JP2001356360A - Liquid crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a liquid crystal device whose price is low, and which has reliability and whose occupancy area is small. SOLUTION: In a liquid crystal device in which first and second substrate each provided with electrodes are disposed to face oppositely with a gap and liquid crystal is sealed in the gap and a flexible printed board is connected to end parts of the first substrate and second substrate, the first substrate and the second substrate has respectively a first connection part and a second connection part which are provided at positions where the substrates are not opposed and the flexible printed board on which a second integrated circuit is mounted is connected to the first connection part and the back of the second integrated circuit is opposed to the first substrate and the flexible printed board is connected to the second connection part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device,
In particular, the present invention relates to a liquid crystal device having a flexible substrate for connecting a liquid crystal panel and a control circuit for controlling the liquid crystal panel.

[0002]

2. Description of the Related Art In a conventional liquid crystal device, when a flexible substrate integrally formed is connected to a second substrate and a first substrate of a liquid crystal panel composed of a second substrate and a first substrate. The flexible substrate is connected to the electrode pattern surface so that the end is directed inward and extends outward, and the flexible substrate extending outward is involved.

FIG. 5 is a perspective view showing a connection state of a flexible circuit board 10 in a conventional example. In FIG.
One side of the first transparent substrate 50 has a first extension 52, and a first drive IC 60 which is an IC for driving liquid crystal is mounted on the first extension 52, and the first drive IC 60 has moisture resistance. And a first terminal electrode (not shown) for external connection, which is molded to improve mechanical strength.
On the other hand, the second transparent electrode 70 has a second extension 72 on one side thereof, and a second drive IC 80 which is an IC for driving liquid crystal is mounted on the second extension 72.
In order to improve moisture resistance and mechanical strength, a second terminal electrode 78 for external connection is provided on the second extension 72.
A flexible circuit board 10 for connection to an external circuit is connected to the first terminal electrode and the second terminal electrode 78 (not shown) by anisotropic conductive bonding or heat sealing (not shown). The flexible circuit board 10 is provided with a positioning hole 19 for bonding a conductive wire to a part of the flexible circuit board 10.

The flexible circuit board 10 has a winding portion 20 formed thereon, and an FPC first terminal 12 for connecting to a first terminal electrode (not shown), an external circuit connecting terminal 16 for connecting to an external circuit, and a second terminal. It has an FPC second terminal 14 for connecting to the two-terminal electrode 78, and the FPC first terminal 12 and the FPC second terminal 14 protrude back to back. When the flexible circuit board 10 is connected to the liquid crystal panel 40, , FPC first terminal 12 and FPC second terminal 1
After bending at an arbitrary position between 4 and winding up several times at the bent position, the flexible circuit board 10 is connected to the liquid crystal panel 40.

[0005]

As described above, the conventional liquid crystal device has the first transparent substrate 50 and the second transparent substrate 70.
FP of the flexible circuit board 10 integrally formed
When the C first terminal 12 and the FPC second terminal 14 are connected, since the FPC first terminal 12 and the FPC second terminal 14 are connected in a state of being wound up several times, the flexible circuit board 10 is wound up. The work was difficult and time-consuming. The winding section 2 of the flexible circuit board 10
The shape of the flexible circuit board 10 is easy to move because it is not stable, and there is a disadvantage that the flexible circuit board 10 is likely to be disconnected and the connection portion with the liquid crystal panel 40 is easily separated due to an unexpected movement.

An object of the present invention is to provide a liquid crystal device which can easily connect a flexible substrate to a liquid crystal panel, has no risk of disconnection, and has a small occupied volume.

[0007]

In order to achieve the above-mentioned object, according to the present invention, a first substrate and a second substrate, each having electrodes, are arranged to face each other with a gap therebetween, and the liquid crystal is sealed in the gap. In a liquid crystal device in which a flexible substrate is connected to end portions of a first substrate and a second substrate, a first connection portion and a second connection portion projecting to positions not facing the first substrate and the second substrate, respectively, are formed. A flexible substrate on which a second integrated circuit is mounted is connected to a first connection portion, a back surface of the second integrated circuit faces the first substrate, and the flexible substrate is provided to the second connection portion. Are connected.

In addition, a first substrate and a second substrate each having electrodes are opposed to each other with a gap therebetween, liquid crystal is sealed in the gap, and a flexible substrate is connected to the ends of the first and second substrates. In the liquid crystal device, the first substrate and the second substrate each have a first protruding position that does not face the first substrate and the second substrate.
It has a connection portion and a second connection portion, and the first connection portion has a first connection portion.
An integrated circuit is mounted, the flexible substrate on which the second integrated circuit is mounted is connected, and a back surface of the second integrated circuit is disposed adjacent to the second integrated circuit facing the first substrate; The flexible board is connected to the connection portion.

The flexible substrate has a connection terminal for connecting to the first substrate, a connection terminal for connecting to the second substrate, and a connection terminal for mounting a second integrated circuit. A connection terminal for connecting to one substrate, a connection terminal for connecting to a second substrate, and a second integrated circuit are formed on the same surface of the flexible substrate.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on embodiments with reference to the drawings. FIG. 1 is a plan view showing a completed planar state of an embodiment according to the present invention. FIG.
FIG. 3 is a plan view showing a planar state before connecting the flexible substrate 4 to the liquid crystal panel 1 in FIG. 1. FIG. 3 is a plan view showing a planar state of the liquid crystal panel 1 before the flexible substrate 4 in FIG. 1 is connected. FIG. 4 is an explanatory diagram showing a state in which the second end 4d is connected while connecting the flexible substrate 4 to the liquid crystal panel 1. FIG.

Referring to FIG. 1, an outline of an embodiment according to the present invention will be described. The liquid crystal panel 1 is configured such that a cell is formed by a sealing member (not shown) interposed between the first substrate 2 and the second substrate 3, and a liquid crystal (not shown) is sealed inside the cell. . The first substrate 2 has a second substrate 3
A first connection portion 2a is formed protruding from a portion facing the first connection portion, and an electrode pattern 2b described later is formed on a surface of the first connection portion 2a, and a first integrated circuit 5 is fixed to the first connection portion 2a. The second substrate 3 has a second connecting portion 3 a formed protruding from a portion facing the first substrate 2.
An electrode pattern 3b to be described later is formed on the surface of a.

A first end 4a and a second end 4d are formed on the flexible substrate 4, and an electrode pattern 4b and a connector 4c, which will be described later, are formed on the first end 4a. 6 is implemented. An electrode pattern 4e described later is formed on the second end 4d.

An electrode pattern 4b of a flexible substrate 4 described later is connected to the electrode pattern 2b of the first substrate 2,
A flexible substrate 4 is provided on the electrode pattern 3b of the second substrate 3.
Electrode pattern 4e is connected. The flexible substrate 4 is bent in a substantially right angle direction at a bent portion 4f between the first end 4a and the second end 4d.

As described above, since the base of the connector 4c formed on the flexible substrate 4 is fixed to the liquid crystal panel 1, the rigidity and the mounting strength of the base of the connector 4c are large. Therefore, the operation for inserting and removing the connector portion 4c from the mating connector member is easy.

Referring to FIG. 2, the structure of the flexible substrate 4 will be described. The flexible substrate 4 is formed in an elongated linear shape. The flexible substrate 4 has a first end 4a and a second end 4d. The first end 4a has an electrode pattern 2b of the first substrate 2 described later. An electrode pattern 4b for connecting to a control circuit (not shown) and a connector 4c for connection to a control circuit (not shown) are formed close to and on the same surface, and the second integrated circuit is connected to the connector 4c and on the same surface. 6 is implemented. An electrode pattern 4e for connecting to an electrode pattern 3b of the second substrate 3, which will be described later, is formed on the second end 4d on the same surface as the electrode pattern 4b. Connector part 4c and second integrated circuit 6, and second integrated circuit 6 and electrode pattern 4b and electrode pattern 4e
Are connected by a wiring pattern (not shown).

As described above, since the flexible substrate 4 is formed in an elongated linear shape, material can be efficiently removed, and the electrode pattern 4b and the connector portion 4 can be removed.
Since the mounting surface of the electrode c, the electrode pattern 4e, and the second integrated circuit 6 is the same, the processing is easy, and the manufacturing cost can be reduced.

The connector portion 4c and the electrode pattern 4
b, and since the mounting position of the connector part 4c and the second integrated circuit 6 are close to each other, the wiring connecting them to each other can be short,
As a result, the flexible substrate 4 can be formed small and the reliability of the wiring can be increased.

Referring to FIG. 3, the structure of the liquid crystal panel 1 will be described. The liquid crystal panel 1 includes a first substrate 2 and a second substrate 3
A cell is formed by a sealing member (not shown) interposed between the cell and the cell, and a liquid crystal (not shown) is sealed inside the cell. A first connection portion 2a is formed on the first substrate 2 so as to protrude from a portion facing the second substrate 3, and an electrode pattern 2b, which will be described later, is formed on the surface of the first connection portion 2a. The integrated circuit 5 is fixed,
A second connection portion 3a is formed on the second substrate 3 so as to protrude from a portion facing the first substrate 2, and an electrode pattern 3b described later is formed on a surface of the second connection portion 3a.

Referring to FIG. 4, a state in which the first end 4a is connected while the flexible substrate 4 is being connected to the liquid crystal panel 1 will be described. First, as shown in FIG. 4, the electrode pattern 4b of the flexible substrate 4 is connected to the electrode pattern 3b formed on the back surface of the second connection portion 3a of the second substrate 3. Next, the flexible substrate 4 is bent in a substantially right-angle direction at the bent portion 4f as shown by an imaginary line, and the electrode pattern 4b of the flexible substrate 4 is formed on the surface of the first connection portion 2a of the first substrate 2. The electrode pattern 4b is connected to the pattern 2b. At this time, the second integrated circuit 6 mounted on the flexible substrate 4 is connected to the first connection portion 2a.
Are arranged at positions adjacent to the first integrated circuit 5 such that the back surface faces the first integrated circuit 5.

Thus, the state shown in FIG. 1 is obtained. As shown in FIG. 1, the first integrated circuit 5 and the second integrated circuit 6
It is mounted on or close to the first connecting portion 2a protruding from the portion facing the second substrate 3, and is within the thickness range of the second substrate 3, so that it protrudes from the liquid crystal panel 1. It can be configured compactly and space-efficiently. In addition, by bonding the entire surface of the first end 4a to the first substrate 2, the rigidity and the mounting strength of the root of the connector 4c are further increased, and the operation when the connector 4c is inserted into and removed from the mating connector member. Becomes easier.

[0021]

According to the present invention, since the flexible substrate is formed in an elongated linear shape, material can be removed without waste and the electrode pattern, the connector portion,
Since the electrode pattern and the mounting surface of the second integrated circuit are on the same surface, the processing is easy and the manufacturing cost can be reduced. In addition, since the mounting positions of the connector portion and the electrode pattern and the mounting portion of the connector portion and the second integrated circuit are close to each other, it is possible to reduce the length of the wiring for interconnecting the wirings. It becomes high. Further, the first integrated circuit and the second integrated circuit protrude from a portion facing the second substrate, are mounted on or close to the first connection portion, and fall within the thickness range of the second substrate. Therefore, a compact and space-efficient configuration can be achieved without protruding from the liquid crystal panel 1.
Further, since the root portion of the connector portion formed on the flexible substrate is fixed to the liquid crystal panel, the rigidity and the mounting strength of the root portion of the connector portion are large. Therefore, the operation of inserting and removing the connector portion from the mating connector member is easy. In addition, since the second connection portion of the second substrate requires only the space for connecting the flexible substrate, the size in the left-right direction can be reduced, the displacement of the center position of the screen can be minimized, and the left-right symmetry can be improved. It is easy to obtain and has an effect that a display screen with a good balance can be obtained with respect to the frame for housing the liquid crystal panel.

[Brief description of the drawings]

FIG. 1 is a plan view showing a completed planar state of an embodiment according to the present invention.

FIG. 2 is a plan view showing a planar state before connecting a flexible substrate 4 to the liquid crystal panel 1 in FIG.

FIG. 3 is a plan view showing a planar state of the liquid crystal panel 1 before a flexible substrate 4 in FIG. 1 is connected. .

FIG. 4 is an explanatory view showing a state in which a second end 4d is connected in the middle of connecting the flexible substrate 4 to the liquid crystal panel 1.

FIG. 5 is a perspective view showing a connection state of a flexible circuit board 10 in a conventional example. .

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2 1st board | substrate 2a 1st connection part 2b electrode pattern 3 2nd board 3a electrode pattern 3b electrode pattern 4 Flexible board 4a 1st end 4b electrode pattern 4c connector part 4d 2nd end 4e electrode pattern 5 first Integrated circuit 6 Second integrated circuit

Claims (3)

[Claims] A first substrate and a second substrate each having an electrode are opposed to each other with a gap therebetween, a liquid crystal is sealed in the gap, and a flexible substrate is connected to an end of the first and second substrates. In a liquid crystal device, a first substrate and a second substrate each have a first connection portion and a second connection portion protruding at positions not opposed to each other, and a second integrated circuit is mounted on the first connection portion. A liquid crystal device, wherein the flexible substrate is connected, a back surface of the second integrated circuit faces the first substrate, and the flexible substrate is connected to the second connection portion. 2. A first substrate and a second substrate each having an electrode are opposed to each other with a gap therebetween, a liquid crystal is sealed in the gap, and a flexible substrate is connected to an end of the first and second substrates. In a liquid crystal device, a first substrate and a second substrate each have a first connection portion and a second connection portion protruding at positions not opposed to each other, and a first integrated circuit is mounted on the first connection portion. And the flexible substrate on which the second integrated circuit is mounted is connected, the back surface of the second integrated circuit is disposed adjacent to the second integrated circuit facing the first substrate, and the second connecting portion has A liquid crystal device, wherein the flexible substrate is connected. 3. A connection terminal for connecting to a first substrate, a connection terminal for connecting to a second substrate, and a connection terminal for mounting a second integrated circuit are formed on the flexible substrate. The connection terminal for connecting to one substrate, the connection terminal for connecting to a second substrate, and the second integrated circuit are formed on the same surface of the flexible substrate. 3. The liquid crystal device according to claim 1.