JP2002001653A - Fine adjustment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To highly accurately adjust a supporting condition, while maintaining rigidity of a supporting part of a region for holding a workpiece, in various processing apparatuses. SOLUTION: A fine adjustment device 50 is provided for finely adjusting relation of the position by being interposed between a first member and a second member, which is at least composed of a lever member 51 having a fulcrum 54, a point of application 55, and a force point 56, and a bolt member 53 for transferring force to the force point 56.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine adjustment device for adjusting a positional relationship between two members.

[0002]

2. Description of the Related Art For example, in a grinding apparatus 70 shown in FIG. 6, a rail 73 is vertically disposed on an upright wall 72, and a slide 74 moves up and down along the rail 73. Is configured to move up and down. Further, a chuck table 76 for holding a workpiece is provided on the base cover 71a.

In the grinding means 75, a grinding wheel 80 provided with a grinding wheel 79 at a lower portion is mounted on a mounter 78 at the tip of a spindle 77 having a vertical axis, and the grinding wheel 80 rotates the spindle 77. It rotates with this.

When grinding a semiconductor wafer, for example, using such a grinding apparatus 70, the semiconductor wafer W is held on a chuck table 76, positioned immediately below the grinding means 75, and the spindle 77 is rotated. 75 is lowered. And the spindle 77
As the grinding wheel 80 rotates at a high speed with the high-speed rotation of the semiconductor wafer W, the rotating grinding wheel 79 comes into contact with the semiconductor wafer W to apply a pressing force, whereby the surface thereof is ground by the grinding wheel 79.

Therefore, in order to grind the surface of the semiconductor wafer W to a uniform thickness, the grinding surface of the grinding wheel 79 and the chuck surface of the chuck table 76 must be in a state of being parallel with high precision. No. Therefore, a mechanism for adjusting the inclination of the chuck surface 76a is provided below the chuck table 76.

[0006] As shown in FIG.
The chuck table 76 a is supported from below by the table support 81, and the table support 81
Is connected to a motor 82, and the chuck table 76 is rotated by driving the motor 82.

A flange 83 is formed on the outer periphery of the table support 81, and one or more adjustment bolts 84 are arranged on the base 71b so that the flange 83 can move up and down in the vertical direction. By rotating the rotating part 85 to move the adjustment bolt 84 forward and backward, the chuck surface 76 is rotated.
The inclination of a can be adjusted, whereby the positional relationship between the grinding wheel 79 and the ground surface can be adjusted.

[0008]

However, according to the adjustment mechanism shown in FIG. 7, since the advance and retreat of the adjustment bolt 84 directly appears as the surface accuracy of the chuck surface 76a, the adjustment bolt 8
If the machining accuracy of No. 4 is poor and backlash or play occurs between the male screw and the female screw, the accuracy of the chuck surface 76a may not be stable. In addition, there is a problem that rigidity is reduced when uneven contact occurs due to the processing accuracy of the screw surface. Furthermore, since the adjustment resolution is determined by the pitch of the screws, there is a limit in increasing the resolution, and it is difficult to finely adjust the inclination of the chuck surface 76a.

Such a problem can occur not only in the above-described grinding apparatus but also in any apparatus in which the positional relationship between members must be adjusted with high precision. Another problem is that it is possible to adjust the positional relationship with high accuracy while maintaining high rigidity.

[0010]

SUMMARY OF THE INVENTION As a specific means for solving the above-mentioned problems, the present invention is a fine-adjustment device for finely adjusting a positional relationship between a first member and a second member. A lever member having a fulcrum, an action point, and a force point,
A fine adjustment device including at least a bolt member that transmits a force to a force point portion.

In this fine adjustment device, a fulcrum, an action point, and a power point constituting the lever member are each composed of a support part and a neck part, and the bolt member is composed of a rotating part, a fixed part, and a force transmission part. The fulcrum support portion of the lever member is fixed at a required position of the first member, the operation point support portion of the lever member is fixed at a required position of the second member, and a force transmitting portion of the bolt member is provided. Is fixed to the power point support portion of the lever member, and the fixing portion of the bolt member is fixed to a required position of the first member. The coarse adjustment is performed between the action point support portion of the lever member and the second member. The member is interposed, the coarse adjustment member penetrates the nut portion fixed to the operation point support portion, the coarse adjustment hollow bolt screwed to the nut portion, and the hollow portion formed in the coarse adjustment hollow bolt, and the operation point support is provided. Fixing screw which is screwed into the portion to fix the second member and the action point support portion. The first member is a base that constitutes a processing device, the second member is a support portion of a holding member that holds the workpiece, and the processing device is a workpiece. Grinding means provided with a grinding wheel for grinding the surface of, a chuck table which is a holding member for holding the workpiece, and a base supporting the chuck table, the first member is a base The second member is a table supporting portion for supporting the chuck table, the chuck table is supported at three positions with respect to the base, and is disposed at at least two positions;
It is an additional requirement that a driving source is mounted on the rotating part constituting the bolt member.

According to the fine adjustment device configured as described above, not only the adjustment using only the bolt member as in the related art,
Since the adjustment is performed by combining the bolt member and the lever member, the amount of movement of the lever member at the point of application is smaller than the amount of movement of the lever member at the point of force when the bolt member is rotated. Even when looseness or play occurs in the set screw, the influence thereof is small, high-precision adjustment is possible, and rigidity can be maintained even when uneven contact occurs on the screw surface.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As an example of an embodiment of the present invention, a fine adjustment device mounted on a grinding device 10 shown in FIG. 1 will be described. The grinding device 10 is a device for grinding a plate-like object, for example, a semiconductor wafer, into a planar shape. Semiconductor wafers W to be ground are stored in a plurality of stages in a cassette 11a, and are loaded one by one by a loading / unloading unit 12. It is picked up and placed on the centering table 13.
Then, after the semiconductor wafer W is positioned at a predetermined position, the semiconductor wafer W is sucked by the first transfer means 14 and transferred to the chuck table 15 and held.

Next, as the turntable 16a rotates by a required angle, the semiconductor wafer W is removed by the grinding means 17a.
Is located directly below. Then, the semiconductor wafer W positioned immediately below the grinding means 17a is
The upper surface is ground by the action of a. Here, for example, rough grinding is performed.

After the completion of the rough grinding, the chuck table 15
When the turntable base 16b, which is a base for supporting the semiconductor wafer W, rotates by a required angle, the roughly ground semiconductor wafer W is positioned immediately below the grinding means 17b, and the surface is ground by the action of the grinding means 17b. You. Here, for example, finish grinding is performed.

The grinding means 17a, 17b can move up and down with respect to the upright wall portion 18. Here, since the grinding means 17a and the grinding means 17b have the same configuration except for the type of the grindstone, the same reference numerals are used to describe the same. And are driven by a pulse motor 20 to
As the slide portion 21 moves up and down while being guided by the guide 9, the grinding means 17a and 17 fixed to the slide portion 21 are provided.
b is configured to move up and down.

In the grinding means 17a and 17b, a grinding wheel 24 is mounted on a rotatably supported spindle 22 via a mounter 23.
Grinding stones 25a and 25b are fixed to the lower part of 4. A grinding wheel for rough grinding is used as the grinding wheel 25a, and a grinding wheel for finish grinding is used as the grinding wheel 25b.

The chuck table 15 on which the finish-ground semiconductor wafer W is mounted is mounted on the turntable base 1.
By the rotation of 6b, it is positioned near the second transport means 26. The ground semiconductor wafer W is transported to the cleaning unit 27 by the second transport unit 26 and washed, and then picked up by the loading / unloading unit 12 and stored in the cassette 11b. When the grinding is sequentially performed as described above, finally, all the ground semiconductor wafers W are stored in the cassette 11b.

As shown in FIG. 2, the chuck table 15
Is supported by a turntable base 16b which can be driven and rotated by a motor 16c, and a suction force is supplied to the chuck surface 15a through a tube 16d. Also,
A ball screw 28 is disposed on the back side of the wall 18 in the vertical direction. The ball screw 28 is connected to the pulse motor 20 and penetrates through the wall 18 so that the grinding means 17
a, 17b, which is screwed into a nut provided on a supporting portion 29 connected to the supporting portion 29 and the grinding means 17a connected to the supporting portion 29 as the ball screw 28 is rotated by driving the pulse motor 20; 17b moves up and down.

The pulse motor 20 is connected to a control unit 31 via a pulse motor driver 30.
By turning the ball screw 28 under the control of 1, the grinding means 17a and 17b are moved up and down. Also,
The vertical position of the support portion 29 is measured by the linear scale 32, and the information is transmitted to the control portion 31, whereby the vertical movement of the grinding means 17a, 17b is precisely controlled.

When the surface of the semiconductor wafer W is ground using the grinding apparatus 10 having the above-described configuration, the surface of the semiconductor wafer W can be finished with high accuracy by using the chuck surface 15a of the chuck table 15 for holding the semiconductor wafer W. It is necessary that the grinding surface of the grinding wheel 25a or 25b is in parallel with high precision.

Therefore, the chuck surface 15a and the grinding wheel 25
a or the grinding surface of the grinding wheel 25b is not parallel to each other by finely adjusting the angle of the chuck table 15 using the fine adjustment device 50 of the present invention shown in FIG. .

As shown in FIG. 3, the chuck table 15 having the chuck surface 15a is supported from below by a table support portion 40, and a flange portion 42 is formed on an outer peripheral portion of the table support portion 40. 40
A rotating shaft (not shown) penetrating vertically through the inside is connected to a motor 41, and the chuck table 15 is rotated by driving the motor 41.

As shown in FIG. 4, the flange 42 has a through hole 44a forming the supported portion 43a, a through hole 44b forming the supported portion 43b, and a through hole 44c forming the supported portion 43c. They are arranged at 120 degree intervals. The through-hole 44a forming the supported portion 43a is provided in FIG.
The bolt 45 shown in FIG. 1 penetrates, and a male screw portion (not shown) formed at the tip of the bolt 45 is
The table support 40 is fixedly supported by the turntable base 16b by being screwed into the threaded portion 47 fixed to 6b.

On the other hand, the supported portions 43b, 43 shown in FIG.
c is supported by the fine adjustment device 50. As shown in FIG. 3, the fine adjustment device 50 includes a turntable base 16b as a first member and a flange 4 as a second member.
2, only the fine adjustment device 50 that supports the supported portion 43c is shown in FIG.

As shown in FIG. 5, the fine adjustment device 50 includes a lever member 51, a coarse adjustment member 52, and a bolt member 53. The lever member 51 has a fulcrum portion 54, an action point portion 55, and a force point portion 56, and is configured so that a force acts on the action point portion 55 by a force applied to the force point portion 56. The fulcrum support portion 54a is
Is formed so that the action point support portion 55a can be fixed to the power point portion 56 by screwing.

A fulcrum neck 54b is formed above the fulcrum support 54a, a fulcrum neck 55b is formed below the fulcrum support 55a, and a fulcrum neck 56b is formed above the fulcrum support 56a. Each of the necks has a structure slightly bent by the movement of the lever member 51.

The coarse adjustment member 52 includes a nut portion 58 fixed to the application point support portion 55a and having a female screw portion 58a, a male screw portion 59a screwed into the female screw portion 58a of the nut portion 58, and a hollow portion 59b. A coarse adjustment hollow bolt 59 provided and a male screw portion 6 penetrating through the hollow portion 59 and formed at the distal end portion
0a is a female screw portion 55c formed on the action point support portion 55a.
3 to form a flange 42 as shown in FIG.
And a fixing bolt 60 which is clamped and fixed by the coarse adjustment hollow bolt 59.

As shown in FIGS. 3 and 5, the bolt member 53 includes a force transmitting portion 61 fixed to the force point supporting portion 56a,
Fixed part 6 fixed to the lower surface of turntable base 16b
2 and a rotating part 63 rotatable with respect to the fixed part 62. A male screw part 63b is formed at the tip of a shaft part 63a extending upward from the rotating part 63.
Are screwed into a female screw portion formed inside the force transmitting portion 61.

The chuck surface 15a of the chuck table 15
When adjusting the positional relationship between the grinding wheel 25a or the grinding surface of the grinding wheel 25b, the fixing bolt 60 is loosened, and the coarse adjustment hollow bolt 59 is rotated to roughly adjust the position. Tighten flange 4
2 is clamped between the fixing bolt 60 and the coarse adjustment hollow bolt 59, and then the rotating part 63 of the bolt member 53 is rotated to move the force transmitting part 61 up and down, whereby the lever member 5 is moved.
A force is applied to one force point portion 56. For example, the rotating unit 6
3 is rotated in the L direction in FIG. 3, an upward force is applied to the power point portion 56.

The force applied to the force point portion 56 is transmitted to the action point 55 using the fulcrum portion 54 as a fulcrum. For example, when an upward force is applied to the power point portion 56, an upward force also acts on the action point portion 55.

Here, since the action point portion 55 is located between the fulcrum portion 54 and the force point portion 56, the force applied to the force point portion 56 by rotating the rotating portion 63 is directly applied to the action point portion 55. Instead of working at the same time, it will work with great power. That is, the lever member 51 at the action point 55
Is smaller than the vertical movement amount of the force point portion 56, and fine adjustment with high precision is possible. For example, when the distance between the fulcrum portion 54 and the application point portion 55 is 1 and the distance between the application point portion 55 and the force application portion 56 is 5, the application point portion 5
The resolution of 5 is five times the resolution of the bolt 53, and the precision of the fine adjustment is five times.

When a force is applied to the power point portion 56,
The inclination of the lever member 51 can be absorbed by slightly bending the neck 54b, the neck 55b, or the neck 56b.
Therefore, it is possible to perform fine adjustment with high accuracy without difficulty.

Further, even if play or play occurs between the male screw portion 63b and the female screw portion to be screwed with the male screw portion 63b, the high resolution has little effect on the adjustment accuracy, and the high accuracy is maintained. can do. Further, even if the processing accuracy of the screw surface of the male screw portion 63b and the female screw portion to be screwed thereto is low and the uneven contact occurs, the force applied to the power point portion 56 is relatively small, and the force at the power point portion 56 of the lever member 51 is small. Since the vertical movement amount at the action point portion 55 is smaller than the vertical movement amount, the rigidity in the vertical direction can be maintained.

The vertical movement amount of the lever member 51 in the force point portion 56 and the vertical movement amount in the application point portion 55 depend on the force point and the ratio of the distance from the application point to the fulcrum. A desired resolution can be configured by preparing a lever member having different positions of the fulcrum, the action point, and the force point according to the need, and appropriately selecting and using the lever member.

If a driving source such as a pulse motor is connected to the rotating portion 63 of the bolt member 53, the rotating portion 63 can be rotated automatically instead of manually, so that adjustment can be easily performed. .

As described above, when a force acts on the action point portion 55 by appropriately rotating the rotating portion 63 in either direction,
The table support portion 40 is inclined according to the force, and the chuck surface 15a is correspondingly inclined, so that the positional relationship between the grinding wheel and the grinding surface can be finely adjusted.

In this embodiment, the fine adjustment for making the grinding surface of the grinding wheel and the chuck surface of the chuck table parallel in the grinding device which is an example of the processing device has been described. Is not limited to a grinding device, and the positional relationship to be adjusted is not limited to parallel.

[0039]

As described above, according to the fine adjustment device of the present invention, the adjustment is performed not only by the conventional bolt member but also by the combination of the bolt member and the lever member. Therefore, the amount of movement of the lever member at the point of force is smaller than the amount of movement of the lever member at the point of force when the bolt member is rotated, so that the position can be adjusted with high resolution, and the screw formed on the bolt member has play or play. The influence is small even when the thread is generated, the adjustment can be performed with high accuracy, and the rigidity can be maintained even when the screw surface is unevenly contacted. Therefore, the processing accuracy is improved, and the workpiece can be finished with high precision.

Further, the vertical movement amount at the force point portion of the lever member and the vertical movement amount at the application point portion depend on the ratio of the force point and the distance from the application point to the fulcrum.
A desired resolution can be configured by preparing a lever member having different positions of a fulcrum, a point of action, and a point of force as needed, and appropriately selecting and using the member. Therefore, it is possible to flexibly cope with the required adjustment accuracy.

Further, each of the fulcrum, the action point, and the power point has a neck, and each neck bends following the inclination of the lever member. Therefore, the inclination of the lever member can be absorbed by the neck. The positional relationship can be adjusted without difficulty.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a grinding device as an example of a device on which a fine adjustment device according to the present invention is mounted.

FIG. 2 is an explanatory diagram showing a configuration of the grinding device.

FIG. 3 is a perspective view showing a fine adjustment device mounted on the grinding device.

FIG. 4 is a plan view showing a flange portion provided at a lower portion of a chuck table constituting the grinding device.

FIG. 5 is an exploded perspective view showing a fine adjustment device according to the present invention.

FIG. 6 is a perspective view showing a grinding device.

FIG. 7 is a perspective view showing a conventional adjustment mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Grinding apparatus 11a, 11b ... Cassette 12 ... Carry-in / out 13 ... Centering table 14 ... 1st conveyance means 15 ... Chuck table 16a ... Turntable 16b ... Turntable base 16c ... Motor 16d ... Tube 17a, 17b ... Grinding Means 18 ... Wall 19 ... Rail 20 ... Pulse motor 21 ... Slide 22 ... Spindle 23 ... Mounter 24 ... Grinding wheel 25a, 25b ... Grinding wheel 26 ... Second conveying means 27 ... Cleaning means 28 ... Ball screw 29 ... Support part DESCRIPTION OF SYMBOLS 30 ... Pulse motor driver 31 ... Control part 32 ... Linear scale 40 ... Table support part 41 ... Motor 42 ... Flange part 43a, 43b, 43c ... Supported part 44a, 44b, 44c ... Through hole 45 ... Bolt 50 ... Fine adjustment device 51 ... Leverage member 52 ... Coarse adjustment member 53 ... Bo G member 54: fulcrum 54a: fulcrum support 55: application point 55a: application point support 56: power fulcrum 56a: power fulcrum support 58: nut 58a: female screw 59: coarse adjustment hollow bolt 59a: male screw Part 59b Female screw part 60 Fixing bolt 61 Force transmitting part 62 Fixed part 63 Rotating part 63a Shaft part 63b Male screw part 70 Grinding device 71a Base cover 71b Base 72 ... Rail 74 ... Sliding part 75 ... Grinding means 76 ... Chuck table 76a ... Chuck surface 77 ... Spindle 78 ... Mounter 79 ... Grinding wheel 80 ... Grinding wheel 81 ... Table support part 82 ... Motor 83 ... Flange part 84 ... Adjustment bolt 85 ... Rotating part

Claims (8)

[Claims] 1. A fine adjustment device that finely adjusts a positional relationship between a first member and a second member, comprising: a lever member having a fulcrum portion, an action point portion, and a power point portion; And a bolt member for transmitting a force to the part. 2. A fulcrum, an action point, and a power point constituting a lever member are each composed of a support part and a neck part, and the bolt member is composed of a rotating part, a fixed part, and a force transmission part. 2. The fine adjustment device according to 1. 3. A fulcrum support portion of the lever member is fixed at a required position of the first member, and an action point support portion of the lever member is fixed at a required position of the second member. The fine adjustment device according to claim 2, wherein a portion is fixed to a force point support portion of the lever member, and a fixing portion of the bolt member is fixed to a required position of the first member. 4. A coarse adjustment member is interposed between the operation point support portion of the lever member and the second member, the coarse adjustment member includes a nut portion fixed to the operation point support portion, and the nut A coarse adjustment hollow bolt screwed into the portion, and a hollow portion formed in the coarse adjustment hollow bolt is penetrated and screwed into the operation point support to fix the second member and the operation point support. The fine adjustment device according to claim 3, comprising a fixing bolt. 5. The fine-adjustment device according to claim 1, wherein the first member is a base constituting the processing device, and the second member is a support portion of a holding member for holding the workpiece. 6. A processing apparatus includes: a grinding unit having a grinding wheel for grinding a surface of a workpiece; a chuck table serving as a holding member for holding the workpiece; and a base supporting the chuck table. The fine adjustment device according to claim 5, wherein at least the first member is the base, and the second member is a table supporting portion that supports the chuck table. 7. The fine adjustment device according to claim 6, wherein the chuck table is supported at three positions with respect to the base, and is disposed at at least two positions. 8. The fine-adjustment device according to claim 2, wherein a driving source is mounted on the rotating part constituting the bolt member.