JP2002003229A - Quartz glass product used for semiconductor producing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a quartz glass product which has an excellent temperature following property in heating, cooling, etc., is able to suppress increase in process time of a heat treatment, and is used for a semiconductor producing device. SOLUTION: There are provided a 1st quartz glass member 2b having a face in which grooves 4 are formed and a 2nd quartz glass member 2a which closes the above grooves by being stuck to the groove-formed face of the 1st quartz glass member, the grooves 4 being transformed into paths 3. So a heating fluid or a cooling fluid for promoting temperature rising/lowering is made to flow through the paths 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a quartz glass product used in a semiconductor manufacturing apparatus, and more particularly, to a quartz glass product used in a semiconductor manufacturing apparatus having excellent temperature followability such as heating and cooling.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, a silicon wafer or the like is subjected to various heat treatments. A heat treatment furnace such as a diffusion furnace is used for these heat treatments, and a high-purity quartz glass product is used for a furnace core tube, a chamber, a heat insulating portion in the furnace, and the like. In addition, wafer loaded products such as wafer boats are used for storing and transporting semiconductor wafers to be subjected to heat treatment, and these jigs are often made of high-purity quartz glass. In the heat treatment of the semiconductor wafer, SiO ₂ , Si ₃ N ₄ , polysilicon, BPS
This process is performed to form a thin film such as G (SiO ₂ to which B and P are added by several%), and to perform an annealing process for stabilizing the wafer surface. This heat treatment is performed at a high temperature of, for example, 400 to 1000 ° C.

[0003]

By the way, quartz glass has a high softening point of 1500 ° C. or higher, has a small coefficient of thermal expansion, is hardly deformed even at a high temperature of 1000 ° C. or higher, and has a relatively high purity. It has excellent properties, such as low metal impurities and excellent chemical resistance. From these characteristics, it is suitable as a constituent material of a product used in a semiconductor manufacturing apparatus such as the heat treatment furnace. On the other hand, quartz glass has a specific heat of 890 to 1140 J
/ Kg · K (20-1000 ° C) and low thermal conductivity of 1.5-3.0 W / mK (10-1000 ° C), which makes it difficult to heat and cool. Also,
Because the infrared transmittance is 95% or more, if the contribution of heat transfer by high-temperature radiation is large, such as lamp heating or heater heating, the quartz glass itself will be heated even if the workpiece and furnace body are heated and heated. Is difficult to be heated because it transmits radiant heat. Therefore, when quartz glass is used as a product for a semiconductor manufacturing device, there is a technical problem that the product absorbs or emits heat, so that the temperature rise and fall in the furnace is delayed, thereby increasing the process time. .

An object of the present invention is to provide a quartz glass product which is used in a semiconductor manufacturing apparatus and which can improve the temperature followability such as heating and cooling in the apparatus and can suppress an increase in the process time of heat treatment. And

[0005]

A quartz glass product used in a semiconductor manufacturing apparatus according to the present invention, which has been made to solve the above-mentioned object, is a quartz glass product used in a semiconductor manufacturing apparatus, the surface of which a groove is formed. A first quartz glass member having: a second quartz glass member that closes the groove by being in close contact with the surface of the first quartz glass member where the groove is formed, and forms the groove as a flow passage. A heating fluid or a cooling fluid for promoting a temperature rise or a temperature decrease is circulated through the flow passage.

As described above, in the quartz glass product used in the semiconductor manufacturing apparatus according to the present invention, the flow passage for flowing the heating fluid or the cooling fluid for promoting the temperature rise or the temperature decrease is formed inside the quartz glass product. Because, for example, by connecting tubes and the like to both ends of this flow path, by connecting an external heating device equipped with fluid transfer means,
A gas or liquid heating fluid is passed through the flow passage to raise the temperature of the quartz glass product. In addition, the temperature of the quartz glass product is lowered by flowing a gas or liquid fluid which has been cooled in advance through the flow passage. As a result, the temperature follow-up properties such as heating and cooling are excellent, and an increase in the process time can be suppressed without slowing down the rate of temperature rise and fall in the furnace.

Here, the first quartz glass member and the second quartz glass member
It is desirable that the quartz glass member is fused and integrated. By thus fusing and integrating the first quartz glass member and the second quartz glass member, the mechanical strength of the quartz glass product can be increased.

The first quartz glass member and the second quartz glass member
The quartz glass member is desirably a flat plate shape,
Further, it is desirable that the first quartz glass member and the second quartz glass member have a hemispherical shape, and that the first quartz glass member and the second quartz glass member have a tubular shape.

Further, the surface of the first quartz glass member where the groove is formed and the surface of the second quartz glass member which is in close contact with the surface where the groove of the first quartz glass member is formed are mirror-finished. It is desirable to have been. Thus, the first
When the grooved surface of the quartz glass member and the surface of the second quartz glass member that is in close contact with the grooved surface of the first quartz glass member are mirror-finished, bonding is performed. It is possible to obtain a strong quartz glass product in which no air bubbles or the like remain on the surface and the bonding strength is almost the same as that of an integrated product.

The quartz glass product has a flat or hemispherical shape, and the total area of the flow passage projected on the plane of the product is 20% of the total area of the product projected on the plane. It is desirably about 80% to 80%. Thus, the flow passage is formed such that the total projected area of the flow passage projected on the plane of the quartz glass product occupies 20 to 80% of the entire area of the product projected on the plane. In this case, the temperature of the quartz glass product can be raised and lowered at a sufficient speed.

Further, as the first quartz glass member,
A quartz glass material having a viscosity at 1430 ° C. of 1.0 × 10 ¹⁰ poise or more is used, and the viscosity of the second quartz glass member is 0.05 to less than the viscosity of the first quartz glass member. It is desirable to use 0.85 times, and more desirably, the viscosity of the second quartz glass member is 0.35 to 0.55 times the viscosity of the first quartz glass member. By using such a first quartz glass member and a second quartz glass member, higher adhesion between them can be obtained. In particular,
Even if the joining surfaces of the first quartz glass member and the second quartz glass member are not mirror-finished, if they are formed on a flat surface, they can be sufficiently adhered to each other. Further, by using the first quartz glass member and the second quartz glass member having the above specific viscosity,
During fusion, excessive deformation during use can be prevented.

Further, the first quartz glass member may be a quartz glass member having a thickness of 1 to 20 mm, and a groove having a depth of 0.5 to 10 mm formed on one surface thereof. More preferably, the second quartz glass member is made of a thin body having a thickness of 0.2 to 5 mm.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail with reference to the drawings. FIG. 1 is a view showing one embodiment of a quartz glass product according to the present invention, wherein (a) is a plan view,
(B) is a sectional view taken along line XX of (a). The quartz glass product 1 shown in FIG. 1 is formed in a rectangular flat plate shape, and represents a quartz glass product used as a product for a semiconductor manufacturing device such as a heat insulating wall plate such as a heating furnace and a heat shielding plate. . In the quartz glass product 1 shown in FIG. 1, for example, as shown in FIG. 1B, a flow passage 3 through which a heating fluid or a cooling fluid flows is formed inside a quartz glass member 2. Except for the flow passage 3, the structure is integrated by fusion.

The plane arrangement pattern of the flow passage 3 is shown in FIG.
As shown in (a), the quartz glass product 1 having a rectangular flat plate shape is arranged in a zigzag manner. In the figure,
Reference numeral 3a denotes a terminal opening of the flow passage 3 for connecting a fluid supply or discharge tube or the like. Further, the arrangement pattern of the flow passages 3 is not limited to a zigzag arrangement as shown in FIG. 1, but may be a spiral shape or another shape.

The distribution density of the flow passages 3 is determined by the total area of the flow passages 3 projected on the plane of the quartz glass product 1 (FIG. 1A).
(The total area of the flow passage 3 in FIG. 1) occupies 20 to 80% of the total area projected on the plane of the quartz glass product 1 (the entire area of the quartz glass product in FIG. 1A). It is preferable from the viewpoints of the ability to follow the temperature rise and fall of the product and the in-plane temperature uniformity.

The cross-sectional shape of the flow passage 3 is not limited to a rectangle or a square as shown in FIG. 1, but may be a circle, an ellipse, a polygon other than a pentagon or more as long as the flow of the fluid is smooth. It may have a cross section.

The quartz glass product 1 is not limited to a rectangular flat plate as shown in FIG. 1, but may be an arbitrary flat plate such as a circular plate or an elliptical plate.

In order to manufacture such a flat quartz glass product 1, as shown in FIG. 2, a plate-like quartz having an upper surface mirror-polished (mirror-finished) and a groove 4 formed in the surface. A glass member (first quartz glass member) 2b;
It is preferable to prepare a quartz glass member (second quartz glass member) 2a whose lower surface is mirror-polished so as to be in close contact with the mirror-polished surface of the quartz glass member 2b, and to use a manufacturing method of joining these.

That is, the plate-shaped quartz glass member (first quartz glass member) 2b having the groove 4 formed thereon and the quartz glass member (second quartz glass member) 2a forming the lid thereof are connected to each other. The mirror surfaces are joined to each other by, for example, heating and fusing in a furnace. The quartz glass joined body thus obtained may, of course, be used as it is, as it is, as a quartz glass product, or the joint body may be further processed into a specially shaped quartz glass product. .

The first quartz glass member (main member) 2b and the second quartz glass member (sealing lid member)
Although quartz glass of the same material may be used for 2a, quartz glass of another material may be used for both members 2a and 2b. For example, the first quartz glass member (main member) 2b
Has a viscosity of 1.0 × 10 ¹⁰ poise or more, more preferably 3.1 × 10 ^{10 to} 3.4 × 10 4 at a melting softening temperature of 1430 ° C.
By using a high-viscosity quartz glass of ¹⁰ poise, the quartz glass product 1 is provided with stable shape retention at high temperatures, that is, excellent heat deformation resistance.

As a quartz glass material constituting the second quartz glass member (sealing lid member) 2a, its viscosity is
The first quartz glass member (main member) 2b has a viscosity of 0.
A low-viscosity quartz glass in the range of 05 to 0.85 times, particularly preferably 0.35 to 0.55 times is used.
As described above, by using a high-viscosity quartz glass in combination with the first quartz glass member (main member) 2b and a low-viscosity quartz glass in a specific range for the second quartz glass member (sealing lid member). In addition, excessive deformation does not occur in the joint surface at the time of fusion, and the generation of an unfused portion is suppressed. Further, the first quartz glass member (main member) 2b and the second quartz glass member (sealing lid member) can be sufficiently adhered to each other to integrate them into a predetermined shape. Further, since the presence of the unfused portion is suppressed as much as possible, cracking due to a rapid temperature change is prevented.

Incidentally, in the case of the above-mentioned configuration in which the high-viscosity quartz glass of the first quartz glass member (main member) 2b and the specific low-viscosity quartz glass of the second quartz glass member (sealing lid member) 2a are combined, Thorough mirror finishing of the fusion surface to be joined is not required, and by increasing the surface to have a certain degree of flatness, there is also obtained an advantage that sufficient fusion can be achieved.

Here, when the viscosity of the second quartz glass member (sealing lid member) 2a is smaller than 0.05 times the viscosity of the first quartz glass member (main member) 2b,
Since the viscosity at the time of fusion is low, the second quartz glass member (sealing lid member) 2a bends and hangs down from the upper surface of the groove 4 of the first quartz glass member (main member) 2b into the groove. 4 may be inconvenient. Therefore, the viscosity of the second quartz glass member (sealing lid member) 2a is lower than the viscosity of the first quartz glass member (main member) 2b by 0.1.
It is preferably at least 05 times, particularly preferably at least 0.35 times the viscosity of the first quartz glass member (main member) 2b.

On the other hand, the viscosity of the second quartz glass member (sealing lid member) 2a is reduced by the first quartz glass member (main member) 2a.
If the viscosity is more than 0.85 times the viscosity of b, as described above, the same state is obtained as when quartz glass of the same quality is used for both members, and an appropriate mirror surface finish of the fusion surface to be joined is required. Further, it is somewhat difficult to maintain the shape of the quartz glass body 1 in a completely predetermined shape and to fuse the joint. Therefore, the viscosity of the second quartz glass member (sealing lid member) 2a is preferably 0.85 times or less the viscosity of the first quartz glass member (main member) 2b, and particularly the first quartz glass member ( It is preferably 0.55 times or less the viscosity of the main member 2b.

The thicknesses of the second quartz glass member (sealing lid member) 2a and the first quartz glass member (main member) 2b are 1 to 2 for the first quartz glass member (main member) 2b.
About 0 mm is preferable. When the plate thickness is large, the heat capacity increases, and the speed of temperature rise and fall decreases. On the other hand, when the plate thickness is small, the heat capacity is small, but the plate is easily deformed. In consideration of these points, the plate thickness of the first quartz glass member (main member) 2b is appropriately determined. Further, the second quartz glass member (sealing lid member) 2a is preferably a thin body having a plate thickness in the range of 1 to 5 mm, and the second quartz glass member has a thickness of 0.2 mm. More preferably, it is made of a thin body having a thickness of 5 to 5 mm. The second quartz glass member (sealing lid member)
If the thickness of the plate 2a is less than 1 mm, the member 2a is deformed, and there is a risk that the unevenness is formed on the upper surface of the groove 4 for forming the flow passage 3 of the present invention. On the other hand, if the plate thickness exceeds 5 mm, the distance to the upper surface of the second quartz glass member (sealing lid member) 2a may be long, and the heat capacity of that portion may increase, and the flow path 3 The heat transfer from the fluid passing through is slightly poor.

In the case of the quartz glass product 1 shown in FIG. 1, as shown in FIG. 2, the thickness t ₂ of the first quartz glass member (main member) 2b not including the thickness of the groove 4 is the second quartz glass. The thickness is set substantially equal to the thickness t ₁ of the member (sealing lid member) 2a. However, the two members 2a and 2b do not necessarily have to have the same effective thickness, and the thickness t _{2 of the} main member 2b is not necessary.
And the thickness t ₁ of the sealing lid member 2a can be reduced, and vice versa. At this time, the depth d of the groove 4 formed in the first quartz glass member (main member) 2b
Is 0.5 mm to 10 mm.

Next, referring to FIG.
The method for fusing the quartz glass member in the production of the above will be described. As shown in FIG. 3, a first quartz glass member (main member) 2b and a second quartz glass member (sealing lid member) 2a are arranged on a lower member 5 made of carbon, and carbon An upper member 6 made of carbon material is placed thereon, and a weight 7 made of a carbon material is further placed thereon and set in a heat treatment furnace. The upper surface of the lower member 5 and the lower surface of the upper member 6 are mirror-finished.

In the fusing treatment according to the present invention,
In order for each quartz glass member to be completely fused and for the quartz glass member to be integrated, the carbon member must be homogeneous and the portion in contact with the quartz glass member must have a predetermined surface roughness. is important. In order to make the surface roughness and the homogeneity appropriate, for example, the carbon material has an open porosity of 15% or less and a bulk density of 1.8 to 2.0 g / g.
cm ³ , which is finished by buffing or mirror polishing.

This makes it possible to apply uniform pressure to the quartz glass member by the carbon member, and to prevent thermal strain from remaining in the quartz glass during manufacture due to the difference in the thermal expansion coefficient between quartz glass and carbon. It becomes possible.

Then, the inside of the furnace is kept at a vacuum of 1 torr or less, and a heat treatment is performed at 1300 to 1600 ° C. for 0.5 to 5 hours to fuse the bonded surfaces of the two quartz glass plates 2a and 2b. This heat treatment is performed for a long time when the temperature is low, and for a short time when the temperature is high. In this step, the atmosphere in the groove is set to a reduced pressure or a non-oxidizing atmosphere. In cooling, the cooling is performed gently at about 1150 ° C., which is the strain point of quartz glass. 1150
The cooling rate in the vicinity of ° C. is set, for example, to about 50 to 150 ° C./hour.

By such a heat treatment, two sheets of the first,
The entire joint surface of the second quartz glass members 2a, 2b is fused and substantially integrated. That is, the groove 4 is closed to form a hollow space (flow passage 3) inside the quartz glass product 1, and the quartz glass product 1 is substantially integrated except for this space.

Next, a second embodiment of the quartz glass product according to the present invention will be described with reference to FIG. The embodiment shown in FIG. 4 is a bowl-shaped quartz glass product used for a quartz chamber or the like of a wafer heat treatment furnace. 4A and 4B are views showing a quartz glass product formed in a bowl shape, wherein FIG. 4A is a plan view, FIG. 4B is a front view, and FIG. 4C is a cross-sectional view. In the bowl-shaped quartz glass product 21 shown in FIG. 2, as shown in FIG.
A flow path 23 for the heating fluid or the cooling fluid is formed inside the quartz glass product 21, and is integrated except for the flow path 23 to form a bowl-like shape as a whole. The arrangement pattern of the flow passages 23 is spirally arranged with respect to the bowl-shaped curved surface of the quartz glass product 21 as shown in FIG. Also, in the figure, reference numerals 23a, 23b
Denotes a fluid supply pipe and a discharge pipe connected to the terminals of the flow passage 23, respectively. Reference numeral 25 denotes a heater for heating the semiconductor wafer 25.

The arrangement pattern of the flow passage 23 is as follows.
The shape is not limited to the spiral shape as in the case of the flat quartz glass product 1 shown in FIG.

The distribution density of the flow passages 23 is determined by the total flow passage area of the flow passages 23 projected on the plane of the quartz glass product 21 (the total flow passage area of the flow passages 23 shown in FIG. area)
Is the total area projected on the plane of the quartz glass product 21 (total area of the quartz glass product 21 shown in FIG. 4A).
However, it is preferable to form so as to occupy 20 to 80% from the viewpoints of the ability to follow the temperature rise and fall of the product and the in-plane uniform temperature. Further, the cross-sectional shape and flow area of the flow passage 23 are not necessarily limited, but it is preferable that the flow passage 23 be formed to have substantially the same size as that of the flat quartz glass product 1. In addition, as a matter of course, the planar shape of the quartz glass product 21 is not necessarily limited to a circular shape as in the case of FIG. 2 and may be an elliptical shape or the like.

As a method of manufacturing such a bowl-shaped quartz glass product 21, a bowl-shaped inner quartz glass member having an outer surface side (convex curved surface side) mirror-polished and a groove formed in the surface is used. A first quartz glass member) 22b and an outer quartz glass member 22a whose inner surface side (concave curved surface side) is mirror-polished so that the mirror-polished surface of the first quartz glass member is in close contact with the outer quartz glass member 22a
Are prepared, and the mirror surfaces of both members are fitted together and joined.
For joining these members, techniques such as heat fusion in a furnace and welding by flame heating are used. Contrary to the above case, the groove may be formed on the inner side (concave curved side) mirror surface of the envelope quartz glass member.

The quartz glass members 22a and 22b are the same.
It may be composed of the same material quartz glass,
Any one of the glass members, for example, the first quartz glass part
The material 22b is the same as that of the flat quartz glass product 1 described above.
High-viscosity quartz glass (having a viscosity at 1430 ° C. of 1.
0x10^TenPoise or more, more preferably 3.1 × 10 ^Ten
To 3.4 × 10^TenPoise) high viscosity quartz glass
And the other member, for example, the second quartz glass member 22a
The viscosity of the high-viscosity quartz glass is 0.05 to 0.8.
5 times, particularly preferably 0.35 to 0.55 times.
It is preferred to use the low viscosity quartz glass in the enclosure.

The thickness of the outer quartz glass member (second quartz glass member) 22a and the inner quartz glass member (first quartz glass member) 22b constituting the quartz glass product 21 is determined by the inner quartz glass member. Is preferably about 3 to 6 mm, and the thickness of the jacket glass member is preferably in the range of 1 to 4 mm. In the case of the quartz glass product 21 of FIG. 4, the thickness of the inner quartz glass member not including the thickness of the groove is set substantially equal to the thickness of the outer quartz glass member. However, it is not necessary for both members to have the same thickness, and it is possible to increase the thickness of the inner quartz glass member and the thickness of the outer quartz glass member, and vice versa. The depth of the groove formed at this time is 0.
5 mm to 5 mm.

Next, a third embodiment of the quartz glass product according to the present invention will be described with reference to FIG. This embodiment is a tube-shaped quartz glass product used for a furnace core tube or the like. 5A and 5B show a quartz glass product, wherein FIG. 5A is a perspective view of the quartz glass product, FIG. 5B is a side view of an outer tube member constituting the quartz glass product, and FIG. The side view of the inner tube member which comprises a quartz glass product is shown.

The tube-shaped quartz glass product 3 shown in FIG.
In FIG. 1, as shown in FIG.
A flow path 33 for a heating fluid or a cooling fluid is formed in the inside, and is integrated except for the flow path 33 to form a tubular shape as a whole. The arrangement pattern of the flow passages 33 does not need to be formed linearly along the axis of the quartz glass product 21 as shown in FIG. May be formed.

The inner tube member 32b constituting the tube-shaped quartz glass product 31 is the first tube member in the above-described embodiment.
What has the characteristic of the quartz glass member of is used,
As the outer tube member 32a, a member having the characteristics of the second quartz glass member is used. Therefore, detailed description is omitted. In addition, the shape and size of the groove are also determined by the first
Since the third embodiment is the same as the first embodiment, a detailed description thereof will be omitted.

Next, a method for producing a tube-shaped quartz glass product will be described. To make this quartz glass product,
First, the inner tube member 32b is fitted into the inside and outside.
(First quartz glass member) and outer tube member 32a (second quartz glass member) are prepared. Then, the respective surfaces are mirror-polished so that the outer peripheral surface of the inner tube member 32b (first quartz glass member) and the inner surface of the outer tube member 32a (second quartz glass member) are in close contact with each other.

Next, a groove 34 is formed in the mirror-finished outer peripheral surface of the inner tube member 32b. Then, the inner tube member 32b having the groove 34 formed therein is fitted into the outer tube member 32a. Thereafter, the inner and outer pipe members are heated from the inside and the outside while the inner and outer pipe members are heated while being evacuated from the gap between the inner and outer pipe members, thereby welding and joining the inner and outer pipe members to each other, thereby obtaining a tube-shaped quartz glass product 31.

In any of the quartz glass products described above, the temperature of the quartz glass product is quickly and reliably raised and lowered to a desired temperature by flowing a heating or cooling fluid through a flow passage formed therein. This can solve the problem of the quartz glass product, which has conventionally been a problem of improving the processing speed because of poor follow-up to the temperature change in the semiconductor processing apparatus.

For example, when a quartz chamber made of the bowl-shaped quartz glass product of the present invention is used in the wafer heat treatment apparatus, the rate of temperature rise can be improved by 10% compared to a conventional apparatus of the same type which does not use it. Furthermore, the time required for soaking in the apparatus, which was not stable until the temperature of the quartz glass was increased, can be reduced by about 10%. As for the temperature decrease, a 20% improvement was achieved in the case of conventional natural cooling or cooling by gas inflow. Further, in the batch processing furnace, by using the product of the present invention, the temperature raising time was improved by 5% and the soaking time was also improved by 5%. As for cooling, the heating time is 10 minutes.
% And soaking time increased by 20%.

[0045]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A single-wafer type wafer heat treatment furnace (embodiment) shown in FIG. 4 equipped with a quartz glass chamber according to the present invention;
Except for using a conventional product in a quartz glass chamber, a conventional single-wafer processing furnace (conventional example) of the same type as the above-described apparatus was prepared, and both wafer heat treatment processes (in each case, a steady heat treatment temperature of a wafer of 850 ° C.) The change cycle of the furnace temperature at the time was compared and evaluated. In the apparatus shown in FIG. 4, N ₂ gas heated to 1000 ° C. was flowed as a heating fluid for forced temperature rise, and 10 ° C. water was used as a cooling fluid for forced temperature fall. The result is shown in FIG. 6 as a diagram. As is clear from FIG. 6, it was recognized that the heating time required from about 35 hours to 850 ° C. in the conventional example was reduced to about 20 hours in the example. In addition, the cooling rate was about 20 ° C./hr in the conventional example, but about 40 ° C./hr in the example.
It was observed that the speed was increased to hr.

[0046]

As described above, the quartz glass product used in the semiconductor manufacturing apparatus according to the present invention has a flow passage through which a heating or cooling fluid flows. By allowing the cooling fluid to flow, the temperature of the semiconductor manufacturing apparatus can be quickly and surely raised and lowered to a desired temperature, excellent in temperature followability such as heating and cooling, and suppressing an increase in the heat treatment process time. Can be.

[Brief description of the drawings]

FIGS. 1A and 1B are views showing a first embodiment according to the present invention, wherein FIG. 1A is a plan view, and FIG.
FIG.

FIG. 2 is a sectional view of the flat quartz glass product of FIG. 1;

FIG. 3 is a view for explaining a method of fusion-bonding a quartz glass member in manufacturing the flat quartz glass product of FIG. 1;

FIGS. 4A and 4B are views showing a second embodiment of the present invention, wherein FIG. 4A is a plan view, FIG. 4B is a front view, and FIG.

FIG. 5 is a view showing a third embodiment of the present invention, wherein (a) is a perspective view of a quartz glass product, and (b) is an outer tube used for manufacturing the quartz glass product. FIG. 3C is a sectional view of the member, and FIG.

FIG. 6 is a diagram comparing and evaluating a temperature change cycle in a furnace in a wafer heat treatment step (steady heat treatment temperature of 850 ° C.) between a heat treatment furnace equipped with a quartz chamber of the present invention and a conventional treatment furnace. .

[Explanation of symbols]

1, 21, 31 Quartz glass product 2 Quartz glass member 2a Sealing lid member (second quartz glass member) 2b Main member (first quartz glass member) 22a Outer quartz glass member (second quartz glass member) 22b Inner jacket Quartz glass member (first quartz glass member) 32a Outer tube member (second quartz glass member) 32b Inner tube member (first quartz glass member) 3, 23, 33 Flow passage 3a Terminal opening 4, 34 Groove 5 Carbon lower member 6 made of carbon upper member 7 weight 23a fluid supply tube 23b fluid discharge pipe t ₁ quartz glass member (sealing lid member) thickness t ₂ of quartz glass member (main member) thickness A wafer

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[Procedure amendment]

[Submission date] June 26, 2000 (2006.2.
6)

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] Fig. 6

[Correction method] Change

[Correction contents]

FIG. 6

Continued on the front page (72) Inventor Tomi Kane 378 Oguni-machi, Oguni-machi, Nishiokitama-gun, Yamagata Toshiba Ceramics Co., Ltd. 4G014 AH02 AH08 AH23 5F031 CA02 HA02 HA03 HA62 HA63 HA64 MA30 PA30

Claims (9)

[Claims] 1. A quartz glass product used in a semiconductor manufacturing apparatus, wherein a first quartz glass member having a surface on which a groove is formed, and a surface of the first quartz glass member on which the groove is formed are in close contact with each other. A second quartz glass member that closes the groove and forms the groove as a flow passage, wherein a heating fluid or a cooling fluid for promoting a temperature rise or a temperature decrease is passed through the flow passage. Quartz glass products used in semiconductor manufacturing equipment. 2. The quartz glass product used in a semiconductor manufacturing apparatus according to claim 1, wherein the first quartz glass member and the second quartz glass member are fused and integrated. 3. A quartz glass product used in a semiconductor manufacturing apparatus according to claim 1, wherein the first quartz glass member and the second quartz glass member have a flat plate shape. . 4. The quartz glass product used in a semiconductor manufacturing apparatus according to claim 1, wherein the first quartz glass member and the second quartz glass member have a hemispherical shape. 5. The quartz glass member according to claim 1, wherein the first quartz glass member and the second quartz glass member have a tubular shape.
A quartz glass product used in the semiconductor manufacturing apparatus according to claim 2. 6. A mirror-finished surface of the first quartz glass member on which the groove is formed and a surface of the second quartz glass member which is in close contact with the groove-formed surface of the first quartz glass member. A quartz glass product used in the semiconductor manufacturing apparatus according to claim 1, wherein 7. The quartz glass product has a flat plate shape or a hemispherical shape, and a total projected area of a flow passage projected on a plane of the product is 20 to a total area of the product projected on the plane. The quartz glass product used in the semiconductor manufacturing apparatus according to claim 1, wherein the quartz glass product is in a range of from about 80% to about 80%. 8. A quartz glass material having a viscosity of not less than 1.0 × 10 ¹⁰ poise at 1430 ° C. as said first quartz glass member, and a viscosity of said second quartz glass member being: 8. A quartz glass product used in a semiconductor manufacturing apparatus according to claim 1, wherein the first quartz glass member has a viscosity of 0.05 to 0.85 times the viscosity of the first quartz glass member. . 9. The quartz glass member according to claim 1, wherein the first quartz glass member is a quartz glass member having a thickness of 1 to 20 mm and a groove having a depth of 0.5 to 10 mm formed on one surface thereof. A quartz glass product used in the semiconductor manufacturing apparatus according to claim 1.