the material to the electrode via the ink supply path, and applies an electric field to the electrode via the wiring pattern to shear-deform the sidewall, thereby forming an ink in the discharge channel. A method for manufacturing an ink jet print head for discharging ink from the ink discharge surface, the method including at least a side wall portion made of the piezoelectric member. And a second member including at least a portion where the wiring pattern is formed, and then bonding the first member and the second member to each other. Since it is configured as a manufacturing method, only the groove processing of the piezoelectric member of the first member is performed by linear dicing, and the second member is processed by molding or sandblasting using, for example, general-purpose ceramics. Is possible,
A complicated concave shape such as an ink supply path can be easily formed. Further, since the piezoelectric member may be used only for the discharge channel portion, the expensive piezoelectric member is not wasted and the cost can be reduced.

Here, the side wall portion other than the piezoelectric element constituting the discharge channel may constitute the first member as shown in FIG. 2 or the first member as shown in FIG. Although it may be formed integrally as a member of 2,
In the former case, the first member needs to be further divided into two parts, so that the latter can reduce the number of parts. Further, a portion of the second member on which the wiring pattern is formed on the upper surface of the head substrate is formed in a concave shape,
After bonding the first and second members, a plating layer is formed on the entire surface thereof, and the upper surface of the head substrate and the ink discharge surface are polished to separate the wirings separated for each discharge channel. If it is configured to form a pattern and the above-mentioned electrodes, it is possible to perform processing such as masking without performing
Electrodes and wiring patterns can be easily formed only by mechanical processing. In addition, since the wiring pattern is formed by plating, it is possible to form the wiring pattern more reliably on the edge portion and the like than by vapor deposition or the like. Further, in the ink jet print head manufactured by this, since the wiring pattern is formed in the concave groove, it is possible to prevent a problem that the wiring pattern is peeled off in a later process, for example, by being scratched by a part of the processing apparatus. .

Further, if an electric circuit component for controlling ink ejection is mounted so as to be connected to the wiring pattern on the upper surface of the head substrate, the number of lead lines drawn from the print head can be reduced. , Cost can be reduced. In addition, except for the piezoelectric member portion of the first member and the second member, a material having a lower relative dielectric constant than the piezoelectric member, for example, a general-purpose ceramic,
If it is made of a machinable ceramic, plastic, or the like, for example, it is possible to reduce the capacitance at the partition wall portion of the ink supply unit, and it is possible to suppress unnecessary power consumption. The concave shape of the first member is
For example, by using sand blasting or molding, it is possible to easily form even a complicated shape.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating a method for manufacturing an ink jet print head according to Embodiment 1 of the present invention.

FIG. 2 is an explanatory diagram of a formation processing portion of a head base material 3 in the manufacturing method according to the first embodiment.

FIG. 3 is an explanatory view after an electrode and wiring pattern forming process in the manufacturing method according to the first embodiment;

FIG. 4 is a flowchart illustrating a method for manufacturing an ink jet print head according to a second embodiment of the present invention.

FIG. 5 is an explanatory diagram of a portion of the head substrate 3 in a manufacturing method according to the second embodiment.

FIG. 6 is an explanatory diagram of a method for manufacturing an ink jet print head according to the related art.

[Explanation of symbols]

1, 1 '... member (an example of a first member) 2, 2' ... member (an example of a second member) 1b ... upper member (corresponding to a side wall portion other than the piezoelectric element constituting the discharge channel) 1ab ... piezoelectric Member 2a: Ink supply path 2b: Wiring pattern forming part 3: Head substrate 3a: Upper surface of head substrate 3b: Ink ejection surface 4: Driver IC (an example of an electric circuit component) c: Ejection channel

Claims (12)

[Claims] 1. A plurality of rectangular tubes substantially perpendicular to an ink ejection surface, which is one surface of a substantially rectangular parallelepiped head substrate, wherein at least a part of a side wall separating the side walls is formed of a piezoelectric member and electrodes are formed on the side walls. A discharge channel formed, an ink supply path formed to communicate from the upper surface of the head base material adjacent to the ink discharge surface to the discharge channel, and an ink supply path from the upper surface of the head base material via the ink supply path. An ink jet printing method, comprising: a wiring pattern electrically connected to the electrode; and applying an electric field to the electrode through the wiring pattern to cause the side wall to be sheared to discharge ink in the discharge channel from the ink discharge surface. In the method of manufacturing a head, a first member including at least a side wall portion made of the piezoelectric member and The second including the turn forming part
After the members are individually formed, the first member and the second member are formed.
A method for manufacturing an ink-jet printhead, comprising bonding a member of (1). 2. The method for manufacturing an ink jet print head according to claim 1, wherein a side wall portion other than said piezoelectric element constituting said discharge channel constitutes said first member. 3. The method according to claim 1, wherein a side wall other than the piezoelectric element constituting the discharge channel is integrally formed as the second member. 4. A portion of the second member on which the wiring pattern is formed on the upper surface of the head substrate is formed in a concave shape, and after bonding the first and second members, a plating layer is formed on the entire surface thereof. 4. The electrode according to claim 1, further comprising polishing the upper surface of the head substrate and the ink ejection surface to form the wiring pattern and the electrode separated for each ejection channel. A method for manufacturing an ink jet print head. 5. The method for manufacturing an ink jet print head according to claim 1, wherein an electric circuit component for controlling ink ejection is mounted so as to be connected to the wiring pattern on the upper surface of the head base material. 6. The piezoelectric member according to claim 1, wherein a portion other than the piezoelectric member of the first member and the second member is made of a material having a lower dielectric constant than the piezoelectric member. Of manufacturing an inkjet print head. 7. The method according to claim 6, wherein the material having a lower relative dielectric constant than the piezoelectric member is ceramic. 8. The method according to claim 6, wherein the material having a lower relative dielectric constant than the piezoelectric member is plastic. 9. The method according to claim 1, wherein the concave shape of the first member is formed by sandblasting. 10. The method according to claim 1, wherein the concave shape of the first member is formed by molding. 11. A plurality of rectangular tubes substantially perpendicular to an ink ejection surface, which is one surface of a substantially rectangular parallelepiped head base material, at least a part of a side wall separating each other is formed of a piezoelectric member, and electrodes are formed on the side walls. A discharge channel formed, an ink supply path formed to communicate from the upper surface of the head base material adjacent to the ink discharge surface to the discharge channel, and an ink supply path from the upper surface of the head base material via the ink supply path. An ink jet printing method, comprising: a wiring pattern electrically connected to the electrode; and applying an electric field to the electrode through the wiring pattern to cause the side wall to be sheared to discharge ink in the discharge channel from the ink discharge surface. In the head, a portion of the second member on which the wiring pattern is formed on the upper surface of the head substrate is formed in a concave shape. An ink jet print head, comprising: 12. The ink jet print head according to claim 11, further comprising an electric circuit component for controlling ink ejection so as to be connected to the wiring pattern on the upper surface of the head base material.