JP2002020899A - Plating solution regenerator, substrate plating device and plating system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the plating cost by removing a deteriorated additive and recycling the plating solution. SOLUTION: An organic matter removing filter 19 is provided to remove the deteriorated additive in the waste solution, the waste solution is introduced into a regeneration tank 15, the waste solution is passed through the filter 19, the additive concentration in the plating solution freed from the additive stored in the regeneration tank 15 is adjusted to a specified value by controlling an additive analyzing part 5 and an additive replenishing part 7, then the regenerated plating solution is delivered from a delivery pipe 31, and a control part 9 is furnished to control the process. Since the regenerated plating solution with the additive removed by the filter 19 and the additive concentration adjusted is delivered, the waste solution with the plating solution as the main component is recycled, and the plating cost is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waste liquid containing a plating solution as a main component, which is generated when plating a semiconductor wafer or a glass substrate for a liquid crystal display device (hereinafter simply referred to as a substrate). The present invention relates to a plating solution regenerating device, a substrate plating device, and a plating system for regenerating.

[0002]

2. Description of the Related Art Conventionally, in an electrolytic plating process on a substrate by a substrate plating apparatus, the plating solution in the apparatus decreases as time passes, and the plating solution is supplied from a solution replenishing apparatus so as to compensate for this decrease. Refilling.

The plating solution generally contains several kinds of organic additives (referred to as brighteners and carriers), which gradually deteriorate when exposed to air or the like. Function will be degraded.

[0004]

However, the prior art having such a structure has the following problems. That is, since the additive is contained in the plating solution in a deteriorated state even after the replenishment of the plating solution, the presence of the deteriorated additive adversely affects the finish of the plating process. Therefore, in order to prevent such adverse effects, particularly in the semiconductor industry, the plating solution itself is periodically replaced and disposed of as waste solution in order to prevent contamination of the substrate. There is a problem that the consumption increases and the cost required for the plating process increases.

[0005] When the plating solution is exchanged as described above, an operation for the exchange is required, and the maintenance is complicated. Further, since a large amount of copper ions is contained in the waste liquid of the plating solution, discharging the waste liquid is not preferable for global environmental conservation. In addition, since it is necessary to perform waste liquid treatment,
There is a problem that the processing cost for that is increased.

[0006] The present invention has been made in view of such circumstances, and it is possible to reduce the cost required for the plating process by removing the deteriorated additive and reusing the plating solution. An object of the present invention is to provide a plating solution regenerating device, a substrate plating device, and a plating system that can be used.

[0007]

The present invention has the following configuration to achieve the above object. That is, a plating solution regenerating apparatus according to claim 1 is a plating solution regenerating apparatus that regenerates a waste solution containing a plating solution as a main component, a take-in pipe for taking the waste solution, a storage tank for storing the taken waste solution, and a waste solution. An additive removing means for removing the deteriorated additive therein, a regeneration tank for storing waste liquid passing through the additive removing means as a removed plating solution, and addition of a removed plating solution stored in the regeneration tank. An additive analyzing section for analyzing the agent concentration, an additive replenishing section for replenishing the additive according to the analysis result of the additive analyzing section, and sending out the removed plating solution supplemented with the additive as a regenerated plating solution. Pipe, waste liquid is taken into the storage tank from the intake pipe, and the waste liquid in the storage tank is passed through the additive removing means and stored in the regeneration tank. A control unit that controls the additive replenishment unit to adjust the additive concentration of the removed plating solution stored in the regeneration tank to a predetermined value, and then controls the additive to be sent out from the delivery pipe as a regeneration plating solution. It is characterized by having.

Further, the plating solution regenerating apparatus according to claim 2 is the plating solution regenerating apparatus according to claim 1, wherein the regenerating tank also serves as the storage tank, and the additive removing means is provided from the regenerating tank. It is arranged in a circulation path which is sent out and returned to the regeneration tank again, wherein the control unit circulates the waste liquid to the additive removing means a plurality of times.

A plating solution regenerating apparatus according to a third aspect of the present invention is the plating solution regenerating apparatus according to the first or second aspect, wherein the particle removing means removes particles in a waste liquid in addition to the additive removing means. It is characterized by having.

A plating solution regenerating apparatus according to a fourth aspect of the present invention is the plating solution regenerating apparatus according to any one of the first to third aspects, further comprising a separate buffer tank between the regeneration tank and the delivery pipe. After the regenerating plating solution in the regenerating tank is transferred to the buffer tank, it is sent out from the delivery pipe.

According to a fifth aspect of the present invention, there is provided a substrate plating apparatus including the plating solution regenerating apparatus according to the first aspect of the present invention, wherein a waste liquid generated in the plating process on the substrate is regenerated and reused in the plating process on the substrate. It is characterized by doing.

According to a sixth aspect of the present invention, there is provided a plating system comprising: the substrate plating apparatus according to the fifth aspect; and a liquid replenishing apparatus for replenishing the substrate plating apparatus with a plating solution. is there.

According to a seventh aspect of the present invention, in the plating system of the sixth aspect, there is provided a plating solution analyzing apparatus for analyzing a plating solution taken from the substrate plating apparatus and analyzing a concentration of an additive. Further, the present invention is characterized in that waste liquid generated in the plating solution analyzer is also regenerated by the plating solution regenerating device.

[0014]

The operation of the first aspect of the invention is as follows. That is, the waste liquid is stored in the storage tank through the intake pipe, and the waste liquid is passed through the additive removing means to remove the deteriorated additive and stored in the regeneration tank as the removed plating solution. After the control unit adjusts the additive to a predetermined concentration by replenishing the additive from the additive replenishment unit according to the concentration analyzed by the additive analysis unit, the regenerating plating solution in the regenerating tank is sent out from the delivery pipe.

According to the second aspect of the present invention, since the waste liquid is circulated a plurality of times to the additive removing means provided in the circulation path for circulating the regeneration tank, the rate of removal of the deteriorated additive is reduced. Can be increased.

According to the third aspect of the present invention, the cleanliness of the plating solution can be increased by removing particles in the waste liquid by the particle removing means.

Further, according to the present invention, the waste liquid to be processed next can be taken in immediately after the plating liquid is transferred to the buffer tank.

Further, according to the fifth aspect of the present invention, since the plating solution regenerating device is provided, it is possible to remove the adverse effect of the deteriorated additive.

According to the sixth aspect of the present invention, the same effect as described above also occurs in a plating system including a substrate plating apparatus having a plating solution regenerating apparatus and a liquid replenishing apparatus.

According to the seventh aspect of the present invention, the same operation as described above occurs even in a plating system further provided with a plating solution analyzer.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 relates to an embodiment of the present invention,
FIG. 2 is a block diagram showing a schematic configuration of a plating solution regenerating apparatus.

The plating solution regenerating apparatus 1 includes a regenerating unit 3 for taking in a waste solution containing a plating solution as a main component and performing a process for regenerating it as a regenerating plating solution, and an additive for removing the degraded additive from the plating solution. Analysis unit 5 for analyzing the concentration of the additive, an additive replenishment unit 7 for replenishing the plating solution from which the deteriorated additive has been removed with an additive based on the analysis result of the additive analysis unit 5, A plating solution from which a degraded additive is removed by taking a waste liquid into the unit 3, sending out a regenerated plating solution from the regenerating unit 3, and controlling the additive replenishing unit 7 based on the analysis result by the additive analyzing unit 5. And a control unit 9 for performing control such as controlling the additive concentration to a predetermined additive concentration.

The additive analyzer 5 is, for example, a CVS
The additive concentration in the plating solution is quantified by the method (cyclic voltammetric stripping).

The regenerating section 3 takes in the waste plating solution into the regenerating tank 15 through a take-in pipe 13 provided with a pump 11. The regeneration tank 15 is an upper limit sensor 1 for detecting a liquid level.
5a and a lower limit sensor 15b, and the controller 9 drives the pump 11 with reference to these outputs. Further, the regeneration tank 15 is provided with a circulation path 17 that takes in waste liquid from the bottom and returns the waste liquid to the upper part of the regeneration tank 15.

An organic substance adsorption filter 19 and a particle removal filter 21 are mounted downstream of the organic substance adsorption filter 19 in the circulation path 17. Pump 23 provided in circulation path 17
Is driven, the waste liquid in the regeneration tank 15 is returned to the regeneration tank 15 again through the organic substance adsorption filter 19 and the particle removal filter 21. The particle removal filter 21 may be disposed upstream of the organic substance adsorption filter 19 by exchanging the positional relationship between the organic substance adsorption filter 19 and the particle removal filter 21.

The regenerating tank 15 in the present embodiment
Corresponds to the storage tank and the regeneration tank in the present invention.

The sampling pipe 5a of the above-described additive analyzer 5 is disposed so that the lower end is located slightly below the lower limit sensor 15b of the regeneration tank 15. Further, the supply pipe 7a of the additive replenishment unit 7 described above is disposed so that its lower end is located near the upper limit sensor 15a of the regeneration tank 15.

A buffer tank 25 is provided beside the regeneration tank 15. This buffer tank 25 also has
Similarly to the regeneration tank 15, an upper limit sensor 25a and a lower limit sensor 25b are attached. A transfer pipe 27 extends from the regeneration tank 15 to the buffer tank 25, and its starting end is located near the lower limit sensor 15 b of the regeneration tank 15, and its end is located at the upper limit sensor 25 a of the buffer tank 25.
It is located near. The transfer pipe 27 is provided with a pump 29.
Is attached.

The regeneration tank 15 and the buffer tank 2
The upper limit sensors 15a and 25a and the lower limit sensors 15b and 25b attached to the sensor 5 are exemplified by capacitance sensors.

The lower end sensor 2 of the buffer tank 25 has a starting end.
The delivery pipe 31 provided so as to be located in the vicinity of 5b is used for sending out the regenerating plating solution in the buffer tank 25 from the plating solution regenerating apparatus 1. Delivery of the regenerated plating solution is performed by operating a pump 33 attached to the delivery pipe 31.

The above-described pumps 11, 23, 29, 33
A magnet pump or a bellows pump that sends out a fluid by a rotational force generated by a magnetic coupling force can be used.

The organic substance adsorption filter 19 corresponding to the additive removing means of the present invention includes, for example, activated carbon, activated carbon fiber,
It is made of a material containing an adsorbent such as zeolite and ceramic such as activated alumina. Zeolites refer to crystalline molecular sieves having a silicate lattice, the membrane of which is suitable for the separation of gas mixtures. In the crystal,
There are several angstrom pores available as molecular sieves.

Further, as the particle removing filter 21 corresponding to the particle removing means of the present invention, a membrane filter having a hole diameter of about 0.1 μm made of fluororesin or polyethylene is exemplified.

Next, the operation of the plating solution regenerating apparatus having the above-described configuration will be described with reference to the operation explanatory diagrams of FIGS. It is assumed that the regenerated plating solution obtained by performing the regenerating process is already stored in the buffer tank 25.

First, the control unit 9 operates the pump 11,
For example, a waste solution containing a plating solution discharged from a substrate plating apparatus (not shown) is taken in from the intake pipe 13 and stored in the regeneration tank 15. At this time, when the upper limit sensor 15a operates, the control unit 9 stops the pump 11. FIG. 2A shows this state.

When the waste liquid is stored in the regenerating tank 15, it is preferable that the additive analyzer 5 examines the degree of deterioration of the additive and adjusts the circulation time and the number of circulations of the waste liquid, which will be described later.

Next, the pump 33 is operated to send the regenerated plating solution stored in the buffer tank 25 from the delivery pipe 31 to the outside.

Next, the control section 9 operates the pump 23. As a result, the waste liquid stored in the regeneration tank 15 flows through the circulation path 17 and returns to the regeneration tank 15 again through the organic substance adsorption filter 19 and the particle removal filter 21. FIG. 2B shows the above state. This circulation is repeated for a certain time or a certain number of times. As a result, the deteriorated additive contained in the waste liquid is removed by the organic substance adsorption filter 19, and the particles in the waste liquid are removed by the particle removal filter 21. Generally, in the semiconductor industry and the like where a high level of cleanliness is required, it is apt to be avoided to reuse the processing solution. However, by removing particles in the waste solution, the cleanness of the regenerated plating solution can be increased. Therefore, the use of the recycled plating solution can be promoted.

Although the waste liquid contains normal additives which have not deteriorated, they are hardly adsorbed by the organic substance adsorption filter 19 because they have a large molecular weight. Since the deteriorated additive has various molecular weights depending on the degree of deterioration and the like, there is a case where the additive cannot be completely removed only by once passing through the organic substance adsorption filter 19. Therefore,
With the above-described configuration, the waste liquid is circulated through the organic substance adsorption filter 19 so that the removal rate of the deteriorated additive can be increased.

After stopping the pump 23 and terminating the circulation, the control unit 9 removes the deteriorated additives and particles from the regenerating tank 15 by the additive analysis unit 5 (hereinafter, this waste liquid is removed). (Referred to as plating solution). Specifically, the sampling pipe 5
The removed plating solution is collected from a and the concentration of the additive is quantified by the CVS method. Then, based on the result, the additive replenishment unit 7 replenishes the removed plating solution with the additive from the supply pipe 7a (see FIG. 3A).

The additive replenishing section 7 is added to the removed plating solution.
After replenishing the additives, it is preferable that the additive analyzer 5 re-quantifies the additives and confirms whether the replenishment amount of the additives is appropriate.

The removed plating solution (hereinafter referred to as “regenerated plating solution”) stored in the regenerating tank 15 and adjusted for the additive is transferred to the buffer tank 25. Specifically, the pump 29 is operated to transfer through the transfer pipe 27 (see FIG. 3B). Thus, buffer tank 2
Since the regenerating plating solution is transferred to the tank 5, the waste liquid to be regenerated next can be quickly taken into the regenerating tank 15. Therefore, it is possible to apparently shorten the waste liquid regeneration processing time.

According to the regenerating plating apparatus 1 described above, the deteriorated additive is removed by passing the waste liquid through the additive adsorption filter 19, and the concentration of the additive is adjusted to be sent out as a regenerated plating solution. Waste liquid containing liquid as a main component can be reused. Therefore, the cost required for the plating process can be reduced.

The plating solution regenerating apparatus can be modified as follows.

(1) In the above configuration, the storage tank and the regeneration tank in the present invention are shared by the regeneration tank 15, but the storage tank may be provided separately. In this case, the organic matter adsorption filter 19 and the particle removal filter 21 may be provided in the pipe from the storage tank to the regeneration tank.

(2) The particle removal filter 21 is not indispensable, and may be the organic substance adsorption filter 19 alone. In this case, for example, the particles may be removed on the side of the apparatus that uses the regenerated plating solution sent from the plating solution regenerating apparatus 1.

(3) The plating solution regenerating apparatus according to the present invention
The buffer tank 25 is not an essential component, and the buffer tank 25 need not be provided if there is no problem even if the regenerating time of the plating solution is long.

(4) Instead of the organic substance adsorption filter 19,
A decomposition unit that contains ozone gas or oxygen gas, or both ozone gas and oxygen gas in waste liquid, and decomposes and removes additives that have been degraded by irradiating ultraviolet rays, or a catalyst that adsorbs and decomposes degraded additives using a catalyst An additive removing means such as a unit may be employed.

<Substrate Plating Apparatus> FIG. 4 shows an embodiment of a substrate plating apparatus according to the present invention.

The substrate plating apparatus 41 includes the plating solution regenerating apparatus 1 described above, a support section 43 for supporting the substrate W with the plating surface facing downward, and a plating tank 45 for performing the plating processing on the substrate W. And a plating solution circulation tank 47 for circulating the plating solution. It should be noted that the apparatus may further include a solution replenishing device for replenishing a new plating solution.

The support portion 43 is configured to be able to move up and down with respect to the plating tank 45 and to be rotatable around a vertical axis.
When performing the plating process, the plating tank 45 together with the support 43 is required.
And the substrate W is rotated at a low speed.

More specifically, the mask has an annular shape, contacts the peripheral portion of the lower surface of the substrate W to support the substrate W, conducts the plating surface, and prevents the plating solution from flowing out to the periphery. The member 43a and the mask member 43a
Is attached to the lower end, and is configured to be rotatable and vertically movable, and a substrate presser 43c that abuts against the back surface of the substrate W and presses the substrate W against the mask member 43a.
And

The plating tank 45 has a double structure. The central part is a processing tank 45a, and the outer peripheral part is a collecting tank 45b.
It is. A processing tank 45a to which a plating solution is supplied from below is vertically divided by a punching plate 45c, and an anode electrode 45d is provided below the processing tank 45a.

The plating solution overflowing from the processing tank 45a and collected in the collecting tank 45b is sent to the plating liquid circulation tank 47 and temporarily stored therein, and is again stored in the processing tank 45 by the pump 47a.
sent to a. Further, the plating solution circulation tank 47 is provided with an additive replenishing part 49 so as to replenish the plating solution mainly containing pure water, copper sulfate or the like with an organic additive. Further, an intake pipe 13 and a delivery pipe 31 from the plating solution regenerating apparatus 1 extend to the processing tank 47.

In the substrate plating apparatus 41 having the above configuration,
With the substrate W supported by the support portion 43, the substrate W is immersed in the processing bath 45a as indicated by a dotted line in the drawing. Further, the plating solution is circulated by operating the pump 47a, and the plating process is performed while rotating the spin base 43b.

As the plating process is performed, the plating solution is contaminated by contamination of the substrate W, contaminated by elution from the plating tank 45 and the circulating system, and is in the form of a film released from the surface of the anode electrode 45d. Contamination due to the precipitate (so-called black film) and the like are generated, and debris of an organic substance generated by deterioration of the additive is mixed. Therefore, the plating solution (waste solution) that has been discarded after being used for a predetermined time is sent from the intake pipe 13 into the plating solution regenerating apparatus 1, and the regenerated plating solution in the buffer tank 25 is sent from the sending pipe 31 to the plating solution. Take in the circulation tank 47.

As a result, the plating treatment can be performed using the regenerated plating solution from which the adverse effect of the deteriorated additive has been removed, and the consumption of the plating solution can be suppressed. Therefore, the cost required for the plating process in the substrate plating apparatus can be suppressed.

<Substrate Plating Apparatus> FIG. 5 is a block diagram showing an embodiment of a plating system according to the present invention.

In one substrate plating apparatus 41, the intake pipe 13 and the delivery pipe 31 of one plating solution regenerating apparatus 1 are connected. Further, one solution replenishing device 51 for supplementing the insufficient plating solution is attached to the substrate plating device 41, and one solution replenishing device 51 for analyzing the plating solution in the plating solution circulation tank 47 of the substrate plating device 41. A plating solution analyzer 53 is provided. The plating solution analyzer 53 gives an analysis result such as concentration information to the solution replenisher 51.

In the plating system having the above-described structure, a waste liquid not containing a plating solution as a main component and containing a large amount of a rinsing solution, for example, flows from the substrate plating apparatus 41 and the plating solution analyzing apparatus 53. Since these cannot be regenerated as a plating solution, they are discarded 41x, 5
3x. On the other hand, the waste liquid containing the plating liquid as a main component, which is discharged from the substrate plating apparatus 41 and the plating liquid analyzing apparatus 53, is taken into the plating liquid regenerating apparatus 1 through the intake pipe 31, and is regenerated into a regenerated plating liquid and is supplied to each apparatus. It is supplied via a delivery pipe 31.

According to such a configuration, the regenerated plating solution can be used also in the plating system, so that the consumption of the plating solution in the substrate plating apparatus 1 and the plating solution analyzer 53 can be suppressed. Therefore, the cost required for the plating process in the plating system can be reduced.

It should be noted that even if the plating system does not include the plating solution analyzer 53 and includes the substrate plating device 41, the solution replenishing device 51, and the plating solution regenerating device 1, the cost required for the plating process is reduced. Can be reduced.

In the above-described plating system, a configuration in which one substrate plating apparatus 41 is provided with one plating solution regenerating apparatus 1 has been exemplified. 6 may be adopted.

That is, a plurality of substrate plating apparatuses 41
One plating solution regenerating device 1, one plating solution analyzing device 53, and a solution replenishing device 51 are connected to (three in FIG. 6). With such a configuration, the plating solution regenerating apparatus 1 regenerates any one of the plurality of substrate plating apparatuses 41 and one of the plating solution analyzers 53, thereby improving the operation rate. be able to.

[0065]

As is apparent from the above description, according to the first aspect of the present invention, the waste liquid is passed through the additive removing means to remove the deteriorated additive and adjust the concentration of the additive. Since the plating solution is sent out as a regenerated plating solution, a waste solution containing the plating solution as a main component can be reused. Therefore, the cost required for the plating process can be reduced.

According to the second aspect of the present invention, since the waste liquid is circulated a plurality of times, the removal rate of the deteriorated additive can be increased, so that the waste liquid can be appropriately regenerated. .

According to the third aspect of the present invention, since the cleanliness of the regenerated plating solution can be increased by removing particles in the waste liquid, the recycled plating solution can be recycled even in the semiconductor industry where a high level of cleanliness is required. Use of plating solution can be promoted.

According to the fourth aspect of the present invention, the waste liquid can be taken in immediately after the plating liquid has been transferred to the buffer tank and the next waste liquid can be regenerated, so that it is necessary to reproduce the apparent waste liquid. Time can be reduced.

Further, according to the fifth aspect of the present invention, it is possible to use a regenerated plating solution from which the adverse effect of the deteriorated additive has been removed, so that the consumption of the plating solution can be suppressed.
Therefore, the cost required for the plating process in the substrate plating apparatus can be suppressed.

Further, according to the present invention, since the regenerated plating solution can be used in the plating system, the consumption of the plating solution in the substrate plating apparatus can be suppressed. Therefore, the cost required for the plating process in the plating system can be reduced.

According to the seventh aspect of the present invention, since the regenerated plating solution can be used even in a plating system having a plating solution analyzer, the consumption of the plating solution can be reduced. The cost required for the plating process in the plating system can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a schematic configuration of a plating solution regenerating apparatus according to an embodiment.

FIG. 2 is a diagram provided for explanation of operation.

FIG. 3 is a diagram provided for explanation of operation.

FIG. 4 is a diagram showing a schematic configuration of a substrate plating apparatus according to an embodiment.

FIG. 5 is a block diagram showing an example of a plating system.

FIG. 6 is a block diagram showing another example of the plating system.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Plating liquid regeneration apparatus 3 ... Regeneration processing part 5 ... Addition and reanalysis part 7 ... Additive replenishment part 9 ... Control part 13 ... Intake pipe 15 ... Regeneration tank (storage tank, regeneration tank) 17 ... Circulation path 19 ... Organic matter Adsorption filter (additive removing means) 21: Particle removing filter (particle removing means) 25: Buffer tank 31: Delivery pipe 41: Substrate plating device 51: Liquid replenishing device 53: Plating solution analyzer

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) C25D 21/14 C25D 21/14 B 21/18 21/18 GH G01N 33/20 G01N 33/20 Q (72) Invention Person Yasuhiro Mizohata 4-chome Tenjin, Kitamachi, Horikawa-dori-Terauchi, Kamigyo-ku, Kyoto 1 Dainippon Screen Mfg. Co., Ltd. F-term (reference) 2G055 AA07 AA30 BA11 DA02 DA26 FA09 FA10 4D006 GA02 JA56A JA67A KA02 KA63 KB14 MA22 MC22 MC28 PB08 PC22 PC80 4K024 AB01 BA11 BB12 CA02 CB11 CB24 CB26 GA16

Claims (7)

[Claims] 1. A plating solution regenerating apparatus for regenerating a waste solution containing a plating solution as a main component, an intake pipe for taking in the waste solution, a storage tank for storing the taken waste solution, and a degraded additive in the waste solution. An additive removing unit; a regeneration tank for storing waste liquid passing through the additive removing unit as a removed plating solution; and an additive analyzer for analyzing an additive concentration of the removed plating solution stored in the regeneration tank. An additive replenishing unit that replenishes the additive according to the analysis result by the additive analyzing unit; a delivery pipe that sends out the removed plating solution with the additive replenished as a regenerated plating solution; and The waste liquid is taken into the storage tank, the waste liquid in the storage tank is circulated through the additive removing means and stored in the regenerating tank, and the additive analyzing section and the additive replenishing section are controlled to control the additive. After adjusting the additive concentration of a removed plating solution is stored in the raw tank to a predetermined value,
And a control unit for controlling so as to send the regenerated plating solution from the delivery pipe. 2. The plating solution regenerating apparatus according to claim 1, wherein the regenerating tank also serves as the storage tank, and the additive removing means is sent from the regenerating tank and returned to the regenerating tank again. Wherein the control unit circulates the waste liquid to the additive removing means a plurality of times. 3. The plating solution regenerating apparatus according to claim 1, further comprising a particle removing unit for removing particles in a waste liquid in addition to the additive removing unit. . 4. The plating solution regenerating apparatus according to claim 1, further comprising a separate buffer tank between the regeneration tank and a delivery pipe, wherein the regeneration plating solution in the regeneration tank is buffered. A plating solution regenerating apparatus, wherein the plating solution is sent out from the delivery pipe after being transferred to a tank. 5. A substrate plating apparatus comprising the plating solution regenerating apparatus according to claim 1, wherein a waste liquid generated by plating the substrate is reclaimed and reused for plating the substrate. 6. A plating system, comprising: the substrate plating apparatus according to claim 5; and a liquid replenishing apparatus that replenishes the substrate plating apparatus with a plating solution. 7. The plating system according to claim 6, further comprising: a plating solution analyzer that analyzes a plating solution taken from the substrate plating device to analyze a concentration of an additive, wherein the plating solution is generated by the plating solution analyzer. A plating solution wherein the waste liquid to be recycled is also regenerated by the plating solution regenerating apparatus.