JP2001525123A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001525123A5 JP2001525123A5 JP1998545882A JP54588298A JP2001525123A5 JP 2001525123 A5 JP2001525123 A5 JP 2001525123A5 JP 1998545882 A JP1998545882 A JP 1998545882A JP 54588298 A JP54588298 A JP 54588298A JP 2001525123 A5 JP2001525123 A5 JP 2001525123A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/824,104 US5835335A (en) | 1997-03-26 | 1997-03-26 | Unbalanced bipolar electrostatic chuck power supplies and methods thereof |
| US08/824,104 | 1997-03-26 | ||
| PCT/US1998/005676 WO1998043291A1 (en) | 1997-03-26 | 1998-03-24 | Unbalanced bipolar electrostatic chuck power supplies and methods therefor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001525123A JP2001525123A (ja) | 2001-12-04 |
| JP2001525123A5 true JP2001525123A5 (ja) | 2005-11-10 |
| JP4169792B2 JP4169792B2 (ja) | 2008-10-22 |
Family
ID=25240591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54588298A Expired - Fee Related JP4169792B2 (ja) | 1997-03-26 | 1998-03-24 | 不平衡二極静電チャック電源供給装置およびその方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5835335A (ja) |
| EP (1) | EP0970517B1 (ja) |
| JP (1) | JP4169792B2 (ja) |
| KR (1) | KR100538599B1 (ja) |
| AT (1) | ATE328365T1 (ja) |
| DE (1) | DE69834716T2 (ja) |
| TW (1) | TW432464B (ja) |
| WO (1) | WO1998043291A1 (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5953200A (en) * | 1998-02-05 | 1999-09-14 | Vlsi Technology, Inc. | Multiple pole electrostatic chuck with self healing mechanism for wafer clamping |
| US6346428B1 (en) * | 1998-08-17 | 2002-02-12 | Tegal Corporation | Method and apparatus for minimizing semiconductor wafer arcing during semiconductor wafer processing |
| US6361645B1 (en) * | 1998-10-08 | 2002-03-26 | Lam Research Corporation | Method and device for compensating wafer bias in a plasma processing chamber |
| US6188564B1 (en) * | 1999-03-31 | 2001-02-13 | Lam Research Corporation | Method and apparatus for compensating non-uniform wafer processing in plasma processing chamber |
| KR20010007406A (ko) * | 1999-06-17 | 2001-01-26 | 조셉 제이. 스위니 | 정전 처크에 의해 발생한 정전력 균형을 맞추는 방법 및장치 |
| TW454320B (en) * | 2000-05-12 | 2001-09-11 | Siliconware Precision Industries Co Ltd | Semiconductor devices with heat-dissipation stiffener and manufacturing method thereof |
| JP2003115442A (ja) * | 2001-10-04 | 2003-04-18 | Nikon Corp | 荷電粒子線露光装置におけるレチクル又はウエハの静電チャック方法 |
| US6898065B2 (en) * | 2002-07-26 | 2005-05-24 | Brad Mays | Method and apparatus for operating an electrostatic chuck in a semiconductor substrate processing system |
| US7026174B2 (en) * | 2002-09-30 | 2006-04-11 | Lam Research Corporation | Method for reducing wafer arcing |
| US7567421B2 (en) * | 2003-06-17 | 2009-07-28 | Creative Technology Corporation | Bipolar electrostatic chuck |
| JP2005182494A (ja) * | 2003-12-19 | 2005-07-07 | Mitsubishi Electric Corp | 電流増幅回路およびそれを備える液晶表示装置 |
| US20120140362A1 (en) * | 2010-12-02 | 2012-06-07 | Mathew Robins | Method of Operating a Heating Element for Underfloor Heating |
| US9076831B2 (en) * | 2011-11-04 | 2015-07-07 | Lam Research Corporation | Substrate clamping system and method for operating the same |
| US9754809B2 (en) * | 2013-11-11 | 2017-09-05 | Western Alliance Bank | Tri-modal carrier for a semiconductive wafer |
| US10236202B2 (en) * | 2013-11-11 | 2019-03-19 | Diablo Capital, Inc. | System and method for adhering a semiconductive wafer to a mobile electrostatic carrier through a vacuum |
| CN104715988B (zh) * | 2013-12-17 | 2017-05-24 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其基片直流偏置电压测量方法 |
| EP3399545B1 (en) * | 2017-05-04 | 2021-09-29 | Meyer Burger (Germany) GmbH | Substrate treatment system |
| JP6933097B2 (ja) * | 2017-11-13 | 2021-09-08 | オムロン株式会社 | 電源システム、電源装置の動作状態表示法、およびプログラム |
| CN112635381B (zh) * | 2019-10-08 | 2022-03-22 | 长鑫存储技术有限公司 | 控制方法、控制系统及半导体制造设备 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4692836A (en) * | 1983-10-31 | 1987-09-08 | Toshiba Kikai Kabushiki Kaisha | Electrostatic chucks |
| DE3705866A1 (de) * | 1987-02-24 | 1988-09-01 | Siemens Ag | Schaltungsanordnung zum erzeugen von symmetrischen ausgangsspannungen |
| JP2779950B2 (ja) * | 1989-04-25 | 1998-07-23 | 東陶機器株式会社 | 静電チャックの電圧印加方法および電圧印加装置 |
| DE69103915T2 (de) * | 1990-01-25 | 1995-05-11 | Applied Materials Inc | Elektrostatische Klemmvorrichtung und Verfahren. |
| US5325261A (en) * | 1991-05-17 | 1994-06-28 | Unisearch Limited | Electrostatic chuck with improved release |
| US5557215A (en) * | 1993-05-12 | 1996-09-17 | Tokyo Electron Limited | Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus |
| US5535507A (en) * | 1993-12-20 | 1996-07-16 | International Business Machines Corporation | Method of making electrostatic chuck with oxide insulator |
| US5467249A (en) * | 1993-12-20 | 1995-11-14 | International Business Machines Corporation | Electrostatic chuck with reference electrode |
| US5463525A (en) * | 1993-12-20 | 1995-10-31 | International Business Machines Corporation | Guard ring electrostatic chuck |
| US5812361A (en) * | 1996-03-29 | 1998-09-22 | Lam Research Corporation | Dynamic feedback electrostatic wafer chuck |
| US5708250A (en) * | 1996-03-29 | 1998-01-13 | Lam Resarch Corporation | Voltage controller for electrostatic chuck of vacuum plasma processors |
-
1997
- 1997-03-26 US US08/824,104 patent/US5835335A/en not_active Expired - Lifetime
-
1998
- 1998-03-24 KR KR10-1999-7008778A patent/KR100538599B1/ko not_active IP Right Cessation
- 1998-03-24 EP EP98911954A patent/EP0970517B1/en not_active Expired - Lifetime
- 1998-03-24 JP JP54588298A patent/JP4169792B2/ja not_active Expired - Fee Related
- 1998-03-24 WO PCT/US1998/005676 patent/WO1998043291A1/en active IP Right Grant
- 1998-03-24 DE DE69834716T patent/DE69834716T2/de not_active Expired - Lifetime
- 1998-03-24 AT AT98911954T patent/ATE328365T1/de not_active IP Right Cessation
- 1998-03-26 TW TW087104757A patent/TW432464B/zh not_active IP Right Cessation