JP2002025357A - Extr-fine coaxial cable, extr-fine coaxial flat cable, processed electric wire and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an insulator and an outer conductor from damage during processing. SOLUTION: For the extra-fine coaxial cable 10, not winding copper evaporated polyester tape on an outer conductor 3 as it was, a laminated tape 4, composed of an inside metal film 4a with the thickness of 5 μm and an outside resin film 4b, is wound. Because of the thickness of the metal film 4a, heat is sufficiently released, and the insulator 2 and outer conductor 4 become so as not to be damaged by the heat added from outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro coaxial cable, a micro coaxial flat cable, a processed wire and a method of manufacturing the same, and more particularly, to a micro coaxial cable in which an insulator or an outer conductor is prevented from being damaged during processing. The present invention relates to a micro coaxial cable using the micro coaxial cable, a processed wire product using the micro coaxial flat cable, and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIG. 10 is a perspective view showing a conventional ultrafine coaxial flat cable disclosed in Japanese Patent Application Laid-Open No. 10-144145. This micro coaxial flat cable 5
Reference numeral 00 denotes an outer periphery of the center conductor 1 in which seven tin-plated copper alloy wires each having a wire diameter of 0.03 mm were twisted with a thickness of 0.03 mm using a fluororesin.
The outer conductor 3 is formed by horizontally winding a tin-plated copper alloy wire having a wire diameter of 0.03 mm on the outer periphery to form an outer conductor 3, an inner surface on the outer surface of which is a copper vapor-deposited layer 54 a and an outer surface being polyester. A copper-deposited polyester tape 54 of the film 54b is wrapped, and a colored polyester tape is wrapped around the outer periphery of the film 54b to form an outer cover 5. Twelve micro coaxial cables 50 having an outer diameter of 0.33 mm are arranged in parallel at a pitch of 0.5 mm in a plane. It is a structure that is arranged side by side and sandwiched by an adhesive tape 20 to be integrated.

FIGS. 11 to 16 are disclosed in Japanese Patent Application Laid-Open No. 10-1441.
It is explanatory drawing which shows the processing method of the said micro coaxial flat cable 500 disclosed by Unexamined-Japanese-Patent No. 45 gazette. As shown in FIG. 11, a laser beam is applied to a position 15 mm from the end, and a cut S1 is made in the adhesive tape 20, the jacket 5, and the copper-deposited polyester tape 54. As shown in FIG.
The adhesive tape 20, the outer cover 5, and the copper-deposited polyester tape 54 on the end side are integrally shifted from the cut S1 to the end side to expose the outer conductor 3, and the outer conductor 3 is vertically moved by the ground bar pair 6. And solder it. Similarly, the outer conductor 3 is sandwiched from above and below by the ground bar pair B2 and soldered in the vicinity thereof. The ground bar pair 6, B2 is a tin-plated phosphor bronze plate having a width of 1 mm and a thickness of 0.5 mm.

[0004] As shown in FIG.
The outer conductor 3 is cut by bending between B2, and the ground bar pair B2, the outer conductor 3, the adhesive tape 20, the outer cover 5, and the copper-deposited polyester tape 54 on the end side are integrally removed from the cut portion. Then, the insulator 2 is exposed. As shown in FIG. 14, the insulating film F is thermally fused to the insulator 2.

[0005] As shown in FIG. 15, a laser beam is applied to a position between the ground bar pair 6 and the insulating film F to make a cut S 2 in the insulator 2. As shown in FIG. 16, the insulating film F and the insulator 2 on the end side from the cut S2 are integrally shifted to the end side to expose the center conductor 1. Figure 1
As shown in FIG. 7, the end side of the insulating film F is cut off to obtain a wire processed product 502.

[0006]

In the step of soldering the pair of ground bars 6 and B2, heat and pressure are applied to the insulator 2. Therefore, the outer conductor 3 is cut by bending between the pair of ground bars 6 and B2, and the pair of ground bars B2, the outer conductor 3, the adhesive tape 20, the outer cover 5, and the copper-deposited polyester on the end from the cut portion. As shown in FIG. 18, when the tape 2 is integrally removed to expose the insulator 2, as shown in FIG. 18, a melt deformed portion (a portion where the insulator 2 is deformed by heat and pressure) P1 or a melt cut portion (A portion that has been cut off due to the removal force applied thereto after the insulator 2 has been deformed by heat and pressure) There was a problem that P2 was generated. In addition, when making the cut S1, the outer conductor 3 may be damaged due to a variation in the intensity of the laser beam. Therefore, an object of the present invention is to provide a micro coaxial flat cable and a micro coaxial cable which prevent the insulator from being damaged by heat and pressure applied during processing and prevent the outer conductor 3 from being damaged by laser light. It is in.

[0007]

According to a first aspect of the present invention, there is provided a center conductor, an insulator covering the outer periphery of the center conductor, and a conductor wire horizontally wound around the outer periphery of the insulator. A micro coaxial cable 10 comprising: an outer conductor 3 formed as described above; and a laminated film 4 of a metal film 4a having a thickness of 5 μm or more and an outer surface formed of a resin film 4b on the inner surface wound around the outer periphery of the outer conductor 3. I will provide a. In the micro coaxial cable 10 according to the first aspect, the copper-evaporated polyester tape 54 is not wound around the outer conductor 3 as in the conventional case, but the inner surface is a metal film 4a having a thickness of 5 μm or more and the outer surface is a resin film. The laminated tape 4 of 4b was wound. In the case of the copper-deposited polyester tape 54, the thickness of the copper-deposited layer 54a is at most about 0.3 μm, and it is difficult to increase the thickness by deposition. Since the copper deposited layer 54a is thin as described above, the function of the copper deposited layer 54a to release heat is not sufficient. For this reason, when the ground bar pair 6 is soldered to the external conductor 3 when manufacturing a wire processed product, it is considered that the heat of soldering is locally transmitted to the insulator 2 to cause damage. On the other hand, in the case of the laminated tape 4, it is extremely easy to laminate the metal film 4a having a thickness of 5 μm or more. Since the metal film 4a is thick as described above, the function of the metal film 4a to release heat is sufficient. Therefore, when the ground bar pair 6 is soldered to the external conductor 3 when manufacturing a wire processed product, it is possible to avoid local heat transfer to the insulator 2 and to prevent damage to the insulator 2. . Further, when the laser beam is applied to form the cut S1, even if the laser beam intensity varies, the outer conductor 3 is not damaged because the thick metal film 4a protects it.

Although the metal film 4a may be a copper film, an aluminum film is more preferable in terms of heat conductivity and softness. Further, if the metal film 4a is too thick, it becomes difficult to wind the metal film 4a, so that the thickness is preferably 9 μm or less.

In a second aspect, the present invention relates to a center conductor 1
An insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 in which a conductor wire is horizontally wound around the outer periphery of the insulator 2, and an inner side surface wound around the outer periphery of the outer conductor 3 has a thickness of 5 μm or more. An ultrafine coaxial cable 10 having a metal film 4a and a laminated tape 4 having a resin film 4b on the outer surface and a jacket 5 having a resin tape wound around the outer periphery of the laminated tape 4
, A micro coaxial flat cable 100 characterized in that a plurality of the flat coaxial flat cables 100 are integrated by arranging a plurality of them in a plane. In the micro coaxial flat cable 100 according to the second aspect, since the micro coaxial cable 10 according to the first aspect is used, when the ground bar pair 6 is soldered to the external conductor 3 when manufacturing a wire processed product. In addition, heat can be prevented from being locally transmitted to the insulator 2, and the insulator 2 is not damaged.

[0010] In a third aspect, the present invention provides a center conductor 1
An insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 in which a conductor wire is horizontally wound around the outer periphery of the insulator 2, and an inner side surface wound around the outer periphery of the outer conductor 3 has a thickness of 5 μm or more. An ultrafine coaxial cable 10 having a metal film 4a and a laminated tape 4 having a resin film 4b on the outer surface and a jacket 5 having a resin tape wound around the outer periphery of the laminated tape 4
Are arranged in a plane in parallel, the outer jacket 5 and the laminated tape 4 at the ends of the micro coaxial cable 10 are removed, the outer conductor 3 is exposed, and the ground bar is straddled over the outer conductor 3. The pair 6 is soldered, the outer conductor 3 on the end side from the ground bar pair 6 is removed, the insulator 2 is exposed, and the insulating tape 7 is arranged so that the insulators 2 are arranged in a plane at a predetermined pitch.
The invention provides an electric wire processed product 101 characterized by the above. In the processed wire product 101 according to the third aspect, since the micro coaxial cable 10 according to the first aspect is used, the insulator 2 and the outer conductor 3 are not damaged, and the quality is high.

[0011] In a fourth aspect, the present invention provides a center conductor 1
An insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 in which a conductor wire is horizontally wound around the outer periphery of the insulator 2, and an inner side surface wound around the outer periphery of the outer conductor 3 has a thickness of 5 μm or more. An ultrafine coaxial cable 10 having a metal film 4a and a laminated tape 4 having a resin film 4b on the outer surface and a jacket 5 having a resin tape wound around the outer periphery of the laminated tape 4
Are arranged in a plane in parallel, the outer jacket 5 and the laminated tape 4 at the ends of the micro coaxial cable 10 are removed, the outer conductor 3 is exposed, and the ground bar is straddled over the outer conductor 3. The pair 6 is soldered, the outer conductor 3 on the end side from the ground bar pair 6 is removed, the insulator 2 is exposed, and the insulating tape 7 is arranged so that the insulators 2 are arranged in a plane at a predetermined pitch.
A cut S2 is formed between the pair of ground bars 6 and the insulating tape 7, and the insulating tape 7 and the insulator 2 at the end are shifted from the cut S2 to the end to expose the center conductor 1. An electric wire processed product 102 is provided. In the processed wire product 102 according to the fourth aspect, since the micro coaxial cable 10 according to the first aspect is used, the insulator 2 and the outer conductor 3 are not damaged, and the quality is high.

[0012] In a fifth aspect, the present invention provides a center conductor 1
An insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 having a conductor wire wound around the outer periphery of the insulator 2, and an inner side surface wound around the outer periphery of the outer conductor 3 having a thickness of 5 μm or more. An ultrafine coaxial cable 10 having a metal film 4a and a laminated tape 4 having a resin film 4b on the outer surface and a jacket 5 having a resin tape wound around the outer periphery of the laminated tape 4
Are arranged in parallel in a plane, and a cut S1 is made near the end of the micro coaxial cable 10, and the cut S1 is formed.
The outer conductor 3 is exposed by displacing the outer jacket 5 and the laminated tape 4 from the end to the end side, and the ground bar pair 6 is soldered across the outer conductors 3.
A copper plate 8 is soldered to the end side so as to straddle the plurality of external conductors 3, the external conductor 3 on the end side from the ground bar pair 6 is removed together with the copper plate 8, and the insulator 2 is exposed. A method of manufacturing a processed wire product is provided. In the method for manufacturing a processed wire product according to the fifth aspect, the micro coaxial cable 10 according to the first aspect is used,
Instead of using the ground bar pair B2 having a small area as in the related art, the copper plate 8 having a large area is used, so that heat can be sufficiently released. Therefore, when the ground bar pair 6 and the copper plate 8 are soldered to the outer conductor 3, it is possible to avoid local heat transfer to the insulator 2, and the insulator 2 is not damaged.
High quality wire products can be manufactured. In addition, since the copper plate 8 can be grasped, the work of cutting the external conductor 3 by bending between the ground bar pair 6 and the copper plate 8 becomes easy. Further, by grasping the copper plate 8 and pulling it out, the work of removing the adhesive tape 20, the outer cover 5, and the laminated tape 4 becomes easy, and it is possible to prevent an excessive force from being applied to the insulator 2.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. Note that the present invention is not limited by this.

FIG. 1 is a perspective view showing a micro coaxial cable 10 according to one embodiment of the present invention. In this micro coaxial cable 10, the outer periphery of a center conductor 1 in which seven tin-plated copper alloy wires having a wire diameter of 0.03 mm are twisted is coated with a fluorine-based resin to a thickness of 0.06 mm to form an insulator 2. A tin-plated copper alloy wire having a wire diameter of 0.03 mm is wrapped around the outer periphery to form an outer conductor 3. A laminated tape 4 of an aluminum film 4a having a thickness of 7 μm on one side and a polyester film 4b on the other side is provided on the outer periphery. The aluminum film 4a is wound with its surface facing inward, and a colored polyester tape is wound around the outer periphery of the aluminum film 4a to form an outer cover 5, which has an outer diameter of 0.33 mm.

FIG. 2 is a perspective view showing a micro coaxial flat cable 100 according to one embodiment of the present invention. This micro coaxial flat cable 100 has a structure in which 20 micro coaxial cables 10 of FIG. 1 are arranged side by side in a plane at a pitch of 0.5 mm and are sandwiched between adhesive tapes 20 from above and below to be integrated.

FIGS. 3 to 9 are explanatory diagrams showing a method of processing the micro coaxial flat cable 100. FIG. For convenience of illustration, the micro coaxial cable 10 is represented by 12 cables. First, a micro coaxial flat cable 100 having a length of 13
Cut to 0 mm. Next, as shown in FIG. 3, a laser beam was applied to a position 15 mm from the end to apply pressure-sensitive adhesive tape 20.
A cut S1 is made between the outer cover 5 and the laminated tape 4. Next, as shown in FIG. 4, the adhesive tape 20 on the end side, the jacket 5, and the laminated tape 4 are integrally shifted from the cut S1 to the end side to expose the outer conductor 3, and the outer conductor 3 is sandwiched from above and below by a pair of ground bars 6 and soldered. next,
The lower surface of the outer conductor 3 on the end side from the ground bar pair 6 is in contact with the ground bar below the ground bar pair 6,
The copper plate 8 is soldered. The ground bar pair 6 has a width of 1
It is a tin-plated rectangular copper wire with a thickness of 0.03 mm and a thickness of 0.03 mm.

FIG. 5A is a plan view of the copper plate 8.
FIG. 5B shows a side view of the copper plate 8. Copper plate 8
Are formed with 20 grooves g at a pitch of 0.5 mm. By fitting each external conductor 3 into these grooves g,
The pitch of the outer conductor 3 is kept exactly at 0.5 mm.

Next, as shown in FIG. 6, the outer conductor 3 is cut by bending at the boundary between the ground bar pair 6 and the copper plate 8, and the outer conductor 3 on the end side, the adhesive tape 20 and the outside are cut from the cut portion. The cover 5 and the laminated tape 4 are removed integrally with the copper plate 8 to expose the insulator 2. Next, as shown in FIG.
An insulating tape 7 is adhered to each of the insulators 2 to maintain the pitch of each insulator 2. As described above, a wire processed product 101 with improved pitch accuracy and easy batch connection was obtained.

Further, as shown in FIG. 8, a laser beam is irradiated to a position between the pair of ground bars 6 and the insulating tape 7, so that a cut S2 is made in the insulator 2. Next, as shown in FIG. 9, the center conductor 1 is exposed by shifting the insulating tape 7 and the insulator 2 on the end side from the cut S2 integrally to the end side. As described above, the processed wire 102 having improved pitch accuracy and easy batch connection was obtained.

-Other Embodiments- (1) The ends of the processed electric wires 101 and 102 from the insulating tape 7 may be cut and removed. (2) The exposed center conductor 1 of the processed wire product 102 may be immersed in a solder bath to apply a solder coat. Thereby, the workability of the collective connection can be further improved. (3) The adhesive tape 20 may be peeled off. This allows
Since the ends are maintained at a constant pitch, there is no problem in the collective connection, but the other parts can be freely moved, so that it is possible to obtain an easy-to-use wire processed product.

[0021]

According to the micro coaxial cable 10 and the micro coaxial flat cable 100 of the present invention, since the inner surface uses the metal film 4a having a thickness of 5 μm or more and the outer surface uses the laminated tape 4 of the resin film 4b, Metal film 4
a can sufficiently release heat, and when soldering the ground bar pair 6 to the outer conductor 3 in manufacturing a wire processed product, it is possible to avoid local heat transfer to the insulator 2, and to prevent the insulator 2 Damage will not occur. Further, when the laser beam is applied to form the cut S1, even if the laser beam intensity varies, the outer conductor 3 is not damaged because the thick metal film 4a protects it.

According to the processed electric wires 101 and 102 of the present invention, since the micro coaxial cable 10 is used, the insulator 2 and the outer conductor 3 are not damaged, and the quality can be improved.

According to the method for manufacturing a processed wire product of the present invention,
Since the micro coaxial cable 10 is used and the copper plate 8 is used, when the ground bar pair 6 and the copper plate 8 are soldered to the external conductor 3, the heat can sufficiently escape to the copper plate 8,
Local heat transfer to the insulator 2 can be avoided, and the insulator 2
The quality can be improved without causing any damage. In addition, since the copper plate 8 can be grasped, the work of cutting the external conductor 3 by bending between the ground bar pair 6 and the copper plate 8 becomes easy. Further, by grasping and pulling out the copper plate 8, the work of removing the adhesive tape 20, the jacket 5 and the laminated tape 4 becomes easy, and it is also possible to prevent an excessive force from being applied to the insulator 2.

[Brief description of the drawings]

FIG. 1 is a sectional view of a micro coaxial cable according to the present invention.

FIG. 2 is a perspective view of a micro coaxial flat cable according to the present invention.

FIG. 3 is an explanatory diagram of a step of making a cut in an adhesive tape or the like in a process of manufacturing a processed wire product according to the present invention.

FIG. 4 is an explanatory diagram of a step of soldering a pair of ground bars in a process of manufacturing a processed wire product according to the present invention.

FIG. 5 is a plan view and a side view of a copper plate used for manufacturing a processed wire product according to the present invention.

FIG. 6 is an explanatory view of a step of exposing an insulator during a process of manufacturing a processed wire product according to the present invention.

FIG. 7 is an explanatory diagram of a step of attaching an insulating tape in a process of manufacturing a processed wire product according to the present invention.

FIG. 8 is an explanatory view of a step of making a cut in an insulator in a process of manufacturing a processed wire product according to the present invention.

FIG. 9 is an explanatory view of a step of exposing a center conductor during a manufacturing process of a processed wire product according to the present invention.

FIG. 10 is a perspective view of an example of a conventional micro coaxial flat cable.

FIG. 11 is an explanatory view of a step of making a cut in an adhesive tape or the like in a conventional manufacturing process of a processed wire product.

FIG. 12 is an explanatory view of a step of soldering a pair of ground bars in a conventional manufacturing process of a processed wire product.

FIG. 13 is an explanatory view of a step of exposing an insulator during a conventional process of manufacturing a processed wire product.

FIG. 14 is an explanatory view of a step of welding an insulating film in a conventional manufacturing process of a processed wire product.

FIG. 15 is an explanatory diagram of a step of making a cut in an insulator during a conventional manufacturing process of a processed wire product.

FIG. 16 is an explanatory view of a step of exposing a center conductor in a conventional manufacturing process of a processed wire product.

FIG. 17 is a plan view of an example of a conventional processed wire product.

FIG. 18 is an explanatory diagram of a problem that occurs during a manufacturing process of a conventional wire processed product.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Center conductor 2 Insulator 3 Outer conductor 4 Laminated tape 4a Aluminum film (metal film) 4b Polyester film (resin film) 5 Jacket 6, B2 Ground bar pair 7 Insulating tape 8 Copper plate 10 Micro coaxial cable 20 Adhesive tape 50 Micro coaxial Cable 54 Copper-evaporated polyester tape 54a Copper-deposited layer 54b Polyester film 100 Micro coaxial flat cable 101, 102 Wire processed product 500 Micro coaxial flat cable 502 Wire processed product F Insulating film S1, S2 Cut g Groove

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tadashi Yamaguchi 300 Oya Oya, Ueda-shi, Nagano Tokyo Special Electric Wire Co., Ltd.Ueda Plant (72) Inventor Hotaka Sakaguchi 300 Oya Oya, Ueda-shi, Nagano Tokyo Electric Cable Co., Ltd. F-term in Ueda factory (reference) 5G309 FA04 FA06 5G319 FA10 FC06 FC21 FC21 GA01

Claims (5)

[Claims] 1. A center conductor 1, an insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 having a conductor wire wrapped around the outer periphery of the insulator 2, and wrapping around the outer periphery of the outer conductor 3. An ultrafine coaxial cable 10 having an inner surface provided with a metal film 4a having a thickness of 5 μm or more and an outer surface provided with a laminated tape 4 of a resin film 4b. 2. A center conductor 1, an insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 in which a conductor wire is wound around the outer periphery of the insulator 2, and an outer periphery of the outer conductor 3. A micro-coaxial cable 10 having a laminated tape 4 of a metal film 4a having a thickness of 5 μm or more on the inner side and a resin film 4b on the outer side, and a jacket 5 having a resin tape wound around the outer periphery of the laminated tape 4, An ultrafine coaxial flat cable 100, wherein a plurality of parallel flat coaxial cables are arranged in a plane and integrated. 3. A center conductor 1, an insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 in which a conductor wire is wound around the outer periphery of the insulator 2, and an outer periphery of the outer conductor 3. A micro-coaxial cable 10 having a laminated tape 4 of a metal film 4a having a thickness of 5 μm or more on the inner side and a resin film 4b on the outer side, and a jacket 5 having a resin tape wound around the outer periphery of the laminated tape 4, Plural pieces are arranged side by side in parallel,
The outer jacket 5 and the laminated tape 4 at the ends of the micro coaxial cable 10 are removed, the outer conductor 3 is exposed, and a pair of ground bars 6 is soldered over the outer conductor 3 to form a pair of ground bars. 6. A processed electric wire product 101, wherein the outer conductor 3 on the end side from the end 6 is removed, the insulator 2 is exposed, and the insulators 2 are put together with an insulating tape 7 so as to be arranged in a plane at a predetermined pitch. . 4. A center conductor 1, an insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 in which a conductor wire is horizontally wound around the outer periphery of the insulator 2, and an outer periphery of the outer conductor 3. A micro-coaxial cable 10 having a laminated tape 4 of a metal film 4a having a thickness of 5 μm or more on the inner side and a resin film 4b on the outer side, and a jacket 5 having a resin tape wound around the outer periphery of the laminated tape 4, Plural pieces are arranged side by side in parallel,
The outer jacket 5 and the laminated tape 4 at the ends of the micro coaxial cable 10 are removed, the outer conductor 3 is exposed, and a pair of ground bars 6 is soldered over the outer conductor 3 to form a pair of ground bars. 6, the outer conductor 3 on the end side is removed, the insulator 2 is exposed, and the insulators 2 are put together with an insulating tape 7 so that the insulators 2 are arranged in a plane at a predetermined pitch. A cut wire S2, wherein the center conductor 1 is exposed by displacing the insulating tape 7 and the insulator 2 at the end from the cut S2 toward the end. 5. A center conductor 1, an insulator 2 covering the outer periphery of the center conductor 1, an outer conductor 3 having a conductor wire wound around the outer periphery of the insulator 2, and a periphery of the outer conductor 3. A micro-coaxial cable 10 having a laminated tape 4 of a metal film 4a having a thickness of 5 μm or more on the inner side and a resin film 4b on the outer side, and a jacket 5 having a resin tape wound around the outer periphery of the laminated tape 4, Plural pieces are arranged side by side in parallel,
A cut S1 is made in the vicinity of the end of the micro coaxial cable 10, and the outer jacket 3 and the laminated tape 4 are shifted from the cut S1 to the end to expose the outer conductor 3, and the outer conductor 3 is exposed. And a copper plate 8 is soldered on the end side of the pair of ground conductors 6 to the end side of the pair of external conductors 3. And removing the outer conductor 3 on the side together with the copper plate 8 to expose the insulator 2.