JP2002001696A - Tape punching method and tape punching device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To punch a tape without causing any burr, to stick the punched tape without any defective adhesion part, and to perform these processes without lowering productivity or requiring highly-experienced skill. SOLUTION: The tape to be punched is pressed to a die by means of a stopper, and a punch is moved forward/backward to a die hole for performing punching in a predetermined shape. In this punching method, when the tape 1 to be punched is pressed to the die 6 by means of the stopper 11, a cutting or formation of a cut is carried out by means of a projecting blade 12 arranged in the die hole circumference of the stopper 11, and then, the punch 5 is moved to the die hole 7 so as to carry out punching into a tape piece separately.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for punching a tape.

[0002]

2. Description of the Related Art For example, a tape is adhered to a lead frame for a semiconductor device in order to prevent deformation of a lead, to install a heat sink, or to mount a semiconductor chip. The tape includes a structure in which an adhesive is attached to one or both sides of a resin film such as a polyimide film or an epoxy film, and a structure in which a protective film is attached to a film made of only the adhesive.

When a tape is to be attached to a lead frame, a strip-shaped tape is passed through a punching device, punched into a desired shape of a tape piece by a punch and a die, and then the punched tape piece is placed in the middle of an inner lead of the lead frame. It is stuck to a predetermined part such as a part or a tip part.

[0004] The tape is provided with an adhesive as described above, and the tape material has different material properties from the resin film.
Since the adhesive has adhesiveness even at room temperature, burrs are likely to be generated when punches are punched into and out of a die hole, and in fact, burrs frequently occur.

[0005] Even when the tape is made of only an adhesive and a protective film, burrs are similarly generated when the tape is punched into a predetermined shape.

When the burrs are adhered to the lead frame, the burrs protrude from the tape pieces and have an adverse effect such as the adhesion of unnecessary objects, and the sticking posture is deteriorated to displace the leads. In addition, a bad effect such as a part of the tape piece causing poor bonding is caused, and the lead frame or the semiconductor device becomes defective.

Since the above-mentioned problem occurs even when the adhered object is other than the lead frame, it is necessary to prevent the occurrence of burrs at the time of punching the tape, or to reduce the harmfulness even if it occurs. This is very important.

Conventionally, as a technique for preventing the generation of burrs in tape punching, frequent adjustment of the clearance between the punch and the die and re-polishing, or cooling of the punch or die during punching to suppress a rise in temperature have been taken. I have.

[0009]

However, the conventional frequent adjustment of the clearance between the punch and the die and the re-polishing are performed by temporarily stopping the punching operation, adjusting the cutting edge, or removing and polishing the re-grind. Assembly and trial cutting must be performed, which lowers productivity. Further, there is a problem that requires a high degree of skill and labor. Further, it is conceivable to provide extra punches and dies in order to shorten the operation stop, but this increases the cost, and further has a problem that storage and management thereof are further required.

In the conventional means for cooling a punch or a die, a refrigeration device or a refrigerant passage which is not originally required for punching must be incorporated into the punching device, which complicates the device configuration and requires extra maintenance. Furthermore, there is a problem that the punching environment by the refrigerant is polluted.

[0011] The present invention does not reduce the productivity, does not require a high level of skill, is easy, and does not complicate the device configuration.
It is an object of the present invention to punch a tape without burrs and to attach the tape to an object to be adhered with a good posture and uniformity without any defective bonding.

[0012]

SUMMARY OF THE INVENTION The gist of the present invention is to provide a method in which a tape to be punched is pressed by a die with a stripper, and a punch is advanced into and retracted from a die hole to punch the tape into a die with a stripper. At this time, there is provided a tape punching method characterized in that the stripper is cut or cut by a projection blade provided around a die hole of the stripper, and then the punch is advanced to the die hole and punched and separated into a piece of tape of a predetermined shape. .

Another gist is a punching device including a stripper for pressing a tape to be punched toward a die side and a punch for punching into and out of a die hole into a predetermined shape. A tape punching device provided with a projection blade. Also,
The protrusion blade is a notch blade.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a tape punching apparatus according to one embodiment of the present invention, FIG. 2 shows an enlarged cross section of a tape to be punched in this embodiment, and FIG. 3 is a view for explaining a tape punching method according to this embodiment. 4 and 4 show a lead frame to which a tape piece is adhered in this embodiment. In the drawing, reference numeral 1 denotes a band-shaped tape to be punched, which is passed through a punching device 2 by a passing device (not shown). As shown in an enlarged cross-sectional view in FIG. 2, the punched tape 1 is provided with an adhesive 4 on both surfaces of a resin film 3 of epoxy, polyimide or the like, and an extremely thin protective film ( (Not shown).

Reference numeral 5 denotes a punch provided in the punching device 2, which can move in and out of a die hole 7 formed in the die 6. Reference numeral 8 denotes a punch holder, and 9 denotes a punch plate. Reference numeral 10 denotes a knockout for providing guidance when the stripper 11 moves toward and away from the die 6.

If the punch 5 advances and retreats into the die hole 7 and only punches the tape 1 to be punched, burrs will occur unless the clearance is adjusted or regrinding is performed frequently as described above. In the present invention, a stripper 11 for pressing the tape 1 to be punched against the die 6 at the time of punching.
A protruding blade 12, for example, a notch-shaped blade is provided facing the upper surface around the die hole 7, and the protruding blade 1
The tape 1 to be punched is cut or cut at 2, and a tape piece is punched and separated from the tape 1 to be punched which is pressed against the die 6 by the stripper 11.

The projection blade 12 provided on the stripper 11
Protrudes from the lower surface of the stripper 11 to a height equal to or slightly greater than the thickness of the tape 1 to be punched. Although the shape of the projection blade 12 can be variously formed, a notch shape is preferable.

The die hole 7 has a projection blade 12 of a stripper 11.
When the tape 1 to be punched is pressed against the die 6 by the stripper 11, the projection blade 12 comes into contact with the surface of the die 6 to cut or completely cut the tape 1 to be punched. At the same time, a cut is made. On the other hand, the tape 1 to be punched is pressed between the die 6 and a portion where the projection blade 12 is not formed on the stripper 11.

When the punch 5 is holding the tape 1 to be punched by the die 6 with the stripper 11, the punch 5 advances into the die hole 7 and separates by punching.
Is formed at a height equal to or slightly greater than the thickness of the punched tape 1, the punched tape 1 is strongly pressed and restrained by the die 6 irrespective of the presence of the protruding blades 12, The separation by punching can be performed without any trouble.

In the present invention, the punched tape 1 is cut or cut by the engagement between the projection blade 12 of the stripper 11 and the die surface around the die hole 7, and then the punch 5 advances to the die hole 7. No burrs are formed because the material is punched and separated in a shaving manner. In addition, the sharpness of the punching separation of the tape does not change even if it is repeated an extremely large number of times.

The tape piece 13 punched and separated from the punched tape 1 is separately attached to a lead frame 14 which is passed below the punching device 2 via a punch 5 as shown in FIG. FIG. 4 shows the lead frame 14 to which the tape piece 13 is attached.

[0022]

According to the tape punching method of the present invention, as described above, the tape is cut or cut by the projection blade provided around the die hole of the stripper, and then the punch is separated by punching. Burrs do not occur on the tape pieces, and the tape pieces have a great effect such that the tape pieces are adhered to an adherend such as a lead frame in a good posture, and are adhered uniformly over the entire surface without any defective adhesion.

According to the tape punching apparatus of the present invention, the stripper for pressing the tape to be punched toward the die is provided with the protruding blade opposite to the die hole. And a great effect such as an increase in productivity can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing a tape punching device according to one embodiment of the present invention.

FIG. 2 is an enlarged view showing a cross section of the tape to be punched in one embodiment of the present invention.

FIG. 3 is a diagram for explaining a tape punching method according to one embodiment of the present invention.

FIG. 4 is a view showing a lead frame to which a tape piece is adhered in one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tape to be punched 2 Punching device 3 Resin film 4 Adhesive material 5 Punch 6 Die 7 Die hole 8 Punch holder 9 Punch plate 10 Knockout 11 Stripper 12 Protrusion blade 13 Tape piece 14 Lead frame

Claims (4)

[Claims] In a method of pressing a punched tape to a die with a stripper, and moving a punch into and out of a die hole to punch a predetermined shape, the punched tape is provided around a die hole of the stripper when the stripped tape is pressed against the die. A tape punching method characterized by cutting or making a cut with a protruding blade, and then punching and separating the tape into a predetermined shape by moving a punch into a die hole. 2. The method according to claim 1, wherein the tape to be punched is a tape with an adhesive. 3. A punching device comprising a stripper for pressing a tape to be punched against a die, and a punch for punching into and out of a die hole into a predetermined shape, wherein a projection blade is provided around the die hole of the stripper. Tape punching device. 4. The notch blade according to claim 3, wherein the projection blade provided around the die hole of the stripper is a notch blade.
The tape punching device as described in the above.