JP2002001191A - Method and device for applying adhesive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for applying an adhesive, which is capable of equalizing the applying quantity of the adhesive after the 2nd point of coating to the applying quantity of the adhesive in the 1st point of coating even in the case that the surface tension is different with the difference of a material between a trial-applying tape and a circuit board. SOLUTION: In the method of applying the adhesive, which is performed by using an adhesive applying nozzle 1 capable of optionally controlling the discharge time of the adhesive, sticking the adhesive discharged and held in the adhesive applying nozzle 1 on the adhesive trial-applying tape and successively sticking the adhesive successively discharged from the adhesive applying nozzle 1 to a prescribed place on the circuit board, the adhesive discharge time in the 1st point of coating is set based on the difference of the material between the tape and the circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive applying method and an adhesive applying apparatus used when applying an adhesive to a circuit board before mounting electronic components.

[0002]

2. Description of the Related Art An adhesive for mounting an electronic component is applied to a predetermined position on a printed circuit pattern on a circuit board on which the electronic component is mounted before mounting the electronic component. A conventional adhesive application device of this type will be described with reference to FIGS.

FIG. 7 is a schematic configuration diagram of a conventional adhesive coating device. In this figure, A is an adhesive application device, B is an adhesive application unit, and C is a stage unit that carries and regulates a circuit board. The adhesive application section B includes a plurality of application nozzles 1 and a syringe 3. The application nozzle 1 and the syringe 3 are supported by an elevating mechanism 5 that can move up and down in the Z direction. A mechanism 7 is provided. 9
Is a camera for recognition. Further, the entire adhesive application section B is supported by a robot section 11 that can operate in the X direction. The stage C is a table 13 movable in the Y direction.
And transport means 17 for transporting the circuit board 15. With these configurations, the adhesive application section B can move in the X, Y, and Z directions with respect to the circuit board 15.

[0004] The disposal tape 19 is stretched so as to be movable in the longitudinal direction along the transport path of the circuit board 15. The operation and control of the adhesive application section B and the stage section C are performed by the control section D of the adhesive application apparatus A.

Next, the operation of applying the adhesive to the circuit board 15 using the adhesive applying apparatus A will be described. Circuit board 1
5 is transported by the substrate transport means 17 and the table 13
Regulated above. Next, the relative movement of the coating section B with respect to the circuit board 15 in the XY directions is performed by the mutual operation of the X-direction robot section 11 and the Y-direction moving table 13. Further, the recognition camera 9 recognizes the target mark on the circuit board 15, and the application position is corrected.

Next, the coating section B and the stage section C operate in accordance with the coating program of the control section D, and the lifting and lowering mechanism 5 raises and lowers the nozzle in the Z direction, and positions the coating nozzle 1 on the discarding tape 19. The adhesive 21 is discarded and beaten. Thereafter, the application nozzle 1 is positioned at a designated application position on the circuit board 15 by movement control in the X, Y, and Z directions, and the application of the adhesive 21 to the circuit board 15 is continuously performed. After the application operation, the application nozzle 1 returns to the original position, and repeats the operation of waiting for the next circuit board 15 to be carried in.

FIG. 10 is a flowchart showing the operation of the conventional adhesive coating device. Processing procedure step 1 (S1)
Sets the adhesive discharge time based on the application program, and executes the application operation of the first point or the second and subsequent points in S2. In step S3, it is determined whether or not the final application is performed. If the final application is not performed, the process returns to step S1 and the next application cycle is started again. In the case of the final application, the adhesive application operation is completed.
5 are repeated.

Next, details of the adhesive application timing when the adhesive 21 is applied to the circuit board 15 will be described with reference to FIG. When applying the adhesive 21 to the circuit board 15, first, as shown in Step 1, the adhesive 21 in the syringe 3 is pushed out, the adhesive 21 is discharged from the application nozzle 1, and the adhesive 21 is applied by the surface tension of the discharged adhesive 21. A droplet a of the adhesive 21 is formed at the discharge port of the nozzle 1.

Thereafter, as shown in step 2, the coating nozzle 1 is lowered to a predetermined position on the surface of the circuit board 15, and the tip of the coating nozzle 1 is brought into contact with the circuit board 15 to transfer and adhere the adhesive 21 to the circuit board 15. And apply.

After the droplet a is deposited, when the application nozzle 1 is raised in step 3, the control unit D prepares for the next transfer deposition.
The adhesive in the syringe 3 is extruded based on the command set in the above, and the adhesive 21 is again discharged from the syringe 3 to form a droplet a of the adhesive. In step 4, the application nozzle 1 is positioned at the next specified application position, and the adhesive 21 is thus positioned at a predetermined position on the circuit board 15 in the same manner.
Is applied.

However, in the above-mentioned conventional adhesive coating apparatus A, there is a problem that the applied amount of only the first point becomes smaller than the set value. In order to solve this problem, for example, in the technique disclosed in Japanese Patent Application Laid-Open No. 10-351996, the application nozzle 1 from the dumping position to the first application point is set.
Paying attention to the fact that the moving distance of the first and second points is longer than that of the second point and thereafter, and "the means for setting the adhesive discharge time required as the first point to be longer than the discharge time of the second point and thereafter, Means for delaying the point of adhesive discharge from the second point onward. "
Was used.

[0012]

Generally, the surface properties of the discarded tape and the circuit board are different due to the different materials. This difference in the surface properties causes a difference in the surface tension of the adhesive to be attached, and causes the amount of the adhesive to be applied to the application nozzle to be different. FIG. 12 shows the difference in the amount of adhesive applied on the surface between the case where the discarding is performed on the discarding tape 19 and the case where the coating is performed on the circuit board 15.

When the adhesive 21 is applied onto the throw-away tape 19, the adhesive in the syringe 3 is pushed out in S1 in FIG. 10 described above, and the adhesive 21 is discharged from the application nozzle 1, and the surface of the discharged adhesive is discharged. The droplet a of the adhesive is formed at the discharge port of the application nozzle 1 by the tension. Thereafter, as shown in step 2, the application nozzle 1 is lowered to a predetermined position on the discarding tape 19, the tip of the nozzle 1 is brought into contact with the discarding tape 19, and the adhesive 21 is transferred and adhered to the discarding tape 19. Apply.

In step 3 after the coating operation, the coating nozzle 1
A residual adhesive b corresponding to the surface tension of the adhesive adhered on the discarded tape adheres to the tip of the tape. When the discarding is performed again, the droplet a of the adhesive is formed at the discharge port of the application nozzle 1 in step 4 as in step 1. At this time, the adhesive of a + b is attached to the tip of the application nozzle 1.

In step 5, the application nozzle 1 is lowered to a predetermined position on the discarding tape 19 in the same manner as in step 2,
The adhesive 21 is transferred and applied to the throw-away tape 19 and applied. In step 6, the application nozzle 1 is discarded and the tape 19
When the adhesive is lifted from the surface of the application nozzle 1, the residual adhesive b corresponding to the surface tension of the adhesive adhered on the discarding tape 19 is adhered to the tip of the application nozzle 1 again. Therefore, the adhesive of a will adhere on the discarded tape 19,
Thereafter, even when the discarding is repeated, the adhesive amount on the discarding tape 19 is stabilized at a.

Next, when applying the adhesive 21 on the circuit board 15, the adhesive 21 is discharged from the application nozzle 1 in step 7 as in step 1, and the adhesive droplet a Is formed. At this time, the adhesive of a + b is attached to the tip of the application nozzle 1. In step 8, the application nozzle 1 is lowered to a predetermined position on the circuit board 15, and the tip of the nozzle 1 is brought into contact with the circuit board 15 so that the adhesive 2
1 is transferred to the circuit board 15 and applied.

In step 9 after the coating operation, the coating nozzle 1
A residual adhesive c corresponding to the surface tension of the adhesive adhered on the circuit board 15 is adhered to the tip of the substrate. Therefore, the amount of the adhesive applied at the first application point on the circuit board 15 is a + bc. If coating is performed on the circuit board again, step 10
As in step 7, a droplet a of the adhesive is formed at the discharge port of the application nozzle 1. At this time, the adhesive of a + c is attached to the tip of the application nozzle 1.

Next, in step 11, the application nozzle 1 is lowered to a predetermined position on the surface of the circuit board 15 as in step 8, and the adhesive 21 is transferred and applied to the circuit board 15 for application. When the application nozzle 1 is raised from the surface of the circuit board 15 in step 12, the circuit board 1
5 Residual adhesive c corresponding to the surface tension of the adhesive adhered on
Is attached. The adhesive “a” adheres to the circuit board 15, and the adhesive adhesion amount after the second application point on the circuit board 15 stabilizes at “a”. The problem is that the adhesive amount a + bc of the first point of application is not equal to the adhesive amount a of the second and subsequent points of application, and only the first point is smaller than the set value. Had occurred. this is,
The surface properties of the discarded tape 19 and the circuit board 15 are different, the surface tension of the adhesive to be attached is different, and the adhering amounts b and c are different.
Are not equal.

Although the above description has been made on the case where the material of the adhesive 21 to be used is constant, even when the adhesive 21 to be used is changed, even if the adhesive 21 to be used is changed, Since the properties are also different, the residual adhesive at the tip of the application nozzle 1 is also different, and there has been a problem that the adhesive adhesion amount at the first point is not uniform compared to the second and subsequent points.

Further, the first program is applied by a coating program as disclosed in Japanese Patent Application Laid-Open No. 10-351996.
If the discharge time is set to be long only for the spots or the discharge timing is set to be delayed, when the processing of optimizing the coating order is performed by NC control to shorten the production time per circuit board, the coating before optimization is performed. The first point is not always the first point after optimization, and there has been a problem that the ejection time or the ejection timing of the first point of application after optimization has to be set again.

FIG. 13 is a view showing a problem in a case where the application sequence is optimized in a conventional adhesive coating apparatus. When the adhesive discharge time at the first application point of the application program P1 is set as shown in FIG. 13A, optimization processing is performed on the application program P1, and the first application point before optimization is the L-point. I will see it. At this time, the application point L is not always equal to the application first point. If the ejection time of the application first point is multiplied by 1.1, the optimized application program P
In the case of 1, the ejection time becomes long only at the L-th point of application.
Further, the adhesive application amount at the first application point after the optimization does not reach the target value. This is shown in FIG.
The same can be said for another application program P2 shown in (b).

When a step & repeat function is used in a coating program for a multi-circuit board,
If the ejection time is set long or the ejection timing is set to be delayed only at the first point of application of the application program as in the technique disclosed in Japanese Patent Application Laid-Open No. 10-351996, there is a problem that the amount of adhesive applied is not uniform. Was.

FIG. 14 shows a step and step in a coating program for a circuit board of a multi-cavity in a conventional adhesive coating apparatus.
FIG. 9 is a diagram illustrating a problem when a repeat function is used. First, the step & repeat function will be briefly described. In the case where the circuit board 15 is formed into, for example, four chamfers as shown in FIG.
Application position X, Y coordinates up to the point, adhesive discharge time, second
It is configured as shown in FIG. 15 so that the pattern to the fourth pattern repeat the first step. The application sequence is as follows: the first point of the first pattern, the first point of the second pattern, the first point of the third pattern, the first point of the fourth pattern, and the second point of the first pattern. The order is the N-th point of the pattern. When mounting the same parts at several points on the circuit board 15,
Since the amount of adhesive applied is also the same, this is a method of sequentially applying the same position for each pattern.

If the adhesive discharge time at the first point of application is set to be long or the discharge timing is set to be delayed, the first point of application of the first pattern can have a desired amount of adhesive applied. However, if the first point of application of the second pattern and the third and fourth patterns is also applied with the same adhesive discharge time, the amount of adhesive applied from the second point to the first point of application of the fourth pattern is reversed. Will increase. As described above, the coating operation from the first point of application of the first pattern to the first point of application of the second pattern is not performed on the discarding tape 19 on the circuit board 15 but on the circuit board 15. This is because the operation is performed on the same circuit board 15. The same applies to the first point of application of the third pattern and the first point of application of the fourth pattern.

Therefore, depending on only the technique disclosed in Japanese Patent Application Laid-Open No. 10-351996, the adhesion of the adhesive after the first point of application and the second and subsequent points of application caused by the difference in the surface properties of the discarded tape and the circuit board. There was a problem that the unevenness of the quantity could not be solved.

The present invention has been made in view of the above circumstances, and even when the surface properties are different due to the difference in the material of the discarded tape and the circuit board, the amount of the adhesive applied at the first application point is determined by the second application point. It is an object of the present invention to provide an adhesive application method and an adhesive application device that can make the same amount of adhesive applied after the eye and to make the amount of adhesive applied to a circuit board uniform.

[0027]

According to a first aspect of the present invention, there is provided a method for applying an adhesive, the method comprising the steps of: After the adhesive discharged from the adhesive application nozzle and held on the adhesive disposing tape, the adhesive sequentially discharged from the adhesive application nozzle is sequentially applied to a predetermined position on the circuit board to apply the adhesive. In the adhesive application method to be performed,
The adhesive discharge time at the first application point is set based on a difference in material between the throw-away tape and the circuit board.

In this adhesive application method, the adhesive discharge time at the first application point is set based on the difference in material between the discarded tape and the circuit board, and is caused by the difference in surface tension between the discarded tape and the circuit board. This makes it possible to correct the difference in the residual adhesive at the tip of the nozzle. That is, the amount of the residual adhesive at the tip of the nozzle can be controlled according to the difference in surface tension. Therefore, the first application point can be applied according to the target application amount. As a result, the amount of the adhesive applied to the first and second application points on the circuit board becomes uniform.

According to a second aspect of the present invention, in the adhesive applying method, the adhesive discharging time at the first application point is set based on a difference between the materials of the adhesive and the circuit board and the adhesive. Features.

In this adhesive application method, in addition to the difference in the material of the discarded tape and the circuit board, the adhesive discharge time is increased.
The first application point can be applied according to the target application amount even if the adhesive used is set depending on the difference in the material of the adhesive.

According to a third aspect of the present invention, there is provided an adhesive applying method using an adhesive applying nozzle in which an adhesive discharging time can be arbitrarily adjusted, and disposing of the adhesive discharged and held by the adhesive applying nozzle. An adhesive application method in which an adhesive sequentially discharged from the adhesive application nozzle is sequentially applied to a predetermined position on a circuit board and applied after the adhesive tape is applied on the taping tape. It is characterized by using a tape made of a material capable of obtaining the same surface tension of the adhesive as the surface tension of the adhesive adhered on the substrate.

In this adhesive application method, a discarding tape made of a material exhibiting substantially the same surface tension as the adhesive adhered on the circuit board is used as the discarding tape, so that the difference in surface properties and the adhesive It is no longer necessary to change the adhesive discharge time at the first point of application after the discarding operation according to the difference in the material of the material, and the adhesive can be applied to all points on the pattern at high speed and according to the target application amount. Become.

According to a fourth aspect of the present invention, there is provided an adhesive applying apparatus, comprising: a stage section for supporting a circuit board; a moving means capable of operating an adhesive applying nozzle in a three-dimensional direction; And an adhesive application device having a control means for automatically controlling the adhesive discharge time of the adhesive application nozzle, wherein the adhesive discharge time at the first application point set by the control means is set to the discarded tape. A sub-control means for correcting based on a difference in material of the circuit board is provided.

In this adhesive coating apparatus, there is provided a sub-control means for correcting the adhesive discharge time at the first application point based on the difference between the materials of the tape and the circuit board.
When the adhesive is applied to the spot, the discharge time is calculated by multiplying the set adhesive discharge time by, for example, a certain magnification based on the difference in the material of the discarded tape and the circuit board. This makes it possible to correct an error in the amount of adhesion caused by a difference in surface tension between the discarded tape and the circuit board. As a result, the first application point can be applied according to the target application amount.

According to a fifth aspect of the present invention, in the adhesive applying apparatus, the adhesive discharging time at the first application point set by the control means is based on a difference between the materials of the adhesive tape, the circuit board, and the adhesive. And sub-control means for performing correction.

In this adhesive coating apparatus, the adhesive discharge time is determined by the difference between the material of the discarded tape and the material of the circuit board.
It is also set by the difference in the material of the adhesive, and the error of the adhesive amount can be corrected according to the change of the adhesive used. As a result, the first application point can be applied according to the target application amount.

According to a sixth aspect of the present invention, there is provided an adhesive applying apparatus, comprising: a stage for supporting a circuit board; moving means capable of operating an adhesive applying nozzle in a three-dimensional direction; And a control means for automatically controlling the adhesive ejection time of the adhesive application nozzle, wherein the discarded tape has an adhesion substantially equal to the surface tension of the adhesive adhered on the circuit board. It is characterized by being made of a material capable of obtaining the surface tension of the agent.

In this adhesive applying apparatus, the throwing-out is performed on a throwing-out tape made of a material having a surface tension substantially the same as the surface tension of the adhesive adhered on the circuit board. In the application of the adhesive, there is no error in the amount of adhesion due to the difference in the surface properties and the material of the adhesive. Accordingly, it is not necessary to change the adhesive discharge time at the first point of application after the discarding operation, and the adhesive can be applied to all points on the pattern at a high speed and at the target application amount.

[0039]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an adhesive applying method and an adhesive applying apparatus according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a block diagram of an adhesive application device according to the present invention.

The adhesive applying apparatus 31 used in the adhesive applying method of the present invention has substantially the same mechanism as the apparatus shown in FIGS. When the dispensing time is set, the sub-control means for calculating the adhesive dispensing time at the first application point is based on the difference in the material of the discarded tape and the circuit board. The same members as those shown in FIGS. 7 to 9 are denoted by the same reference numerals and described.

The adhesive application device 31 of the first embodiment
Is an adhesive application section B that applies the adhesive 21 to the surface of the circuit board 15 and a movement that moves the adhesive application section B relative to the circuit board 15 in the X-axis direction along the surface of the circuit board 15. An X-direction robot section 11 as a means, a Y-direction table 13 as a moving means for moving the adhesive application section B relative to the circuit board 15 in the Y-axis direction, and an adhesive application section B
, Which is a moving means for relatively moving in the Z-axis direction orthogonal to the surface of the circuit board 15, and recognizes the input processing instruction data 36 based on a predetermined processing program stored in advance to perform the above-described operations. And a sub-controller that corrects the adhesive discharge time of the first application point set by the controller 35 based on the difference in the material of the discarding tape 19 and the circuit board 15. 37, a predetermined member is mounted at a designated position on the surface of the circuit board 15 in accordance with the instruction content of the processing instruction data 36.

That is, the adhesive application device 31 of the present embodiment
Is an adhesive application device that applies a predetermined amount of adhesive to a designated position on the circuit board 15. The adhesive application section B stores the three application nozzles 1 that emit the adhesive 21 and the adhesive 21. And a syringe 3 to be supplied to the application nozzle 1.

Each application nozzle 1 has a different emission amount. For example, the first application nozzle 1 has a small output amount for one application, the second application nozzle 1 has a large output amount for one application, and the third application nozzle 1 has a small output amount. The number of times of emission is set to a medium value.

The application amount is adjusted by selecting the application nozzle 1 to be used in accordance with a control signal of the controller 35. Further, for example, the operation of the adhesive supply control mechanism for adjusting the supply amount from each syringe 3 to each application nozzle 1 is described as follows.
By controlling the controller 35 according to a numerical value designated in advance, fine adjustment of the application amount can be performed.

The adhesive application section B is connected to the controller 35
Is supported by an X-direction robot unit 11 capable of traveling in the X-axis direction based on a control signal from the
1 is movable in the X direction in accordance with the traveling of the vehicle.

The adhesive application section B is equipped with an elevating mechanism 5 for elevating and lowering each application nozzle 1 and the syringe 3 in the Z-axis direction. The elevating mechanism 5 is configured to convert the rotation of a cam rotationally driven via, for example, a servo motor (not shown) into a linear displacement in the Z-axis direction of the application nozzle 1 by a link that abuts the cam.

The basic operation of applying the adhesive in the adhesive application device 31 is as follows. When the circuit board 15 to be processed is transported to the reference position by the transport means 17 of the table 13, the recognition camera 9 moves the circuit board 15 on the circuit board 15. Detect and identify the target mark attached to. Then, in accordance with the identified target mark, the application nozzle 1 in which the adhesive is emitted in an appropriate amount is selected, and the separation distance between the material application nozzle 1 and the disposal tape 19 is determined by the circuit board 15 and the application nozzle 1. The adhesive is discarded on the discarding tape 19 by adjusting to an appropriate separation distance between the adhesive and the tape.

Adhesive coating device 31 according to this embodiment
When setting the adhesive discharge time, the adhesive discharge time at the first application point is discarded and the tape 19 and the circuit board 15
Is characterized in that a sub-control means 37 for calculating based on the difference in the material is provided.

FIG. 2 is a flowchart showing the operation procedure of the adhesive application device of FIG. That is, it is determined in step 11 (hereinafter abbreviated as S11) whether or not the application is the first application point, and if it is the first application point, the magnification value is calculated in S12. From the data table provided in the controller 35, the used tape 19, the circuit board 15, and the adhesive 21
And calculates the corresponding magnification value.

Next, in step S13, the adhesive discharge time is multiplied by the calculated magnification value. If it is not the first point of application in S11, the adhesive discharge time based on the application program is selected in S14. Next, in S15, the application operation for the first application point or the second and subsequent application points is performed based on the ejection time obtained from S13 or S15. In step S16, it is determined whether or not the final application is performed. If the final application is not performed, the process returns to step S11, and the next application cycle starts again. In the case of the final application, the adhesive application operation is completed, and the next circuit board 15 is loaded. Are repeated.

FIG. 3 is an explanatory diagram showing a data table for calculating the magnification value of FIG. In calculating the magnification value, a data table 41 relating to the material of the throw-away tape 19, the material of the circuit board 15, and the type of the adhesive 21 is prepared in the setting circuit of the controller 35, and the first point of application is determined by a combination of these. A magnification value indicating how many times the eye adhesive discharge time is to be set in advance is stored.

The magnification value can be changed by the operator. In some cases, the result of adhesive application at the first point of application may be recognized by the recognition camera 9 and may be increased or decreased based on the recognition result. . When the material of the discarded tape 19 is L and the material of the circuit board 15 is O, the magnification value is U, and the material of the discarded tape 19 is L and the material of the circuit board 15 is P
In this case, the magnification value is V, and so on.

When setting the adhesive discharge time at the first application point, referring to this data table 41, a numerical value selected according to the material of the discarded tape 19 and the circuit board 15 is used as the magnification value for the application time. The first set adhesive discharge time is multiplied, and the adhesive 21 is discharged based on this time. This magnification value does not apply to the second and subsequent points of application,
The application is performed in the set adhesive discharge time.

As described above, since the predetermined adhesive discharge time can be controlled by the magnification value, it is possible to set the application result as the target amount, and the adhesive adhesion amount at the first point of application becomes insufficient. Is resolved.

FIG. 4 is an explanatory diagram of a process of calculating the adhesive discharge time at the first point of application in the processing procedure of FIG. 2 based on the difference in material between the tape and the circuit board. When the amount of adhesive applied at the first point of application of the application program P3 is set as shown in FIG. 4A, when the application program P3 is subjected to optimization processing, the first point of application before optimization is the point L of application. I will see it. At this time, the L-th point of application is not always equal to the first point of application. However, according to the present invention, the first point of application after optimization can be multiplied by the magnification value calculated from the data table 41 of FIG. The same can be said for another application program P2 shown in FIG.

According to the present invention, it is not necessary to set the adhesive application amount at the first application point for each application program.
Even when the application program is optimized and the application program in which the application order is changed is used, the adhesive application result at the first application point can always be made equal to the target application amount. As a result, it is possible to make the amount of the adhesive applied to the first and second application points on the circuit board uniform, and to improve the application accuracy.

Next, the second method of the adhesive application method according to the present invention will be described.
An embodiment will be described. FIG. 5 is an explanatory diagram showing a data table for calculating a magnification value according to the second embodiment. When setting the adhesive discharge time, the adhesive coating device according to the second embodiment of the present invention discards the adhesive discharge time at the first point of application and discards the tape 19, the circuit board 15, and the adhesive 21. A sub-control means (not shown) for calculating based on the difference in material is provided.

That is, in the setting circuit of the controller 35, the material of the discarding tape 19, the material of the circuit board 15,
A data table 51 relating to the type of the adhesive 21 is prepared, and a magnification value indicating how many times the adhesive discharge time at the first application point is to be set to a preset value is stored based on the combination. The magnification value may be a value that can be changed by an operator. In some cases, the adhesive application result at the first application point may be recognized by the recognition camera 9 and may be increased or decreased based on the recognition result. The material of the disposal tape 19 is L, the material of the circuit board 15 is O, and the type of the adhesive 21 is S.
In this case, the magnification value is U, the material of the discarding tape 19 is L, the material of the circuit board 15 is P, and the type of the adhesive 21 is S.
In this case, the magnification value is V, and so on.

When setting the adhesive discharge time at the first application point, the data table 51 is referred to, and a numerical value selected according to the material of the discarding tape 19 and the circuit board 15 is used as a magnification value as a magnification value. The first set adhesive discharge time is multiplied, and the adhesive 21 is discharged based on this time. This magnification value does not apply to the second and subsequent points of application,
The application is performed in the set adhesive discharge time.

As described above, since the preset adhesive discharge time can be controlled by the magnification value, the adhesive 21 to be used can be controlled.
Is changed, the application result can be set as the target amount, and the problem that the adhesive amount at the first application point is insufficient can be solved.

Next, the third method of the adhesive application method according to the present invention will be described.
An embodiment will be described. FIG. 6 is an explanatory diagram showing details of the adhesive application timing in the adhesive application method according to the third embodiment. The adhesive application device according to the third embodiment of the present invention is characterized in that the same material having the same surface texture as the circuit board 15 is used for the discarded tape 19.

FIG. 6 shows the adhesion amount of the adhesive on the surface when the discarding is performed on the discarding tape 19 and when the coating is performed on the circuit board 15 in this embodiment. When the adhesive 21 is applied onto the discarded tape 19, the adhesive amount on the discarded tape 19 is stabilized at a in steps 1 to 6 as mentioned in the related art.

Next, when applying the adhesive 21 on the circuit board 15, the adhesive 21 is discharged from the application nozzle 1 in step 7, as in step 1, and the adhesive droplet a is discharged to the discharge port of the nozzle 1. Is formed. At this time, the adhesive 21 of a + b is attached to the tip of the application nozzle 1. In step 8, the application nozzle 1 is lowered to a predetermined position on the circuit board 15, and the tip of the nozzle 1 is brought into contact with the circuit board 15 to transfer and apply the adhesive 21 to the circuit board 15.

In step 9 after the coating operation, the coating nozzle 1
A residual adhesive b corresponding to the surface tension of the adhesive adhered on the circuit board 15 is adhered to the tip of. Therefore, the amount of the adhesive applied at the first application point on the circuit board 15 is a + bb−a.
Becomes When the application is performed on the circuit board 15 again, a droplet a of the adhesive is formed at the discharge port of the application nozzle 1 in Step 10 as in Step 7. At this time, the adhesive of a + b is attached to the tip of the application nozzle 1. Step 11
Then, as in step 8, the application nozzle 1 is lowered to a predetermined position on the surface of the circuit board 15, and the adhesive 21 is transferred onto the circuit board 15 and applied.

In step 12, the application nozzle 1 is connected to the circuit board 1.
When the nozzle 5 is lifted from the surface, the residual adhesive b corresponding to the surface tension of the adhesive adhered on the circuit board 15 is again adhered to the nozzle tip. The adhesive 21 a adheres to the circuit board 15, and the second
The adhering amount of the adhesive after the dot is stabilized at a. in this way,
Since the surface properties of the discarded tape 19 and the circuit board 15 are the same, the adhesive adhesion amount at the first application point becomes equal to the adhesive adhesion amount after the second application point.

According to the adhesive applying method and the adhesive applying apparatus according to the present embodiment, the first point of application of the adhesive after the dumping operation is performed according to the difference in the surface tension and the difference in the material of the adhesive. There is no need to change the time, and the adhesive can be applied to all points on the pattern at high speed and according to the target application amount.

[0067]

As described above in detail, in the adhesive applying method according to the present invention, the adhesive discharging time at the first application point is set based on the difference in the material of the discarded tape and the circuit board. As a result, the difference in the residual adhesive at the tip of the nozzle caused by the difference in the surface properties of the discarded tape and the circuit board can be corrected, and the first application point can be applied according to the target application amount. . As a result, it is possible to make the amount of the adhesive applied to the first and second application points on the circuit board uniform, and to improve the application accuracy.

The adhesive application apparatus according to the present invention uses the adhesive discharge time at the first application point set by the control means,
Since the sub-control means for correcting based on the difference in the material between the discarded tape and the circuit board is provided, it is possible to correct the error in the amount of adhesion caused by the difference in the surface tension between the discarded tape and the circuit board. it can. That is, the difference in the residual adhesive at the nozzle tip can be corrected. Thus, the first application point can be applied according to the target application amount.

[Brief description of the drawings]

FIG. 1 is a block diagram of an adhesive application device according to the present invention.

FIG. 2 is a flowchart showing an operation procedure of the adhesive application device of FIG. 1;

FIG. 3 is an explanatory diagram showing a data table for calculating a magnification value in FIG. 2;

FIG. 4 is an explanatory diagram of a process of calculating an adhesive discharge time at a first point of application in the processing procedure of FIG. 2 based on a difference in material between a discarded tape and a circuit board.

FIG. 5 is an explanatory diagram showing a data table for calculating a magnification value according to the second embodiment.

FIG. 6 is an explanatory diagram showing details of an adhesive application timing in the adhesive application method according to the third embodiment.

FIG. 7 is a schematic configuration diagram of a conventional adhesive application device.

FIG. 8 is an enlarged perspective view of an adhesive application section shown in FIG. 7;

9 is an enlarged perspective view of the stage unit shown in FIG.

FIG. 10 is a flowchart showing the operation of a conventional adhesive application device.

FIG. 11 is an explanatory diagram showing details of an adhesive application timing in a conventional adhesive application method.

FIG. 12 is an explanatory diagram showing the difference in the amount of adhesive attached on the surface when discarded on a discarded tape and when applied on a circuit board.

FIG. 13 is an explanatory view showing a problem in a case where a process of optimizing a coating order is performed in a conventional adhesive coating device.

FIG. 14 is an explanatory diagram showing a problem in a case where a step & repeat function is used in a coating program on a circuit board of a multi-cavity in a conventional adhesive coating device.

FIG. 15 is an explanatory diagram of a coating program when a circuit board is chamfered, for example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Adhesive application nozzle 3 Syringe 5 Z direction elevating mechanism (moving means) 9 Recognition camera 11 X direction robot part (moving means) 13 Y direction table (moving means) 15 Circuit board 19 Discarded tape 21 Adhesive 31 Adhesive Coating device 35 Controller (control means) 37 Sub-control means C Stage part a Adhesive droplet b Residual adhesive c Residual adhesive

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshiyuki Kino 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. F term (reference) 4D075 AC06 AC86 AC99 CA47 DA06 DB14 DC22 EA35 4F041 AA06 AB01 BA05 BA22 BA35 BA38 BA56 4F042 AA07 BA02 CB03

Claims (6)

[Claims] 1. An adhesive application nozzle whose discharge time of an adhesive can be arbitrarily adjusted is used. The adhesive discharged and held by the adhesive application nozzle is applied onto an adhesive discarding tape, and then the adhesive is applied. An adhesive application method in which an adhesive sequentially ejected from an agent application nozzle is sequentially adhered to a predetermined position on a circuit board to perform application, wherein the adhesive ejection time at the first point of application is determined by the discarding tape and the circuit. A method for applying an adhesive, wherein the method is set based on a difference in material of a substrate. 2. The method according to claim 1, wherein the adhesive discharge time at the first application point is:
2. The method for applying an adhesive according to claim 1, wherein the setting is performed based on a difference between materials of the adhesive tape, the circuit board, and the adhesive. 3. After using an adhesive application nozzle whose discharge time of the adhesive can be arbitrarily adjusted, the adhesive discharged and held by the adhesive application nozzle is applied onto an adhesive disposal tape, An adhesive application method in which an adhesive sequentially discharged from the adhesive application nozzle is applied to a predetermined position on a circuit board by sequentially applying the adhesive, the surface of the adhesive attached to the circuit board on the discarded tape. A method for applying an adhesive, characterized by using a tape of a material capable of obtaining a surface tension of an adhesive substantially equal to the tension. 4. A stage for supporting a circuit board, moving means capable of moving an adhesive application nozzle in a three-dimensional direction, a disposal tape for disposing the adhesive, and an adhesive for the adhesive application nozzle An adhesive application device having control means for automatically controlling the discharge time, wherein the adhesive discharge time at the first application point set by the control means is based on a difference in material between the discarding tape and the circuit board. An adhesive coating device, comprising: a sub-control means for performing correction. 5. A sub-control means for correcting the adhesive discharge time at the first point of application set by the control means based on the difference in the material of the adhesive tape, the circuit board, and the adhesive is provided. The adhesive application device according to claim 4, wherein: 6. A stage for supporting a circuit board, moving means capable of operating an adhesive application nozzle in a three-dimensional direction, a disposal tape for disposing and ejecting the adhesive, and an adhesive for the adhesive application nozzle An adhesive coating apparatus having control means for automatically controlling a discharge time, wherein the discarding tape is made of a material that can obtain a surface tension of an adhesive substantially equal to a surface tension of the adhesive adhered on the circuit board. An adhesive coating device, comprising: