JP2002001244A - Apparatus for cleaning particulate semiconductor material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for uniformly and highly efficiently cleaning a particulate semiconductor material such as particulate polysilicon. SOLUTION: An apparatus for cleaning a particulate semiconductor material PS with a cleaning liquid L, which apparatus comprises a cylindrical container 11 that can hold the particulate semiconductor material together with the cleaning fluid and a container rotation mechanism 14 that rotates the cylindrical container about the center being a central axis C kept in a horizontal or inclined state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a granular semiconductor material cleaning apparatus for cleaning a granular semiconductor material such as granular polysilicon used as a material for pulling a silicon single crystal by a CZ method (Czochralski method) with a cleaning liquid. About.

[0002]

2. Description of the Related Art In general, a single crystal pulling method using a CZ method is known as one of means for growing a semiconductor single crystal such as silicon (Si) or gallium arsenide (GaAs). For example, in order to grow single-crystal silicon by the CZ method, first, a silicon material is put (charged) into a quartz crucible disposed in a chamber and melted, and a seed crystal is immersed in the melt. Then, the silicon single crystal is grown by pulling up.

In general, bulk polycrystalline silicon (polysilicon) is used as a silicon raw material to be charged into a crucible. In recent years, high-density charging is possible and suitable for recharging, and productivity can be improved. Use of possible granular polysilicon as a raw material is being considered. Although this granular polysilicon has the above-mentioned advantages, the granular polysilicon is liable to rub against each other due to vibrations during transportation, and is liable to generate dust. There is a disadvantage that a large amount of fine powder is generated.

If the granular polysilicon to which such fine powder adheres is charged into the crucible, dislocation-free growth of single crystal silicon grown from the melt is hindered.
The so-called free ratio (the ratio at which dislocation-free single crystal silicon is obtained from the raw material) deteriorates. Therefore, it is necessary to clean the granular polysilicon before charging the crucible.

Conventionally, to clean granular polysilicon,
As shown in FIG. 4, the granular polysilicon PS is put into a car 1, and the cage 1 is immersed in a cleaning tank 2 in which a chemical solution L such as a mixed acid of hydrofluoric acid and nitric acid is stored. Had been washed. In this cleaning means, the cleaning tank 2
The chemical solution L overflowing from the tank is returned to the washing tank 2 by the pump P via the filter F for filtration and circulated. The granular polysilicon PS washed in this manner was pulled out of the cleaning tank 2 together with the car 1 and was placed in a tank storing pure water (or ultrapure water) together with the car 1 to wash out the chemical liquid L.

[0006]

The above-mentioned conventional cleaning means has the following problems. In other words, in the past, granular polysilicon was placed in a cleaning tank in a basket, so the chemical solution did not sufficiently spread in the basket, and the inside of the basket could not be cleaned well, and the entire granular polysilicon was uniformly cleaned. There was an inconvenience that could not be done. For this reason, the cleaning efficiency is poor and sufficient cleaning cannot be performed as a whole.

The present invention has been made in view of the above-mentioned problems, and has as its object to provide a granular semiconductor material cleaning apparatus capable of uniformly and efficiently cleaning a granular semiconductor material such as granular polysilicon. .

[0008]

The present invention has the following features to attain the object mentioned above. That is, the granular semiconductor material cleaning apparatus of the present invention is an apparatus for cleaning a granular semiconductor material with a cleaning liquid, and a cylindrical container capable of storing the granular semiconductor material together with the cleaning liquid, and a state in which a central axis is horizontal or inclined. And a container rotating mechanism for rotating the cylindrical container about the central axis.

In this granular semiconductor material cleaning apparatus, a container rotating mechanism for rotating the cylindrical container about the central axis while the central axis is horizontal or inclined is provided. When rotated, the granular semiconductor material in the cylindrical container is stirred together with the cleaning liquid, so that the cleaning liquid is sufficiently distributed throughout, and the granular semiconductor material can be uniformly and efficiently cleaned.

Further, the cleaning apparatus for granular semiconductor material of the present invention recovers the cleaning liquid overflowing from the opening of the cylindrical container, removes foreign substances contained in the cleaning liquid, and returns the cleaning liquid to the cylindrical container. Preferably, a circulation mechanism is provided. That is, in this granular semiconductor material cleaning apparatus, the cleaning liquid circulation mechanism collects the overflowing cleaning liquid, removes foreign matter such as fine powder, and makes it reusable.
This can be returned to the cylindrical container and circulated, and the cleaning liquid can be reused and foreign substances can be removed.

Further, in the granular semiconductor material cleaning apparatus according to the present invention, the cleaning liquid circulation mechanism separates and recovers the granular semiconductor material from the overflowing cleaning liquid, and returns the granular semiconductor material to the cylindrical container. It is preferable to have a recharging mechanism. The granular semiconductor material being cleaned in the cylindrical container is:
When the oxide film adhered to the surface is peeled off, the surface tension may increase and the surface may rise, and may spill out of the cylindrical container together with the cleaning liquid overflowing from the cylindrical container. Therefore, in this granular semiconductor material cleaning apparatus, the granular semiconductor material is separated and recovered from the overflowing cleaning liquid by the material re-feeding mechanism and returned to the cylindrical container again, whereby the spilled granular semiconductor material can be repeatedly cleaned. As a whole, it can be sufficiently washed without waste.

Further, in the granular semiconductor material cleaning apparatus of the present invention, it is preferable that the material reloading mechanism includes a reloading aspirator for sucking in the collected granular semiconductor material and sending it out to the cylindrical container. . That is,
When the granular semiconductor material is sucked up and returned by the pump, the granular semiconductor material may be clogged in the pump. However, in this granular semiconductor material cleaning apparatus, the granular semiconductor material spilled out by the re-feeding aspirator using the pressure difference. Is transported, so that the granular semiconductor material is hardly clogged and can be smoothly returned to the cylindrical container.

Further, in the granular semiconductor material cleaning apparatus according to the present invention, the refill aspirator is provided in a pipe of the cleaning liquid returned to the cylindrical container by the cleaning liquid circulation mechanism, and is generated when the cleaning liquid rapidly flows out. It is preferable that the granular semiconductor material is sucked in at a negative pressure and that the granular semiconductor material is sent out together with the cleaning liquid. In other words, in this granular semiconductor material cleaning apparatus, the negative pressure when the cleaning liquid returned to the cylindrical container rapidly flows out of the refilling aspirator is used to suck in the granular semiconductor material and to form the cylindrical container together with the cleaning liquid. The cleaning liquid to be circulated can be used also as a fluid for driving the re-feeding aspirator, and the pipe for returning the cleaning liquid and the pipe for returning the particulate semiconductor material can be shared to simplify the piping system.

Further, the granular semiconductor material cleaning apparatus of the present invention includes a material charging mechanism for charging the granular semiconductor material into the cylindrical container, and a material removing mechanism for removing the granular semiconductor material from the cylindrical container. Is preferred. That is, in this granular semiconductor material cleaning apparatus,
Since the granular semiconductor material is charged and unloaded by the material charging mechanism and the material removing mechanism, these operations need not be performed manually or the like, and the efficiency of the operation can be improved.

Further, in the granular semiconductor material cleaning apparatus of the present invention, it is preferable that the material charging mechanism includes a charging aspirator for sucking the granular semiconductor material to be charged and sending the granular semiconductor material to the cylindrical container. Further, in the granular semiconductor material cleaning apparatus of the present invention, it is preferable that the material take-out mechanism includes a take-out aspirator that sucks the granular semiconductor material from the cylindrical container and sends it out of the cylindrical container.

That is, in these granular semiconductor material cleaning apparatuses, the material supply mechanism and the material removal mechanism include the aspirator for charging and removing the granular semiconductor material, respectively. Clogging and the like hardly occur, and the granular semiconductor material can be smoothly charged and unloaded.

Further, in the granular semiconductor material cleaning apparatus of the present invention, at least one of the charging aspirator and the discharging aspirator is provided in a pipe of pure water fed into the cylindrical container, and the pure water rapidly flows out. It is preferable that the granular semiconductor material is sucked in at a negative pressure generated at the same time and the granular semiconductor material is sent out together with pure water.

That is, in this granular semiconductor material cleaning apparatus, at least one of the input aspirator and the take-out aspirator utilizes a negative pressure generated when pure water sent to the cylindrical container rapidly flows out, and uses the negative pressure. Since the material is inhaled and sent out to the cylindrical container together with the pure water, the pure water for washing out the cleaning liquid can also be used as the fluid for driving the aspirator, and the pure water piping and the piping for charging or removing the granular semiconductor material are provided. And the piping system can be simplified.

Further, in the granular semiconductor material cleaning apparatus of the present invention, it is preferable that the material removing mechanism includes a pure water cleaning mechanism for cleaning the removed granular semiconductor material with pure water. In other words, in the granular semiconductor material cleaning apparatus, the removed granular semiconductor material is cleaned with pure water by the pure water cleaning mechanism, so that it is not necessary to perform pure water cleaning by a manual operation or the like, and the working efficiency is further improved. Can be.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a granular semiconductor material cleaning apparatus according to the present invention will be described below with reference to FIGS. In these figures, reference numeral 11 denotes a drum,
Reference numeral 12 denotes a chemical tank, 13 denotes a take-out tank, and 14 denotes a drum rotation mechanism.

The apparatus for cleaning a granular semiconductor material according to the present embodiment comprises:
This is a granular polysilicon cleaning apparatus for cleaning granular polysilicon (granular semiconductor material) PS having a diameter of several hundred μm to several mm with a chemical solution (cleaning liquid) L. FIG. 1 schematically shows the overall configuration of the granular polysilicon cleaning apparatus. FIG. In addition,
In this figure, a drum (tubular container) 11, a chemical tank 12,
The cross-sectional structures of the removal tank 13 and the storage container 23 are illustrated. This granular polysilicon cleaning apparatus includes a drum 11 made of polyethylene or the like, which is a cylindrical container capable of storing the granular polysilicon PS together with the chemical solution L, and a drum 11 centered on the central axis C while the central axis C is inclined. And a drum rotation mechanism (container rotation mechanism) 14 for rotating the drum.

Further, this granular polysilicon cleaning apparatus comprises:
The chemical liquid L overflowing from the opening 11a of the drum 11 is collected, foreign substances (oxide film or granular polysilicon PS) contained in the chemical liquid L are removed, and the chemical liquid L is returned to the drum 11 by a chemical liquid circulation mechanism (cleaning liquid circulation mechanism). 15 are provided.
Further, the granular polysilicon cleaning apparatus is provided with a drum 11
Material supply mechanism 16 for supplying granular polysilicon PS into the inside
And a material take-out mechanism 17 for taking out the granular polysilicon PS from the drum 11.

As shown in FIG. 2, the drum rotating mechanism 14 is provided with a plurality of rollers 14a for supporting the lower portion of the drum 11 in a horizontal state and rotating the drum 11, and these rollers 14a rotate the roller 14a. It is connected to a motor M which is a driving source. The drum 11
Is supported by the roller 14a with the opening 11a inclined slightly above the horizontal state.

The chemical liquid circulation mechanism 15 receives a chemical liquid tank 12 installed below the opening 11a of the drum 11, a chemical liquid L installed in the chemical liquid tank 12, and overflowing from the opening 11a and granular polysilicon PS spilling out. A recovery net basket 18 and a material re-feeding mechanism 19 for separating and recovering the granular polysilicon PS from the overflowing chemical liquid L and returning the granular polysilicon PS to the drum 11 are provided.

A chemical supply line 12a for supplying a chemical L is connected to the chemical tank 12 via a chemical supply valve 12b. In addition, an overflow pipe 12c is connected to the side wall of the chemical liquid tank 12, and when the chemical liquid L in the chemical liquid tank 12 exceeds a certain amount, it is discharged outside through the overflow pipe 12c. Furthermore, the chemical solution tank 1
A drain line 12d for the chemical liquid L is connected to the bottom of the tank 2 via a drain valve 12e, so that the drain liquid in the chemical tank 12 can be discharged after the cleaning.

The collection net basket 18 has a mesh smaller than the size of the granular polysilicon PS, leaving only the dropped granular polysilicon PS inside, and the chemical solution L
Deposits such as oxides and oxide films can be discharged to the chemical solution tank 12 below. The chemical circulation mechanism 15
It has a chemical solution circulation filtration line 20 which is a pipe having a base end connected to the chemical solution tank 12 and a distal end connected to the drum 11. A pump P for sucking out the stored chemical liquid L and a filter F for removing foreign substances (adhering substances such as oxide films) from the chemical liquid L drawn up by the pump P are connected.

The material reloading mechanism 19 has a polysilicon recovery line 21 which is a pipe having a lower end disposed in a recovery net basket 18, and the polysilicon recovery line 21 sucks the recovered granular polysilicon PS. Drum 1
It is connected to a re-injection aspirator 22 for sending out to 1.

The re-injection aspirator 22 is provided in the middle of the re-injection line 20a (downstream of the filter F) branching off from the chemical circulation / filtration line 20, and the chemical L sucked out of the chemical tank 12 by the pump P rapidly. The granular polysilicon PS in the collecting net basket 18 is sucked through the polysilicon collecting line 21 by the negative pressure generated when the granular polysilicon PS flows out, and the granular polysilicon PS is opened together with the chemical liquid L through the recharge line 20a. Drum 1 from section 11a
1 is sent out.

The material charging mechanism 16 includes a storage container 23 in which the granular polysilicon PS to be charged before cleaning is filled together with pure water (or ultrapure water). And a polysilicon input line 24 disposed in the opening 11a of the semiconductor device. The polysilicon charging line 24 is provided with a charging aspirator 25 for sucking the granular polysilicon PS from the storage container 23 and sending it out to the drum 11 along the way.

The charging aspirator 25 is connected to a first pure water line 27 branched from a pure water supply line 26 for supplying pure water, and when the pure water from the first pure water line 27 rapidly flows out. Granular silicon PS from the storage container 23 through the polysilicon input line 24 with the negative pressure generated at
And the granular polysilicon PS is charged into the drum 11 through the opening 11a together with pure water.

The material take-out mechanism 17 includes a take-out tank 13 for holding the washed granular polysilicon PS taken out of the drum 11, and a polysilicon take-out having a base end disposed in the lower portion of the drum 11 and a tip disposed in the take-out tank 13. A line 28 and a pure water cleaning mechanism 29 for cleaning the granular polysilicon PS taken out with pure water are provided. The polysilicon take-out line 28 sucks the washed granular polysilicon PS from the drum 11 in
Is provided with a take-out aspirator 30 to be sent out of the apparatus.

The take-out aspirator 30 is connected to a second pure water line 31 branched from the pure water supply line 26, and a negative pressure generated when pure water from the second pure water line 31 rapidly flows out. Polysilicon take-out line 28
The granular polysilicon PS is sucked from the drum 11 through the, and the granular polysilicon PS is taken out of the drum 11 together with the pure water and put into the tank 13.

The take-out tank 13 contains granular polysilicon P sent out from the tip of the polysilicon take-out line 28.
A take-out net basket 33 for receiving S is provided inside. The net cage 33 for take-out is set so that its mesh is smaller than the size of the granular polysilicon PS, leaving only the dropped granular polysilicon PS inside, and the liquid such as pure water flows into the lower take-out tank 13 main body. It can be put out.

The pure water washing mechanism 29 is connected to the pure water supply line 26.
The tip of the third pure water line 32 branched from
3 and is configured to be able to sprinkle pure water from the third pure water line 32 onto a net basket 33 for taking out. The first to third pure water lines 27, 31, 32 have valves 27a, 31a, 3
2a is provided.

A rinse line 40 connected to the pure water supply line 26 via a valve 40a is connected to the chemical liquid circulation filtration line 20. That is, the valve 4
By opening Oa, pure water can be sent into the drum 11 via the rinsing line 40 and the chemical liquid circulation filtration line 20.

The entire apparatus is covered with an enclosure or the like, and an exhaust duct or the like for exhausting gas or the like generated from the chemical solution L is connected to the enclosure. As the chemical solution L, dilute hydrofluoric acid, a mixed acid of hydrochloric acid and hydrofluoric acid, ozone hydrofluoric acid, hydrofluoric nitric acid, aqueous hydrogen peroxide, hydrochloric acid, or the like is used.

Next, a method for cleaning granular polysilicon in the granular semiconductor material cleaning apparatus of the present embodiment will be described.

[Polysilicon Injection Step] First, the granular polysilicon PS in the storage container 23 is
Is transported and charged into the drum 11. That is, the valve 27a of the first pure water line 27 is opened and pure water is rapidly poured into the charging aspirator 25. At that time, the granular polysilicon PS in the storage container 23 is discharged through the polysilicon charging line 24 by the negative pressure. Suction, further opening 11a
And into the drum 11. When a predetermined amount of the granular polysilicon PS is charged, the flow rate of the pure water is reduced by the valve 27a, the negative pressure generated by the charging aspirator 25 is reduced, and the charging of the granular polysilicon PS is stopped.

[Pure water rinsing step] Next, the supply of pure water from the first pure water line 27 through the polysilicon charging line 24 is continued, and at the same time, the drum 11 is rotated by the drum rotating mechanism 14.
By rotating the inside, the granular polysilicon PS inside
While rinsing with pure water for a predetermined time.

[Cleaning Step] Next, the chemical solution L
Supply. That is, the pump P is driven to
The chemical liquid L is sucked out of the filter liquid F, foreign substances in the chemical liquid L are removed through the filter F, and the chemical liquid L is supplied into the drum 11 by the chemical liquid circulation filtration line 20. The chemical liquid L is supplied and stored in the chemical liquid tank 12 in advance through the chemical liquid supply line 12a. In the state where the liquid medicine L is thus supplied,
By rotating the drum 11 by the drum rotation mechanism 14, the granular polysilicon PS inside is washed with the chemical solution L for a predetermined time while stirring.

During the cleaning, the chemical liquid L and the granular polysilicon PS overflowing from the opening 11a of the drum 11 fall into the collecting net basket 18, and only the granular polysilicon PS is separated and collected. The granular polysilicon PS in the recovery net basket 18 is sucked up through the polysilicon recovery line 21 by the negative pressure of the chemical solution L flowing through the drum 11 and returned into the drum 11 together with the chemical solution L. The chemical solution L that has fallen into the chemical solution tank 12 is filtered by the filter F, and is again returned to the drum 11 by the chemical solution circulating filtration line 20.
Will be returned within.

[Removing Step] After thoroughly washing,
The rotation of the drum 11 by the drum rotation mechanism 14 is stopped, and the pump P is stopped to stop the circulation of the drug solution L. Next, the second pure water line 31 is moved by the material take-out mechanism 17.
The valve 31a is opened and pure water is rapidly poured into the aspirator 30 for taking out, and the negative pressure at that time sucks up the granular polysilicon PS in the drum 11 through the polysilicon take-out line 28, and takes out the polysilicon in the taking-out tank 13. It is sent into the net basket 33. At this time, the valve 3 of the third pure water line 32 is
2a is opened and pure water is taken out and water is sprayed on the granular polysilicon PS in the net basket 33 to wash away the adhering liquid L.

Finally, the granular polysilicon PS from which the chemical solution L has been washed out is dried and put into a crucible for pull-up growth.

As described above, in the present embodiment, the drum 1 is moved around the center axis C while the center axis C is horizontal or inclined.
Since it has a drum rotation mechanism 14 for rotating 1
When the drum 11 is rotated by the drum rotation mechanism 14, the granular polysilicon PS in the drum 11 is agitated together with the chemical liquid L, whereby the chemical liquid L is sufficiently distributed throughout, and the granular polysilicon PS is uniformly and efficiently cleaned. Can be.

Further, since the granular polysilicon PS is charged, taken out, and recharged by using each aspirator, the granular polysilicon PS, which tends to occur when these are performed by the pump, hardly occurs, and these operations can be performed smoothly. It can be carried out. Further, since the chemical solution L is circulated and the filtration is performed by the filter F, the cleaning can be efficiently performed with the clean chemical solution L.

The technical scope of the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention. For example, in the pure water cleaning mechanism 29 in the above-described embodiment, the cleaning granular polysilicon PS is added to the take-out net basket 33.
And the chemical liquid L was washed off by spraying pure water from the third pure water line 32, but as another example, a pure water cleaning mechanism 29 of a belt conveyor type may be adopted as shown in FIG. .

That is, the pure water cleaning mechanism 29 of the other example is used.
Is an endless belt 36 receiving on its upper surface the granular polysilicon PS sent out from the polysilicon take-out line 28.
And a motor (not shown) for driving the endless belt 36 to rotate.
And a shower mechanism 37 connected to the pure water supply line 26 and spraying pure water on the granular polysilicon PS transported on the endless belt 36, and a granular poly-silicon provided downstream of the shower mechanism 37 and washed with pure water. A drying mechanism 38 including a heater or the like for drying the silicon PS with a heating inert gas is provided.

In the pure water cleaning mechanism 29, the granular polysilicon PS taken out is placed on an endless belt 36 and transported by the endless belt 36, thereby performing a pure water cleaning step by a shower mechanism 37 and a drying process by a drying mechanism 38. The steps can be performed sequentially and continuously, and the work can be performed more efficiently.

Further, inside the drum 11, as another stirring means, a rotating fin or a screw for stirring the granular polysilicon PS may be provided. Further, the drum rotating mechanism 14 rotates the drum 11 with the center axis C inclined.
However, the center axis C may be supported and rotated in a horizontal state.

As another means for extracting the granular polysilicon from the drum, a mixer system in which a spiral threshold or groove is formed in the drum and the granular polysilicon is moved to an opening and discharged according to the rotation direction of the drum. May be adopted. Further, in the present embodiment, the granular polysilicon is cleaned as the granular semiconductor material, but another granular semiconductor material may be cleaned.

[0051]

According to the granular semiconductor material cleaning apparatus of the present invention, since the container rotating mechanism for rotating the cylindrical container about the central axis while the central axis is horizontal or inclined is provided, the cylindrical semiconductor material cleaning apparatus has a cylindrical shape. By rotating the container, the granular semiconductor material in the cylindrical container is stirred together with the cleaning liquid, so that the cleaning liquid can be sufficiently distributed throughout, and the cleaning can be performed uniformly and efficiently. Therefore, if the granular semiconductor material washed by this apparatus is used as a raw material for the CZ method, an excellent crystalline single crystal can be grown.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an entire apparatus together with a partial cross-sectional structure in one embodiment of a granular semiconductor material cleaning apparatus according to the present invention.

FIG. 2 is a side view showing a drum and a drum rotating mechanism in one embodiment of the granular semiconductor material cleaning apparatus according to the present invention.

FIG. 3 is a schematic front view showing another example of a pure water cleaning mechanism in the embodiment of the granular semiconductor material cleaning apparatus according to the present invention.

FIG. 4 is an overall sectional view showing a conventional example of a granular semiconductor material cleaning apparatus according to the present invention.

[Explanation of symbols]

 Reference Signs List 11 drum (cylindrical container) 14 drum rotation mechanism (container rotation mechanism) 15 chemical liquid circulation mechanism (washing liquid circulation mechanism) 17 material take-out mechanism 19 material re-input mechanism 22 re-input aspirator 25 input aspirator 27 first pure water line 29 Pure water cleaning mechanism 30 Aspirator for removal 31 Second pure water line 32 Third pure water line C Center axis of drum F Filter L Chemical solution (cleaning solution) PS Granular polysilicon (granular semiconductor material)

Claims (10)

[Claims] 1. An apparatus for cleaning a granular semiconductor material with a cleaning liquid, comprising: a cylindrical container capable of storing the granular semiconductor material together with the cleaning liquid; and a centered axis centered on a horizontal or inclined center axis. A granular semiconductor material cleaning apparatus, comprising: a container rotating mechanism configured to rotate the cylindrical container. 2. The granular semiconductor material cleaning apparatus according to claim 1, wherein the cleaning liquid overflowing from an opening of the cylindrical container is collected, and foreign substances contained in the cleaning liquid are removed. A cleaning apparatus for cleaning a granular semiconductor material, comprising: a cleaning liquid circulation mechanism for returning to the state described above. 3. The granular semiconductor material cleaning apparatus according to claim 2, wherein the cleaning liquid circulation mechanism separates and recovers the granular semiconductor material from the overflowing cleaning liquid, and stores the granular semiconductor material in the cylindrical container. An apparatus for cleaning a granular semiconductor material, comprising a material re-introduction mechanism for returning to the original state. 4. The granular semiconductor material cleaning apparatus according to claim 3, wherein the material reloading mechanism includes a reloading aspirator for sucking the collected granular semiconductor material and sending the collected particulate semiconductor material to the cylindrical container. An apparatus for cleaning a granular semiconductor material, comprising: 5. The granular semiconductor material cleaning apparatus according to claim 4, wherein the refilling aspirator is provided in a pipe of the cleaning liquid returned to the cylindrical container by the cleaning liquid circulation mechanism, and the cleaning liquid quickly flows out. A granular semiconductor material cleaning apparatus characterized in that the granular semiconductor material is sucked in at a negative pressure that is sometimes generated, and the granular semiconductor material is sent out together with a cleaning liquid. 6. The granular semiconductor material cleaning apparatus according to claim 1, wherein a material charging mechanism for charging the granular semiconductor material into the cylindrical container, and the granular semiconductor material from the cylindrical container. And a material take-out mechanism for taking out the semiconductor material. 7. The granular semiconductor material cleaning apparatus according to claim 6, wherein the material charging mechanism includes a charging aspirator for sucking the granular semiconductor material to be charged and sending the granular semiconductor material to the cylindrical container. And a granular semiconductor material cleaning apparatus. 8. The granular semiconductor material cleaning apparatus according to claim 6, wherein the material take-out mechanism includes a take-out aspirator that sucks the granular semiconductor material from the cylindrical container and sends the material to the outside of the cylindrical container. An apparatus for cleaning a granular semiconductor material, comprising: 9. The granular semiconductor material cleaning apparatus according to claim 7, wherein at least one of the input aspirator and the take-out aspirator is provided in a pipe of pure water fed into the cylindrical container. A granular semiconductor material cleaning apparatus, wherein the granular semiconductor material is sucked in at a negative pressure generated when water rapidly flows out, and the granular semiconductor material is sent out together with pure water. 10. The granular semiconductor material cleaning apparatus according to claim 6, wherein the material removing mechanism includes a pure water cleaning mechanism for cleaning the removed granular semiconductor material with pure water. A granular semiconductor material cleaning apparatus characterized by the above-mentioned.