JP2002026204A - Heat conducting material, electromagnetic wave shielding structure and method for manufacturing heat conducting material - Google Patents
Heat conducting material, electromagnetic wave shielding structure and method for manufacturing heat conducting materialInfo
- Publication number
- JP2002026204A JP2002026204A JP2000206596A JP2000206596A JP2002026204A JP 2002026204 A JP2002026204 A JP 2002026204A JP 2000206596 A JP2000206596 A JP 2000206596A JP 2000206596 A JP2000206596 A JP 2000206596A JP 2002026204 A JP2002026204 A JP 2002026204A
- Authority
- JP
- Japan
- Prior art keywords
- heat conductive
- conductive material
- electromagnetic wave
- heat conducting
- metal particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品等の発熱
体からの放熱を促すため、その発熱体に対して接触する
ように配置して使用される熱伝導材に関し、詳しくは、
上記電子部品に出入りする電磁波をシールド（遮蔽）す
る機能も備えた熱伝導材と、その熱伝導材を利用した電
磁波シールド構造、並びに、上記熱伝導材の製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat conductive material arranged to be in contact with a heating element for promoting heat radiation from a heating element such as an electronic component.
The present invention relates to a heat conductive material having a function of shielding (shielding) an electromagnetic wave entering and exiting the electronic component, an electromagnetic wave shielding structure using the heat conductive material, and a method of manufacturing the heat conductive material.
【０００２】[0002]
【従来の技術】従来より、シリコーンゴムやＥＰＤＭ等
の母材に熱伝導フィラーを充填し、混練・成形してなる
熱伝導材が考えられている。この種の熱伝導材は、電気
・電子装置の内部において、例えば、発熱源となる電子
部品と、放熱板や筐体パネル等といったヒートシンクと
なる部品（以下、単にヒートシンクという）との間に介
在させるように配置して使用される。このように熱伝導
材を配置した場合、電子部品等が発生する熱をヒートシ
ンク側へ良好に逃がすことができる。このため、この種
の熱伝導材は、例えばＣＰＵの高速化等のために不可欠
な素材として注目を集めている。2. Description of the Related Art Heretofore, there has been considered a heat conductive material obtained by filling a base material such as silicone rubber or EPDM with a heat conductive filler, kneading and molding. This kind of heat conductive material is interposed, for example, between an electronic component serving as a heat source and a component serving as a heat sink such as a heat sink or a housing panel (hereinafter simply referred to as a heat sink) inside the electric / electronic device. Used to be arranged to let. When the heat conductive material is arranged in this manner, heat generated by the electronic components and the like can be satisfactorily released to the heat sink side. For this reason, this type of heat conductive material has attracted attention as an indispensable material for, for example, speeding up a CPU.
【０００３】また、ＣＰＵ等の電子部品では、その電子
部品に入出力される信号に外部からの電磁波がノイズと
して重畳したり、電子部品自身が発生する電磁波が他の
信号にノイズとして重畳したりするのを防止する必要も
ある。そこで、従来より、その電子部品に出入りする電
磁波をシールドするために、プリント基板上に載置され
た単一または複数の電子部品を上方から金属ケースで覆
っている。また、この場合、金属ケースとプリント基板
との間にコンデンサが形成されて電子部品に悪影響を及
ぼさないように、上記金属ケースをプリント基板のアー
ス電極に接続することが行われている。In electronic components such as CPUs, external electromagnetic waves are superimposed as noise on signals input to and output from the electronic components, and electromagnetic waves generated by the electronic components themselves are superimposed on other signals as noise. It is necessary to prevent that. Therefore, conventionally, in order to shield an electromagnetic wave entering and exiting the electronic component, a single or a plurality of electronic components mounted on a printed circuit board are covered with a metal case from above. Further, in this case, the metal case is connected to a ground electrode of the printed circuit board so that a capacitor is formed between the metal case and the printed circuit board so that the electronic components are not adversely affected.
【０００４】[0004]
【発明が解決しようとする課題】ところが、このように
放熱用の部材と電磁波シールド用の部材とを電子部品の
周囲に個々に設ける場合、その電子部品周囲の構成が複
雑化して製造コストが上昇してしまう。そこで、本発明
は、電磁波シールド性と熱伝導性とを兼ね備えた熱伝導
材を提供して、電子部品周囲の構成を簡略化することを
目的としてなされた。特に、請求項１〜３記載の発明
は、電磁波シールド性及び熱伝導性と共に良好な導電性
を有する熱伝導材の提供を、請求項４記載の発明は、そ
の熱伝導材を利用して電子部品周囲の構成を良好に簡略
化することのできる電磁波シールド構造の提供を、請求
項５〜７記載の発明は、電磁波シールド性及び熱伝導性
と共に良好な絶縁性を有する熱伝導材の提供を、請求項
８記載の発明は上記各熱伝導材を容易に製造する熱伝導
材の製造方法の提供を、それぞれ目的としてなされた。However, when the heat radiation member and the electromagnetic wave shielding member are individually provided around the electronic component as described above, the configuration around the electronic component becomes complicated and the manufacturing cost increases. Resulting in. In view of the above, an object of the present invention is to provide a heat conductive material having both electromagnetic wave shielding properties and heat conductivity to simplify the configuration around an electronic component. In particular, the inventions according to claims 1 to 3 provide a heat conductive material having good conductivity as well as electromagnetic wave shielding properties and heat conductivity, and the invention according to claim 4 provides an electronic device utilizing the heat conductive material. An electromagnetic wave shielding structure capable of favorably simplifying the configuration around components is provided. The inventions according to claims 5 to 7 provide a heat conductive material having good insulation as well as electromagnetic wave shielding and heat conductivity. The invention according to claim 8 has been made for the purpose of providing a method of manufacturing a heat conductive material for easily manufacturing each of the heat conductive materials.
【０００５】[0005]
【課題を解決するための手段及び発明の効果】上記目的
を達するためになされた請求項１記載の発明は、流動性
を有する母材に熱伝導フィラーを充填し、混練・成形し
てなる熱伝導材であって、上記熱伝導フィラーとして、
１重量％以上５重量％未満の鱗片状の窒化ホウ素と、金
属粒子とを混合して用いたことを特徴としている。Means for Solving the Problems and Effects of the Invention According to the first aspect of the present invention, which has been made to attain the above object, a heat conductive filler is filled in a base material having fluidity, and kneaded and formed. A conductive material, as the heat conductive filler,
It is characterized in that scale-like boron nitride of 1% by weight or more and less than 5% by weight and metal particles are mixed and used.
【０００６】本願出願人は、熱伝導フィラーとして金属
粒子を用いることによって、得られる熱伝導材に電磁波
シールド性を付与することを試みた。この場合、良好な
電磁波シールド性は得られたが、金属粒子だけでは充分
な熱伝導性が得られなかった。そこで、熱伝導性の良好
な鱗片状の窒化ホウ素を金属粒子と混合して熱伝導フィ
ラーとして用いたところ、電磁波シールド性と熱伝導性
とを兼ね備えた熱伝導材が得られた。また、この実験に
おいて本願出願人は、上記窒化ホウ素の充填量が５重量
％未満では熱伝導材が全体として良好な導電性を呈し、
上記充填量が５重量％以上となると急に絶縁性を呈する
ことを発見した。[0006] The applicant of the present application has attempted to impart electromagnetic wave shielding properties to the obtained heat conductive material by using metal particles as the heat conductive filler. In this case, good electromagnetic wave shielding properties were obtained, but sufficient thermal conductivity was not obtained with metal particles alone. Then, when flaky boron nitride having good heat conductivity was mixed with metal particles and used as a heat conductive filler, a heat conductive material having both electromagnetic wave shielding properties and heat conductivity was obtained. Further, in this experiment, the applicant of the present application has found that when the boron nitride loading is less than 5% by weight, the heat conductive material exhibits good conductivity as a whole,
It has been found that when the above-mentioned filling amount is 5% by weight or more, insulating properties are suddenly exhibited.
【０００７】本発明の熱伝導材は、熱伝導フィラーとし
て、１重量％以上５重量％未満の鱗片状の窒化ホウ素
と、金属粒子とを混合して用いているので、電磁波シー
ルド性，熱伝導性，及び導電性のいずれにおいても優れ
た特性を有する。なお、上記窒化ホウ素の充填量が１重
量％未満では充分な熱伝導性が得られない。The heat conductive material of the present invention uses, as a heat conductive filler, 1% by weight or more and less than 5% by weight of flaky boron nitride mixed with metal particles. It has excellent properties in both properties and conductivity. If the amount of the boron nitride is less than 1% by weight, sufficient thermal conductivity cannot be obtained.
【０００８】従って、本発明の熱伝導材を電子部品の放
熱用に使用すれば、その電子部品に対する電磁波シール
ドも同時に実現することができ、延いては、その電子部
品周囲の構成を簡略化することができる。また、本発明
の熱伝導材は良好な導電性を有するので、後述のように
アース電極等と導通させて使用した場合、電磁波シール
ド性を一層向上させることができる。なお、良好な熱伝
導性及び導電性を得るための上記窒化ホウ素の望ましい
充填量は２重量％以上５重量％未満で、より望ましい範
囲は３重量％以上５重量％未満、更に望ましい範囲は
３．５重量％以上４．５重量％以下である。Therefore, when the heat conductive material of the present invention is used for heat radiation of an electronic component, an electromagnetic wave shield for the electronic component can be realized at the same time, and the structure around the electronic component can be simplified. be able to. In addition, since the heat conductive material of the present invention has good conductivity, when used in a state of being electrically connected to an earth electrode or the like as described later, the electromagnetic wave shielding property can be further improved. The preferable filling amount of the boron nitride for obtaining good thermal conductivity and conductivity is 2% by weight or more and less than 5% by weight, more preferably 3% by weight or more and less than 5% by weight, and further preferably 3% by weight or less and less than 5% by weight. It is not less than 0.5% by weight and not more than 4.5% by weight.
【０００９】請求項２記載の発明は、請求項１記載の構
成に加え、上記金属粒子が、少なくとも表面に銀，銅，
またはアルミニウムの層を有することを特徴としてい
る。本発明の金属粒子は、少なくとも表面に銀，銅，ま
たはアルミニウムの層を有しているので、極めて良好な
電磁波シールド性が得られる。従って、本発明の熱伝導
材では、請求項１記載の発明の効果に加えて、電磁波シ
ールド性を一層向上させることができるといった効果が
生じる。なお、本発明の金属粒子には、銀，銅，または
アルミニウムのみによって構成された粒子はもちろんの
こと、フェライトやセラミックス等の絶縁性の粒子表面
に銀，銅，またはアルミニウムの層を形成したものも含
まれる。According to a second aspect of the present invention, in addition to the configuration of the first aspect, the metal particles have at least a surface of silver, copper,
Alternatively, it is characterized by having an aluminum layer. Since the metal particles of the present invention have a silver, copper, or aluminum layer on at least the surface, extremely good electromagnetic wave shielding properties can be obtained. Therefore, in the heat conductive material of the present invention, in addition to the effect of the first aspect, an effect that the electromagnetic wave shielding property can be further improved is generated. The metal particles of the present invention include not only particles composed only of silver, copper, or aluminum, but also particles having a silver, copper, or aluminum layer formed on the surface of insulating particles such as ferrite or ceramics. Is also included.
【００１０】請求項３記載の発明は、請求項１または２
記載の構成に加え、上記母材がシリコーンゴムであるこ
とを特徴としている。本発明では、上記母材としてシリ
コーンゴムを使用しているので、電子部品等の放熱用に
使用した場合にその電子部品等との密着性が極めてよく
なり、延いては、放熱性を一層向上させることができ
る。従って、本発明の熱伝導材では、請求項１または２
記載の発明の効果に加えて、電子部品等に対する放熱性
を一層向上させることができるといった効果が生じる。[0010] The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the configuration described above, the base material is a silicone rubber. In the present invention, since silicone rubber is used as the base material, when used for heat dissipation of an electronic component or the like, the adhesion to the electronic component or the like becomes extremely good, and the heat dissipation is further improved. Can be done. Therefore, in the heat conductive material of the present invention, claim 1 or 2
In addition to the effects of the described invention, there is an effect that the heat dissipation to electronic components and the like can be further improved.
【００１１】請求項４記載の発明は、プリント基板上に
載置された単一または複数の電子部品に出入りする電磁
波をシールドする電磁波シールド構造であって、請求項
１〜３のいずれかに記載の熱伝導材により構成され、上
記電子部品の上面に当接する当接部と、該当接部を上記
プリント基板のアース電極に電気的に接続する接続部
と、を備えたことを特徴としている。According to a fourth aspect of the present invention, there is provided an electromagnetic wave shielding structure for shielding an electromagnetic wave entering and exiting from one or a plurality of electronic components mounted on a printed circuit board. And a contact portion that contacts the upper surface of the electronic component, and a connection portion that electrically connects the contact portion to a ground electrode of the printed circuit board.
【００１２】このように構成された本発明では、請求項
１〜３のいずれかに記載の熱伝導材により構成された当
接部が、接続部によってプリント基板のアース電極に電
気的に接続される。また、前述のように、当接部を構成
する熱伝導材は良好な導電性を有している。このため、
当接部の電位はアース電位に安定して保持され、その当
接部を構成する上記熱伝導材によって電子部品に出入り
する電磁波を極めて良好にシールドすることができる。
また、前述のように、当接部を構成する熱伝導材は良好
な熱伝導性を有しているので、その当接部を直接または
間接的にヒートシンクに接触させれば電子部品が発生す
る熱を良好に放熱することができる。According to the present invention thus configured, the contact portion formed of the heat conductive material according to any one of claims 1 to 3 is electrically connected to the ground electrode of the printed circuit board by the connection portion. You. In addition, as described above, the heat conductive material forming the contact portion has good conductivity. For this reason,
The potential of the contact portion is stably maintained at the ground potential, and the heat conductive material constituting the contact portion can shield electromagnetic waves entering and exiting the electronic component very well.
Further, as described above, since the heat conductive material forming the contact portion has good thermal conductivity, an electronic component is generated if the contact portion is directly or indirectly contacted with the heat sink. Heat can be radiated well.
【００１３】従って、本発明では、電子部品が発生する
熱の放熱とその電子部品に対する電磁波シールドとを一
つの部材によって良好に行うことができ、延いては、電
子部品周囲の構成を簡略化して製造コストを低減するこ
とができる。請求項５記載の発明は、流動性を有する母
材に熱伝導フィラーを充填し、混練・成形してなる熱伝
導材であって、上記熱伝導フィラーとして、５重量％以
上の鱗片状の窒化ホウ素と、金属粒子とを混合して用い
たことを特徴としている。Therefore, according to the present invention, the radiation of the heat generated by the electronic component and the shielding of the electromagnetic wave to the electronic component can be satisfactorily performed by one member, and the structure around the electronic component can be simplified. Manufacturing costs can be reduced. The invention according to claim 5 is a heat conductive material obtained by filling a heat conductive filler into a base material having fluidity, kneading and molding, wherein the heat conductive filler has a scale-like nitride of 5% by weight or more. It is characterized by using a mixture of boron and metal particles.
【００１４】前述のように、鱗片状の窒化ホウ素と金属
粒子とを混合して熱伝導フィラーとして用いることによ
り、電磁波シールド性と熱伝導性とを兼ね備えた熱伝導
材が得られる。また、窒化ホウ素の充填量を５重量％以
上とすると、その熱伝導材は良好な絶縁性を呈する。本
発明の熱伝導材は、熱伝導フィラーとして、５重量％以
上の鱗片状の窒化ホウ素と、金属粒子とを混合して用い
ているので、電磁波シールド性，熱伝導性，及び絶縁性
のいずれにおいても優れた特性を有する。As described above, by mixing scaly boron nitride and metal particles and using them as a heat conductive filler, a heat conductive material having both electromagnetic wave shielding properties and heat conductivity can be obtained. When the filling amount of boron nitride is 5% by weight or more, the heat conductive material exhibits good insulating properties. Since the heat conductive material of the present invention uses a mixture of 5% by weight or more of scaly boron nitride and metal particles as a heat conductive filler, any one of the electromagnetic wave shielding property, the heat conductivity, and the insulating property is used. Also has excellent characteristics.
【００１５】従って、本発明の熱伝導材を電子部品の放
熱用に使用すれば、その電子部品に対する電磁波シール
ドも同時に実現することができ、延いては、その電子部
品周囲の構成を簡略化することができる。また、本発明
の熱伝導材は良好な絶縁性を有するので、導体から隔離
しなければならない電子部品に対しても良好に適用する
ことができる。Therefore, when the heat conductive material of the present invention is used for heat radiation of an electronic component, an electromagnetic wave shield for the electronic component can be realized at the same time, and the structure around the electronic component can be simplified. be able to. In addition, since the heat conductive material of the present invention has good insulation properties, it can be favorably applied to electronic components that must be isolated from conductors.
【００１６】請求項６記載の発明は、請求項５記載の構
成に加え、上記金属粒子が、少なくとも表面に銀，銅，
またはアルミニウムの層を有することを特徴としてい
る。本発明の金属粒子は、少なくとも表面に銀，銅，ま
たはアルミニウムの層を有しているので、極めて良好な
電磁波シールド性が得られる。従って、本発明の熱伝導
材では、請求項５記載の発明の効果に加えて、電磁波シ
ールド性を一層向上させることができるといった効果が
生じる。なお、本発明の金属粒子には、銀，銅，または
アルミニウムのみによって構成された粒子はもちろんの
こと、フェライトやセラミックス等の絶縁性の粒子表面
に銀，銅，またはアルミニウムの層を形成したものも含
まれる。According to a sixth aspect of the present invention, in addition to the configuration of the fifth aspect, the metal particles include silver, copper,
Alternatively, it is characterized by having an aluminum layer. Since the metal particles of the present invention have a silver, copper, or aluminum layer on at least the surface, extremely good electromagnetic wave shielding properties can be obtained. Therefore, in the heat conductive material of the present invention, in addition to the effect of the fifth aspect, an effect that the electromagnetic wave shielding property can be further improved is produced. The metal particles of the present invention include not only particles composed only of silver, copper, or aluminum, but also particles having a silver, copper, or aluminum layer formed on the surface of insulating particles such as ferrite or ceramics. Is also included.
【００１７】請求項７記載の発明は、請求項５または６
記載の構成に加え、上記母材がシリコーンゴムであるこ
とを特徴としている。本発明では、上記母材としてシリ
コーンゴムを使用しているので、電子部品等の放熱用に
使用した場合にその電子部品等との密着性が極めてよく
なり、延いては、放熱性を一層向上させることができ
る。従って、本発明の熱伝導材では、請求項５または６
記載の発明の効果に加えて、電子部品等に対する放熱性
を一層向上させることができるといった効果が生じる。The invention according to claim 7 is the invention according to claim 5 or 6.
In addition to the configuration described above, the base material is a silicone rubber. In the present invention, since silicone rubber is used as the base material, when used for heat dissipation of an electronic component or the like, the adhesion to the electronic component or the like becomes extremely good, and the heat dissipation is further improved. Can be done. Therefore, in the heat conductive material of the present invention, claim 5 or claim 6
In addition to the effects of the described invention, there is an effect that the heat dissipation to electronic components and the like can be further improved.
【００１８】請求項８記載の発明は、流動性を有する母
材に熱伝導フィラーを充填し、混練・成形して熱伝導材
を製造する熱伝導材の製造方法であって、上記熱伝導フ
ィラーとして、１重量％以上の鱗片状の窒化ホウ素と、
金属粒子とを混合して用いることを特徴としている。The invention according to claim 8 is a method for producing a heat conductive material, which comprises filling a heat conductive filler into a base material having fluidity, kneading and molding the heat conductive filler, and manufacturing the heat conductive material. As 1% by weight or more of scaly boron nitride,
It is characterized in that it is used by mixing with metal particles.
【００１９】本発明では、熱伝導フィラーとして、１重
量％以上の鱗片状の窒化ホウ素と、金属粒子とを混合し
て用い、流動性を有する母材に充填して混練・成形して
熱伝導材を製造しているので、請求項１〜３または５〜
７のいずれかに記載の熱伝導材を容易に製造することが
できる。従って、電磁波シールド性と熱伝導性とを兼ね
備えた熱伝導材を容易に製造することができる。In the present invention, 1% by weight or more of scaly boron nitride and metal particles are mixed and used as a heat conductive filler, filled into a base material having fluidity, kneaded and molded to form a heat conductive filler. Since the material is manufactured, claims 1-3 or 5-
7 can easily produce the heat conductive material. Therefore, a heat conductive material having both electromagnetic wave shielding properties and heat conductivity can be easily manufactured.
【００２０】また、この製造方法では、窒化ホウ素の充
填量を５重量％未満とするか５重量％以上とするかによ
って、得られる熱伝導材を良好な導体としたり（請求項
１〜３参照）良好な絶縁体としたり（請求項５〜７参
照）することができる。すなわち、製造工程の大幅な改
変を伴うことなく導電性，絶縁性といった全く異なる性
質の熱伝導材を製造することができ、その熱伝導材の製
造コストを一層良好に低減することができる。Further, according to this manufacturing method, the obtained heat conductive material can be a good conductor depending on whether the filling amount of boron nitride is less than 5% by weight or more than 5% by weight. ) A good insulator can be obtained (see claims 5 to 7). That is, it is possible to manufacture a heat conductive material having completely different properties such as conductivity and insulation without significantly modifying the manufacturing process, and it is possible to further reduce the manufacturing cost of the heat conductive material.
【００２１】[0021]
【発明の実施の形態】次に、本発明の実施の形態を説明
する。本実施の形態では、以下の製造方法により熱伝導
材を製造した。すなわち、流動性を有する母材，熱伝導
フィラー，及びオイルとしての塩素化パラフィンを混合
することにより、母材に熱伝導フィラーを充填した。母
材としては、熱可塑性のものとしてパラフィン系または
ポリエチレン系のゴムまたは樹脂が、熱硬化性のものと
してシリコーン系またはエポキシ系のゴム、その他各種
合成ゴムが使用できる。熱伝導フィラーとしては、鱗片
状の窒化ホウ素と金属粒子とを混合したものを使用し、
その金属粒子としては、銀，銅，またはアルミニウムの
粒子、銀でコーティングした銅，アルミニウム，または
ガラスの粒子、ニッケルでコーティングした炭化物等、
種々のものが使用できる。Next, an embodiment of the present invention will be described. In the present embodiment, a heat conductive material was manufactured by the following manufacturing method. That is, the base material was filled with the heat conductive filler by mixing a fluid base material, a heat conductive filler, and chlorinated paraffin as oil. As the base material, a paraffinic or polyethylene rubber or resin can be used as a thermoplastic material, and a silicone or epoxy rubber or other various synthetic rubbers can be used as a thermosetting material. As the heat conductive filler, a mixture of scaly boron nitride and metal particles is used,
The metal particles include silver, copper, or aluminum particles, silver-coated copper, aluminum, or glass particles, nickel-coated carbide, and the like.
Various things can be used.
【００２２】上記混合の方法としては、押し出し，２本
ロール，ニーダ等の種々の方法を適用することができ
る。続いて、このように熱伝導フィラーを混練した固形
状の母材をシート状に成形し、熱伝導材を得た。この成
形の方法としては、カレンダロール，押し出し，プレス
等の機械を用いて成形する方法等、種々の方法を適用す
ることができる。Various methods such as extrusion, two-roll, and kneader can be applied as the mixing method. Subsequently, the solid base material kneaded with the heat conductive filler was formed into a sheet to obtain a heat conductive material. Various molding methods such as a molding method using a machine such as a calendar roll, extrusion, and press can be applied.
【００２３】このようにして製造された熱伝導材は、良
好な電磁波シールド性を有し、かつ、熱伝導性にも優れ
ていた。これは、熱伝導フィラーとして金属粒子を用い
たことによって電磁波シールド性が向上し、更に、良好
な熱伝導性を有する鱗片状の窒化ホウ素をその金属粒子
に混合して用いたことによって熱伝導性も良好に確保で
きたものと考えられる。The heat conductive material manufactured in this manner had good electromagnetic wave shielding properties and also had excellent heat conductivity. This is because the use of metal particles as a heat conductive filler improves the electromagnetic wave shielding properties, and furthermore, the use of flake-like boron nitride having good heat conductivity mixed with the metal particles allows the heat conductivity to be improved. It is probable that these were also secured well.
【００２４】この原理を図１の模式図を用いて説明する
と、上記実施の形態の熱伝導材１は、母材３に、金属粒
子５と鱗片状の窒化ホウ素７とを熱伝導フィラーとして
混合している。このため、金属粒子５の隙間に窒化ホウ
素７が割り込んで積層状につながることによって、良好
な熱伝導経路を構成する。もちろん、金属粒子５も熱伝
導性を有するが、窒化ホウ素７がこのように配設される
ことにより熱伝導材１の熱伝導性を一層良好に確保する
ことができる。一方、金属粒子５は図１に示すように熱
伝導材１に全体的に分散するので、熱伝導材１を通過し
ようとする電磁波を良好に遮断（シールド）することが
できる。The principle of this will be described with reference to the schematic diagram of FIG. 1. The heat conductive material 1 of the above embodiment is obtained by mixing a base material 3 with metal particles 5 and scaly boron nitride 7 as a heat conductive filler. are doing. For this reason, a good heat conduction path is formed by the boron nitride 7 breaking into the gaps between the metal particles 5 and leading to a lamination. Of course, the metal particles 5 also have thermal conductivity, but by arranging the boron nitride 7 in this manner, the thermal conductivity of the thermal conductive material 1 can be more favorably secured. On the other hand, since the metal particles 5 are dispersed throughout the heat conductive material 1 as shown in FIG. 1, it is possible to satisfactorily block (shield) an electromagnetic wave passing through the heat conductive material 1.
【００２５】また、窒化ホウ素７の充填量は、熱伝導材
１の全体に対して５重量％未満であると熱伝導材１が全
体として良好な導電性を呈し、上記充填量が５重量％以
上となると急に絶縁性を呈することが分かった。次に、
熱伝導材１の配合を種々に変更して製造した場合の特性
を実施例を挙げて説明する。When the filling amount of the boron nitride 7 is less than 5% by weight based on the whole heat conducting material 1, the heat conducting material 1 exhibits good conductivity as a whole, and the filling amount is 5% by weight. It turned out that it becomes insulating suddenly when it becomes above. next,
The characteristics in the case where the heat conductive material 1 is manufactured by variously changing the composition will be described with reference to examples.
【００２６】[0026]
【実施例】本実施例では、母材３としてはシリコーンゴ
ム（商品名「ＣＹ５２−２７６」：東レダウコーニング
製）を使用し、配合を次の表１に示すように種々に変更
した。EXAMPLES In this example, silicone rubber (trade name "CY52-276" manufactured by Dow Corning Toray Co., Ltd.) was used as the base material 3, and the composition was variously changed as shown in Table 1 below.
【００２７】[0027]
【表１】 [Table 1]
【００２８】但し、ＳＣ２７０Ｓ２０（商品名：東芝バ
ロティーニ製）は、銀をコーティングしたアルミニウム
で比重３．１である。また、ＵＨＰ−１（商品名：昭和
電工製）は窒化ホウ素で比重２．２７、ＵＨＰ−ＥＸ
（商品名：昭和電工製）も窒化ホウ素で比重２．２７で
ある。更に、シールド効果は５００ＭＨｚの電磁波に対
して測定した値である。However, SC270S20 (trade name: manufactured by Toshiba Barotini) is aluminum coated with silver and has a specific gravity of 3.1. UHP-1 (trade name: Showa Denko) is made of boron nitride and has a specific gravity of 2.27 and UHP-EX.
(Trade name: Showa Denko) is also boron nitride and has a specific gravity of 2.27. Further, the shielding effect is a value measured for an electromagnetic wave of 500 MHz.
【００２９】表１に示すように、熱伝導フィラーとして
金属粒子５のみを使用して窒化ホウ素（熱伝粒子）を使
用しなかったの資料（比較例）では、良好な電磁波シ
ールド性は得られたものの熱伝導性は充分ではなかっ
た。これに対して、金属粒子５と窒化ホウ素７とを混合
して熱伝導フィラーとして使用した〜の資料（実施
例）では、電磁波シールド性と熱伝導性とを兼ね備えた
熱伝導材１が得られた。また、窒化ホウ素７の充填量を
４重量％とした及びの資料では、熱伝導材１が良好
な導電性を呈し、窒化ホウ素７を５重量％以上充填した
，，の資料では、熱伝導材１が良好な絶縁性（＞
１０6 Ω／ｃｍ2 ）を示した。As shown in Table 1, in the data (comparative example) in which only the metal particles 5 were used as the heat conductive filler and no boron nitride (heat conductive particles) was used, a good electromagnetic wave shielding property was obtained. However, the thermal conductivity was not sufficient. On the other hand, in the materials (Examples) in which the metal particles 5 and the boron nitride 7 were mixed and used as the heat conductive filler, the heat conductive material 1 having both the electromagnetic wave shielding property and the heat conductivity was obtained. Was. According to the data that the filling amount of boron nitride 7 was set to 4% by weight, the heat conductive material 1 exhibited good conductivity, and the material filled with boron nitride 7 was 5% by weight or more. 1 is good insulation (>
10 6 Ω / cm 2 ).
【００３０】そこで、金属粒子５と共に窒化ホウ素７を
４重量％充填した，等の熱伝導材１と、金属粒子５
と共に窒化ホウ素７を５重量％以上充填した，，
等の熱伝導材１とは、用途に応じて次のように使い分け
ることができる。なお、充分な熱伝導率（１．５Ｗ／ｍ
・Ｋ以上）を得るためには窒化ホウ素７は少なくとも１
重量％以上は充填することが必要と推定され、熱伝導性
及び導電性を得るための望ましい充填量は２重量％以上
５重量％未満で、より望ましい範囲は３重量％以上５重
量％未満、更に望ましい範囲は３．５重量％以上４．５
重量％以下である。一方、絶縁性を得るための上記充填
量の上限は熱伝導材１の成形が可能な限界である。Therefore, a heat conductive material 1 such as 4% by weight of boron nitride 7 filled with metal particles 5 and metal particles 5
Together with boron nitride 7 in an amount of 5% by weight or more,
The heat conductive material 1 can be properly used as follows depending on the application. In addition, sufficient thermal conductivity (1.5 W / m
・ K or more), boron nitride 7 must be at least 1
It is presumed that it is necessary to fill more than 5% by weight, and a desirable filling amount for obtaining thermal conductivity and electrical conductivity is 2% to less than 5% by weight, a more desirable range is 3% to less than 5% by weight, A more desirable range is 3.5% by weight to 4.5% by weight.
% By weight or less. On the other hand, the upper limit of the above filling amount for obtaining the insulating property is a limit at which the heat conductive material 1 can be formed.
【００３１】導電性を有する熱伝導材１の用途として
は、例えば図２に示すように、プリント配線基板１０に
固定された電子部品１１の上面に，等の熱伝導材１
を載置し、更に、その上に金属部材１３を載置してその
両端の接続部１３ａをプリント配線基板１０のアース電
極（図示せず）に接続することが考えられる。この場
合、熱伝導材１は前述のように良好な導電性を有するの
で、その熱伝導材１（当接部に相当）の電位は接続部１
３ａを介してアース電位に安定して保持される。このた
め、熱伝導材１によって電子部品１１に出入りする電磁
波を極めて良好にシールドすることができる。As a use of the heat conductive material 1 having conductivity, for example, as shown in FIG.
It is conceivable that the metal member 13 is mounted thereon, and the connecting portions 13a at both ends thereof are connected to the ground electrode (not shown) of the printed wiring board 10. In this case, since the heat conductive material 1 has good conductivity as described above, the potential of the heat conductive material 1 (corresponding to the contact portion) is
Stably maintained at the ground potential via 3a. For this reason, the electromagnetic wave that enters and exits the electronic component 11 can be shielded very well by the heat conductive material 1.
【００３２】また、前述のように熱伝導材１は良好な熱
伝導性を有しているので、その熱伝導材１を金属部材１
３を介して間接的にヒートシンク（図示せず）に接触さ
せれば（ヒートシンクに直接接触させてもよい）、電子
部品１１が発生する熱を良好に放熱することができる。
従って、電子部品１１が発生する熱の放熱とその電子部
品１１に対する電磁波シールドとを一つの部材によって
良好に行うことができ、電子部品１１周囲の構成を簡略
化して製造コストを低減することができる。Further, as described above, since the heat conductive material 1 has good heat conductivity, the heat conductive material 1 is
If it is indirectly contacted with the heat sink (not shown) via 3 (or may be in direct contact with the heat sink), the heat generated by the electronic component 11 can be radiated well.
Therefore, the radiation of the heat generated by the electronic component 11 and the shielding of the electromagnetic wave to the electronic component 11 can be satisfactorily performed by one member, and the configuration around the electronic component 11 can be simplified and the manufacturing cost can be reduced. .
【００３３】熱伝導材１が絶縁性であっても、金属粒子
５の分散によって比較的良好な電磁波シールドを行うこ
とができる。電子部品１１が導体から隔離しなければな
らない性質の部品である場合は、熱伝導材１として，
，等を使用し、電子部品１１に対する電磁波シール
ド及び放熱を同時に実行することができる。Even if the heat conducting material 1 is insulative, relatively good electromagnetic wave shielding can be performed by dispersing the metal particles 5. When the electronic component 11 is a component that must be isolated from the conductor,
, Etc., the electromagnetic wave shielding and heat radiation for the electronic component 11 can be performed simultaneously.
【００３４】また、，等の導電性の熱伝導材１と
，，等の絶縁性の熱伝導材１とを積層して使用し
てもよい。この場合、絶縁性の熱伝導材１を電子部品１
１に当接させれば、導体から隔離する必要のある電子部
品１１に対しても電磁波シールド及び放熱を良好に同時
に実行することができる。本実施例では、前述のよう
に、製造工程の大幅な改変を伴うことなく導電性，絶縁
性といった全く異なる性質の熱伝導材１を製造すること
ができるので、このような場合にも熱伝導材１の製造コ
ストを良好に低減することができる。Further, a conductive heat conductive material 1 such as, and an insulating heat conductive material 1 such as, may be laminated and used. In this case, the insulating heat conductive material 1 is replaced with the electronic component 1.
1, the electromagnetic wave shielding and the heat radiation can be simultaneously and satisfactorily executed for the electronic component 11 which needs to be isolated from the conductor. In the present embodiment, as described above, the heat conductive material 1 having completely different properties such as conductivity and insulation can be manufactured without a significant change in the manufacturing process. The production cost of the material 1 can be favorably reduced.
【００３５】なお、本発明は上記実施例に何等限定され
るものではなく、本発明の要旨を逸脱しない範囲で種々
の形態で実施することができる。例えば、母材としては
前述のようにシリコーンゴム以外にも種々のゴム，樹脂
等を使用することができる。但し、母材としてシリコー
ンゴムを使用すると、電子部品等の放熱用に使用した場
合にその電子部品等との密着性が極めてよくなり、延い
ては、放熱性を一層向上させることができる。It should be noted that the present invention is not limited to the above-described embodiment at all, and can be implemented in various forms without departing from the gist of the present invention. For example, as the base material, various rubbers, resins, and the like can be used in addition to the silicone rubber as described above. However, when silicone rubber is used as the base material, when used for heat dissipation of an electronic component or the like, the adhesion to the electronic component or the like becomes extremely good, and the heat dissipation can be further improved.
【００３６】また、金属粒子としても前述のように種々
のものを使用することができる。但し、ＳＣ２７０Ｓ２
０等のように少なくとも表面に銀，銅，またはアルミニ
ウムの層を有するものを金属粒子として使用した場合、
極めて良好な電磁波シールド性が得られる。また、鱗片
状の窒化ホウ素にも金属コーティングを施してもよく、
この場合、一層良好な電磁波シールド性及び導電性が得
られる。Various kinds of metal particles can be used as described above. However, SC270S2
When a material having a silver, copper, or aluminum layer at least on the surface, such as 0, is used as metal particles,
Extremely good electromagnetic wave shielding properties can be obtained. In addition, scaly boron nitride may be provided with a metal coating,
In this case, better electromagnetic wave shielding properties and conductivity can be obtained.
【図１】 本発明が適用された熱伝導材の構成を模式的
に表す説明図である。FIG. 1 is an explanatory diagram schematically showing a configuration of a heat conductive material to which the present invention is applied.
【図２】 その熱伝導材を用いた電磁波シールド構造を
表す側面図である。FIG. 2 is a side view illustrating an electromagnetic wave shielding structure using the heat conductive material.
１…熱伝導材 ３…母材 ５…金属粒子
７…窒化ホウ素 １０…プリント配線基板 １１…電子部品 １
３…金属部材 １３ａ…接続部DESCRIPTION OF SYMBOLS 1 ... Thermal conductive material 3 ... Base material 5 ... Metal particle
7 ... boron nitride 10 ... printed wiring board 11 ... electronic parts 1
3: Metal member 13a: Connection part
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E321 AA02 AA14 BB32 BB34 BB44 CC16 GG05 GH03 5F036 AA01 BA04 BA23 BB01 BB21 BD01 BD03 BD21 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E321 AA02 AA14 BB32 BB34 BB44 CC16 GG05 GH03 5F036 AA01 BA04 BA23 BB01 BB21 BD01 BD03 BD21
Claims (8)
充填し、混練・成形してなる熱伝導材であって、 上記熱伝導フィラーとして、１重量％以上５重量％未満
の鱗片状の窒化ホウ素と、金属粒子とを混合して用いた
ことを特徴とする熱伝導材。1. A heat conductive material obtained by filling a base material having fluidity with a heat conductive filler, kneading and molding, wherein the heat conductive filler has a scale-like shape of 1% by weight or more and less than 5% by weight. A heat conductive material comprising a mixture of boron nitride and metal particles.
銅，またはアルミニウムの層を有することを特徴とする
請求項１記載の熱伝導材。2. The method according to claim 1, wherein the metal particles have at least silver,
2. The heat conductive material according to claim 1, further comprising a copper or aluminum layer.
特徴とする請求項１または２記載の熱伝導材。3. The heat conductive material according to claim 1, wherein the base material is a silicone rubber.
複数の電子部品に出入りする電磁波をシールドする電磁
波シールド構造であって、 請求項１〜３のいずれかに記載の熱伝導材により構成さ
れ、上記電子部品の上面に当接する当接部と、 該当接部を上記プリント基板のアース電極に電気的に接
続する接続部と、 を備えたことを特徴とする電磁波シールド構造。4. An electromagnetic wave shielding structure for shielding an electromagnetic wave entering and exiting a single or a plurality of electronic components mounted on a printed circuit board, wherein the structure is made of the heat conductive material according to claim 1. An electromagnetic wave shield structure comprising: a contact portion that contacts an upper surface of the electronic component; and a connection portion that electrically connects the contact portion to a ground electrode of the printed circuit board.
充填し、混練・成形してなる熱伝導材であって、 上記熱伝導フィラーとして、５重量％以上の鱗片状の窒
化ホウ素と、金属粒子とを混合して用いたことを特徴と
する熱伝導材。5. A heat conductive material obtained by filling a heat conductive filler into a base material having fluidity, kneading and molding, wherein 5% by weight or more of scaly boron nitride is used as the heat conductive filler; A heat conductive material characterized by using a mixture of metal particles.
銅，またはアルミニウムの層を有することを特徴とする
請求項５記載の熱伝導材。6. The method according to claim 1, wherein the metal particles have silver,
6. The heat conductive material according to claim 5, comprising a copper or aluminum layer.
特徴とする請求項５または６記載の熱伝導材。7. The heat conductive material according to claim 5, wherein the base material is a silicone rubber.
充填し、混練・成形して熱伝導材を製造する熱伝導材の
製造方法であって、 上記熱伝導フィラーとして、１重量％以上の鱗片状の窒
化ホウ素と、金属粒子とを混合して用いることを特徴と
する熱伝導材の製造方法。8. A method for producing a heat conductive material, which comprises filling a heat conductive filler into a base material having fluidity, kneading and molding the heat conductive material, wherein the heat conductive filler is 1% by weight or more. A method for producing a heat conductive material, comprising using a mixture of scaly boron nitride and metal particles.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9510452B2 (en) | 2014-03-25 | 2016-11-29 | Kitagawa Industries Co., Ltd. | Electromagnetic shielding member and electromagnetic shielding structure |
| KR20210046480A (en) * | 2019-10-18 | 2021-04-28 | 엔트리움 주식회사 | Semiconductor package |
| WO2021230320A1 (en) * | 2020-05-13 | 2021-11-18 | 国立大学法人 東京大学 | Electromagnetic wave absorber and paste for forming electromagnetic wave absorber |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11229147B2 (en) | 2015-02-06 | 2022-01-18 | Laird Technologies, Inc. | Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide |
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2000
- 2000-07-07 JP JP2000206596A patent/JP4463390B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9510452B2 (en) | 2014-03-25 | 2016-11-29 | Kitagawa Industries Co., Ltd. | Electromagnetic shielding member and electromagnetic shielding structure |
| KR20210046480A (en) * | 2019-10-18 | 2021-04-28 | 엔트리움 주식회사 | Semiconductor package |
| KR102304963B1 (en) * | 2019-10-18 | 2021-09-27 | 엔트리움 주식회사 | Semiconductor package |
| WO2021230320A1 (en) * | 2020-05-13 | 2021-11-18 | 国立大学法人 東京大学 | Electromagnetic wave absorber and paste for forming electromagnetic wave absorber |
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| JP4463390B2 (en) | 2010-05-19 |
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