JP2001354753A - Imide polyester resin, thermosetting resin composition using the same, and cured product thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imide polyester resin which is excellent in surface curability and gives a cured product excellent in resistance to solvents, acids, and heat; a thermosetting resin composition using the same; and a cured product thereof. SOLUTION: This polyester resin is a reaction product of (a) an imide compound having two carboxyl groups and (b) an epoxy compound having two epoxy groups. The thermosetting resin composition essentially comprises (A) the imide-backbone polyester resin, (B) a cross-linker, and (C) a catalyst component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imide skeleton polyester resin, a resin composition using the same, and a cured product thereof, and more particularly to a rigid and flexible printed circuit board, a ball grid array (hereinafter referred to as BGA), and chip size packaging. (Hereinafter referred to as CSP), tape carrier package (hereinafter referred to as TCP)
The present invention relates to a resin composition useful as a solder resist used for manufacturing a semiconductor package such as a semiconductor package or an interlayer insulating film.

[0002]

2. Description of the Related Art An imide resin is a material which is particularly excellent in heat resistance, toughness, and electric characteristics, and therefore has been used in flexible substrates and recently in new packages called BGA and CSP. . This imide resin is used as a protective film (cover lay) for preventing nickel, gold, solder, and the like from adhering to unnecessary portions in a plating or soldering process, or for encapsulating a semiconductor or for a BGA substrate. It is particularly useful as a material used to prevent the wiring, the passivation film, and the ball grid from being damaged by physical and thermal stress. Generally, as a method for obtaining an imide resin, an acid anhydride and a diamino compound are polymerized in a highly polar solvent such as N-methylpyrrolidone to obtain a polyamic acid solution as an intermediate, and then subjected to heat treatment to carry out imidization. Going and getting.

[0003]

However, imide resins are hardly soluble in organic solvents due to their structure, and there are limitations on the case where imide resins are modified or used as liquid resists. Further, when an imide resin is used as an additive or a modifier of another polymerizable composition, it is hardly compatible with each other, and there is a disadvantage that phase separation occurs.

[0004]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems. As a result, the use of a specific imide skeleton polyester resin has heat resistance, solubility and compatibility. The present invention was completed by finding a resin excellent in the above. That is, the present invention is characterized in that (1) a reaction product of an imide compound (a) having two carboxy groups in a molecule and an epoxy compound (b) having two epoxy groups in a molecule. Imide skeleton polyester resin (A), (2) an imide compound having two carboxy groups in the molecule (a) is a compound having trimellitic anhydride and a compound having two primary amino groups in the molecule (d The imide skeleton polyester resin (A) according to (1), which is obtained from (1), and the compound (d) having two primary amino groups in the molecule are represented by the following formula (1). Imide skeleton polyester resin (A) according to (1) or (2),

[0005]

Embedded image

(Wherein R ₁ , R ₂ , R ₃ and R ₄ are
A hydrogen atom, a halogen atom, an alkyl group of C ₁ ~C _4, C ₁
X represents an alkoxy group of C ₂ to C ₄ , and X represents CH ₂ , C (C
F ₃ ) ₂ , C (CH ₃ ) ₂ , ketone, oxygen atom, sulfur atom,
Representing the SO _2. (4) A composition comprising, as essential components, the imide skeleton polyester resin (A), the crosslinking agent (B), and the reaction catalyst component (C) according to any one of (1) to (3). The present invention provides a thermosetting resin composition, a cured product of the resin composition described in (5) and (4), and a substrate having a layer of the cured product described in (6) and (5).

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The imide skeleton polyester resin (A) of the present invention comprises an imide compound (a) having two carboxy groups in the molecule and an epoxy compound (b) having two epoxy groups in the molecule. Characterized in that it is an imide skeleton polyester resin (A) which is a reaction product of imide compound (a) having two carboxyl groups in the molecule and having two carboxyl groups in the molecule. It can be obtained by addition polymerization of the epoxy group of the epoxy compound (b).

The imide compound (a) having two carboxy groups in the molecule for obtaining the imide skeleton polyester resin (A) of the present invention comprises trimellitic anhydride and two primary amino groups in the molecule. An amide compound having two carboxy groups in the molecule can be obtained by dehydrating an amide acid compound obtained by reacting the compound (d) having the formula (d).

The compound (d) having two primary amino groups in the molecule is, for example, a compound represented by the formula

[0010]

Embedded image

(Wherein R ₁ , R ₂ , R ₃ and R ₄ are
A hydrogen atom, a halogen atom, an alkyl group of C ₁ ~C _4, C ₁
X represents an alkoxy group of C ₂ to C ₄ , and X represents CH ₂ , C (C
F ₃ ) ₂ , C (CH ₃ ) ₂ , ketone, oxygen atom, sulfur atom or SO ₂ . )).
Of these, preferred are 4,4'-diaminodiphenylmethane and 4,4'-diamino-3,3 '
-Dimethyldiphenylmethane, 4,4'-diamino-
3,3′-diethyldiphenylmethane, 4,4′-diamino-3,3′-dibutyldiphenylmethane, 3,3 ′
-Diamino-diphenylmethane, 3,3'-diamino-4,4'-dibutyldiphenylmethane, 4,4'-diamino-3,3'-dimethoxydiphenylmethane, 4,4
4'-diamino-3,3'-diethoxydiphenylmethane, 4,4'-diamino3,3'-dipropoxydiphenylsulfone, 4,4'-diamino-3,3 ', 5
5'-tetramethyldiphenylmethane, 4,4'-diamino-3,3 ', 5,5'-tetraethyldiphenylmethane, 4,4'-diamino-3,3', 5,5'-tetrafluorodiphenylmethane, 4, 4'-diamino-
3,3 ′, 5,5′-tetrachlorodiphenylmethane,
4,4'-diaminobenzophenone, 4,4'-diaminodiphenylsulfone, 2,2-bis (4-aminophenyl) propane, and the like. As the epoxy compound for obtaining the imide skeleton polyester resin (A) of the present invention, any epoxy compound having two epoxy groups in the molecule can be used. Examples of the epoxy resin having two epoxy groups in a molecule include epoxy compounds such as hydroquinone diglycidyl ether and resorcin diglycidyl ether, Epicoat 828, Epicoat 1001 (manufactured by Yuka Shell Epoxy), and UVR-641.
0 (manufactured by Union Carbide), D.I. E. FIG. R-331
Bisphenol A type epoxy resin such as (Dow Chemical Co., Ltd.), YD-8125 (Toto Kasei Co., Ltd.), UVR-6
490 (manufactured by Union Carbide), YDF-8170
Bisphenol F-type epoxy resin such as (manufactured by Toto Kasei), bixylenol-type epoxy resin such as YX-4000 (manufactured by Yuka Shell Epoxy), and biphenol such as YL-6121 (manufactured by Yuka Shell Epoxy) Epoxy resin, diglycidyl etherified product of 9,9-bis (4-hydroxyphenyl) fluorene, 9,9-bis (4-
Diglycidyl etherified product of hydroxy-3-methylphenyl) fluorene, 9,9-bis (4-hydroxy-
Fluorene skeleton epoxy compounds such as diglycidyl etherified product of 3-methoxyphenyl) fluorene and diglycidyl etherified product of 9,9-bis (4-hydroxy-3-chlorophenyl) fluorene.

The reaction between the imide compound (a) and the epoxy compound (b) is carried out by a solvent having no hydroxyl group, for example, ketones such as acetone, ethyl methyl ketone and cyclohexanone, benzene, toluene, xylene,
Aromatic hydrocarbons such as tetramethylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, dipropylene glycol dimethyl ether, glycol ethers such as dipropylene glycol diethyl ether, ethyl acetate, butyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate; Esters such as butyl cellosolve acetate, carbitol acetate, propylene glycol monomethyl ether acetate, dialkyl glutarate, dialkyl succinate, dialkyl adipate, petroleum ether,
The reaction is performed in a single or mixed organic solvent such as petroleum-based solvents such as petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha. At the time of the reaction, it is preferable to use a catalyst to promote the reaction, and the amount of the catalyst is 0.1 to 10% by weight based on the reaction raw material mixture. At that time, the reaction temperature is 60 to 150 ° C., and the reaction time is preferably 5 to 60 hours. Examples of the catalyst used in this reaction include triethylamine, benzyldimethylamine, triethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium iodide, triphenylphosphine,
Triphenylstibine, methyltriphenylstibine,
Chromium octoate, zirconium octoate and the like can be mentioned.

The thermosetting resin composition of the present invention is a composition comprising the above-mentioned imide skeleton polyester resin (A), crosslinking agent (B) and reaction catalyst component (C) as essential components. When the solid content of the composition is 100 parts by weight, the amount of the imide skeleton polyester resin (A) is preferably 30 to 90 parts by weight, and particularly preferably 40 to 80 parts by weight.

The crosslinking agent (B) used in the thermosetting resin composition of the present invention includes, for example, phenol novolak type epoxy resin, cresol novolak type epoxy resin, trishydroxyphenylmethane type epoxy resin,
Epoxy resins such as dicyclopentadiene phenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenol type epoxy resin, bisphenol A novolak type epoxy resin, epoxy resin containing naphthalene skeleton and heterocyclic epoxy resin. . Examples of the phenol novolak type epoxy resin include Epiclon N-770 (manufactured by Dainippon Ink and Chemicals, Inc.); E. FIG. N438 (manufactured by Dow Chemical Company), Epicoat 154 (Yukaka Epoxy Co., Ltd.)
And RE-306 (manufactured by Nippon Kayaku Co., Ltd.). Examples of the cresol novolak type epoxy resin include Epicron N-695 (manufactured by Dainippon Ink and Chemicals, Inc.), EOCN-102S, and EOCN-103.
S, EOCN-104S (Nippon Kayaku Co., Ltd.), UVR
-6650 (manufactured by Union Carbide), ESCN-1
95 (manufactured by Sumitomo Chemical Co., Ltd.). Examples of the trishydroxyphenylmethane type epoxy resin include TACTICX-742 (manufactured by Dow Chemical Company),
Epicoat E1032H60 (manufactured by Yuka Shell Epoxy Co., Ltd.) and the like. Examples of the dicyclopentadiene phenol type epoxy resin include, for example, Epicron EX
A-7200 (manufactured by Dainippon Ink and Chemicals, Inc.), TA
CTIX-556 (manufactured by Dow Chemical Company) and the like.

As the bisphenol type epoxy resin,
For example, Epicoat 828, Epicoat 1001 (manufactured by Yuka Shell Epoxy), UVR-6410 (manufactured by Union Carbide), D.C. E. FIG. Bisphenol A type epoxy resin such as R-331 (manufactured by Dow Chemical Company), YD-8125 (manufactured by Toto Kasei), bisphenol such as UVR-6490 (manufactured by Union Carbide), YDF-8170 (manufactured by Toto Kasei) F-type epoxy resins and the like can be mentioned.

Examples of the biphenol type epoxy resin include a bixylenol type epoxy resin of YX-4000 (manufactured by Yuka Shell Epoxy Co., Ltd.) and YL-6121 (manufactured by Yuka Shell Epoxy Co., Ltd.). Examples of bisphenol A novolak type epoxy resin include Epiclon N-880 (manufactured by Dainippon Ink and Chemicals, Inc.),
Epicoat E157S75 (Yukaka Epoxy Co., Ltd.)
Manufactured).

Examples of the epoxy resin containing a naphthalene skeleton include NC-7000 (manufactured by Nippon Kayaku Co., Ltd.) and EXA-
4750 (manufactured by Dainippon Ink and Chemicals, Inc.). As the alicyclic epoxy resin, for example, EHPE-
3150 (manufactured by Daicel Chemical Industries, Ltd.). As the heterocyclic epoxy resin, for example, TEPI
C, TEPIC-L, TEPIC-H, TEPIC-S
(All manufactured by Nissan Chemical Industries, Ltd.).

The amount of the crosslinking agent (B) is determined based on the solid content of the composition.
When it is 00 parts by weight, 10 to 70 parts by weight is preferable,
Particularly preferably, it is 20 to 60 parts by weight.

The reaction catalyst component (C) used in the thermosetting resin composition of the present invention includes, for example, melamine, acetoguanamine, benzoguanamine, dicyandiamide,
Imidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,
2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl- 2-methylimidazole, 1-
Cyanoethyl-2-ethyl-4-methylimidazole,
1-cyanoethyl-2-undecylimidazole, 1-
Cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazolium trimellitate, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate , 2,4-diamino-
6- (2′-methylimidazolyl- (1 ′))-ethyl-s-triazine, 2,4-diamino-6- (2′-undecylimidazolyl) -ethyl-s-triazine,
2,4-diamino-6- (2′-ethyl-4-methylimidazolyl- (1 ′))-ethyl-s-triazine,
-Phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole and the like. These reaction catalyst components (C) can be used alone or in combination of two or more. The amount used is preferably 0.1 to 20 parts by weight, particularly preferably 0.5 to 15 parts by weight, based on 100 parts by weight of the solid content of the composition.

The thermosetting resin composition of the present invention further comprises:
Barium sulfate, barium titanate, silicon oxide powder, finely divided silicon oxide, amorphous silica, talc, clay, magnesium carbonate, calcium carbonate, oxidized, for the purpose of improving properties such as coating suitability, heat resistance, adhesion, and hardness. Fillers such as aluminum, aluminum hydroxide, mica powder, Teflon (registered trademark) powder, and polyalkylene beads can be used. The amount is preferably 60 parts by weight or less, particularly preferably 5 to 40 parts by weight, based on 100 parts by weight of the solid content of the composition of the present invention.

Further, if necessary, coloring agents such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium oxide, carbon black, and naphthalene black; Appropriate amounts of additives such as thickeners, silicone-based, fluorine-based, polymer-based antifoaming agents and / or leveling agents can be added.

The resin composition of the present invention comprises the components (A), (B) and (C), and if necessary, the above-mentioned fillers or additives, preferably in the above-mentioned proportions, and is then mixed with a roll mill or the like. By uniformly mixing, dissolving, dispersing, or the like. In addition, a solvent may be used together if desired, mainly for adjusting the viscosity. This solvent may be a solvent used in the production of the components. Examples of the solvent include ketones such as acetone, ethyl methyl ketone and cyclohexanone, aromatic hydrocarbons such as benzene, toluene, xylene and tetramethylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, dipropylene glycol dimethyl ether and dipropylene. Glycol ethers such as glycol diethyl ether, ethyl acetate, butyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, propylene glycol monomethyl ether acetate, dialkyl glutarate,
Esters such as dialkyl succinate and dialkyl adipate, petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha,
Examples include petroleum solvents such as solvent naphtha and organic solvents such as γ-butyrolactone.

The thermosetting resin composition of the present invention is useful as a resist ink for printed circuit boards, and can also be used as a paint, coating agent, adhesive or the like.

The cured product of the present invention is obtained by curing the above-mentioned thermosetting resin composition of the present invention by thermal energy. Thermal curing can be performed by a conventional method. The cured product of the thermosetting resin composition of the present invention has heat resistance and is used as a coverlay for electric / electronic parts such as a printed circuit board.

[0025]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to Examples, but it should not be construed that the invention is limited thereto.

Example 1 (Synthesis of imide skeleton polyester resin (A)) 208.5 g of N-methylpyrrolidone and 76.9 g (0.40 mol) of trimellitic anhydride were charged into a 1 L flask and stirring was started. Next, as a compound (d) having two primary amino groups in the molecule, Kayabond C-300S (amino compound manufactured by Nippon Kayaku: 4,4′-diamino-3,3 ′,
5,5'-tetraethyldiphenylmethane) 62.1 g
(0.20 mol) was added slowly. After completion of the addition, stirring was continued at room temperature for 12 hours. Next, add this reaction solution
42.9 g (0.42 mol) of acetic anhydride;
After adding 2 g (0.42 mol) with cooling, the reaction was continued at room temperature for 24 hours. After the completion of the reaction,
182.5 g of 0% hydrochloric acid (0.5 mol as HCl) was poured into 3000 ml of water, and the precipitate was collected by filtration. After drying, 1H-NMR analysis with deuterated chloroform revealed 1.15 ppm (12H) and 2.45 ppm (8
H), 4.05 ppm (2H), 7.10 ppm (4
H), 8.10 ppm (2H), 8.60 ppm (2
H), 8.70 ppm (2H). The carboxy equivalent calculated from the acid value was 347.1 g / equivalent.

Next, in a 500 ml flask, 190.9 g (0.55 equivalent) of an imide compound having two carboxyl groups in the molecule obtained by the above reaction and an epoxy compound having two epoxy groups in the molecule ( b) as resorcing ricidyl ether (epoxy equivalent: 111.1 g)
/ Equivalent) 50.0 g (0.45 equivalent), γ-
160.6 g of butyrolactone and 1.21 g of triphenylphosphine as a reaction catalyst were added and reacted at a temperature of 98 ° C. for 24 hours to obtain an imide skeleton polyester resin solution of the present invention (solid content: 60%). Transfer this resin solution to A
-1.

Example 2 An imide skeleton polyester resin was prepared in the same manner as in Example 1 except that 4,4'-diaminodiphenyl ether was used as the compound (d) having two primary amino groups in the molecule. A solution (concentration 60%) was obtained. A-
Let it be 2.

Example 3 An imide skeleton polyester resin solution was prepared in the same manner as in Example 1 except that diglycidyl ether of bisphenol-A was used as the epoxy compound (b) having two epoxy groups in the molecule. (Concentration 60%) was obtained (concentration 6).
0%). This resin solution is designated as A-3.

Examples 4 to 6 (Thermosetting Resin Composition) Each component was blended according to the blending composition shown in Table 1 (the numerical values are parts by weight) and kneaded with a three-roll mill to obtain the photosensitive resin composition of the present invention. Was prepared. This is applied to a copper-clad glass epoxy substrate (about 0.8 mm thick) by screen printing.
The pattern was formed using a 0 mesh screen.
The coating film was dried with a hot air drier at 80 ° C. for 30 minutes to be semi-cured. Thereafter, heat curing was performed for 60 minutes in a hot air dryer at 150 ° C., and the test piece having the obtained cured film was subjected to substrate warpage, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, and heat resistance as described below. Gold plating, PCT resistance, and thermal shock resistance tests were performed. Table 2 shows the results. In addition, the test method and the evaluation method are as follows.

(Surface gloss) 500 mJ
/ Cm ² UV irradiation. Next, it is developed with a 1% aqueous solution of sodium carbonate for 60 seconds at a spray pressure of 2.0 kg / cm ² , and the cured film after drying is observed. The following criteria were used: ○ ・ ・ ・ ・ ・ ・ No fogging observed ×× ・ ・ ・ Slight fogging observed

(Substrate Warpage) The following criteria were used. ○ ・ ・ ・ ・ ・ ・ Surface is not seen on the substrate ×× ・ ・ ・ Surve is seen on the substrate

(Adhesion) According to JIS K5400,
100 test pieces were made with 1 mm-thick squares, and a peeling test was performed using Cellotape (registered trademark). The state of peeling was evaluated by the following criteria. 〇 ・ ・ ・ ・ ・ ・ No peeling × ・ ・ ・ ・ ・ ・ Peel off

(Pencil hardness) The evaluation was performed according to JIS K5400.

(Solvent resistance) A test piece is immersed in isopropyl alcohol at room temperature for 30 minutes. After confirming that there was no abnormality in the appearance, a peeling test was carried out using cellophane tape and evaluated according to the following criteria. ○ ・ ・ ・ ・ ・ ・ No abnormality in the appearance of the coating film and no blistering or peeling × ・ ・ ・ ・ Pattern with blistering or peeling

(Acid Resistance) A test piece is immersed in a 10% hydrochloric acid aqueous solution at room temperature for 30 minutes. After confirming that there is no abnormality in the appearance,
A peeling test was performed using cellotape and evaluated according to the following criteria. ○ ・ ・ ・ ・ ・ ・ No abnormality in the appearance of the coating film and no blistering or peeling × ・ ・ ・ ・ Body with blistering or peeling

(Heat Resistance) Rosin-based plaque was applied to a test piece and immersed in a solder bath at 260 ° C. for 5 seconds. This was defined as one cycle, and three cycles were repeated. After allowing to cool to room temperature, a peeling test was performed using cellophane tape, and evaluated according to the following criteria. 〇: No abnormalities in the appearance of the coating film and no blistering or peeling ×: ・ ・ ・ Films with blistering or peeling

(Gold Plating Resistance) A test substrate was treated with a 30 ° C. acidic degreasing solution (Metex L-5, manufactured by MacDermit Japan Co., Ltd.).
B in a 20 vol% aqueous solution), washed with water, then immersed in a 14.4 wt% aqueous ammonium persulfate solution at room temperature for 3 minutes, washed with water, and further placed in a 10 vol% aqueous sulfuric acid solution at room temperature for 1 minute. After immersion for a minute, it was washed with water.
Next, this substrate was immersed in a 30 ° C. catalyst solution (manufactured by Meltex, a 10 vol% aqueous solution of a metal plate activator 350) for 7 minutes, washed with water, and washed at 85 ° C. with a nickel plating solution (manufactured by Meltex, Melplate Ni-). 865M 2
After immersing in a 0 vol% aqueous solution (pH 4.6) for 20 minutes and performing nickel plating, the substrate was immersed in a 10 vol% aqueous sulfuric acid solution at room temperature for 1 minute and washed with water. Next, the test substrate is
Immersion for 10 minutes in a gold plating solution (available from Meltex, 15 vol% of Aurolectroles UP and 3 vol% of gold potassium cyanide, pH 6), electroless gold plating, washing with water, and further heating with 60 ° C. warm water. Dipped for minutes, washed with water and dried. A cellophane adhesive tape was adhered to the obtained electroless gold-plated evaluation substrate, and the state when peeled off was observed. ：: No abnormality at all. X: Some peeling was observed.

(PCT Resistance) The test substrate was left in water at 121 ° C. and 2 atm for 96 hours, and after confirming that there was no abnormality in appearance, a peeling test was carried out using cellophane tape and evaluated according to the following criteria. ○ ・ ・ ・ ・ ・ ・ No abnormality in the appearance of the coating film and no blistering or peeling × ・ ・ ・ ・ Body with blistering or peeling

(Heat shock resistance) A test piece was subjected to -55 ° C / 30
Min, 125 ° C / 30 min as one cycle, heat history was added, and after 1000 cycles, the specimen was observed under a microscope,
Evaluation was made according to the following criteria. ○ ・ ・ ・ ・ ・ ・ No cracks in the coating ×× ・ ・ ・ Cracks in the coating

Table 1 Example Note 4 5 6 Polycarboxylic acid resin (A) Resin solution (A-1) 50.3 Resin solution (A-2) 50.3 Resin solution (A-3) 50.3 Crosslinking agent (B) EOCN-103S * 1 8.2 8.2 8.2 YX-4000 * 2 9.8 12.3 NC-3000P * 3 9.8 Reaction catalyst component (C) Melamine 1.1 1.1 Dicyandiamide 1.1 Filler component Spherical silica 13.7 13.7 13.7 Leveling agent BYK-354 * 4 0.8 0.8 0.8 Defoamer BYK-057 * 5 0.8 0.8 0.8 Solvent Carbitol acetate 2.7 2.7 2.7 Solvent naphtha 4.7 4.7 4.7

Note * 1 o-cresol novolak type epoxy resin manufactured by Nippon Kayaku * 2 oily shell epoxy biphenol type epoxy resin * 3 biphenyl novolak type epoxy resin manufactured by Nippon Kayaku * 4 Big Chemie: leveling agent * 5 Big Chemie : Antifoaming agent

Table 2 Examples 4 5 6 Evaluation items Surface gloss ○ ○ ○ Substrate warpage ○ ○ ○ Adhesion ○ ○ ○ Pencil hardness 5H 5H 6H Solvent resistance ○ ○ ○ Acid resistance ○ ○ ○ Heat resistance ○ ○ ○ Gold plating ○ ○ ○ PCT resistance ○ ○ ○ Thermal shock resistance ○ ○ ○

As is clear from these evaluations, the thermosetting resin composition of the present invention and the cured product thereof are excellent in surface curability, and the cured product is excellent in solvent resistance, acid resistance, heat resistance and the like. ing.

[0045]

The imide skeleton polyester resin of the present invention and the thermosetting resin composition using the same have good surface curability, and the obtained cured product has bending resistance, folding resistance, adhesion,
It also satisfies solvent resistance, acid resistance, heat resistance, etc., and is particularly suitable for a composition for printed wiring boards.

Continued on front page F-term (reference) 4J036 AB13 AC02 AD07 AD08 AE07 AF06 AF08 AF15 AF19 CB22 DC31 DC38 DC40 DC45 FB11 JA08 5E314 AA27 AA36 CC07 FF05 FF06 GG11 GG14 5E346 AA12 CC04 CC09 CC10 CC37 CC38 DD03 DD23

Claims (6)

[Claims] An imide skeleton characterized in that it is a reaction product of an imide compound (a) having two carboxy groups in a molecule and an epoxy compound (b) having two epoxy groups in a molecule. Polyester resin (A). 2. An imide compound (a) having two carboxy groups in the molecule is obtained by combining trimellitic anhydride with 2 imides in the molecule.
The imide skeleton polyester resin (A) according to claim 1, which is obtained from the compound (d) having one primary amino group. 3. The imide skeleton polyester resin (A) according to claim 1, wherein the compound (d) having two primary amino groups in the molecule is a compound represented by the following formula (1). ). Embedded image (Wherein, R ₁ , R ₂ , R ₃ , and R ₄ each represent a hydrogen atom, a halogen atom, a C ₁ -C ₄ alkyl group, a C ₁ -C ₄ alkoxy group, and X represents CH ₂ , C (CF ₃ ) ₂ , C (C
H ₃ ) ₂ , a ketone, an oxygen atom, a sulfur atom, and SO ₂ . ) 4. The imide skeleton polyester resin (A) according to any one of claims 1 to 3, a crosslinking agent (B),
A thermosetting resin composition, which is a composition comprising the reaction catalyst component (C) as an essential component. 5. A cured product of the resin composition according to claim 4. 6. A substrate having a layer of the cured product according to claim 5.