JP2002026437A - Substrate for optical inspection, optical inspection method using it, and optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for optical inspection which can be applied to a high-speed module, an optical inspection method using the substrate, and an optical module loaded with an optical element. SOLUTION: The substrate P1 for optical inspection is provided with a substrate 11 having a plurality of optical element mounting areas on which a light emitting element and a light receiving element which receives the light emitted from the light emitting element are arranged, insulator layers 12 and 13 formed in a plurality of areas on the substrate 11, a signal line 15 and grounding conductor 16 connected to the electrode terminal of the light emitting element, and another signal line 17 and grounding conductor 1 connected to the electrode terminal of the light receiving element. The signal lines 15 and 17 of the light emitting and receiving elements are respectively laid on the separately formed insulator layers 12 and 13 and the grounding conductor of at least one of the light emitting and receiving elements is laid on one or both sides of the element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical mounting board for mounting optical components such as an optical fiber and an optical element (light emitting element and light receiving element) on a substrate and optically coupling these optical parts. The present invention relates to an optical inspection substrate for performing an inspection, an optical inspection method using the same, and an optical module on which an optical element is mounted.

[0002]

BACKGROUND OF THE INVENTION In recent years, with the aim of reducing the cost of assembling an optical module in which optical components are mounted on a substrate, the substrate made of single crystal silicon (generally,
Attention has been paid to a passive alignment technique using a silicon platform (hereinafter referred to as a silicon platform) as an optical mounting substrate. According to this technique, an optical fiber and an optical element such as a light emitting element such as a laser diode and a light receiving element such as a photodiode are mounted on a V-groove or a conductor pattern formed on the same substrate, resulting in an uncontrollable state. The optical module can be assembled with the core.

[0003] Such an optical mounting substrate is manufactured collectively in a state where a plurality of sets of V-grooves for mounting optical fibers and conductor patterns for mounting optical elements are arranged on the same wafer.
In the final step, the substrate is divided into individual substrates and formed into chips as shown in FIG.

[0004] Producing a large number of optical mounting substrates from a single wafer is extremely advantageous also in terms of the production cost of the optical mounting substrate, and is promising in terms of reducing the cost of an optical module. In addition, using a silicon wafer has the advantage that the cost can be remarkably reduced during mass production because the technology for mass production of semiconductor devices can be used.

[0005] However, even if the mounting substrate is manufactured in units of wafers, it is extremely complicated to mount the optical elements on the mounting substrate one by one and inspect each element, and the cost increases. It is thought to be the cause.

Therefore, similar to wafer burn-in employed in the semiconductor field, visual alignment for mounting a large number of optical elements while observing a positioning marker in a wafer state, and self-alignment of solder, etc. After mounting a plurality of optical elements, it is highly desirable to be able to detect an initial failure in a mounting process including a failure of the optical element itself at a wafer level.

In order to realize the above inspection, at least the following problems must be overcome.

1) As shown in FIG. 9, the substrate 8 of each chip
In order to inspect the initial failure of the light emitting element and the light receiving element for monitoring the light emitting element disposed in the optical element 1, it is necessary to measure not only the electrical characteristics of these optical elements but also the light emitting characteristics and light receiving characteristics. In the optical component mounting board J, it is difficult to measure a light detector for inspecting a light emitting element and a light source for inspecting a light receiving element. In FIG. 9, reference numerals 85 and 86 denote conductive wires for driving light emitting elements, 87 and 88 denote conductive wires for driving light receiving elements, 84 denotes a V-groove for mounting an optical fiber, and 89 denotes a light emitting element. 90 is a solder pattern for mounting the light receiving element.

2) As in the case of a wafer burn-in device used in the semiconductor field, if electrical connection is to be made to all the electrodes, not only a large number of contact terminals are required, but also
A very expensive contactor (probe card) for connecting these at the same time is required. In particular, since the optical elements are mounted on a hybrid (separate from the substrate), it is difficult to make the above-mentioned electrical connection without damaging them.

3) In order to avoid the above problem 2), it is conceivable that the wiring is routed and probing is performed at the edge of the wafer. However, an intersection is generated in the wiring and the structure becomes complicated.

In view of the above problems, the inventors of the present invention can easily perform burn-in on a wafer in which optical elements are mounted collectively in a hybrid manner, and quickly and reliably detect defects in the optical elements themselves and defects in mounting the optical elements. A testable burn-in substrate and a burn-in method using the same have been proposed (see Japanese Patent Application No. 11-192049). An object of the present invention is to provide an optical inspection substrate applicable to a high-speed module, an optical inspection method using the same, and an optical module provided with an optical element.

[0012]

According to the present invention, there is provided an optical inspection substrate comprising: a substrate having a plurality of optical element mounting regions in which a light emitting element and a light receiving element for receiving light emitted from the light emitting element are provided;
An insulator layer formed in a plurality of regions on the substrate; a signal line and a ground line connected to electrode terminals of the light emitting element in each of the optical element mounting regions; and an electrode terminal of a light receiving element in each of the optical element mounting regions. A signal line and a ground line connected to the light-emitting element, and the signal line of the light-emitting element and the signal line of the light-receiving element are disposed on separate insulator layers, respectively. A ground line of at least one of the light receiving elements is provided on one or both sides of a signal line of the optical element.

A substrate having a plurality of optical element mounting areas on which a light emitting element and a light receiving element for receiving light emitted from the light emitting element are provided; an insulating layer formed in a plurality of areas on the substrate; A signal line and a ground line connected to an electrode terminal of a light emitting element provided in each of the optical element mounting areas; and a signal line connected to an electrode terminal of a light receiving element provided in each of the optical element mounting areas. And a ground line, wherein the signal line of the light emitting element and the signal line of the light receiving element are provided on the separated insulator layers, and at least one of the light emitting element and the light receiving element. The ground line of the optical element may be disposed so as to face the signal line of the optical element via an insulator layer.

In the optical inspection method of the present invention, the step of preparing any one of the optical inspection substrates, the step of arranging a light emitting element and a light receiving element in each optical element mounting area of the optical inspection substrate, Heating the optical inspection substrate on which the light emitting element and the light receiving element are disposed to a predetermined temperature, and emitting light in each of the optical element mounting areas while the optical inspection substrate is heated at the predetermined temperature. Driving the element and the light receiving element and measuring the amount of light emitted from the light emitting element by the light receiving element.

An optical module according to the present invention is characterized in that after performing the above-described optical inspection method, the optical inspection substrate is obtained by dividing the substrate for each optical element mounting area. Here, the light receiving element is characterized in that it is of an end face light receiving type.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings. Note that the same components are denoted by the same reference numerals and description thereof may be omitted.

[Optical Inspection Substrate and Optical Inspection Method] FIG. 1 is a schematic plan view of a burn-in substrate 1 which is an optical inspection substrate. A predetermined plane orientation (for example, (100) in Miller index)
(Wafer) W made of a material capable of anisotropic etching, such as silicon single crystal having a principal plane of (110) plane)
Above, a large number of optical component mounting substrate forming (chip forming) regions T indicated by broken lines are arranged in a plurality of rows and a plurality of columns.
Further, an insulator layer is formed in a plurality of regions on the wafer, and conductive lines are wired on these insulator layers.

The conductive lines (signal lines) connected to the upper electrode terminals of the light emitting elements such as semiconductor lasers arranged in the same column are shown as L1, L2, L3,. The conductive lines (signal lines) connected to the electrode terminals on the upper surface of the light receiving element such as the photodiode to be provided are P1, P2, P
Are shown as 3,... The terminals for energization in each signal line are L1a, L2a, L3a,.
a, P2a, P3a,...

In addition, a signal line connected to the light emitting element and a signal line connected to the light receiving element are provided on the separated insulator layers, respectively, and at least one of the light emitting element and the light receiving element The element ground line is disposed on one or both sides of the signal line of the optical element, or is arranged opposite to the signal line of the optical element via an insulating layer. In FIG. 1, ground lines are omitted for simplicity.

FIGS. 2A to 2C schematically show the state of wiring in a partial area of the burn-in board 1 (for four optical component mounting boards). FIG.
(A) illustrates the signal lines L2, L3 and the ground lines LG2, LG3 connected to the upper electrode terminals of the light emitting element on the uppermost surface of the burn-in substrate 1, and (b) illustrates the upper insulator layer Z.
H shows a schematic pattern, and (c) shows a burn-in substrate 1 disposed below the upper insulator layer ZH.
1 shows signal lines P2 and P3 which are arranged on a lower insulator layer formed on the lower surface and are connected to electrode terminals on the upper surface side of the light receiving element (the ground line in this example is the ground line of the light emitting element). And share it).

In FIG. 2, L indicates a region in which the light emitting element is provided (light emitting device mounting region), and P indicates a region in which the light receiving device is provided (light receiving device mounting region). A large number of P element mounting regions are formed on the burn-in substrate 1. A V-shaped groove 14 having a V-shaped cross section for arranging and fixing an optical fiber to be optically connected to the light emitting element is provided near the respective light emitting element mounting areas L by anisotropic etching of the wafer with an alkaline aqueous solution or the like. It is formed with.

As described above, for example, in the case of the light emitting elements located in the same column, the upper surface side electrode terminal of the light emitting element is connected to the signal lines L2, L3,. Are connected to the ground lines LG2, LG3,... Located on the right side of the light emitting element in the figure. Further, in the light receiving elements located in the same row, the signal lines P3, P4,... Located on the lower side of the light receiving element are connected from the upper electrode terminal of the light receiving element to the lower electrode terminal of the light receiving element. Through the openings in the upper insulator layer ZH, the ground lines PG3, PG4,.
・ Connect to The signal line connected to the light emitting element is an upper insulator layer ZH formed on the signal line connected to the light receiving element.
Since it is arranged above, the conductive line of the light emitting element does not come into contact with the conductive line of the light receiving element, and it is possible to energize each optical element, and furthermore, it is possible to wire easily.

Next, a burn-in method as an optical inspection method will be described for each process.

First, a burn-in substrate, which is an optical inspection substrate, is prepared. Then, on the wiring electrodes formed on the burn-in substrate, a plurality of light-emitting elements and a light-receiving element for monitoring the same are arranged by visual alignment or self-alignment of solder using gold tin solder or the like in a wafer state.・ Fix it.

Next, for performing an accelerated test, for example, 85
The substrate for burn-in is heated to about ° C. In this state, a current equal to or higher than the threshold value of the light emitting element is applied to the signal line L1 of the light emitting element in FIG.
Then, the light receiving elements in the same column are sequentially driven (operated) by the signal lines P3, P4,..., And the amount of light emitted from the light emitting element is sequentially measured (detected) by each light receiving element. In this manner, the driving (operation) of the light emitting element and the light receiving element in each column is sequentially performed.
Thus, the inspection based on the detected light amount of the light receiving element can be performed. In FIG. 1, a device for measuring the amount of light detected by the light receiving element is omitted for simplicity.

At this time, if there is a defect in the optical element itself of the light emitting element or the light receiving element, a defect in the mounting process thereof, or a defect such as disconnection, a predetermined light amount cannot be obtained. Also,
Even if a positional shift occurs between the light emitting element and the light receiving element when mounting the optical element, a predetermined amount of light cannot be obtained. This makes it possible to reliably and quickly detect a defect in mounting an optical element in an arbitrary optical component mounting substrate region T. Here, it is preferable to use an end-face light-receiving light-receiving element that has tighter tolerance (more sensitive to positional deviation) than the surface light-receiving light-receiving element. In the burn-in method of the present invention, by detecting the light amount of the light emitting element with the light receiving element,
In order to detect both optical element defects and displacement during mounting, it is preferable to detect the amount of light from the light emitting element on the directly facing light receiving surface.

As shown in FIG. 1, by arranging the conductive lines in a matrix, the defective optical component mounting substrate forming region T can be specified from the columns to be energized and the rows to be detected. In order to provide wiring in a matrix, for example, in a region where the signal line L3 intersects with the signal line P2, it is necessary that both are not short-circuited. In the present invention, as shown in FIG. 2, for example, a signal line connected to an electrode terminal of a light emitting element and a signal line connected to an electrode terminal of a light receiving element are formed on different insulator layers. There is no short circuit.

A line overlapping with each conductive line located at the outline of each optical component mounting substrate forming region T on the wafer W,
The individual chips obtained by cutting vertically and horizontally become, for example, an optical component mounting board P1 shown in FIG. 3, and as shown in FIG.
On this optical component mounting board P1, the light emitting element 30 is mounted on the solder pattern 19 of FIG. 3, the light receiving element 31 is mounted on the solder pattern 20, and the optical fiber 37 is mounted on the V-groove 14 to form the optical module M1. It is.

In the drawing, reference numeral 35 denotes a bonding wire for connecting the upper electrode terminal of the light emitting element 30 to the signal line 15, and 36 denotes a connection between the upper electrode terminal of the light receiving element 31 and the signal line 17. A bonding wire for connecting the ground line for the light emitting element and the light receiving element on the lower insulator layer to the ground line on one or both sides of the signal line on the upper insulator layer; It is a bonding wire. The bonding wire 36 may be formed of a conductor pattern. Thereby, the inductance of the ground line can be reduced, impedance mismatch can be avoided, and an optical module having a wiring structure with more excellent high-frequency characteristics can be obtained.

Further, according to the optical inspection method of the present invention, as shown in FIG.
1, Pa2,... Each optical component mounting substrate region T
For example, when the signal line L3 is energized, the burn-in may be performed by energizing the signal terminals Pa1, Pb1,... Of the individual light receiving elements.
Although the structure of the insulator layer is not restricted, the signal detection of the light receiving element is performed individually. Individual chips cut out from such a burn-in wafer become optical component mounting substrates P1 and P2 as shown in FIGS. 3 and 4, for example.
After the above inspection method is completed, the burn-in wafer is separated by dicing or the like into each optical element mounting area, so that optical elements and optical waveguides are mounted on these optical component mounting substrates P1 and P2. 5. Optical module M shown in FIG.
1, M2.

[Optical Component Mounting Substrate] Next, the wafer W
Of an optical component mounting substrate obtained by cutting the substrate into individual substrates (however, here, an optical element or the like is not mounted in order to clarify the state of a conductor pattern) will be described in detail. In addition, about the same member in FIG.3, FIG.4, for simplification, duplicate description and the display of a code | symbol may be omitted.

As shown in FIGS. 3A and 3B, the optical component mounting substrate P1 has, for example, a silicon single crystal of a main surface having a predetermined plane orientation (a (100) plane or the like represented by a Miller index). A lower insulating layer 13 having a thickness of about several thousand mm is formed on a surface of a substrate 11 made of, for example, thermal oxidation, and an electrode on which lower surface electrode terminals of a light emitting element and a light receiving element are mounted. Pads and solder patterns 19 and 20 are provided. These electrode pads are provided on the substrate 11 by KOH.
It is accurately positioned and formed with respect to a V-groove 14 for mounting an optical waveguide such as an optical fiber formed by anisotropic etching of an alkaline solution such as.

The electrode pad has, for example, an upper / lower layer made of Au / Pt / Ti or Au / Cr, a thickness of 0.3 to 2.0 μm, and a solder pattern of Au-Sn.
It is made of an alloy or the like.

On the lower insulator layer 13, a signal line 17 connected to the upper electrode terminal of the light receiving element by a bonding wire described later and a ground line 18 connected to the lower electrode terminal of the light receiving element are provided. Further, an opening 12a in the optical element mounting region, an opening 12b in the wire bonding region of the conductive line 16, an opening in the wire bonding region of the signal line 17, and openings 12c and 12 in the lead-out region are formed.
d, opening 12 of wire bonding region of ground line 18
e, and an upper insulator layer 12 made of silicon oxide, silicon nitride, or the like is formed to a thickness of 0.1 μm or more.

On the other hand, from the signal line 15 connected to the upper electrode terminal of the light emitting element by a bonding wire described later and the ground line 16 connected to the lower electrode terminal of the light emitting element,
A ground line 21 is formed through an opening 12b on the upper insulator layer and connected by a bonding wire described later.

Each of the conductive wires is made of the same material and thickness as the electrode pads.

Thus, according to the optical component mounting substrate P1, not only can the wafer burn-in be performed favorably, but also the parasitic capacitance of the wiring can be reduced by forming the upper insulator layer 12 thick. In addition, it is possible to provide an excellent optical component mounting board for an optical module which is excellent in thermal stability and suitable for high frequency. Further, by adopting a configuration in which the ground lines 21 are arranged on both sides of the signal electrode 15 (coplanar structure), a wiring structure more suitable for high frequencies is obtained.

Next, another embodiment of the optical component mounting board will be described. For example, FIG.
Like the optical component mounting board P2 shown in FIGS.
A signal line 15 connected to the upper electrode terminal of the light emitting element;
3, a ground line 16 connected to the lower electrode terminal is arranged to face the signal line with the upper insulator layer 12 interposed therebetween. However, in this case, as shown in FIG.
2 is provided with an opening 12f for leading out the ground line 16 (in this example, a common opening 12f is used also for the ground line 18 connected to the light receiving element).

Thus, also in the optical component mounting substrate P2, not only can the wafer burn-in be suitably performed, but also the parasitic capacitance of the wiring can be reduced by forming the upper insulating layer 12 thick. Moreover, it is possible to provide an excellent optical component mounting substrate for an optical module, which is excellent in thermal stability and suitable for high frequency. In addition, a ground line of at least one of the light-emitting element and the light-receiving element has a strip line structure in which the ground line is opposed to the signal line of the optical element via an insulating layer, so that a wiring structure suitable for high frequencies is provided. Becomes

[Optical Module] Next, an optical module obtained by dividing an optical inspection substrate (for example, a burn-in wafer) for each optical element mounting area after performing the optical inspection method will be described.

FIGS. 5 and 6 show the light emitting element 30 and the light receiving element 3 on the optical component mounting substrates P1 and P2 of FIGS. 3 and 4, respectively.
1. An optical module M1 having an optical fiber 37 mounted thereon.
M2 is shown.

In the optical modules M1 and M2,
As a light receiving element, an end face light receiving type optical element is adopted as a preferable example of such hybrid mounting. As shown in FIG. 8, a V-groove 61 is formed below the mounting of the light receiving element 31, and an inner slope 62 thereof is formed. A reflective surface may be formed by vapor-depositing a material such as gold on the substrate, and light emitted backward from the light emitting element 30 may be detected by using a surface light receiving type light receiving element.

The present invention is not limited to the above embodiment. At least one of the signal line and the ground line connected to each of the electrode terminals of the light emitting element and the light receiving element is formed on the same insulator layer as the insulator layer on which the signal line of the optical element is provided. The signal line is provided on one or both sides of the signal line (coplanar structure), or the signal line of the optical element is opposed to the signal line below the insulator layer where the signal line is disposed. With such a configuration (strip line structure), the configuration can be appropriately changed and implemented without departing from the gist of the present invention.

[0044]

As described in detail above, according to the present invention,
For example, since the signal line of the light emitting element and the signal line of the light receiving element are provided on different insulator layers, wiring of each signal line becomes easy. In addition, since it is possible to easily and reliably detect a high-speed optical element itself at the wafer level and a defect at the time of mounting the optical element, it is possible to obtain a highly reliable optical component mounting substrate or optical module from these. Can be.

Further, it is possible to arrange conductive lines (signal lines and ground lines) connected to the light emitting element and conductive lines connected to the light receiving element in a matrix shape crossing each other. It is possible to provide a very excellent optical inspection substrate and an optical inspection method using the same, which can be performed simply and quickly, and furthermore, the prober structure in the burn-in apparatus can be easily configured, and the workability of defect detection is also good. An optical module with excellent performance can be provided.

The ground line of at least one of the light emitting element and the light receiving element is provided on one or both sides of the signal line of the optical element, or the light of at least one of the light emitting element and the light receiving element is provided. Since the ground line of the element is arranged to face the signal line of the optical element via the insulator layer, a wiring structure having excellent high-frequency characteristics can be obtained, and an optical module having excellent performance can be provided.

Furthermore, in the present invention, the reliability of the light receiving element is improved by using an edge receiving light receiving element which is sensitive to displacement and monitors the light emitted from the light emitting element under more severe conditions than the surface light receiving type light receiving element. It is possible to provide an optical inspection substrate and an optical inspection method with high reliability, and it is also possible to provide an optical module with excellent reliability.

[Brief description of the drawings]

FIG. 1 is a plan view schematically illustrating an embodiment of an inspection substrate according to the present invention.

FIGS. 2A and 2B are plan views schematically showing a part of a test substrate according to the present invention, wherein FIG. 2A mainly shows conductive lines connected to a light emitting element, and FIG. 2B shows the conductive lines of FIG. Indicates an upper insulator layer provided thereon. (C) mainly shows a conductive line connected to the light receiving element, which is arranged below the upper insulator layer.

3A and 3B are diagrams schematically illustrating an embodiment of an optical component mounting board according to the present invention, wherein FIG. 3A is a plan view and FIG. 3B is a cross-sectional view taken along line A1-A1.

4A and 4B are diagrams schematically illustrating another embodiment of the optical component mounting board according to the present invention, wherein FIG. 4A is a plan view and FIG.
Is a sectional view taken along line A2-A2.

5 is a plan view schematically illustrating an embodiment of an optical module using the optical mounting board according to the present invention, and shows a plan view of the optical module with respect to the optical component mounting board shown in FIG. 3; .

6 is a plan view schematically illustrating an embodiment of an optical module using the optical mounting board according to the present invention, and shows a plan view of the optical module with respect to the optical component mounting board shown in FIG. 4; .

FIG. 7 is a plan view schematically illustrating another embodiment of the inspection substrate according to the present invention.

FIG. 8 shows another embodiment of the optical module using the optical mounting board according to the present invention.

9A and 9B are views for explaining the configuration of a conventional optical mounting substrate, wherein FIG. 9A is a plan view, and FIG. 9B is a cross-sectional view taken along line BB of FIG.

[Explanation of symbols]

 1: Optical inspection substrate 11: Substrate 12: Upper insulator layer 13: Lower insulator layer 14: V groove 15: Signal line (for light emitting element) 16: Ground line (for light emitting element) 17: (for light receiving element) Signal line 18: ground line (for light receiving element) 19, 20: solder pattern 21: (upper insulator layer for light emitting element) ground line 30: light emitting element 31: light receiving element 37: optical fiber (optical waveguide) L: Light emitting element mounting area (optical element mounting area) P: light receiving element mounting area (optical element mounting area) M1, M2: optical module P1, P2: optical component mounting substrate T: optical component mounting substrate forming area W: substrate ( Wafer) ZH: Upper insulator layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01S 5/026 H01L 31/02 Z F term (Reference) 2H037 AA01 BA02 BA11 DA03 DA04 DA06 DA18 DA22 5F073 BA01 EA28 FA06 HA02 HA06 HA09 HA11 5F088 AA01 BA18 BA20 BB01 JA03 JA11 JA20

Claims (5)

[Claims] A substrate having a plurality of optical element mounting regions in which a light emitting element and a light receiving element for receiving light emitted from the light emitting element are provided; an insulator layer formed in a plurality of regions on the substrate;
A signal line and a ground line connected to the electrode terminal of the light emitting element, a signal line and a ground line connected to the electrode terminal of the light receiving element, and the signal line of the light emitting element and the signal of the light receiving element. And a ground line of at least one optical element of the light emitting element and the light receiving element is disposed on one or both sides of a signal line of the optical element. An optical inspection substrate, comprising: 2. A substrate having a plurality of optical element mounting areas on which a light emitting element and a light receiving element for receiving light emitted from the light emitting element are provided; an insulator layer formed in a plurality of areas on the substrate;
A signal line and a ground line connected to the electrode terminal of the light emitting element, a signal line and a ground line connected to the electrode terminal of the light receiving element, and the signal line of the light emitting element and the signal of the light receiving element. A light-emitting element and a light-receiving element, and a ground line of at least one optical element of the light-emitting element and the light-receiving element faces a signal line of the optical element via an insulator layer. An optical inspection substrate, wherein the substrate is arranged. 3. The step of preparing the substrate for optical inspection according to claim 1 or 2, arranging a light emitting element and a light receiving element in each optical element mounting area of the substrate for optical inspection, and the light emitting element Heating the optical inspection substrate on which the light receiving elements are disposed to a predetermined temperature, and the light emitting elements disposed in the respective optical element mounting areas while the optical inspection substrate is heated at the predetermined temperature; and Driving the light receiving element and measuring the amount of light emitted from the light emitting element with the light receiving element. 4. An optical module obtained by performing the optical inspection method according to claim 3 and dividing the optical inspection substrate into each of the optical element mounting areas. 5. The optical module according to claim 4, wherein said light receiving element is an end face light receiving type.