JP2002016166A - Package and assembly method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problems that a slight gap is generated inside a case and a cap, isolation between a transmission terminal and a reception terminal provided inside lacks, transmission signals are connected to the reception terminal and thereby a reception system malfunctions since only the outer frame of the case and the cap are sealed at the time of sealing the case and the cap in a conventional package. SOLUTION: A resistor is provided between the upper surface of a wall for sectioning the transmission terminal and the reception terminal inside the case and the cap to be sealed and the isolation between transmission and reception and the isolation between the plurality of reception terminals are improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for storing a high-frequency component such as a dielectric substrate or a semiconductor circuit operating in a high-frequency band such as a microwave or a millimeter wave, and a method of assembling the same.

[0002]

2. Description of the Related Art FIGS. 5 and 6 show the structure of a conventional package. In the drawing, 1 is a case formed by laminating dielectric substrates or made of a metal such as aluminum, 2 is a cavity formed with a concave groove on one surface of the case 1, 3
The case 1 has one opening end on the same surface as the cavity forming surface (B surface) of the case 1, and has the other opening end on the bottom surface (C surface) of the case 1 facing the cavity forming surface. A transmission terminal (waveguide terminal) 4 formed of a penetrating waveguide, and a transmission terminal 4 formed of a waveguide penetrating the case 1 like the transmission terminal 3, and provided separately from the transmission terminal 3 in the case 1. Terminals, 5 are bias / control terminals provided on an outer edge protruding from the outer periphery of the case 1, 6 are caps bonded to the cavity forming surface (B surface) of the case 1, 7 are transmission and A wall separating reception terminals, 8 is a high-frequency component such as a dielectric substrate or a semiconductor circuit, 9 is a sealing portion (seal portion), and 10 is a signal leakage path between transmission and reception.

Next, the configuration and characteristics of a conventional package will be described. As shown in FIGS. 5 and 6, a conventional package includes a bottom surface (D) of a case 1 including a cavity 2, a transmission terminal 3, a reception terminal 4, and a bias / control terminal 5.
Surface), a high-frequency component such as a dielectric substrate or a semiconductor circuit 8
And the case 1 and the cap 6 are bonded at the sealing location 9,
The package was hermetically sealed by soldering or welding. Bias from the control terminal 5
The high frequency component 8 operates according to the control signal, and the high frequency component 8
The high-frequency output signal output from the transmitting system of Case 1 is
Component 8 provided on the bottom surface (D surface) inside the cavity
Feedthrough 81 (a dielectric substrate provided with a microstrip line in the inner layer) for connecting the transmission terminal 3 and the transmission terminal 3 at a high frequency
To the transmission terminal 3 An antenna element (not shown) is provided on the bottom surface side of case 1, and a high-frequency output signal output to transmission terminal 3 travels in the waveguide of transmission terminal 3 and is output from the opening end of transmission terminal 3 on the bottom surface of case 1. Then, the antenna element is fed by the output signal, and the transmission radio wave is emitted, for example, toward the bottom surface of the case 1. The received wave input to the antenna element is input to the opening end of the receiving terminal 4 on the bottom surface of the case 1, and the input signal travels in the waveguide of the receiving terminal 4 to connect the high-frequency component 8 and the receiving terminal 4 to each other at a high frequency. The signal is input to the receiving system of the high-frequency component 8 through the feedthrough 82 (a dielectric substrate provided with a microstrip line in the inner layer), and the received signal is amplified or demodulated.
However, in sealing in which only the outer frame of the cap 1 is joined as in the sealing portion 9, a small gap (for example, 0.01 mm to
(Approximately 0.1 mm). For this reason, when the transmission terminal 3 and the reception terminal 4 are provided inside the case 1, as shown in FIG. 6, the transmission signal output from the transmission terminal 3 via the leakage path 10 of the signal between transmission and reception, There is a problem that the liquid leaks from the cap-side opening end of the transmitting terminal 3 to the cap-side opening end of the receiving terminal 4 through this gap, is input to the receiving system of the high-frequency component 8 through the receiving terminal 4, and the receiving system malfunctions. .

[0004]

As described above, in the conventional package, only the outer frame of the case and the cap is sealed to seal the case and the cap. There is a problem that a large gap is generated, the isolation between the transmission terminal and the reception terminal provided inside is insufficient, and the transmission signal is coupled to the reception terminal, so that the reception system malfunctions.

The present invention has been made to solve such a problem. A resistor is provided on an upper surface of a wall separating a transmitting and receiving terminal in a case, that is, a portion facing a cap, and isolation between terminals is provided. The purpose is to secure.

[0006]

According to a first aspect of the present invention, there is provided a package having first and second waveguides and a cavity provided separately from each other.
A case where a dielectric substrate or a high-frequency semiconductor circuit connected to each of the first and second waveguides is mounted, and an opening end of the cavity and the first and second waveguides are closed. , A cap joined to the case, and a resistor provided between the first and second waveguides and between the joining surface of the cap and the cap. .

A package according to a second aspect of the present invention is the
The first and second waveguides are a reception waveguide terminal and a transmission waveguide terminal, respectively.

[0008] The package according to a third aspect of the present invention is the package according to the third aspect.
The first and second waveguides are reception waveguide terminals.

In a package according to a fourth aspect of the present invention, the first and second waveguides communicate a high-frequency signal output from the dielectric substrate or the high-frequency semiconductor circuit to an opening end of the cap on the joint surface side. The other open end of the transmission line is a waveguide terminal for transmission.

[0010] The package according to a fifth aspect of the present invention is the package according to the fifth aspect.
2. The package according to claim 1, further comprising a feedthrough for transmitting a high-frequency signal input or output from the dielectric substrate or the high-frequency semiconductor circuit between the first and second waveguides.

In a package according to a sixth aspect of the present invention, the resistor has a characteristic of particularly attenuating a high frequency band.

In a package according to a seventh aspect of the invention, the resistor is formed by adding ruthenium oxide to a glass substrate.

In a package according to an eighth aspect, first and second cavities provided apart from each other are formed,
A case where a high-frequency signal is transmitted in the cavity;
A cap which is welded to the outer periphery so as to surround the first and second cavities inside, and is joined to the case so as to simultaneously cover the first and second cavities; and the first and second waveguides. It is provided with a resistor provided between the joining surface of the cap and the cap so as to separate the tube.

According to a ninth aspect of the present invention, in the method for assembling a package, the first and second waveguides and the cavity provided separately from each other are formed, and the first and second waveguides are formed in the cavity.
1. A method of assembling a package comprising: a case on which a dielectric substrate or a high-frequency semiconductor circuit connected to a second waveguide is mounted; and a cap bonded to the case. A step of applying a liquid resistor at a position separating the first and second waveguides, and after the step of applying the resistor, closes an opening end of the cavity and the first and second waveguides. like,
This is a method of assembling in the step of joining the case and the cap.

A package according to a tenth aspect of the present invention is assembled by the method of the ninth aspect.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 1 and 2 are configuration diagrams of a package showing a first embodiment of the present invention. In the drawings, 1 is a case, 2 is a cavity, 3 is a transmission terminal, 4 is a reception terminal, and 5 is a bias / control terminal. , 6 is a cap, 7 is a wall separating transmission and reception terminals, 8 is a high-frequency component such as a dielectric substrate or a semiconductor circuit, 82 is a feedthrough for connecting the high-frequency component 8 and the reception terminal 4 at high frequency, and 9 is a sealing portion. Reference numeral 10 denotes a signal leakage path between transmission and reception, and reference numeral 11 denotes a resistor which attenuates a signal in a high frequency band.
Is the same as or the same as the above-mentioned prior art. Although not shown, the high-frequency component 8 and the transmission terminal 3
Is provided between the high-frequency component 8 and the transmission terminal 3. In the figure, the transmission terminal 1
And three receiving terminals, the transmitting terminal,
The number of receiving terminals is not limited to this,
(Channels) and the number of reception CHs (channels) may be set as appropriate.

Next, the configuration and characteristics will be described. Figure
In FIGS. 1 and 2, case 1 is a cavity 2 and a transmission terminal.
3, a receiving terminal 4 and a bias / control terminal 5 are provided, and a high-frequency component 8 such as a dielectric substrate or a semiconductor circuit is housed in the cavity 2. And case 1 and cap 6
Are bonded at a sealing portion 9 by bonding, soldering, welding, or the like to seal the package. At this time, the resistor 11 is provided on the upper surface of the wall 7 separating the transmitting and receiving terminals in the case 1, that is, on a portion facing the cap 6. As described above, by providing the resistor 11 in a slight gap between the cap 6 and the upper surface of the case 1 (the upper surface of the wall 7 separating the transmitting and receiving terminals), isolation between transmission and reception is improved, and the transmission terminal 3 is improved. Thus, the level of the transmission signal leaking into the receiving terminal 4 from the terminal is reduced, and the operating environment of the receiving system can be improved.

It is to be noted that, for example, a thin paste is applied to the upper surface of the case 1 by using a liquid paste-like substance to which ruthenium oxide containing glass as a base material is applied as the resistor 11, thereby facilitating the work of installing the resistor. However, another resistor other than this may be used. For example, a configuration in which a thin-film resistor is placed on the upper surface of the case 1 may be adopted, and in this case, a slight gap may be provided between the cap 6 and the case 1. In addition, the size of the resistor depends on the size of the gap between the terminals, the distance between the terminals,
The size is set to a desired size according to the position of the sealing portion. For example, as shown in FIG. 2, between the transmitting terminal and the receiving terminal, the size is as large as possible below the width of the gap extending inside the sealing portion at both ends. However, it is preferable that the sizes be approximately the same.

Embodiment 2 3 and 4 are configuration diagrams of a package showing a second embodiment of the present invention. In the drawings, 1 is a case, 2 is a cavity, 3 is a transmission terminal, 4 is a reception terminal, and 5 is a bias / control terminal. , 6 is a cap, 7 is a wall separating transmission and reception terminals, 8 is a high-frequency component such as a dielectric substrate or a semiconductor circuit, 9 is a sealing part, 10 is a signal leakage path between transmission and reception, and 11 is a resistor. , 12 are walls separating a plurality of receiving terminals. Note that the resistor 11 is provided between each adjacent receiving terminal 4.

Next, the configuration and characteristics will be described. Figure
3 and FIG. 4, case 1 is a cavity 2 and a transmission terminal.
3, including a receiving terminal 4 and a bias / control terminal 5, and a high-frequency component 8 such as a dielectric substrate or a semiconductor circuit in the cavity 2
To store. Then, the case 1 and the cap 6 are joined to each other at the sealing portion 8 by bonding, soldering, welding, or the like, and the package is sealed. At this time, the resistor 11 is provided on the upper surface of the wall 7 separating the transmitting and receiving terminals in the case 1 and the upper surface of the wall 12 separating the plurality of receiving terminals, that is, the portion facing the cap 6. Thus, cap 6 and case 1
A small gap between the upper surface (the upper surface of the wall 7 separating the transmitting and receiving terminals and the wall 12 separating the plurality of receiving terminals)
By providing 11, isolation between transmission and reception,
The isolation between multiple receiving terminals is improved, and the level of the transmitted signal leaking from the transmitting terminal 3 to the receiving terminal 4 and the signal level coupled between the receiving terminals 4 are reduced, thereby improving the operating environment of the receiving system. Can be.

[0021]

According to the first, fourth to tenth aspects of the present invention,
By providing a resistor between the upper surface of the wall separating the first and second waveguides provided in the case and the cap joined to the case, the first and second waveguides are provided. The isolation between them is improved.

According to the second aspect of the present invention, since the resistor is provided between the upper surface of the wall separating the transmission terminal and the reception terminal provided in the case and the cap joined to the case, the transmission is achieved. The level of the transmission signal leaking from the terminal to the receiving terminal is reduced, and the operating environment of the receiving system can be improved.

According to the third aspect of the present invention, the resistor is provided between the upper surface of the wall separating the transmitting and receiving terminals provided in the case and the upper surface of the wall separating the plurality of receiving terminals and the cap to be sealed. Is provided, the isolation between the plurality of receiving terminals is improved, the signal level coupled between the receiving terminals is reduced, and the operating environment of the receiving system can be further improved.

[Brief description of the drawings]

FIG. 1 is a diagram (perspective view) showing a first embodiment of a package according to the present invention;

FIG. 2 is a diagram showing an operation of the package according to the first embodiment of the present invention;

FIG. 3 is a view (perspective view) showing Embodiment 2 of the package according to the present invention;

FIG. 4 is a diagram showing an operation of the first embodiment of the package according to the present invention;

FIG. 5 is a diagram (perspective view) showing a conventional package.

FIG. 6 is a diagram showing the operation of a conventional package.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 case 2 cavity 3 transmission terminal 4 reception terminal 5 bias / control terminal 6 cap 7 wall separating transmission and reception terminals 8 high-frequency component 9 sealing portion 10 signal leakage path between transmission and reception 11 resistor 12 plural reception terminals Walls separating

Claims (10)

[Claims] A first and a second waveguide and a cavity provided apart from each other are formed, and a dielectric connected to the first and the second waveguide is formed in the cavity. A case on which a substrate or a high-frequency semiconductor circuit is mounted;
The cap is joined to the case and the first and second waveguides so as to close open ends of the cavity and the first and second waveguides. A package comprising a resistor provided between a surface and the cap. 2. The package according to claim 1, wherein said first and second waveguides are a reception waveguide terminal and a transmission waveguide terminal, respectively. 3. The package according to claim 1, wherein said first and second waveguides are reception waveguide terminals. 4. The first and second waveguides transmit a high-frequency signal output from the dielectric substrate or the high-frequency semiconductor circuit to the other open end communicating with the joint-side open end of the cap. 2. The package according to claim 1, wherein the package is a waveguide terminal for transmitting each. 5. A feed-through for transmitting a high-frequency signal input or output from the dielectric substrate or the high-frequency semiconductor circuit between the first and second waveguides. Item 1. The package according to Item 1. 6. The package according to claim 1, wherein said resistor has a characteristic of particularly attenuating a high frequency band. 7. The package according to claim 1, wherein said resistor is formed by adding ruthenium oxide to a glass substrate. 8. A case in which first and second cavities provided apart from each other are formed, and a case in which a high-frequency signal is transmitted in the cavities, and a case where the first and second cavities are surrounded inside. The outer periphery is joined while keeping the airtight,
A cap joined to the case so as to simultaneously cover the second cavity; and a resistor provided between the joining surface of the cap and the cap so as to separate the first and second waveguides. And a package with. 9. A first and a second waveguide and a cavity provided apart from each other are formed, and a dielectric connected to the first and the second waveguide is formed in the cavity. A case on which a substrate or a high-frequency semiconductor circuit is mounted;
A method of assembling a package including a cap joined to the case, a step of applying a liquid resistor at a position separating the first and second waveguides in the cap or the case, A package assembling method for assembling the case and the cap in a step of joining the case and the cap so as to cover an opening end of the cavity and the first and second waveguides after the application step. 10. A package assembled by the method according to claim 9.