JP2002006491A - Negative resist composition for electron beam or x-ray - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance performance and to solve technical problem in the microfabrication of a semiconductor device using electron beams or X-rays and to provide a negative type chemical amplification type resist composition for electron beams or X-rays which satisfies characteristics such as sensitivity, resolution, resist shape, development defects and appliability in the use of electron beams or X-rays. SOLUTION: The negative chemical amplification type resist composition contains a compound which generates an acid and/or a radical species when irradiated with electron beams or X-rays, an alkali-soluble resin, a crosslinker which causes crosslinking under the acid and a fluorine- and/or silicon-containing surfactant.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a negative resist composition suitable for use in ultra microlithography processes such as the production of ultra LSIs and high capacity microchips, and other photofabrication processes. More specifically, the present invention relates to a negative type photoresist composition capable of forming a pattern with high definition using X-rays, electron beams and the like, and is particularly suitable for fine processing of a semiconductor device using high energy rays such as electron beams. The present invention relates to a negative resist composition which can be used for a negative resist composition.

[0002]

2. Description of the Related Art The degree of integration of integrated circuits is increasing, and in the manufacture of semiconductor substrates such as VLSI, processing of ultrafine patterns having a line width of less than half a micron is required. Have been. In order to satisfy the need, the wavelength used in an exposure apparatus used for photolithography has become shorter and shorter, and now, far ultraviolet light and excimer laser light (XeCl, KrF, ArF, etc.) have been studied. . Further, formation of finer patterns by electron beams or X-rays has been studied.

In particular, electron beams or X-rays are positioned as a next-generation or next-next-generation pattern forming technology, and development of a negative resist capable of achieving a high sensitivity, a high resolution and a rectangular profile is desired. In electron beam lithography, energy is supplied to a compound in a process where an accelerated electron beam causes collision and scattering with atoms constituting a resist material to cause a reaction of the resist material to form an image. The use of a highly accelerated electron beam increases the straightness, reduces the effects of electron scattering, and makes it possible to form a high-resolution rectangular pattern.On the other hand, the electron beam permeability increases, The sensitivity decreases. As described above, in electron beam lithography, there is a trade-off between sensitivity, resolution, and resist shape, and it has been a problem how to achieve both. As a resist material for these, for the purpose of improving sensitivity, a chemically amplified resist mainly using an acid catalyzed reaction is used, and as a main component for a negative resist, an alkali-soluble resin, an acid generator, and A chemically amplified composition comprising an acid crosslinking agent has been effectively used.

Conventionally, for a negative chemically amplified resist,
Various alkali-soluble resins have been proposed. For example, Japanese Patent No. 2505053, JP-A-3-170554 and JP-A-6-118646 disclose novolak-type phenol resins, JP-A-7-31463, and JP-A-8-29255.
No. 9 discloses a polyvinyl phenol resin having a narrowed molecular weight distribution; JP-A-3-87746; JP-A-8-44061 discloses a phenol resin partially converted to a cyclic alcohol structure by hydrogenation; JP-A-7-295200; Kaihei 8
JP-A-152717 discloses a resin in which a part of OH groups of polyvinyl phenol is protected by an alkyl group.
No. 86 discloses a polyvinyl phenol resin having an acid-inactive protecting group such as an acyl group. JP-A-6-67431 and JP-A-10-10733 disclose a polyvinyl phenol resin copolymerized with styrene and JP-A-9-166870. Discloses a polyvinylphenol resin copolymerized with (meth) acrylate monomers, and JP-A-8-240911 discloses a resin having a carboxy group.

The acid generator is disclosed in Japanese Patent Publication No. 8-36.
No. 35 discloses an organic halogen compound, JP-A-2-52348.
Nos. 4 and 5 include aromatic compounds substituted with Br and Cl.
No. 368864 and JP-A-4-366865 describe Br,
Cl-substituted aromatic compounds having alkyl or alkoxy groups, JP-A-2-150848, JP-A-6-19
No. 9770, iodonium and sulfonium compounds, JP-A-3-87746, haloalkanesulfonate compounds, JP-A-4-210960, JP-A-4-2172
No. 49, a diazodisulfone compound or a diazosulfone compound; JP-A-4-336454, Br and I-substituted alkyltriazine compounds; JP-A-4-291258, a sulfonamide, sulfonimide compound;
JP-A-291259 discloses a sulfonic acid compound of a polyhydric phenol, JP-A-4-291260 and JP-A-4-29126.
No. 1 and JP-A-6-202320 disclose a naphthoquinonediazide-4-sulfonate compound.
No. 9 discloses a disulfone compound, JP-A-6-236024 discloses an N-oxyimidosulfonate compound, and U.S. Pat. No. 5,344,742 discloses a benzylsulfonate compound.

Further, with respect to acid crosslinking agents, see JP-A-3-75.
652, JP-A-5-181277, JP-A-7-14
No. 6556, a methoxymethyl melamine compound, JP-A-4-281455, JP-A-5-232702, JP-A-6-83055, a compound having an alkoxymethyl ether group, JP-A-5-281715, an oxazine compound, JP-A-5-134412, JP-A-6-38
No. 25 discloses an aromatic compound having an alkoxyalkyl group, and JP-A-6-194838 discloses, in addition to a trioxane compound, an alkoxymethyluryl compound described in JP-A-1-293339. However, in any combination of these compounds, it is difficult to obtain a sufficiently high sensitivity under electron beam irradiation or X-ray irradiation under high accelerating voltage conditions, and the sensitivity, resolution and resist shape are satisfied. It has been a challenge to achieve both at the level they need. Further, suppression of development defects and good applicability (uniformity of the applied surface) have been desired.

[0007]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the problem of a technique for improving the performance in microfabrication of a semiconductor device using an electron beam or an X-ray. Another object of the present invention is to provide a negative chemically amplified resist composition for electron beams or X-rays, which satisfies sensitivity, resolution, resist shape, development defect, and coatability. Highly sensitive electron beam or X-ray that can be used in next-generation EB irradiators (EB block irradiators or EB steppers (sequentially reduced projection irradiators) aimed at improving throughput) adapted to mass production of semiconductor devices To provide a negative type chemically amplified resist composition.

[0008]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies while paying attention to the above-mentioned characteristics, and as a result, have found that the object of the present invention is excellently achieved by using the following specific compositions. Reached the present invention. That is, the present invention has the following configuration.

(1) (A) a compound which generates an acid and / or a radical species upon irradiation with an electron beam or X-ray, (B)
A water-insoluble resin having at least one unsaturated bond polymerizable by an acid and / or a radical and soluble in an aqueous alkali solution, (C) a crosslinking agent which crosslinks with the resin (B) by the action of an acid, and D) A negative resist composition for electron beam or X-ray, comprising: a fluorine-based and / or silicon-based surfactant.

(2) The resin of the component (B) is represented by the general formula (a)
The negative resist composition for an electron beam or X-ray according to the above (1), which is a resin containing a repeating unit of the formula (1).

[0011]

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In the formula, R ₁ represents a hydrogen atom, a halogen atom, a cyano group, an alkyl group or a haloalkyl group which may have a substituent. R _{2 to} R ₄ are a hydrogen atom, a group represented by any of formulas (b), (c) and (d), an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl, which may have a substituent; Group or an acyl group.
R ₅ and R ₆ may be the same or different, and may have a hydrogen atom, a hydroxyl group, a halogen atom, a cyano group, or a substituent, an alkyl group, a cycloalkyl group, an alkenyl group, an aralkyl group, Alternatively, it represents an aryl group.

[0013]

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In the formula, R _{7 to} R ₁₂ , R ₁₆ and R ₁₇ represent a hydrogen atom, a halogen atom, a cyano group or an alkyl group or a haloalkyl group which may have a substituent. R ₁₃ ,
R ₁₄ represents a hydrogen atom, a halogen atom, a hydroxyl group, an optionally substituted alkyl group, an alkoxy group,
Represents an acyloxy group. R ₁₅ represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aralkyl group, or an aryl group which may have a substituent. A ₁ is a single bond, which may have a substituent, a divalent alkylene group, an alkenylene group,
Cycloalkylene group, or arylene group, or -O
_{-, - SO 2 -, -} O-CO-R 20 -, - CO-O-R
_{21 -, - CO-N (} R 22) -R 23 - represents a. R ₂₀ ,
R ₂₁ and R ₂₃ may be the same or different and may have a single bond, an ether structure, an ester structure, an amide structure, a urethane structure or a ureide structure, or may have a substituent. Represents a valent alkylene group, alkenylene group, cycloalkylene group, or arylene group. R ₂₂ represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aralkyl group, or an aryl group which may have a substituent. A ₂ is a single _{bond, -O-R 21 -, -} N (R 22) -R 23
Represents-. A ₃ represents an arylene group which may have a single bond, —SO ₂ — or an alkylene structure, and may have a substituent. A ₄ is a single bond, which may have a substituent, a divalent alkylene group, a cycloalkylene group, an arylene group, —O—, —SO ₂ —, —CO—, —CO—O—
R ₂₁ - represents a. x, y, and z represent 0 or 1, and m and n represent 0 or an integer of 1 or more. However, in the general formula (a), at least one of the general formulas (b), (c), or (d)
Having a group of Also, _{two of} R _{2 to} R ₄ or R ₂ to
One with R ₅ or R ₆ in R ₄ may combine with each other to form a ring.

(3) The above (1) or (2), further comprising (E) a compound having at least one unsaturated bond polymerizable by an acid and / or a radical.
3. The negative resist composition for electron beam or X-ray according to item 1.

(4) The negative resist composition for electron beam or X-ray according to any one of the above (1) to (3), further comprising (F) an organic basic compound.

(5) The electron beam or X as described in any of (1) to (4) above, wherein the compound of the component (A) is selected from sulfonium or iodonium sulfonate compounds. Negative resist composition for lines.

(6) The compound according to any one of the above (1) to (4), wherein the compound of the component (A) is a sulfonic acid ester compound of N-hydroxyimide or a disulfonyldiazomethane compound. Negative resist composition for electron beam or X-ray.

(7) The method according to any one of the above (1) to (6), wherein the crosslinking agent as the component (C) is a hydroxymethylated, alkoxymethylated or acyloxymethylated phenol compound. Negative resist composition for electron beam or X-ray.

(8) The above (1) to (6), wherein the crosslinking agent of the component (C) is an alkoxymethylated or acyloxymethylated melamine compound or resin, or a urea compound or resin. The negative resist composition for electron beam or X-ray according to any one of the above.

(9) The negative resist composition for electron beam or X-ray according to any one of (1) to (8), wherein the electron beam is irradiated under an acceleration voltage condition of 75 keV or more.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the compounds used in the present invention will be described in detail. (1) Resin of the present invention (B) The resin of the present invention (B) is a water-insoluble and alkali-soluble resin having at least one unsaturated bond polymerizable by an acid and / or a radical, and is preferable. Is a phenol novolak resin, a polyvinyl phenol resin, a copolymer having a structural unit derived from vinyl phenol, a resin obtained by partially protecting or modifying the polyvinyl phenol resin, and a phenol such as a (meth) acrylate polymer having a phenol skeleton. A resin in which some or all of the groups are substituted with a group having an unsaturated bond polymerizable by an acid and / or a radical can be widely used. Preferable examples include a phenolic resin containing a repeating structural unit represented by the general formula (a).

In the general formula (a), R ₁ represents a hydrogen atom, a halogen atom, a cyano group, an alkyl group or a haloalkyl group which may have a substituent. R _{2 to} R ₄ are a hydrogen atom,
A group of any of the above general formulas (b), (c), or (d);
It represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an acyl group which may have a substituent. R ₅ and R ₆ may be the same or different, and may have a hydrogen atom, a hydroxyl group, a halogen atom, a cyano group, or a substituent, an alkyl group, a cycloalkyl group, an alkenyl group, an aralkyl group, Alternatively, it represents an aryl group.

R _{7 to} R ₁₂ , R ₁₆ and R _{17 each} represent a hydrogen atom, a halogen atom, a cyano group or an alkyl group or a haloalkyl group which may have a substituent. R ₁₃ and R ₁₄ represent a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group, an alkoxy group, or an acyloxy group which may have a substituent. R ₁₅ may have a hydrogen atom or a substituent;
Represents an alkyl group, a cycloalkyl group, an aralkyl group, or an aryl group.

A ₁ may have a single bond or a substituent,
Valent alkylene group, alkenylene group, cycloalkylene group or arylene group, or -O -, - SO ₂ -,
_{-O-CO-R 20 -,} - CO-O-R 21 -, - CO-N
(R ₂₂₎ -R ₂₃ - represents a. R ₂₀ , R ₂₁ and R ₂₃ may be the same or different and may have a single bond, an ether structure, an ester structure, an amide structure, a urethane structure or a ureido structure, or may have a substituent. Good represents a divalent alkylene group, alkenylene group, cycloalkylene group, or arylene group.

R ₂₂ represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aralkyl group or an aryl group which may have a substituent. A ₂ is a single bond, -OR ₂₁ -,-
N (R ₂₂₎ -R ₂₃ - represents a. A ₃ represents an arylene group which may have a single bond, —SO ₂ — or an alkylene structure, and may have a substituent. A ₄ is a single bond, which may have a substituent, a divalent alkylene group, a cycloalkylene group, an arylene group, -O-, -SO _2- , -CO
-, - CO-O-R 21 - represents a.

X, y and z represent 0 or 1, and m and n represent 0
Or represents an integer of 1 or more. However, in general formula (a), at least one has a group represented by general formula (b), (c) or (d). Also two of R ₂ to R _4, or R ₂ to R ₄
And R ₅ or R ₆ may combine to form a ring.

The alkyl group for R _{1 to} R ₁₇ and R ₂₂ is, for example, an alkyl group having 1 to 8 carbon atoms, and specifically includes a methyl group, an ethyl group, a propyl group, and an n-butyl group. , Sec-butyl group, hexyl group, 2-ethylhexyl group,
An octyl group can be preferably mentioned.

The cycloalkyl group of R _{2 to} R ₆ , R ₁₅ and R ₂₂ may be monocyclic or polycyclic. Preferred examples of the monocyclic type include a cyclopropyl group, a cyclopentyl group, and a cyclohexyl group each having 3 to 8 carbon atoms. Preferred examples of the polycyclic type include an adamantyl group, a norbornyl group, an isobornyl group, a dicyclopentyl group, an a-pinel group, and a tricyclodecanyl group.

The alkenyl group for R ₅ and R ₆ is, for example, an alkenyl group having 2 to 8 carbon atoms.
Preferable examples include a vinyl group, an allyl group, a butenyl group, and a cyclohexenyl group.

The aryl group of R _{2 to} R ₆ , R ₁₅ and R ₂₂ is, for example, an aryl group having 6 to 15 carbon atoms, and specifically, a phenyl group, a tolyl group, a dimethylphenyl group, , 4,6-trimethylphenyl group, naphthyl group,
An anthryl group and the like can be preferably mentioned. R ₂ ~
The aralkyl group for R ₆ , R ₁₅ , and R ₂₂ is, for example, an aralkyl group having 7 to 12 carbon atoms, and specific examples thereof include a benzyl group, a phenethyl group, and a naphthylmethyl group.

The haloalkyl group of R ₁ , R _{7 to} R ₁₂ , R ₁₆ and R ₁₇ is, for example, a haloalkyl group having 1 to 4 carbon atoms, specifically, chloromethyl group, chloroethyl group, chloropropyl group. Group, chlorobutyl group, bromomethyl group, bromoethyl group and the like.
The acyl group of R _{2 to} R ₄ is, for example, an acyl group having 1 to 10 carbon atoms, preferably a formyl group, an acetyl group, a propanoyl group, a butanoyl group, a pivaloyl group, a benzoyl group and the like.

The alkoxy group for R ₁₃ and R ₁₄ is, for example, an alkoxy group having 1 to 8 carbon atoms, preferably a methoxy group, an ethoxy group, a propoxy group, a butoxy group. The acyloxy group is, for example, an acyloxy group having 1 to 10 carbon atoms, and preferably includes an acetoxy group, a propanoyloxy group, and a benzoyloxy group.

The alkylene group for A ₁ , A ₄ , R ₂₀ , R ₂₁ and R ₂₃ is, for example, an alkylene group having 1 to 8 carbon atoms, such as methylene, ethylene, propylene, butylene, hexylene. And an octylene group. The alkenylene group represented by A ₁ , R ₂₀ , R ₂₁ and R ₂₃ is, for example, an alkenylene group having 2 to 6 carbon atoms, and preferably includes an ethenylene group, a propenylene group, a butenylene group and the like.

The cycloalkylene group of A ₁ , A ₄ , R ₂₀ , R ₂₁ and R ₂₃ is, for example, a cycloalkylene group having 5 to 8 carbon atoms, preferably a cyclopentylene group, a cyclohexylene group or the like. Can be mentioned. A ₁ , A ₃ , A
_4, as the arylene group _{R 20, R 21, R 23} , for example a number 6-12 arylene group having a carbon, a phenylene group, tolylene group, xylylene group, and preferably a naphthylene group.

Examples of the substituent substituted on these groups include those having active hydrogen such as amino group, amide group, ureido group, urethane group, hydroxyl group, carboxyl group, and halogen atom (fluorine atom, chlorine atom). , A bromine atom, an iodine atom), an alkoxy group (a methoxy group, an ethoxy group, a propoxy group, a butoxy group, etc.), a thioether group,
Acyl group (acetyl group, propanoyl group, benzoyl group, etc.), acyloxy group (acetoxy group, propanoyloxy group, benzoyloxy group, etc.), alkoxycarbonyl group (methoxycarbonyl group, ethoxycarbonyl group, propoxycarbonyl group, etc.), cyano Group, nitro group and the like. Particularly, those having active hydrogen such as an amino group, a hydroxyl group and a carboxyl group are preferable.

Further two of R ₂ to R _4, or R ₂ to R ₄
Examples of the ring one with R ₅ or R ₆ are formed by binding, a benzofuran ring, benzodioxolyl Nord rings include 4-7 membered rings containing oxygen atoms such benzopyran ring.

The resin of the present invention (B) may be a resin comprising only the repeating structural unit of the general formula (a), but for the purpose of further improving the performance of the negative resist of the present invention,
Other polymerizable monomers may be copolymerized.

The copolymerizable monomers that can be used include the following. For example, acrylates other than the above, acrylamides, methacrylates, methacrylamides, allyl compounds, vinyl ethers, vinyl esters, styrenes, addition polymerizable unsaturated bonds selected from crotonates and the like. It is a compound having one.

Specifically, for example, acrylates such as alkyl (the alkyl group has 1 to 1 carbon atoms)
Acrylates (eg, methyl acrylate, ethyl acrylate, propyl acrylate, t-butyl acrylate, amyl acrylate, cyclohexyl acrylate, ethylhexyl acrylate, octyl acrylate, tert-octyl acrylate) , Chloroethyl acrylate, 2-hydroxyethyl acrylate 2,2
-Dimethylhydroxypropyl acrylate, 5-hydroxypentyl acrylate, trimethylolpropane monoacrylate, pentaerythritol monoacrylate, glycidyl acrylate, benzyl acrylate, furfuryl acrylate, tetrahydrofurfuryl acrylate, etc.) aryl acrylate (for example, phenyl acrylate);

Methacrylic esters, for example, alkyl (alkyl having preferably 1 to 10 carbon atoms) methacrylate (for example, methyl methacrylate,
Ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, t-butyl methacrylate,
Amyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate,
Chlorbenzyl methacrylate, octyl methacrylate, 2-hydroxyethyl methacrylate, 4-hydroxybutyl methacrylate, 5-hydroxypentyl methacrylate, 2,2-dimethyl-3-hydroxypropyl methacrylate, trimethylolpropane monomethacrylate, pentaerythritol monomethacrylate, glycidyl methacrylate , Furfuryl methacrylate, tetrahydrofurfuryl methacrylate, etc.),
Aryl methacrylates (eg, phenyl methacrylate, cresyl methacrylate, naphthyl methacrylate, etc.);

Acrylamides, for example, acrylamide, N-alkylacrylamide, (where the alkyl group has 1 to 10 carbon atoms, for example, methyl, ethyl, propyl, butyl, t-butyl, heptyl) Group, octyl group, cyclohexyl group, benzyl group, hydroxyethyl group, benzyl group, etc.), N-arylacrylamide (aryl group includes, for example, phenyl group, tolyl group, nitrophenyl group, naphthyl group,
Examples include a cyanophenyl group, a hydroxyphenyl group, and a carboxyphenyl group. ), N, N-dialkylacrylamide (an alkyl group having 1 to 10 carbon atoms, for example, a methyl group, an ethyl group, a butyl group, an isobutyl group, an ethylhexyl group, a cyclohexyl group, etc.), N-diarylacrylamide (an aryl group includes, for example, a phenyl group), N-methyl-N-phenylacrylamide, N-hydroxyethyl-N-methylacrylamide, N-2-acetamidoethyl-N-acetylacrylamide and the like ;

Methacrylamides, for example, methacrylamide, N-alkylmethacrylamide (an alkyl group having 1 to 10 carbon atoms, for example, methyl, ethyl, t-butyl, ethylhexyl, hydroxyethyl Group, cyclohexyl group, etc.), N
-Aryl methacrylamide (an aryl group includes a phenyl group and the like), N, N-dialkyl methacrylamide (an alkyl group includes an ethyl group, a propyl group and a butyl group), N, N-diaryl Methacrylamide (an aryl group includes a phenyl group and the like), N-hydroxyethyl-N-methylmethacrylamide, N-methyl-N-phenylmethacrylamide, N-ethyl-N-phenylmethacrylamide and the like;
Allyl compounds, for example, allyl esters (for example, allyl acetate, allyl caproate, allyl caprylate, allyl laurate, allyl palmitate, allyl stearate, allyl benzoate, allyl acetoacetate, allyl lactate), allyloxyethanol Such;

Vinyl ethers such as alkyl vinyl ethers (eg, hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, ethylhexyl vinyl ether, methoxyethyl vinyl ether,
Ethoxyethyl vinyl ether, chloroethyl vinyl ether, 1-methyl-2,2-dimethylpropyl vinyl ether, 2-ethylbutyl vinyl ether, hydroxyethyl vinyl ether, diethylene glycol vinyl ether, dimethylaminoethyl vinyl ether, diethylaminoethyl vinyl ether, butylaminoethyl vinyl ether, benzyl vinyl ether, Tetrahydrofurfuryl vinyl ether, etc.), vinyl aryl ethers (for example, vinyl phenyl ether, vinyl tolyl ether, vinyl chlorophenyl ether, vinyl-
2,4-dichlorophenyl ether, vinyl naphthyl ether, vinyl anthranyl ether, etc.);

Vinyl esters, for example, vinyl butyrate, vinyl isobutyrate, vinyl trimethyl acetate, vinyl diethyl acetate, vinyl valate, vinyl caproate, vinyl chloroacetate, vinyl dichloroacetate, vinyl methoxy acetate, vinyl butoxy acetate , Vinylphenyl acetate, vinyl acetoacetate, vinyl lactate, vinyl-β-
Phenyl butyrate, vinyl cyclohexyl carboxylate, vinyl benzoate, vinyl salicylate, vinyl chlorobenzoate, vinyl tetrachlorobenzoate, vinyl naphthoate, and the like;

Styrenes such as styrene, alkyl styrene (eg, methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, isopropyl styrene, butyl styrene, hexyl styrene, cyclohexyl styrene, decyl styrene, benzyl styrene, chloromethyl Styrene, trifluoromethylstyrene, ethoxymethylstyrene, acetoxymethylstyrene, etc., alkoxystyrene (eg, methoxystyrene, 4-methoxy-3-methylstyrene, dimethoxystyrene, etc.), halogen styrene (eg, chlorostyrene, dichlorostyrene) , Trichlorostyrene, tetrachlorostyrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodostyrene, fluors Ren, trifluoromethyl styrene, 2
-Bromo-4-trifluoromethylstyrene, 4-fluoro-3-trifluoromethylstyrene, etc.), carboxystyrene;

Crotonic esters, for example, alkyl crotonates (eg, butyl crotonate, hexyl crotonate, glycerin monocrotonate, etc.); dialkyl itaconates (eg, dimethyl itaconate, diethyl itaconate, dibutyl itaconate, etc.) ); Dialkyl esters of maleic acid or fumaric acid (eg,
Dimethyl maleate, dibutyl fumarate, etc.), maleic anhydride, maleimide, acrylonitrile, methacrylonitrile, maleilenitrile and the like. In addition, generally, any addition-polymerizable unsaturated compound that can be copolymerized may be used.

Among these, monomers having a carboxyl group such as carboxystyrene, N- (carboxyphenyl) acrylamide, N- (carboxyphenyl) methacrylamide, and monomers improving the alkali solubility such as maleimide are copolymerizable components. Is preferred. The content of the other polymerizable monomer in the resin in the present invention is preferably 50 mol% or less, more preferably 30 mol% or less, based on all repeating units.

Specific examples of the resin having a repeating structural unit represented by the general formula (a) are shown below, but the present invention is not limited thereto.

[0050]

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[0051]

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[0052]

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[0053]

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[0054]

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[0055]

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[0056]

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[0057]

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[0058]

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[0059]

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[0060]

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[0061]

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M, n and o represent the molar ratio of the resin composition,
In the resin composed of the components, m = 10 to 95, n = 5 to 9
0, preferably m = 40-90, n = 10-60. For a resin consisting of three components, m = 10-9
0, n = 5-85, o = 5-85, preferably m = 40
-80, n = 10-50, o = 10-50.

The preferred molecular weight of the resin having the repeating unit (B), preferably represented by the general formula (a), is from 1,000 to 200,000, more preferably from 3,000 to 50, by weight average. Used in the range of 2,000. The molecular weight distribution is 1 to 10, preferably 1 to 3,
More preferably, those having a range of 1 to 1.5 are used.
The smaller the molecular weight distribution, the higher the resolution, resist shape,
In addition, the side walls of the resist pattern are smooth and have excellent roughness. The content of the repeating structural unit represented by the general formula (a) is 5 to 100 mol%, preferably 10 to 90 mol%, based on the whole resin.

The alkali-soluble resin containing a structural unit represented by the general formula (a) used in the present invention can be obtained from Macrom
olecules (1995), 28 (11), 3787-3789, Polym. Bull.
(Berlin) (1990), 24 (4), 385-389, JP-A-8-2863.
75 can be synthesized. That is, the desired alkali-soluble resin can be obtained by radical polymerization or living anion polymerization. These resins may be used alone or in combination of two or more.

Here, the weight average molecular weight is defined as the value in terms of polystyrene by gel permeation chromatography. The alkali dissolving rate of the alkali-soluble resin is preferably 20 ° / sec or more as measured (23 ° C.) using 0.261N tetramethylammonium hydroxide (TMAH). Particularly preferably, it is 200 ° / sec or more. The alkali-soluble resin of the present invention may be used alone or in combination with another alkali-soluble resin. As for the use ratio, another alkali-soluble resin other than the present invention can be used up to a maximum of 100 parts by weight with respect to 100 parts by weight of the alkali-soluble resin of the present invention. The following are examples of alkali-soluble resins that can be used in combination.

Examples include, but are not limited to, novolak resins, hydrogenated novolak resins, acetone-pyrogallol resins, styrene-maleic anhydride copolymers, carboxyl group-containing methacrylic resins and derivatives thereof. . The amount of the resin (B) to be added is 30 to 95% by weight, preferably 40 to 95% by weight, based on the total solid content of the composition.
It is used in an amount of 90% by weight, more preferably 50 to 80% by weight.

(2) Compound of the present invention (A) which generates an acid and / or a radical species upon irradiation with an electron beam or X-ray The component (A) used in the present invention is irradiated with an electron beam or X-ray. Any compound can be used as long as it generates an acid and / or a radical species. here,
The compound that generates an acid and / or a radical species refers to a compound that generates an acid, a compound that generates an acid and a radical species, or a compound that generates a radical species.

By irradiation with such an electron beam or X-ray,
Examples of the compound that generates an acid and / or a radical species include a photoinitiator for photocationic polymerization, a photoinitiator for photoradical polymerization,
A compound capable of generating an acid by a known light and a mixture thereof, which is used in a photo-decoloring agent, a photo-discoloring agent, or a micro-resist of a dye, can be appropriately selected and used.

Compounds in which a group or a compound capable of generating an acid and / or a radical species upon irradiation with these electron beams or X-rays are introduced into the main chain or side chain of the polymer, for example, JP-A-63-26653 No., JP-A-55-16
4824, JP-A-62-69263, JP-A-63-69263
Compounds described in JP-A No. 146038, JP-A-63-163452, JP-A-62-153853, JP-A-63-14629 and the like can be used. Further, compounds capable of generating an acid by light described in U.S. Pat. No. 3,779,778 and European Patent 126,712 can also be used.

Onium salts such as known diazonium salts, phosphonium salts, iodonium salts, sulfonium salts, selenonium salts, etc .; organic halogen compounds; o-nitrobenzylsulfonate compounds; N-iminosulfonate compounds; N-imidosulfonate compounds; Examples thereof include a sulfone compound, a diazodisulfone compound, and a disulfone compound.

Preferred are sulfonium or iodonium sulfonate compounds, N-hydroxyimide sulfonate compounds, and disulfonyldiazomethane compounds. Among them, particularly preferred are N-imidosulfonate compounds described in JP-A-10-7653 and JP-A-11-2901, and JP-A-4-21096.
No. 0, diazodisulfone compounds described in European Patent No. 417557, and the like, and sulfonium salts and iodonium salts represented by the following general formulas (I) to (III). Sulfonium salts and iodonium salts represented by (III) are most preferred.

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R ₁ in the general formulas (I) to (III)
To R ₃₇ is a hydrogen atom, an alkyl group, an alkoxy group, a hydroxyl group, a halogen atom, or a group which can be represented by -S-R _38. The alkyl group represented by R _{1 to} R ₃₇ may be linear, branched, or cyclic.
Examples of the linear or branched alkyl group include an alkyl group having 1 to 4 carbon atoms, such as a methyl group, an ethyl group, a propyl group, an n-butyl group, a sec-butyl group, and a t-butyl group. be able to. Examples of the cyclic alkyl group include an alkyl group having 3 to 8 carbon atoms such as a cyclopropyl group, a cyclopentyl group, and a cyclohexyl group.

The alkoxy groups represented by R _{1 to} R ₃₇ may be linear, branched, or cyclic alkoxy groups. Examples of the linear or branched alkoxy group include those having 1 to 8 carbon atoms such as a methoxy group, an ethoxy group, a hydroxyethoxy group, a propoxy group, an n-butoxy group,
Examples thereof include an isobutoxy group, a sec-butoxy group, a t-butoxy group, and an octyloxy group. Examples of the cyclic alkoxy group include a cyclopentyloxy group and a cyclohexyloxy group.

Examples of the cyclic alkoxy group include a cyclopentyloxy group and a cyclohexyloxy group. Examples of the halogen atom represented by R _{1 to} R ₃₇ include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom. R ₃₈ in -S-R ₃₈ in which R ₁ to R ₃₇ represents is an alkyl group, or an aryl group. The scope of the alkyl group R ₃₈ is represented can also include any example in the alkyl groups already listed as an alkyl group represented by R ₁ to R _37. The aryl group represented by R ₃₈ has a carbon number of 6 to 6, such as a phenyl group, a tolyl group, a methoxyphenyl group, and a naphthyl group.
There may be mentioned 14 aryl groups.

The alkyl group and the alkoxy group represented by R _{1 to} R ₃₇ and the alkyl group and the aryl group represented by R ₃₈ are
Further, a substituent may be bonded to increase the number of carbon atoms, or may not have a substituent. Further, as the substituent which may be bonded, preferably, an alkoxy group having 1 to 4 carbon atoms, an aryl group having 6 to 10 carbon atoms, and a 2 to 6 carbon atoms.
Alkenyl groups, a cyano group, a hydroxyl group, a carboxy group, an alkoxycarbonyl group,
Nitro groups and the like can also be mentioned. In addition, a halogen atom may be used. For example, there can be mentioned a fluorine atom, a chlorine atom and an iodine atom.

The groups represented by R _{1 to} R ₁₅ in the general formula (I) are
Two or more of them may combine to form a ring. The ring may be formed by directly bonding the terminals of the groups represented by R _{1 to} R ₁₅ . They may be indirectly linked via one or more elements selected from carbon, oxygen, sulfur and nitrogen to form a ring. The ring structure formed by combining two or more of R _{1 to} R ₁₅ is the same as the ring structure found in a furan ring, dihydrofuran ring, pyran ring, trihydropyran ring, thiophene ring, pyrrole ring, and the like. Can be mentioned. R _{16 to} R in the general formula (II)
_{The same} can be said for ₂₇ . Two or more may be directly or indirectly linked to form a ring. The same applies to R _{28 to} R ₃₇ in the general formula (III).

The general formulas (I) to (III) have X ⁻ . X ⁻ in the general formulas (I) to (III) is an anion of an acid. The acid forming the anion is an acid selected from benzenesulfonic acid, naphthalenesulfonic acid, or anthracenesulfonic acid. The acid is substituted by one or more fluorine atoms. Or the acid is, together with or in place of the fluorine atom, an alkyl group, an alkoxyl group, an acyl group, an acyloxyl group, a sulfonyl group,
It has at least one organic group selected from the group consisting of a sulfonyloxy group, a sulfonylamino group, an aryl group, an aralkyl group, and an alkoxycarbonyl group, and the organic group further substitutes at least one fluorine atom. are doing. Further, the above benzenesulfonic acid, naphthalenesulfonic acid, or anthracenesulfonic acid may be substituted with a halogen atom other than fluorine, a hydroxyl group, a nitro group, or the like.

[0079] X ^- alkyl group bonding such as benzenesulfonic acid to form the anion of, for example, a carbon number 1 to 1
2 alkyl groups. The alkyl group may be linear, branched, or cyclic. At least one fluorine atom, preferably 25 or less, is substituted. Specifically, a trifluoromethyl group, a pentafluoroethyl group, a 2,2,2-trifluoroethyl group, a heptafluoropropyl group, a heptafluoroisopropyl group, a perfluorobutyl group, a perfluorooctyl group, a perfluorododecyl group, Perfluorocyclohexyl group and the like can be mentioned. Among them, carbon atoms all substituted with fluorine 1
~ 4 perfluoroalkyl groups are preferred.

The above-mentioned alkoxy group bonded to benzenesulfonic acid or the like together with the alkyl group or alone is an alkoxy group having 1 to 12 carbon atoms. The alkoxy group may be linear, branched, or cyclic.
At least one fluorine atom, preferably 25 or less, is substituted. Specific examples include a trifluoromethoxy group, a pentafluoroethoxy group, a heptafluoroisopropyloxy group, a perfluorobutoxy group, a perfluorooctyloxy group, a perfluorododecyloxy group, and a perfluorocyclohexyloxy group.
Among them, a perfluoroalkoxy group having 1 to 4 carbon atoms, all of which is substituted by fluorine, is preferable.

The acyl group bonded to benzenesulfonic acid or the like together with the alkyl group or alone is preferably substituted with a fluorine atom having 2 to 12 or 1 to 23 carbon atoms. Specific examples include a trifluoroacetyl group, a fluoroacetyl group, a pentafluoropropionyl group, and a pentafluorobenzoyl group.

The acyloxy group bonded to benzenesulfonic acid or the like together with the alkyl group or alone is preferably substituted with a fluorine atom having 2 to 12 or 1 to 23 carbon atoms. Specific examples include a trifluoroacetoxy group, a fluoroacetoxy group, a pentafluoropropionyloxy group, and a pentafluorobenzoyloxy group. As the sulfonyl group bonded to benzenesulfonic acid or the like together with the alkyl group or alone, a sulfonyl group having 1 to 12 carbon atoms and substituted with 1 to 25 fluorine atoms is preferable. Specific examples include a trifluoromethanesulfonyl group, a pentafluoroethanesulfonyl group, a perfluorobutanesulfonyl group, a perfluorooctanesulfonyl group, a pentafluorobenzenesulfonyl group, and a 4-trifluoromethylbenzenesulfonyl group.

The sulfonyloxy group bonded to the above benzenesulfonic acid or the like together with the alkyl group or alone is preferably a group substituted with a fluorine atom having 1 to 12 or 1 to 25 carbon atoms. Specific examples include a trifluoromethanesulfonyloxy group, a perfluorobutanesulfonyloxy group, and a 4-trifluoromethylbenzenesulfonyloxy group. The sulfonylamino group bonded to the above-mentioned benzenesulfonic acid or the like together with the alkyl group or alone has a carbon number of 1 to
12 which is substituted with 1 to 25 fluorine atoms is preferred. Specifically, a trifluoromethanesulfonylamino group, a perfluorobutanesulfonylamino group,
Examples thereof include a perfluorooctanesulfonylamino group and a pentafluorobenzenesulfonylamino group.

The aryl group bonded to the above-mentioned benzenesulfonic acid or the like together with the alkyl group or alone is preferably an aryl group substituted by a fluorine atom having 6 to 14 or 1 to 9 carbon atoms. Specific examples include a pentafluorophenyl group, a 4-trifluoromethylphenyl group, a heptafluoronaphthyl group, a nonafluoroanthranyl group, a 4-fluorophenyl group, and a 2,4-difluorophenyl group. The aralkyl group bonded to the above-mentioned benzenesulfonic acid or the like together with the alkyl group or alone is preferably a group substituted by a fluorine atom having 7 to 10 or 1 to 15 carbon atoms. Specific examples include a pentafluorophenylmethyl group, a pentafluorophenylethyl group, a perfluorobenzyl group, a perfluorophenethyl group, and the like. The alkoxycarbonyl group bonded to the benzenesulfonic acid or the like alone or together with the alkyl group may have 2 to 13, 1 to 1 carbon atoms.
Those substituted with 25 fluorine atoms are preferred.
Specific examples include a trifluoromethoxycarbonyl group, a pentafluoroethoxycarbonyl group, a pentafluorophenoxycarbonyl group, a perfluorobutoxycarbonyl group, and a perfluorooctyloxycarbonyl group.

Among these anions, the most preferred X ⁻ is a fluorine-substituted benzenesulfonic acid anion,
Among them, pentafluorobenzenesulfonic acid anion is particularly preferred. Further, the benzene sulfonic acid, naphthalene sulfonic acid, or anthracene sulfonic acid having the fluorine-containing substituent further has a linear, branched or cyclic alkoxy group, an acyl group, an acyloxy group, a sulfonyl group,
It may be substituted with a sulfonyloxy group, a sulfonylamino group, an aryl group, an aralkyl group, an alkoxycarbonyl group (the number of carbon atoms is the same as described above), a halogen (excluding fluorine), a hydroxyl group, a nitro group and the like. Hereinafter, specific examples of the compounds represented by the general formulas (I) to (III) are shown, but the invention is not limited thereto.

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[0087]

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[0088]

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[0089]

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[0090]

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[0091]

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Compounds of the general formulas (I) and (II)
It can be synthesized by the following method. For example, an aryl Grignard reagent such as aryl magnesium bromide is reacted with phenylsulfoxide, and the resulting triarylsulfonium halide is subjected to salt exchange with the corresponding sulfonic acid. There is another way. For example, there is a method in which phenyl sulfoxide and an aromatic compound corresponding thereto are condensed and salt-exchanged using an acid catalyst such as methanesulfonic acid / diphosphorus pentoxide or aluminum chloride. Further, the diaryl iodonium salt and the diaryl sulfide can be synthesized by a method of condensation or salt exchange using a catalyst such as copper acetate. In any of the above methods, the phenylsulfoxide may have a substituent substituted on the benzene ring, or may not have such a substituent. The compound of the general formula (III) can be synthesized by reacting an aromatic compound with periodate.

The content of the component (A) used in the present invention is as follows:
0.1 to 20 with respect to the solid content of the whole negative resist composition
% Is suitable, preferably 0.5 to 10% by weight,
More preferably, it is 1 to 7% by weight.

In the present invention, in addition to the compounds represented by the above general formulas (I) to (III), or together with them, other compounds which decompose upon irradiation with radiation to generate acid and / or radical species Can be used. In the case where another compound which is decomposed by irradiation with radiation to generate an acid and / or a radical species is used together with the compounds represented by the general formulas (I) to (III), the acid and And / or the ratio of other compounds generating radical species is 100/0 to 20 /
80, preferably 90/10 to 40/60, more preferably 80/20 to 50/50.

(3) Acid Crosslinking Agent of the Invention (C) In the present invention, a compound capable of being crosslinked by an acid together with an alkali-soluble resin, an acid and / or a radical generator (hereinafter referred to as an acid crosslinking agent or simply a crosslinking agent, as appropriate) ). Here, a known acid crosslinking agent can be effectively used. Preferably, it is a compound having two or more hydroxymethyl groups, alkoxymethyl groups, acyloxymethyl groups, or alkoxymethyl ether groups, a resin, or an epoxy compound.

More preferably, alkoxymethylated, acyloxymethylated melamine compounds or resins, alkoxymethylated, acyloxymethylated urea compounds or resins, hydroxymethylated or alkoxymethylated phenol compounds or resins, and alkoxymethyl etherified phenol compounds Alternatively, a resin or the like can be used.

[0097] Specifically, a phenol derivative can be used as the crosslinking agent. Preferably, the molecular weight is 120
0 or less, containing 3 to 5 benzene rings in the molecule, and further having 2 or more hydroxymethyl groups or alkoxymethyl groups in total, and concentrating the hydroxymethyl group or alkoxymethyl group on at least one of the benzene rings. ,
Alternatively, a phenol derivative formed by distributing and binding can be used. By using such a phenol derivative, the effects of the present invention can be made more remarkable. The alkoxymethyl group bonded to the benzene ring preferably has 6 or less carbon atoms. Specifically, methoxymethyl, ethoxymethyl, n-propoxymethyl, i-propoxymethyl, n-butoxymethyl, i-butoxymethyl, sec-butoxymethyl and t-butoxymethyl are preferred. Further, an alkoxy-substituted alkoxy group such as a 2-methoxyethoxy group and a 2-methoxy-1-propyl group is also preferable. Among these phenol derivatives, particularly preferred ones are listed below.

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[0099]

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[0100]

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[0101]

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[0102]

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(Wherein L ^{1 to} L ⁸ may be the same or different and each represents a hydroxymethyl group, a methoxymethyl group or an ethoxymethyl group.) A phenol derivative having a hydroxymethyl group corresponds to A phenol compound having no hydroxymethyl group (compound wherein L ^{1 to} L ⁸ are hydrogen atoms in the above formula) and formaldehyde are reacted in the presence of a base catalyst. At this time, the reaction is preferably performed at a reaction temperature of 60 ° C. or lower in order to prevent resinification and gelation. Specifically, JP-A-6-282067 and JP-A-7-64
No. 285, for example.

The phenol derivative having an alkoxymethyl group can be obtained by reacting the corresponding phenol derivative having a hydroxymethyl group with an alcohol in the presence of an acid catalyst. At this time, the reaction is preferably performed at a reaction temperature of 100 ° C. or less in order to prevent resinification and gelation. Specifically, it can be synthesized by a method described in European Patent EP632003A1 or the like. A phenol derivative having a hydroxymethyl group or an alkoxymethyl group synthesized as described above is preferable in terms of stability during storage, but a phenol derivative having an alkoxymethyl group is particularly preferable from the viewpoint of stability during storage.
Such a phenol derivative having two or more hydroxymethyl groups or alkoxymethyl groups in total and concentrated or linked to any benzene ring may be used alone. A combination of the above may be used.

In addition to the above phenol derivatives, the following compounds (i) and (ii) can be used as crosslinking agents. (I) Compound having N-hydroxymethyl group, N-alkoxymethyl group, or N-acyloxymethyl group (ii) Epoxy compound

The cross-linking agent contained 3% of the total solid content of the resist composition.
It is used in an addition amount of up to 65% by weight, preferably 5 to 50% by weight. If the amount of the cross-linking agent is less than 3% by weight, the residual film ratio decreases, and if it exceeds 65% by weight, the resolving power decreases, and the stability of the resist solution during storage is not so preferable.

In the present invention, in addition to the above-mentioned phenol derivatives, for example, other crosslinking agents (i) and (i) as described above
i) can be used in combination. The ratio of other crosslinking agents that can be used in combination in addition to the above-mentioned phenol derivative is 10 mol%.
0 / 0-20 / 80, preferably 90 / 10-40 / 6
0, more preferably 80/20 to 50/50.

These crosslinking agents will be described in detail below. (I) As a compound having an N-hydroxymethyl group, an N-alkoxymethyl group, or an N-acyloxymethyl group, European Patent Publication (hereinafter referred to as “EP-A”) No. 0,133,216; West German Patent No. 3,63
No. 4,671, No. 3,711,264, monomer and oligomer-melamine-formaldehyde condensate and urea-formaldehyde condensate, alkoxy disclosed in EP-A 0,212,482 Benzoguanamine-formaldehyde condensates disclosed in substituted compounds and the like can be mentioned. More preferred examples include, for example, at least two free N-hydroxymethyl groups,
A melamine-formaldehyde derivative having an -alkoxymethyl group or an N-acyloxymethyl group, among which an N-alkoxymethyl derivative is particularly preferred.

(Ii) Examples of the epoxy compound include monomer, dimer, oligomer, and polymer epoxy compounds containing one or more epoxy groups. For example, a reaction product of bisphenol A with epichlorohydrin, a reaction product of a low molecular weight phenol-formaldehyde resin with epichlorohydrin and the like can be mentioned. Other examples include epoxy resins described and used in U.S. Pat. No. 4,026,705 and British Patent 1,539,192.

(4) Fluorine and / or Silicon Surfactant of the Invention (D) The negative photoresist composition of the invention contains (D) a fluorine and / or silicon surfactant. . The negative photoresist composition of the present invention may contain a fluorine-based surfactant, a silicon-based surfactant and / or a surfactant containing both a fluorine atom and a silicon atom, or may contain two or more kinds. it can. The addition of these fluorine-based and / or silicon-based surfactants is effective in suppressing development defects and improving coatability.

As these surfactants, for example, those described in
No. 62-36663, JP-A-61-226746, JP-A-61-226745,
JP-A-62-170950, JP-A-63-34540, JP-A-7-23016
No. 5, JP-A-8-62834, JP-A-9-54432, JP-A-9-598
8, U.S. Patent 5,405,720, U.S. Patent 5,306,692, U.S. Patent 5,529,881, U.S. Patent 5,296,330, U.S. Patent 5436098
No., US Patent No. 5,576,143, US Patent No. 5,296,143, US Patent
Surfactants described in 5294511 and US Pat. No. 5,824,451 can be mentioned, and the following commercially available surfactants can be used as they are. As such commercially available surfactants, for example, F-top EF301, EF303, (Shin-Akita Chemical Co., Ltd.)
), Florado FC430, 431 (manufactured by Sumitomo 3M Limited),
Megafac F171, F173, F176, F189, R08 (Dai Nippon Ink Co., Ltd.), Surflon S-382, SC101, 102, 10
3, 104, 105, 106 (manufactured by Asahi Glass Co., Ltd.) and the like, and fluorine-based surfactants or silicon-based surfactants. Also, polysiloxane polymer KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) can be used as a silicon-based surfactant.

The amount of the surfactant is usually 0.001 to 2% by weight, preferably 0.01 to 1% by weight, based on the solid content in the composition of the present invention. These surfactants may be added alone or in some combination. (5) Compound having unsaturated bond polymerizable by acid and / or radical of the present invention (E) As compound having unsaturated bond polymerizable by acid and / or radical generated from compound of the present invention (A) Any known monomer having a polymerizable group can be used without particular limitation. As such a monomer, specifically, for example, 2-ethylhexyl acrylate,
Monofunctional acrylic acid esters such as 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate and derivatives thereof, or compounds in which these acrylates are replaced with methacrylates, itaconates, crotonates, maleates, and the like;

Polyethylene glycol diacrylate,
Bifunctional acrylates such as pentaerythritol diacrylate, bisphenol A diacrylate, diacrylate of ε-caprolactone adduct of neopentyl glycol hydroxypivalate and derivatives thereof, or these acrylates are replaced with methacrylate, itaconate, crotonate, maleate, etc. Compound;

Alternatively, polyfunctional acrylates such as trimethylolpropane tri (meth) acrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pyrogallol triacrylate and derivatives thereof, or acrylates of these with methacrylate, itaconate, crotonate, maleate And the like. Further, a so-called prepolymer obtained by introducing acrylic acid or methacrylic acid into an oligomer having an appropriate molecular weight and imparting photopolymerizability can also be suitably used.

In addition to the above, JP-A-58-212994,
Nos. 61-6649, 62-46688 and 62-
No. 48589, No. 62-173295, No. 62-18
Nos. 7092 and 63-67189, JP-A-1-244
No. 891 and the like, and furthermore, "11290 Chemical Products", Chemical Daily, 286-
Compounds described on page 294, compounds described in “UV / EB Curing Handbook (Raw Materials Edition)”, Polymer Publishing Association, pages 11 to 65, and the like can also be suitably used.

Among them, compounds having two or more acrylic or methacrylic groups in the molecule are preferred in the present invention, and those having a molecular weight of 10,000 or less, more preferably 5,000 or less are desirable. In the present invention, the polymerizable compound is selected from among monomers having a polymerizable group, including those exemplified above, and prepolymers.
Two or more kinds can be used in combination. The compound having an unsaturated group accounts for 2 to 50% by weight, preferably 5 to 40% by weight, more preferably 10% by weight, based on the total solid content of the resist composition.
It is used in an addition amount of ３０30% by weight.

(6) Organic Basic Compound (F) of the Present Invention Preferred organic basic compounds that can be used in the present invention are compounds that are more basic than phenol. Among them, a nitrogen-containing basic compound is preferable. Preferred chemical environments include compounds having structures of the following formulas (A) to (E).

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Here, R ²⁵⁰ , R ²⁵¹ and R ²⁵² may be the same or different and include a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aminoalkyl group having 1 to 6 carbon atoms,
Represents 6 to 6 hydroxyalkyl groups or a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, wherein R
²⁵¹ and R ²⁵² may combine with each other to form a ring. R
²⁵³ , R ²⁵⁴ , R ²⁵⁵ and R ²⁵⁶ may be the same or different and represent an alkyl group having 1 to 6 carbon atoms. Further preferred compounds are nitrogen-containing basic compounds having two or more nitrogen atoms having different chemical environments in one molecule, and particularly preferred are both substituted or unsubstituted amino groups and ring structures containing nitrogen atoms. Or a compound having an alkylamino group.

Preferred specific examples include substituted or unsubstituted guanidine, substituted or unsubstituted aminopyridine, substituted or unsubstituted aminoalkylpyridine, substituted or unsubstituted aminopyrrolidine, substituted or unsubstituted indazole, imidazole, Substituted or unsubstituted pyrazole, substituted or unsubstituted pyrazine, substituted or unsubstituted pyrimidine, substituted or unsubstituted purine, substituted or unsubstituted imidazoline, substituted or unsubstituted pyrazoline, substituted or unsubstituted piperazine, substituted Or, unsubstituted aminomorpholine, substituted or unsubstituted aminoalkylmorpholine and the like can be mentioned. Preferred substituents are an amino group, aminoalkyl group, alkylamino group, aminoaryl group, arylamino group, alkyl group, alkoxy group, acyl group, acyloxy group, aryl group, aryloxy group, nitro group, hydroxyl group, cyano group It is.

As particularly preferred compounds, guanidine,
1,1-dimethylguanidine, 1,1,3,3-tetramethylguanidine, imidazole, 2-methylimidazole, 4-methylimidazole, N-methylimidazole, 2-phenylimidazole, 4,5-diphenylimidazole, , 4,5-triphenylimidazole, 2-aminopyridine, 3-aminopyridine, 4-aminopyridine, 2-dimethylaminopyridine, 4-dimethylaminopyridine, 2-diethylaminopyridine,
-(Aminomethyl) pyridine, 2-amino-3-methylpyridine, 2-amino-4-methylpyridine, 2-amino-5-methylpyridine, 2-amino-6-methylpyridine, 3-aminoethylpyridine, -Aminoethylpyridine,

3-aminopyrrolidine, piperazine, N-
(2-aminoethyl) piperazine, N- (2-aminoethyl) piperidine, 4-amino-2,2,6,6-tetramethylpiperidine, 4-piperidinopiperidine, 2-
Iminopiperidine, 1- (2-aminoethyl) pyrrolidine, pyrazole, 3-amino-5-methylpyrazole,
5-amino-3-methyl-1-p-tolylpyrazole,
Pyrazine, 2- (aminomethyl) -5-methylpyrazine, pyrimidine, 2,4-diaminopyrimidine, 4,6
-Dihydroxypyrimidine, 2-pyrazoline, 3-pyrazoline, N-aminomorpholine, N- (2-aminoethyl) morpholine, and the like, but are not limited thereto. These nitrogen-containing basic compounds are used alone or in combination of two or more.

The ratio of the acid generator and the organic basic compound used in the composition is preferably (acid generator) / (organic basic compound) (molar ratio) = 2.5 to 300. When the molar ratio is less than 2.5, the sensitivity becomes low and the resolving power may decrease. On the other hand, when the molar ratio exceeds 300, the thickness of the resist pattern increases over time until the heat treatment after exposure, and the resolving power may decrease. . (Acid generator) / (organic basic compound) (molar ratio) is preferably from 5.0 to 200, more preferably from 7.0 to 150.

(7) Other components that may be used in the composition of the present invention If necessary, the negative resist composition of the present invention may further contain a dye, a radical generator, a solvent, A surfactant other than the surfactant can be contained.

(7) -1 Dye Suitable dyes include oil dyes and basic dyes. Specifically, Oil Yellow # 101, Oil Yellow # 1
03, Oil Pink # 312, Oil Green BG, Oil Blue BOS, Oil Blue # 603, Oil Black BY, Oil Black BS, Oil Black T-5
05 (all manufactured by Orient Chemical Industries, Ltd.), crystal violet (CI42555), methyl violet (CI42535), rhodamine B (CI45170)
B), malachite green (CI42000), methylene blue (CI52015) and the like.

(7) -2 Radical Generator The negative resist composition of the present invention may optionally contain (F)
In order to accelerate the reaction of the polymerizable compound, a radical generator can be used in combination. As such a radical generator, a known radical polymerization initiator generally used for a polymer synthesis reaction by radical polymerization can be used without any particular limitation, and 2,2′-azobisisobutyronitrile, Azobisnitrile compounds such as 2,2'-azobispropionitrile, benzoyl peroxide, lauroyl peroxide, acetyl peroxide, t-butyl perbenzoate, α-
Cumyl hydroperoxide, di-t-butyl peroxide, diisopropylperoxydicarbonate, t
Organic peroxides such as -butyl peroxyisopropyl carbonate, peracids, alkyl peroxycarbamates, nitrosoaryl acylamines,

Inorganic peroxides such as potassium persulfate, ammonium persulfate and potassium perchlorate; azo or diazo compounds such as diazoaminobenzene, p-nitrobenzenediazonium, azobis-substituted alkanes, diazothioethers and arylazosulfones , Nitrosophenyl urea, tetraalkyl thiuram disulfides such as tetramethyl thiuram disulfide, diaryl disulfides such as dibenzoyl disulfide, dialkyl xanthogenic disulfides, aryl sulfinic acids, aryl alkyl sulfones, 1-alkane sulfinic acids and the like. Can be.

The activation energy for radical generation of the radical generator is preferably 30 Kcal / mol or more, such as an azobisnitrile compound and an organic peroxide. Among them, compounds which are excellent in stability at room temperature, have a high decomposition rate upon heating, and become colorless upon decomposition are preferable, and examples thereof include benzoyl peroxide and 2,2'-azobisisobutyronitrile. The above radical generators may be used alone or in combination of two or more, and are used at about 0.5 to 30% by weight, preferably 2 to 10% by weight, based on the total solid content of the radical polymerization layer.

(7) -3 Solvents The composition of the present invention is dissolved in a solvent that dissolves the above-mentioned components, and coated on a support. As the solvent used here,
Ethylene dichloride, cyclohexanone, cyclopentanone, 2-heptanone, γ-butyrolactone, methyl ethyl ketone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, 2-methoxyethyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether, propylene glycol Monoethyl ether,
Propylene glycol monomethyl ether acetate,
Toluene, ethyl acetate, methyl lactate, ethyl lactate, methyl methoxypropionate, ethyl ethoxypropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, N, N-dimethylformamide, dimethyl sulfoxide, N-methylpyrrolidone, tetrahydrofuran, etc. And these solvents are used alone or in combination.

(7) -4 Surfactants Surfactants can be added to the above solvents. Specifically, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene alkyl ethers such as polyoxyethylene oleyl ether, polyoxyethylene octyl phenol ether, polyoxyethylene nonyl phenol ether and the like Sorbitan such as polyoxyethylene alkyl allyl ethers, polyoxyethylene / polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan tristearate, etc. Fatty acid esters, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopal Te - door,

Nonionic surfactants such as polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan fatty acid esters such as polyoxyethylene sorbitan tristearate, acrylic acid or methacrylic acid ( Co) polymerized polyflow No. 75, no. 95
(Manufactured by Kyoeisha Yushi Kagaku Kogyo KK) and the like. The amount of these surfactants is usually 2 parts by weight or less, preferably 1 part by weight or less, per 100 parts by weight of the solids in the composition of the present invention. These surfactants may be added alone or in some combination.

In the manufacture of precision integrated circuit elements, the pattern formation step on a resist film is performed by forming the negative of the present invention on a substrate (eg, a transparent substrate such as a silicon / silicon dioxide coating, a glass substrate, an ITO substrate, etc.). A good photoresist pattern is formed by applying a photoresist composition and then irradiating with an electron beam (under an acceleration voltage of 75 keV or more) or using an X-ray lithography apparatus, heating, developing, rinsing and drying. can do.

Examples of the developing solution for the negative photoresist composition of the present invention include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate and aqueous ammonia, ethylamine, and the like.
primary amines such as n-propylamine, secondary amines such as diethylamine and di-n-butylamine, tertiary amines such as triethylamine and methyldiethylamine, alcoholamines such as dimethylethanolamine and triethanolamine, Aqueous solutions of alkalis such as quaternary ammonium salts such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline, and cyclic amines such as pyrrole and piperidine can be used. Further, an appropriate amount of an alcohol such as isopropyl alcohol or a surfactant such as a nonionic surfactant may be added to an aqueous solution of the above alkalis. Of these developers, quaternary ammonium salts are preferred, and tetramethylammonium hydroxide and choline are more preferred.

[0134]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the contents of the present invention are not limited thereto.

[0135] 1. Synthesis Examples of Constituent Materials (1) Alkali-soluble resin having a polymerizable unsaturated group Synthesis Example 1 (Synthesis of Resin Example (2)) Poly (4-hydroxystyrene) (manufactured by Nippon Soda Co., Ltd., trade name: VP-15000) 12.1 g (0.10 mol) was dissolved in 100 ml of THF, and 3.7 g (0.024 mol) of methacrylic anhydride was added. Further, 2.4 g (0.030 mol) of pyridine was added, and the mixture was refluxed for 5 hours while stirring. After allowing the reaction solution to cool, it was poured into 1 L of ion-exchanged water with vigorous stirring to precipitate a white resin. After washing with ion-exchanged water, the obtained resin was dried under reduced pressure to obtain 13.1 g of the resin (2) of the present invention. When the content of the unsaturated group was measured by NMR, the introduction amount of the methacryl group to the OH group of the polyhydroxystyrene was 18 mol%. When the molecular weight was measured by GPC, the weight average was 16,700 (dispersion degree 1.2; polystyrene standard).

Synthesis Example 2 (Synthesis of Resin Example (4)) Poly (4-hydroxystyrene) (manufactured by Nippon Soda Co., Ltd., trade name: VP-8000) was mixed with 12.1 g (0.10 mol) of N, N-dimethyl. The solution was dissolved in 100 ml of acetamide, and 3.1 g (0.020 mol) of 2-isocyanatoethyl methacrylate was added thereto.
For 7 hours. After allowing the reaction solution to cool, 1 L of ion-exchanged water
The white resin was precipitated by throwing into the mixture with vigorous stirring. After washing with ion-exchanged water, the obtained resin was dried under reduced pressure to obtain 14.4 g of the resin (4) of the present invention. When the content of the unsaturated group was measured by NMR, the amount of the methacryl group introduced into the OH group of the polyhydroxystyrene was 16 mol%. When the molecular weight was measured by GPC, the weight average was 9,100 (dispersion degree 1.2; polystyrene standard).

Synthesis Example 3 (Synthesis of Resin Example (7)) 12.1 g (0.10 mol) of poly (4-hydroxystyrene) (trade name: VP-8000, manufactured by Nippon Soda Co., Ltd.) was dissolved in 100 ml of THF. 4.7 g (0.023 mol) of 4-styrenesulfonyl chloride were added.
Further, 0.37 g of N, N-dimethylaminopyridine (0.
003 mol) /2.1 g of triethylamine (0.020
(Mol) in 20 ml of THF was added dropwise with stirring under ice-cooling. The mixture was further stirred at room temperature for 5 hours. The reaction solution was filtered, and the filtrate was poured into 1 L of ion-exchanged water with vigorous stirring to precipitate a white resin. After washing with ion-exchanged water, the obtained resin was dried under reduced pressure to obtain 15.0 g of the resin (7) of the present invention. When the content of the unsaturated group was measured by NMR, the OH of polyhydroxystyrene was measured.
The amount of the styryl group introduced into the group was 18 mol%. When the molecular weight was measured by GPC, the weight average was 9,2.
00 (dispersion degree 1.2; polystyrene standard).

Synthesis Example 4 (Synthesis of Resin Order (8)) 12.1 g (0.10 mol) of poly (4-hydroxystyrene) (trade name: VP-8000, manufactured by Nippon Soda Co., Ltd.) was N, N-dimethyl Dissolved in 100 ml of acetamide, and 3.4 g of chloromethylstyrene (0.022
Mol) was added. 2.3 g of triethylamine
(0.022 mol) of N, N-dimethylacetamide 2
A 0 ml solution was added dropwise at room temperature with stirring. Thereafter, the reaction solution was stirred at 60 ° C. for 5 hours. After allowing the reaction solution to cool, it was poured into 1 L of ion-exchanged water with vigorous stirring to precipitate a white resin. After washing with ion exchange water,
The obtained resin is dried under reduced pressure to obtain the resin (8) of the present invention.
13.9 g were obtained. When the content of the unsaturated group was measured by NMR, the amount of the styryl group introduced into the OH group of the polyhydroxystyrene was 17 mol%. When the molecular weight was measured by GPC, the weight average was 9,300 (dispersion degree 1.2; polystyrene standard). Hereinafter, the resin of the present invention (B) was synthesized in the same manner.

(2) Acid generator 1) Synthesis of tetramethylammonium pentafluorobenzenesulfonate 25 g of pentafluorobenzenesulfonyl chloride was dissolved in 100 ml of methanol under ice cooling, and 100 g of a 25% aqueous solution of tetramethylammonium hydroxide was added thereto. Added slowly. After stirring at room temperature for 3 hours, a solution of tetramethylammonium pentafluorobenzenesulfonate was obtained. This solution was used for salt exchange with sulfonium salt and iodonium salt.

2) Synthesis of triphenylsulfonium pentafluorobenzenesulfonate 50 g of diphenylsulfoxide was dissolved in 800 ml of benzene, and 200 g of aluminum chloride was added thereto.
Refluxed for 4 hours. The reaction solution was slowly poured into 2 L of ice, and 400 ml of concentrated hydrochloric acid was added thereto, followed by heating at 70 ° C. for 10 minutes. This aqueous solution was washed with 500 ml of ethyl acetate, filtered, and then a solution prepared by dissolving 200 g of ammonium iodide in 400 ml of water was added. The precipitated powder was collected by filtration, washed with water, washed with ethyl acetate and dried to obtain 70 g of triphenylsulfonium iodide. Triphenylsulfonium iodide (30.5 g) was dissolved in methanol (1000 ml), and silver oxide (19.1 g) was added to the solution.
Stirred for hours. The solution was filtered, and an excess amount of a solution of tetramethylammonium pentafluorobenzenesulfonate was added thereto. The reaction solution was concentrated, dissolved in 500 ml of dichloromethane, and the solution was washed with a 5% aqueous solution of tetramethylammonium hydroxide and water. The organic phase was dried over anhydrous sodium sulfate and concentrated to obtain triphenylsulfonium pentafluorobenzenesulfonate (I-1).

3) Synthesis of di (4-t-amylphenyl) iodonium pentafluorobenzenesulfonate 60 g of t-amylbenzene, 39.5 potassium iodate
g, 81 g of acetic anhydride and 170 ml of dichloromethane, and 66.8 g of concentrated sulfuric acid was slowly added dropwise thereto under ice cooling. After stirring for 2 hours under ice cooling, the mixture was stirred at room temperature for 10 hours. To the reaction mixture was added 500 ml of water under ice-cooling, and the mixture was extracted with dichloromethane. The organic phase was washed with sodium hydrogen carbonate and water, and concentrated to obtain di (4-t-amylphenyl) iodonium sulfate. This sulfate was added to a solution of an excess amount of tetramethylammonium pentafluorobenzenesulfonate. To this solution was added 500 ml of water, and the mixture was extracted with dichloromethane. The organic phase was washed with a 5% aqueous solution of tetramethylammonium hydroxide and water, and concentrated to obtain di (4-t-amylphenyl) iodonium pentafluorobenzenesulfonate (III). -1) was obtained. Other compounds can be synthesized using the same method as described above.

(3) Crosslinking agent Synthesis of crosslinking agent [HM-1] 1- [α-methyl-α- (4-hydroxyphenyl) ethyl] -4- [α, α-bis (4-hydroxyphenyl) ethyl 20 g of benzene (Honshu Chemical Industry Co., Ltd. T
risp-PA) was added to a 10% aqueous potassium hydroxide solution, and the mixture was stirred and dissolved. Then, while stirring this solution, 3
60 ml of a 7% aqueous formalin solution was gradually added at room temperature over 1 hour. After stirring at room temperature for 6 hours, the mixture was thrown into a dilute sulfuric acid aqueous solution. The precipitate was filtered, washed sufficiently with water, and recrystallized from 30 ml of methanol to obtain 20 g of a white powder of a phenol derivative having a hydroxymethyl group [HM-1] having the following structure. The purity was 92% (liquid chromatography method).

[0143]

Embedded image

Synthesis of Crosslinking Agent [MM-1] 20 g of the hydroxymethyl group-containing phenol derivative [HM-1] obtained in the above Synthesis Example was added to 1 liter of methanol, heated and stirred to dissolve. Next, 1 ml of concentrated sulfuric acid was added to this solution, and the mixture was heated under reflux for 12 hours. After the completion of the reaction, the reaction solution was cooled, and 2 g of potassium carbonate was added. After sufficiently concentrating this mixture, 300 ml of ethyl acetate was added. This solution was washed with water and concentrated to dryness to obtain 22 g of a white solid of a phenol derivative having a methoxymethyl group [MM-1] having the following structure. 90 purity
% (Liquid chromatography method).

[0145]

Embedded image

Further, the following phenol derivatives were synthesized in the same manner.

[0147]

Embedded image

[0148]

Embedded image

[0149]

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2. Examples [Examples and Comparative Examples] (1) Coating of Resist A solution of a photoresist composition having a composition shown in Table 1 below using a compound constituting the present invention and a comparative compound selected from the above synthesis examples. Was adjusted. After each sample solution was filtered through a 0.1 μm filter, it was applied on a silicon wafer using a spin coater and dried on a vacuum adsorption hot plate at 110 ° C. for 90 seconds to form a film having a thickness of 0.3 μm.
m was obtained.

[0151]

[Table 1]

In Table 1, the composition of the resin (40) is x / y / z
= 82/13/5, the composition of resin (47) was x / y / z =
78/15/7, the composition of the resins (58) and (59) was x / y / z = 65/20/15 in the charge ratio, and the other resins were x / y = 80/20 to 85/15, Each of the weight average molecular weights is 8,000 to 16,000 (dispersion degree 1.2 to
2.4).

<Resin> Polymer 1: Poly (4-hydroxystyrene)
(Nippon Soda Co., Ltd .: VP-8000) Polymer 2: Poly (3-hydroxystyrene)
(Maruzen Petrochemical Co., Ltd .: Mw = 9700, Mw / Mn
= 2.2)

[0154]

Embedded image

[0155]

Embedded image

As the polymerizable monomer, RM-1: tetraethylene glycol diacrylate (manufactured by Nippon Kayaku Co., Ltd.) RM-2: trimethylolpropane triacrylate (manufactured by Nippon Kayaku Co., Ltd.) RM-3: Pentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd.). Examples of the surfactant include: W1: Megafac F176 (manufactured by Dainippon Ink and Chemicals, Inc.) (fluorine) W2: Megafac R08 (manufactured by Dainippon Ink and Chemicals, Inc.) (fluorine and silicone) W3: Polysiloxane polymer KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) W4: represents polyoxyethylene nonylphenyl ether.

(2) Preparation of resist pattern An electron beam lithography system (acceleration voltage 50 Ke
Irradiation was performed using V). 110 ° C each after irradiation
Heating for 60 seconds with a vacuum adsorption type hot plate,
It was immersed in a 2.38% by weight aqueous solution of tetramethylammonium hydroxide (TMAH) for 60 seconds, rinsed with water for 30 seconds, and dried. The cross-sectional shape of the obtained pattern was observed with a scanning electron microscope. The sensitivity is
The minimum irradiation energy at the time of resolving a 0.20 μm line (line: space = 1: 1) was defined as the sensitivity, and the limit resolution at that irradiation amount (line and space were separated and resolved) was defined as the resolution. For those lines that do not resolve the 0.20 μm line (line: space = 1: 1), the resolution limit was defined as the resolution and the irradiation energy at that time was defined as the sensitivity.

The development defects and coating properties were evaluated as follows. [Number of development defects]: KL-Tencor K.K.
The number of development defects was measured by an LA-2112 machine, and the obtained primary data value was defined as the number of development defects. [Applicability (In-plane uniformity)]: Each resist solution is applied on an 8-inch silicon wafer, and the same processing as the application of the resist layer as described above is performed to form a resist coating film for in-plane uniformity measurement. Obtained. This is Lam made by Dainippon Screen Co., Ltd.
With bdaA, the coating film thickness was measured at 36 locations evenly so as to form a cross along the wafer diameter direction. The standard deviation of each measurement is taken, and three times less than 50 are O, 50
The above was evaluated as X. Table 2 shows the performance evaluation results.

[0159]

[Table 2]

From the results shown in Table 2, it can be seen that the negative resist composition of the present invention is excellent not only in sensitivity, resolution and profile but also in development defects and coating properties.

Examples 1, 4, 7, and 12 and Comparative Example 1
The resist film prepared in the same manner as described above was irradiated with an electron beam lithography apparatus under the condition of an acceleration voltage of 75 KeV (Examples 13 to 16, Comparative Example 3). After irradiation, heating, development, and rinsing were performed in the same manner as in the above example, and the obtained pattern was observed with a scanning electron microscope. Table 3 shows the results of the evaluation performed in the same manner as in the above example.

[0162]

[Table 3]

From the results shown in Table 3, it can be seen that the negative resist composition of the present invention, as compared with the composition of the comparative example, had good sensitivity and resolution, as well as development defects and coatability, even when irradiated with an electron beam at a high accelerating voltage. It turns out that it is also excellent.

[0164]

According to the negative resist composition for an electron beam and an X-ray of the present invention, sensitivity and sensitivity can be improved even under high accelerating voltage conditions.
Excellent resolution, enabling rectangular profiles, and
A negative resist composition having excellent development defects and excellent coating properties can be provided.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08F 20/10 C08F 20/10 20/54 20/54 22/30 22/30 28/02 28/02 290 / 00 290/00 290/12 290/12 299/00 299/00 G03F 7/004 501 G03F 7/004 501 504 504 7/027 511 7/027 511 H01L 21/027 H01L 21/30 502R F term (reference 2H025 AA01 AA02 AA03 AB16 AC05 AC06 AD01 BC14 BC19 BC34 BC43 BC64 BE00 BE07 CC04 CC17 CC20 FA17 4J011 QA03 QA08 QA12 QA22 QA24 QA26 QA33 QA34 QA46 QB01 QB03 QB11 QB16 SA78 A08 AC03 A08 A08 AC08 BA08 BA10 BA17 BA19 BA23 BA24 BA26 CA10 CA23 CA25 CA26 CA29 CA34 CB02 CB03 CB09 CB10 CC06 CC08 CD10 4J100 AB15P AE81P AE82P AF11P AL60P AL74P AM03P AM23P AP02P BA02P BA03P BA04P BA05P BA06P BA15P BA16P BA20P BA29P BA35P BA37P BA38P BA40P BA41P BA51P BA55P BB01P BB03P BB05P BB07P BC02P BC03P BC04P BC07P BC08P BC09P BC41P BC43P BC48P BC49P CA01 CA04 CA05 DA01 JA38

Claims (9)

[Claims] 1. A compound which generates an acid and / or a radical species upon irradiation with an electron beam or an X-ray, and (B) a water-insoluble compound having at least one unsaturated bond polymerizable by an acid and / or a radical. Resin soluble in aqueous alkali solution
A negative electrode for electron beam or X-ray, comprising (C) a cross-linking agent which cross-links with the resin of (B) by the action of an acid, and (D) a fluorine-based and / or silicon-based surfactant. Resist composition. 2. The negative resist composition for electron beams or X-rays according to claim 1, wherein the resin as the component (B) is a resin containing a repeating unit of the general formula (a). Embedded image In the formula, R ₁ represents a hydrogen atom, a halogen atom, a cyano group, or an optionally substituted alkyl group or haloalkyl group. R _{2 to} R ₄ are a hydrogen atom, general formulas (b), (c),
Or (d) may have any group or substituent;
Represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an acyl group. R ₅ and R ₆ may be the same or different, and may have a hydrogen atom, a hydroxyl group, a halogen atom, a cyano group, or a substituent, an alkyl group, a cycloalkyl group, an alkenyl group, an aralkyl group, Alternatively, it represents an aryl group. Embedded image In the formula, R _{7 to} R ₁₂ , R ₁₆ , and R ₁₇ represent a hydrogen atom, a halogen atom, a cyano group, or an alkyl group or a haloalkyl group which may have a substituent. R ₁₃ and R ₁₄ are a hydrogen atom,
It represents a halogen atom, a hydroxy group, an alkyl group, an alkoxy group or an acyloxy group which may have a substituent.
R ₁₅ represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aralkyl group, or an aryl group which may have a substituent. A ₁ is a single bond, which may have a substituent, a divalent alkylene group, an alkenylene group, a cycloalkylene group,
Or arylene group, or _{-O -, - SO 2 -,} - O
_{-CO-R 20 -, - CO} -O-R 21 -, - CO-N (R
₂₂₎ -R ₂₃ - represents a. R ₂₀ , R ₂₁ and R ₂₃ may be the same or different and may have a single bond, an ether structure, an ester structure, an amide structure, a urethane structure or a ureido structure, or may have a substituent. Good represents a divalent alkylene group, alkenylene group, cycloalkylene group, or arylene group. R ₂₂ represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aralkyl group, or an aryl group which may have a substituent. A ₂ is a single bond, -OR _{21
-, - N (R 22)} -R 23 - represents a. A ₃ is a single bond, -S
Represents an arylene group which may have an O ₂ -or alkylene structure and may have a substituent. A ₄ is a single bond, which may have a substituent, a divalent alkylene group, a cycloalkylene group, an arylene group, —O—, —SO ₂ —,
-CO- and -CO-OR ₂₁ -are represented. x, y, z are 0
Or 1, and m and n represent 0 or an integer of 1 or more. However, in the general formula (a), at least one is represented by the general formula (b),
(C) or (d). The R ₂ two of to R _4, or R ₂ one with R ₅ or R ₆ in to R ₄ may combine with each other to form a ring. 3. The electron beam or X-ray negative according to claim 1, further comprising (E) a compound having at least one unsaturated bond polymerizable by an acid and / or a radical. -Type resist composition. 4. The negative resist composition for electron beams or X-rays according to claim 1, further comprising (F) an organic basic compound. 5. The compound of component (A) is a sulfonium,
5. The negative resist composition for an electron beam or X-ray according to claim 1, wherein the negative resist composition is selected from a sulfonate compound of iodonium. 6. The compound according to claim 1, wherein the component (A) is a sulfonic acid ester compound of N-hydroxyimide or a disulfonyldiazomethane compound.
5. The negative resist composition for electron beam or X-ray according to any one of 4. 7. The cross-linking agent of component (C) is a hydroxymethylated, alkoxymethylated, or acyloxymethylated phenol compound.
7. The negative resist composition for electron beams or X-rays according to any one of claims 1 to 6. 8. The method according to claim 1, wherein the crosslinking agent as the component (C) is an alkoxymethylated or acyloxymethylated melamine compound or resin, or a urea compound or resin. Electron beam or X
Negative resist composition for lines. 9. The negative resist composition for electron beam or X-ray according to claim 1, wherein electron beam irradiation is performed under an acceleration voltage condition of 75 keV or more.