JP2002014169A - X-ray imaging apparatus - Google Patents

X-ray imaging apparatus

Info

Publication number
JP2002014169A
JP2002014169A JP2000196444A JP2000196444A JP2002014169A JP 2002014169 A JP2002014169 A JP 2002014169A JP 2000196444 A JP2000196444 A JP 2000196444A JP 2000196444 A JP2000196444 A JP 2000196444A JP 2002014169 A JP2002014169 A JP 2002014169A
Authority
JP
Japan
Prior art keywords
housing
sensor panel
support plate
casing
ray imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000196444A
Other languages
Japanese (ja)
Inventor
Yasuhiro Matsuki
康浩 松木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2000196444A priority Critical patent/JP2002014169A/en
Publication of JP2002014169A publication Critical patent/JP2002014169A/en
Pending legal-status Critical Current

Links

Landscapes

  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an X-ray imaging apparatus, capable of absorbing loads and impact forces imparted by the subject for imaging during X-ray imaging, while assuring the load and impact resistance of the casing, without having to increasing the strength of the casing, and being miniaturized and reduced in weight. SOLUTION: In the X-ray imaging apparatus, a sensor panel 1 is fixed on a support plate 2a provided within the casing 3 and a highly airtight member 5 provided between the outer peripheral portion of the support plate 2a and the inner peripheral portion of the casing defines an airtight area within the casing 3, on the side of the casing to which X-rays are irradiated, with the sensor panel 1 facing that side via the airtight area.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、センサーパネルが
筐体内部に設けられた支持板上に固定されているX線像
を記録するための電子カセッテなどのX線像撮像装置に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an X-ray image pickup apparatus such as an electronic cassette for recording an X-ray image in which a sensor panel is fixed on a support plate provided inside a housing. .

【0002】[0002]

【従来の技術】X線像撮像装置は図5に示すような筐体
構造中にセンサー部を有している。ここで、符号1はセ
ンサーパネルであり、ガラス基板、蛍光板、防湿フィル
ムからなる積層材である。また、2aは支持板であり、
センサーパネル1を正面に、また、信号処理回路基板4
aを背面に装着している。4bはセンサーパネル1に構
成されたセンサーから光電変換信号を取り出すフレキシ
ブル回路を持ったフレキシブル回路基板であり、センサ
ーパネル1と信号処理回路基板4aとの間の電気的な接
続を果たしている。3は電子カセッテ(X線像撮像用)
の外囲器を構成する筐体(扁平で方形の筐体)であっ
て、CFRP(炭素繊維強化プラスチック)などのX線
透過性材料で構成されており、特に、可視光に対して不
透明な筐体蓋3aと、不透明な上下筐体ケース3b、3
cとから組み立てられている。
2. Description of the Related Art An X-ray image pickup apparatus has a sensor section in a housing structure as shown in FIG. Here, reference numeral 1 denotes a sensor panel, which is a laminate made of a glass substrate, a fluorescent plate, and a moisture-proof film. 2a is a support plate,
With the sensor panel 1 in front and the signal processing circuit board 4
a is attached to the back. Reference numeral 4b denotes a flexible circuit board having a flexible circuit for extracting a photoelectric conversion signal from a sensor included in the sensor panel 1, and performs an electrical connection between the sensor panel 1 and the signal processing circuit board 4a. 3 is an electronic cassette (for X-ray imaging)
(Flat and rectangular housing), which is made of an X-ray transmitting material such as CFRP (carbon fiber reinforced plastic), and is particularly opaque to visible light. Case lid 3a, opaque upper and lower case cases 3b, 3
and c.

【0003】なお、2bは支持板2aの背面に設けた支
持板足であり、下筐体ケース3cに支持板2aを接続・
支持するためのものである。また、下筐体ケース3cに
は、信号処理回路基板4a上の半導体素子などの放熱の
ための、排気用放熱口3eが設けられている。
Reference numeral 2b denotes a support plate foot provided on the back surface of the support plate 2a. The support plate 2a is connected to the lower housing case 3c.
It is for support. Further, the lower housing case 3c is provided with an exhaust heat radiating port 3e for radiating heat of the semiconductor element and the like on the signal processing circuit board 4a.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上述の
構成では、X線撮影時に筐体3の正面(筐体蓋3a側)
に加わる被写体(図示せず)の荷重や衝撃で、筐体3が
撓み、センサーパネル1に機械的負荷を与えて損傷する
畏れがあるので、これに耐えるだけの機械的強度で、筐
体構造を予め、設計する必要があった。また、筐体3が
荷重や衝撃を受けた場合でも、センサーパネル1への負
荷を吸収できるように、筐体3内に緩衝材を設けたり、
あるいは、筐体3の内壁面とセンサーパネル1の正面と
の間に、所要の空隙を設ける必要があり、電子カセッテ
の小型化、軽量化を妨げる結果となっていた。
However, in the above configuration, the front of the housing 3 (on the side of the housing lid 3a) at the time of X-ray imaging.
The housing 3 may be bent by the load or impact of an object (not shown) applied to the sensor panel, and the sensor panel 1 may be damaged by applying a mechanical load. Had to be designed in advance. Further, even when the housing 3 receives a load or an impact, a cushioning material is provided in the housing 3 so that the load on the sensor panel 1 can be absorbed.
Alternatively, it is necessary to provide a required gap between the inner wall surface of the housing 3 and the front surface of the sensor panel 1, which hinders the reduction in size and weight of the electronic cassette.

【0005】本発明は、上記事情に基づいてなされたも
ので、その目的とするところは、筐体の強度を補強する
ことなく、その耐荷重性および耐衝撃性を確保しつつ、
X線撮影時に被写体によって与えられる荷重や衝撃力を
吸収でき、しかも、小型化、軽量化が図れるX線像撮像
装置を提供するにある。
The present invention has been made based on the above circumstances, and an object of the present invention is to ensure the load resistance and the impact resistance without reinforcing the strength of the housing.
It is an object of the present invention to provide an X-ray imaging apparatus capable of absorbing a load or an impact force given by a subject during X-ray imaging, and achieving a reduction in size and weight.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明のX線像撮像装置では、センサーパネルが筐
体内部に設けられた支持板上に固定されており、前記支
持板の外周部と前記筐体の内周部との間に設けた高気密
性部材で、X線照射側の筐体内部に気密領域を区画し、
該気密領域を介して、センサーパネルがX線照射側に対
向していることを特徴とする。
In order to achieve the above object, in the X-ray imaging apparatus according to the present invention, a sensor panel is fixed on a support plate provided inside a housing, and the sensor panel is mounted on the support plate. With a highly airtight member provided between the outer peripheral portion and the inner peripheral portion of the housing, an airtight region is defined inside the housing on the X-ray irradiation side,
The sensor panel is characterized in that the sensor panel faces the X-ray irradiation side via the airtight region.

【0007】この場合、本発明の実施の形態として、前
記高気密性部材が接着剤であること、あるいは、非接着
性パッキングで構成されていることは、簡易な気密性保
持手段として有効である。
In this case, as an embodiment of the present invention, the fact that the highly airtight member is an adhesive or is formed of a non-adhesive packing is effective as a simple airtight holding means. .

【0008】このように、気密性領域を区画すること
で、特に、筐体の板厚を厚くするような機械的補強をし
なくても、筐体の一部、特に、負荷の掛かるX線照射側
の部分において、エアクッション効果により、センサー
パネルに局部的な衝撃を与えることなく、センサーパネ
ルの破壊・損傷を回避し、保護することができる。この
ため、筐体構造上の軽量化に寄与できる。また、筐体自
体の撓みも、上述のエアクッション効果で低減されるの
で、前記気密領域での間隙を縮小でき、全体として、小
型化が達成できる。
By partitioning the hermetic region in this way, a part of the housing, particularly, an X-ray that is subjected to a load can be applied without mechanical reinforcement such as increasing the thickness of the housing. In the part on the irradiation side, the destruction / damage of the sensor panel can be avoided and protected without giving a local impact to the sensor panel by the air cushion effect. For this reason, it is possible to contribute to weight reduction in the housing structure. In addition, since the bending of the housing itself is also reduced by the above-described air cushion effect, the gap in the hermetic region can be reduced, and the overall size can be reduced.

【0009】[0009]

【発明の実施の形態】以下、本発明の実施の形態を、図
面を参照して、具体的に説明する。なお、図1、図2お
よび図3、図4は、それぞれ、本発明に係わる第1およ
び第2の実施形態を示す断面図、斜視図である。
Embodiments of the present invention will be specifically described below with reference to the drawings. FIGS. 1, 2, 3 and 4 are a cross-sectional view and a perspective view, respectively, showing first and second embodiments according to the present invention.

【0010】(第1の実施の形態)この実施の形態にお
いて、符号1はセンサーパネルであり、ガラス基板、蛍
光板、防湿フィルムからなる積層材である。また、2a
は支持板であり、センサーパネル1を正面に、また、信
号処理回路基板4aを背面に装着している。4bはセン
サーパネル1に構成されたセンサーから光電変換信号を
取り出すフレキシブル回路を持ったフレキシブル回路基
板であり、センサーパネル1と信号処理回路基板4aと
の間の電気的な接続を果たしている。3は電子カセッテ
(X線像記録用)の外囲器を構成する筐体であって、特
に、可視光に対して不透明な筐体蓋3aと、不透明な上
下筐体ケース3b、3cとから組み立てられている。こ
の実施の形態では、筐体蓋3aはCFRP(炭素繊維強
化プラスチック)などのX線透過性材料で構成されてお
り、また、筐体ケース3b、3cはマグネシウム合金な
どの低密度合金から構成されている。また、筐体蓋3a
と上筐体ケース3bとはエポキシ系接着剤3dで、気密
に接着されている。
(First Embodiment) In this embodiment, reference numeral 1 denotes a sensor panel, which is a laminate made of a glass substrate, a fluorescent plate, and a moisture-proof film. Also, 2a
Denotes a support plate, on which the sensor panel 1 is mounted on the front and the signal processing circuit board 4a is mounted on the back. Reference numeral 4b denotes a flexible circuit board having a flexible circuit for extracting a photoelectric conversion signal from a sensor included in the sensor panel 1, and performs an electrical connection between the sensor panel 1 and the signal processing circuit board 4a. Reference numeral 3 denotes a housing constituting an envelope of an electronic cassette (for recording an X-ray image), and particularly includes a housing lid 3a opaque to visible light and opaque upper and lower housing cases 3b and 3c. Assembled. In this embodiment, the housing lid 3a is made of an X-ray permeable material such as CFRP (carbon fiber reinforced plastic), and the housing cases 3b and 3c are made of a low density alloy such as a magnesium alloy. ing. Also, the housing lid 3a
The upper case 3b and the upper case 3b are hermetically bonded with an epoxy adhesive 3d.

【0011】なお、2bは支持板2aの背面に設けた支
持板足であり、下筐体ケース3cに支持板2aを接続・
支持するためのものである。また、下筐体ケース3cに
は、信号処理回路基板4a上での、半導体素子などの電
子部品6の放熱のために、排気用放熱口3eが設けられ
ている。
Reference numeral 2b denotes a support plate foot provided on the back of the support plate 2a. The support plate 2a is connected to the lower housing case 3c.
It is for support. Further, the lower housing case 3c is provided with an exhaust heat radiating port 3e for radiating heat of the electronic component 6 such as a semiconductor element on the signal processing circuit board 4a.

【0012】特に、本発明の電子カセッテでは、支持板
2aの外周部と上筐体ケース3bの内周部に形成したフ
ランジ部との間に高気密性部材5を設けており、この部
材5で、X線照射側の筐体3の内部に気密領域10(緩
衝エリア)を区画し、該気密領域10を介して、センサ
ーパネル1がX線照射側に対向している。ここでは、セ
ンサーパネルの周囲に沿って部材5が配置されている。
なお、この実施の形態では、高気密性部材5は、エポキ
シ系接着剤である(高気密性部材は非接着性のパッキン
グなどの弾性部材でもよい)。なお、センサーパネル1
と信号処理回路4aとの間の電気的接続のために装備さ
れるフレキシブル回路基板4bは、支持板2a上で、高
気密性部材5に接することになるので、支持板2aとの
接触は、接着剤などによる気密性を維持することはより
好ましい。
Particularly, in the electronic cassette according to the present invention, the highly airtight member 5 is provided between the outer peripheral portion of the support plate 2a and the flange formed on the inner peripheral portion of the upper housing case 3b. Thus, an airtight area 10 (buffer area) is defined inside the casing 3 on the X-ray irradiation side, and the sensor panel 1 faces the X-ray irradiation side via the airtight area 10. Here, the member 5 is arranged along the periphery of the sensor panel.
In this embodiment, the highly airtight member 5 is an epoxy-based adhesive (the highly airtight member may be an elastic member such as a non-adhesive packing). The sensor panel 1
The flexible circuit board 4b provided for electrical connection between the signal processing circuit 4a and the signal processing circuit 4a comes into contact with the highly airtight member 5 on the support plate 2a. It is more preferable to maintain airtightness with an adhesive or the like.

【0013】もちろん、完全に気密でなくとも、衝撃に
よる変形で移動する気体の瞬間的な移動を阻止できる、
あるいは、抵抗になる程度の気密性があれば、上記効果
は期待できる。
Of course, even if the gas is not completely airtight, the instantaneous movement of gas moving by deformation due to impact can be prevented.
Alternatively, the above effect can be expected as long as there is airtightness to such an extent that resistance occurs.

【0014】このような構成では、特に、筐体3の板厚
を厚くするような機械的補強をしなくても、筐体3の一
部、特に、負荷の掛かるX線照射側の部分(筐体蓋3
a)において、気密領域10のエアクッション効果(緩
衝効果)により、センサーパネル1に局部的な衝撃を与
えることなく、センサーパネル1の破壊・損傷を回避
し、保護することができる。このため、筐体構造上の軽
量化に寄与できる。また、筐体3自体の撓みも、上述の
エアクッション効果で低減されるので、気密領域10で
の、厚さ方向の間隙を縮小でき、全体として、小型化が
達成できる。
In such a configuration, a part of the housing 3, particularly, a portion on the X-ray irradiation side where a load is applied (particularly, without mechanical reinforcement such as increasing the thickness of the housing 3). Case lid 3
In (a), destruction / damage of the sensor panel 1 can be avoided and protected without giving a local impact to the sensor panel 1 by the air cushion effect (buffering effect) of the airtight region 10. For this reason, it is possible to contribute to weight reduction in the housing structure. In addition, since the bending of the housing 3 itself is also reduced by the above-described air cushion effect, the gap in the thickness direction in the hermetic region 10 can be reduced, and the overall size can be reduced.

【0015】(第2の実施の形態)この実施の形態で
は、下筐体ケース3cの、上筐体ケース3bとの接合面
に位置して、内周側にフランジ部が形成されており、こ
のフランジ部と支持板2aの周縁部との間に高気密性部
材5が装着されている。ここでは、第1の実施の形態と
は異なり、支持板2aには支持足2bが省略されてい
る。これは、高気密性部材5を介して、支持板2aが下
筐体ケース3cに支持されるためで、これにより、1枚
の信号処理回路基板4aに全ての電子部品6を装着でき
るので、部品点数を削減でき、生産性を向上できる。
(Second Embodiment) In this embodiment, a flange portion is formed on the inner peripheral side of the lower housing case 3c at the joint surface with the upper housing case 3b. A highly airtight member 5 is mounted between the flange and the peripheral edge of the support plate 2a. Here, unlike the first embodiment, the support feet 2b are omitted from the support plate 2a. This is because the support plate 2a is supported by the lower housing case 3c via the highly airtight member 5, whereby all the electronic components 6 can be mounted on one signal processing circuit board 4a. The number of parts can be reduced, and productivity can be improved.

【0016】なお、この実施の形態においても、本発明
の作用効果は、第1の実施の形態と同様に達成できる。
また、気密領域10の気密性を確保するために、上下筐
体ケース3b、3cが互いに気密に接合されることは、
勿論のことである。
In this embodiment, the function and effect of the present invention can be achieved in the same manner as in the first embodiment.
Also, in order to secure the airtightness of the airtight region 10, the upper and lower housing cases 3b and 3c are airtightly joined to each other.
Of course.

【0017】[0017]

【発明の効果】以上説明したように、本発明のX線像撮
像装置(電子カセッテ)は、その筐体構造が気密領域を
持つことで、センサーパネルを保護する筐体(外囲器)
の板厚を増すことなく、しかも、前記気密領域のエアク
ッション効果(緩衝効果)により、前記センサーパネル
に局部的な衝撃を与えることなく、破壊・損傷を回避
し、保護することができる。このため、筐体構造上の軽
量化に寄与できる。また、筐体自体の撓みも、上述のエ
アクッション効果で低減されるので、センサーパネル表
面と、X線照射側の筐体内面との間隙(気密領域)を厚
くすることなく、寧ろ、気密領域10での、厚さ方向の
間隙を縮小でき、全体として、筐体の小型化が達成でき
る。
As described above, the X-ray image pickup apparatus (electronic cassette) of the present invention has a housing structure having an airtight region, thereby protecting the sensor panel (enclosure).
Without increasing the thickness of the sensor panel, and by providing an air cushion effect (buffering effect) in the airtight region, destruction and damage can be avoided and protected without giving a local impact to the sensor panel. For this reason, it is possible to contribute to weight reduction in the housing structure. In addition, since the bending of the housing itself is also reduced by the air cushion effect described above, the gap (airtight area) between the sensor panel surface and the inner surface of the housing on the X-ray irradiation side is increased without increasing the airtight area. The gap in the thickness direction at 10 can be reduced, and the size of the housing can be reduced as a whole.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係わる第1の実施の形態を示す断面図
である。
FIG. 1 is a cross-sectional view showing a first embodiment according to the present invention.

【図2】本発明に係わる第1の実施の形態を示す斜視図
である。
FIG. 2 is a perspective view showing a first embodiment according to the present invention.

【図3】本発明に係わる第2の実施の形態を示す断面図
である。
FIG. 3 is a sectional view illustrating a second embodiment according to the present invention.

【図4】本発明に係わる第2の実施の形態を示す斜視図
である。
FIG. 4 is a perspective view showing a second embodiment according to the present invention.

【図5】従来例の断面図である。FIG. 5 is a sectional view of a conventional example.

【符号の説明】[Explanation of symbols]

1 センサーパネル 2a 支持板 2b 支持板足 3 筐体(外囲器) 3a 筐体蓋 3b 上筐体ケース 3c 下筐体ケース 3d 接着剤 4a 信号処理回路基板 4b フレキシブル回路基板 5 高気密性部材 6 電子部品 DESCRIPTION OF SYMBOLS 1 Sensor panel 2a Support plate 2b Support plate leg 3 Housing (envelope) 3a Housing cover 3b Upper housing case 3c Lower housing case 3d Adhesive 4a Signal processing circuit board 4b Flexible circuit board 5 High airtight member 6 Electronic components

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 31/09 H01L 31/00 A ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 31/09 H01L 31/00 A

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 センサーパネルが筐体内部に設けられた
支持板上に固定されており、前記支持板の外周部と前記
筐体の内周部との間に設けた高気密性部材で、X線照射
側の筐体内部に気密領域を区画し、該気密領域を介し
て、センサーパネルがX線照射側に対向していることを
特徴とするX線像撮像装置。
A sensor panel fixed on a support plate provided inside the housing, a highly airtight member provided between an outer peripheral portion of the support plate and an inner peripheral portion of the housing, An X-ray image capturing apparatus, wherein an airtight region is defined inside a casing on the X-ray irradiation side, and a sensor panel faces the X-ray irradiation side via the airtight region.
【請求項2】 前記高気密性部材は接着剤であることを
特徴とする請求項1に記載のX線像撮像装置。
2. The X-ray imaging apparatus according to claim 1, wherein the highly airtight member is an adhesive.
【請求項3】 前記高気密性部材は非接着性パッキング
で構成されていることを特徴とする請求項1に記載のX
線像撮像装置。
3. The X according to claim 1, wherein the highly airtight member is formed of a non-adhesive packing.
Line image pickup device.
JP2000196444A 2000-06-29 2000-06-29 X-ray imaging apparatus Pending JP2002014169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000196444A JP2002014169A (en) 2000-06-29 2000-06-29 X-ray imaging apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000196444A JP2002014169A (en) 2000-06-29 2000-06-29 X-ray imaging apparatus

Publications (1)

Publication Number Publication Date
JP2002014169A true JP2002014169A (en) 2002-01-18

Family

ID=18694937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000196444A Pending JP2002014169A (en) 2000-06-29 2000-06-29 X-ray imaging apparatus

Country Status (1)

Country Link
JP (1) JP2002014169A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010071931A (en) * 2008-09-22 2010-04-02 Fujifilm Corp Radiographic apparatus
JP2018115899A (en) * 2017-01-17 2018-07-26 三井化学株式会社 Metal/resin composite structure for x-ray imaging detection device, and x-ray imaging detection device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010071931A (en) * 2008-09-22 2010-04-02 Fujifilm Corp Radiographic apparatus
JP2018115899A (en) * 2017-01-17 2018-07-26 三井化学株式会社 Metal/resin composite structure for x-ray imaging detection device, and x-ray imaging detection device

Similar Documents

Publication Publication Date Title
JP3815766B2 (en) Two-dimensional imaging device
JP4497663B2 (en) Radiation imaging equipment
JP3848288B2 (en) Radiation imaging equipment
JP2002014168A (en) X-ray imaging apparatus
JP2002014170A (en) Input device for x-ray image
US9091767B2 (en) Electronic cassette for radiographic imaging
JP3815792B1 (en) Two-dimensional imaging device
US10073180B2 (en) Radiation imaging apparatus and radiation imaging system
JP2010145349A (en) Radiation detection apparatus
JP2009122059A (en) Radiation detection device
JP2002186604A (en) Radiographic device
JP2007325924A (en) Method and device for x-ray detector panel
JP2002014169A (en) X-ray imaging apparatus
JP2002006049A (en) X-ray digital imaging device
JP5706357B2 (en) Substrate module and manufacturing method thereof
JP6626548B2 (en) Radiation image capturing apparatus and radiation image capturing system
JP6581424B2 (en) Radiography equipment
JP3121124U (en) Two-dimensional image detection device
US11099286B2 (en) Radiation detection device
JP2018179513A (en) Radiation detector, device for manufacturing radiation detector, and method for manufacturing radiation detector
JP2021165654A (en) Radiation detection device
JP2011117760A (en) Planar x-ray detector
JP2024027374A (en) Radiation imaging apparatus manufacturing method
JP2024064190A (en) Radiation imaging device and radiation imaging system
JP2007299549A (en) Image device