JP2001525120A5 - - Google Patents

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Publication number
JP2001525120A5
JP2001525120A5 JP1998521450A JP52145098A JP2001525120A5 JP 2001525120 A5 JP2001525120 A5 JP 2001525120A5 JP 1998521450 A JP1998521450 A JP 1998521450A JP 52145098 A JP52145098 A JP 52145098A JP 2001525120 A5 JP2001525120 A5 JP 2001525120A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP1998521450A
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English (en)
Japanese (ja)
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JP2001525120A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US1997/019069 external-priority patent/WO1998020533A2/en
Publication of JP2001525120A publication Critical patent/JP2001525120A/ja
Publication of JP2001525120A5 publication Critical patent/JP2001525120A5/ja
Ceased legal-status Critical Current

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JP52145098A 1996-11-08 1997-10-22 ブラインドおよびスルーの両マイクロ―ヴァイアの入口の品質を向上するために吸光コーティングを用いる方法 Ceased JP2001525120A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74564596A 1996-11-08 1996-11-08
US08/745,645 1996-11-08
PCT/US1997/019069 WO1998020533A2 (en) 1996-11-08 1997-10-22 Method for using photoabsorptive coatings to enhance both blind and through micro-via entrance quality

Publications (2)

Publication Number Publication Date
JP2001525120A JP2001525120A (ja) 2001-12-04
JP2001525120A5 true JP2001525120A5 (https=) 2005-06-16

Family

ID=24997611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52145098A Ceased JP2001525120A (ja) 1996-11-08 1997-10-22 ブラインドおよびスルーの両マイクロ―ヴァイアの入口の品質を向上するために吸光コーティングを用いる方法

Country Status (4)

Country Link
US (1) US6018196A (https=)
JP (1) JP2001525120A (https=)
AU (1) AU5084998A (https=)
WO (1) WO1998020533A2 (https=)

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SG78324A1 (en) 1998-12-17 2001-02-20 Eriston Technologies Pte Ltd Bumpless flip chip assembly with strips-in-via and plating
TW444236B (en) 1998-12-17 2001-07-01 Charles Wen Chyang Lin Bumpless flip chip assembly with strips and via-fill
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US6403460B1 (en) 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a semiconductor chip assembly
US6436734B1 (en) 2000-08-22 2002-08-20 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6562709B1 (en) 2000-08-22 2003-05-13 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6562657B1 (en) 2000-08-22 2003-05-13 Charles W. C. Lin Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
US6350633B1 (en) 2000-08-22 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6402970B1 (en) 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6551861B1 (en) 2000-08-22 2003-04-22 Charles W. C. Lin Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
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US6350632B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with ball bond connection joint
US6511865B1 (en) 2000-09-20 2003-01-28 Charles W. C. Lin Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly
US6350386B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly
US6544813B1 (en) 2000-10-02 2003-04-08 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6448108B1 (en) 2000-10-02 2002-09-10 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
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US7414319B2 (en) * 2000-10-13 2008-08-19 Bridge Semiconductor Corporation Semiconductor chip assembly with metal containment wall and solder terminal
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US6908788B1 (en) 2000-10-13 2005-06-21 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using a metal base
US7071089B1 (en) 2000-10-13 2006-07-04 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a carved bumped terminal
US6740576B1 (en) 2000-10-13 2004-05-25 Bridge Semiconductor Corporation Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
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US6440835B1 (en) 2000-10-13 2002-08-27 Charles W. C. Lin Method of connecting a conductive trace to a semiconductor chip
US6576539B1 (en) 2000-10-13 2003-06-10 Charles W.C. Lin Semiconductor chip assembly with interlocked conductive trace
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