JP3121124U - Two-dimensional image detection device - Google Patents

Abstract

To reuse an active matrix substrate and a holding substrate.
A radiation-sensitive layer, an active matrix substrate electrically connected to the radiation-sensitive layer, and a holding substrate that holds the active matrix substrate, are activated by an adsorption mechanism provided on the holding substrate. A matrix substrate is held. Thereby, it becomes easy to remove the active matrix substrate from the holding substrate, and the active matrix substrate and the holding substrate can be reused.
[Selection] Figure 1

Description

The present invention relates to a structure of a two-dimensional image detection apparatus that converts radiation into an electrical signal, and more particularly to a structure for fixing an active matrix substrate including a switching element.

As shown in FIG. 4, the general two-dimensional image detection apparatus includes an active matrix substrate 20, a radiation sensitive layer 10, and a holding substrate 50. Here, the active matrix substrate 20 and the holding substrate 50 are bonded together by a gel sheet-like adhesive material 49 (for example, Patent Document 1). In addition to the function of holding the active matrix substrate 50, the gel sheet-like adhesive material also played a role of absorbing deflection due to thermal deformation.

Here, as shown in FIG. 5, the active matrix substrate 20 includes pixels Du each composed of a switching element 21, a storage capacitor Cs, and a pixel electrode 24 arranged in a lattice on a substrate such as glass. The gate line 23 and the data line 22 are connected to the switching element 21 of each pixel Du.

Furthermore, the radiation sensitive layer 10 is formed on the active matrix substrate 20 by vapor deposition or the like, and the bias electrode 11 for supplying the bias voltage VA is formed on the radiation sensitive layer 10. The radiation-sensitive layer 10 is not only a direct conversion type that converts radiation directly into electric charge, but also an indirect conversion type that converts radiation into visible light or the like with a stimulable phosphor or scintillator and converts visible light into electric charge with a photodiode. There is.

An outline of the operation of such a radiation detector will be described with reference to FIG. When radiation enters the radiation sensitive layer 10, charges are generated in the radiation sensitive layer 10, and the generated charges are transferred to the pixel electrode 24 by the bias voltage VA and stored in the storage capacitor Cs connected to the pixel electrode 24. . The accumulated charge is read out to the data line 22 through the switching element 21 by activating the gate line 23.

JP 2001-281343 A

Regardless of direct conversion or indirect conversion, the larger the area of the two-dimensional image detection apparatus, the more difficult it is to uniformly deposit the radiation sensitive layer on the active matrix substrate. Even if a homogeneous radiation-sensitive layer can be formed at the time of manufacture, the radiation-sensitive layer may be deteriorated due to subsequent aging or use in an abnormal environment, and cannot be used as an image detection device.

However, in order to confirm whether or not the radiation-sensitive layer is formed uniformly, it is necessary to mount the active matrix substrate on the holding substrate and actually irradiate the radiation to detect the image.

Therefore, it becomes difficult to reuse the active matrix substrate and the holding substrate, which has been a major cause of cost increase due to yield.

Therefore, in order to reuse the active matrix substrate and the holding substrate, it is necessary to remove the active matrix substrate from the holding substrate. However, according to the prior art, the active matrix substrate and the holding substrate are bonded to each other with a gel sheet-like adhesive material, and it is extremely difficult to remove the larger area.

In addition, once the holding substrate and the active matrix substrate are bonded together, the relative positional relationship between the two substrates cannot be corrected, and the active matrix substrate is accurately positioned and bonded at a predetermined position. Careful work was needed.

In order to solve this problem, when a mechanical fixing method such as screwing is used, there arises a problem that the glass substrate breaks due to the deflection of the active matrix substrate due to a temperature change or the like.

The two-dimensional image detection apparatus according to claim 1 includes an active matrix substrate, a radiation sensitive layer formed on the active matrix substrate, and a holding substrate that holds the active matrix substrate. Has a suction mechanism for holding an active matrix substrate.

According to a second aspect of the present invention, there is provided the two-dimensional image detection apparatus according to the first aspect, wherein the suction mechanism has a vent hole.

The invention according to claim 3 is the two-dimensional image detection device according to claim 1, wherein the two-dimensional image detection device moves the active matrix substrate around the active matrix substrate. It further has movement restricting means for restricting.

According to a fourth aspect of the invention, there is provided the two-dimensional image detection apparatus according to the third aspect, wherein at least a part of the movement restricting means is made of an elastic body.

The two-dimensional image detection apparatus according to the present invention operates as follows. The active matrix substrate is substantially fixed to the holding substrate by pressing the active matrix substrate against the surface of the holding substrate on which the suction mechanism is provided. Moreover, the active matrix substrate is detached from the holding substrate by introducing air into the adsorption mechanism.

Further, when a vibration or impact is applied from the outside, the vibration of the active matrix substrate is suppressed by the movement limiting means arranged around the periphery.

Furthermore, since the movement limiting means is made of an elastic body, vibrations and impacts are absorbed by the movement limiting means.

Since the present invention operates as described above, the active matrix substrate can be attached and detached very easily, and the active matrix substrate can be reused. Further, it becomes easy to accurately position the active matrix substrate at a predetermined position, and the manufacturing cost can be reduced.

Even when external vibration or impact is applied, since the active matrix substrate is fixed by the movement restricting means, vibration of the active matrix substrate caused by the elasticity of the suction mechanism can be suppressed.

Further, since vibration and impact are absorbed by the movement restricting means formed of an elastic body, the impact transmitted to the active matrix substrate can be mitigated. Therefore, the reliability as a two-dimensional image detector is improved.

Furthermore, even if the active matrix substrate and the holding substrate are bent due to a temperature change, the active matrix substrate is protected by the elasticity of the adsorption mechanism or the elasticity of the movement limiting means.

A two-dimensional image detection apparatus according to a representative embodiment of the present invention will be described with reference to FIG. FIG. 1A is a top view (viewed from a radiation incident direction), and FIG. 1B is a cross-sectional view taken along line A-A ′ of FIG. The holding substrate 50, the active matrix substrate 20 held on the holding substrate 50 by the active matrix suction mechanism 30 as a suction means, the radiation sensitive layer 10 formed on the active matrix substrate 20, and the radiation sensitive layer 10 are formed on the radiation sensitive layer 10. The bias electrode 11 and the pressing mechanism 40 as a movement restricting means that is screwed to the edge 51 of the holding substrate by pressing the four corners of the active matrix substrate 20 from the top, bottom, left and right and the radiation irradiation surface.

Here, details of the active matrix substrate suction mechanism 30 will be described with reference to FIG. FIG. 2 is a part of the B-B ′ sectional view of FIG. 1A, and is an enlarged view of the active matrix substrate suction mechanism 30 portion. The active matrix substrate suction mechanism 30 includes a suction cup 31 embedded in a recess 501 of the holding substrate 50 so as to slightly protrude from the surface of the holding substrate 50. On the bottom surface of the suction cup 31, an air hole 311 in which a highly sensitive screw hole is processed is provided. In addition, a through hole 502 that extends to the back surface is provided on the bottom surface of the recess 501 of the holding substrate 50. After the active matrix substrate 20 is pressed against the suction cup 31, the screw 32 is screwed into the air hole 311 from the back surface of the holding substrate 50 through the through hole 502, and the inside of the suction cup 31 is hermetically sealed. The substrate 20 can be substantially fixed. When the screw 32 is removed in this state, air flows from the air hole 311, the suction force of the suction cup 31 is lost, and the active matrix substrate 20 can be removed.

Details of the pressing mechanism 40 will be described with reference to FIG. FIG. 3A is a view of the portion C in FIG. 1A viewed from the same direction as FIG. 3 (b) is a view seen from the right direction with reference to FIG. 3 (a), FIG. 3 (c) is a view seen from the left direction, and FIG. 3 (d) is a view seen from the bottom surface. . The holding mechanism 40 includes a holding block 41 made of metal or resin and a notch 42. The cutout portion 42 is made of a member that functions as an elastic body, such as sponge or rubber, and is provided with a rectangular parallelepiped cutout to hold the corners of the active matrix substrate. 3, the holding block 41 is fixed to the edge 51 by passing the screw 43 through the screw hole 411 through the long hole 511 provided in the edge 51 of the holding substrate. . In this configuration, the long hole 511 is provided. However, if the total of the tolerances of the components constituting the two-dimensional image detection apparatus can be absorbed by the sponge of the cutout portion 42, it is necessary to make the long hole. Absent. However, it is desirable to use a long hole because the force for holding the active matrix substrate 20 can be adjusted.

Hereinafter, the assembly procedure of the two-dimensional image detection apparatus of this embodiment will be described.
(1) The radiation sensitive layer 10 is formed on the active matrix substrate 20 by a commonly used vacuum deposition method.
(2) On the radiation sensitive layer 10, the bias electrode 11 is similarly formed by vapor deposition.
(3) The active matrix substrate 20 is placed near the center of the holding substrate 50.
(4) The holding blocks 41 are arranged at the four corners of the active matrix substrate 20. At this time, it arrange | positions so that the notch part 42 of the holding block 41 may match the corner | angular part of the active matrix board | substrate 20. FIG.
(5) The active matrix substrate 20 is pressed from above (radiation incidence direction).
(6) Screws 32 are screwed into the air holes 311 from the back surface of the holding substrate.
(7) The holding blocks 41 at the four corners and the edge 51 of the holding substrate are fixed with screws 43 and nuts 43. At this time, the vertical position is adjusted and fixed along the long hole 511 provided in the edge portion 51 of the holding substrate so as to press the corner of the active matrix substrate 20 with a predetermined pressure.

When disassembling the two-dimensional image detection apparatus assembled in this way, the assembly procedure may be reversed. That is, the active matrix substrate 20 can be easily removed by removing the pressing mechanisms 40 at the four corners and removing the screws 32.

Further, since the two-dimensional image detection apparatus assembled in this way has an appropriate gap between the active matrix substrate 20 and the holding substrate 50, the active matrix substrate 20 and the holding substrate 50 are bent due to a temperature change or the like. Even if they are not in contact with each other, even if they are in contact with each other, stress is absorbed by the elasticity of the suction cup 41 and the notch portion 42, so that the glass substrate constituting the active matrix substrate 20 is not easily damaged.

In the present embodiment, the pressing mechanisms 40 are arranged at the four corners as the movement restricting means. However, even if this mechanism is not provided, there are effects specific to the present application.

Further, although the holding block 41 is used as the movement restricting means, it is not always necessary to suppress at the four corners, and a mechanism for pressing at other places such as the center of the four sides may be used. Further, the present invention is not limited to this structure, and various methods can be selected as long as the movement of the active matrix substrate 20 is restricted in any direction.

In addition, as the cutout portion 42 of the holding block 41, sponge or rubber as an elastic body is arranged. However, as long as it is an elastic body, various other materials can be selected.

Furthermore, even if the movement restricting means does not have an elastic body, an effect unique to the present application is achieved.

It is a figure which shows the structure of the two-dimensional image detection apparatus concerning this invention device. It is a detailed structure of the active matrix substrate suction mechanism. It is a detailed structure of the pressing mechanism. It is a figure explaining the two-dimensional image detection apparatus which concerns on a prior art. It is a figure which shows the detailed structure of an active matrix substrate and a two-dimensional image detection apparatus using the same.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Radiation sensitive layer 11 Bias electrode 20 Active matrix board | substrate 21 Switching element 22 Data line 23 Gate line 30 Active matrix board | substrate adsorption | suction mechanism 31 Suction cup 311 Air hole 32 Screw 40 Holding mechanism 41 Holding block 411 Screw hole 42 Notch part 43 Screw 49 Gel sheet Shaped adhesive material 50 holding substrate 501 hollow 502 hole 51 edge 511 of holding substrate long hole Cs storage capacity Du pixel VA bias voltage

Claims (4)

An active matrix substrate, a radiation sensitive layer formed on the active matrix substrate, and a holding substrate for holding the active matrix substrate, wherein the holding substrate has a suction mechanism for holding the active matrix substrate. A two-dimensional image detection apparatus. The two-dimensional image detection apparatus according to claim 1, wherein the suction mechanism has a vent hole. The two-dimensional image detection apparatus according to claim 1, further comprising a movement restriction unit that restricts movement of the active matrix substrate around the active matrix substrate. The two-dimensional image detection apparatus according to claim 3, wherein at least a part of the movement restriction unit is made of an elastic body.

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