JP2001352166A5 - - Google Patents
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- JP2001352166A5 JP2001352166A5 JP2000171955A JP2000171955A JP2001352166A5 JP 2001352166 A5 JP2001352166 A5 JP 2001352166A5 JP 2000171955 A JP2000171955 A JP 2000171955A JP 2000171955 A JP2000171955 A JP 2000171955A JP 2001352166 A5 JP2001352166 A5 JP 2001352166A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000171955A JP4390368B2 (ja) | 2000-06-08 | 2000-06-08 | 配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000171955A JP4390368B2 (ja) | 2000-06-08 | 2000-06-08 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001352166A JP2001352166A (ja) | 2001-12-21 |
| JP2001352166A5 true JP2001352166A5 (ja) | 2007-03-15 |
| JP4390368B2 JP4390368B2 (ja) | 2009-12-24 |
Family
ID=18674436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000171955A Expired - Fee Related JP4390368B2 (ja) | 2000-06-08 | 2000-06-08 | 配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4390368B2 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4635331B2 (ja) * | 2000-12-08 | 2011-02-23 | イビデン株式会社 | プリント配線板 |
| JP3495727B2 (ja) | 2001-11-07 | 2004-02-09 | 新光電気工業株式会社 | 半導体パッケージおよびその製造方法 |
| US6770822B2 (en) * | 2002-02-22 | 2004-08-03 | Bridgewave Communications, Inc. | High frequency device packages and methods |
| JP4551135B2 (ja) * | 2004-06-14 | 2010-09-22 | 新光電気工業株式会社 | 配線基板の製造方法 |
| DE102005002707B4 (de) * | 2005-01-19 | 2007-07-26 | Infineon Technologies Ag | Verfahren zur Herstellung elektrischer Verbindungen in einem Halbleiterbauteil mittels koaxialer Mikroverbindungselemente |
| JP2007027451A (ja) | 2005-07-19 | 2007-02-01 | Shinko Electric Ind Co Ltd | 回路基板及びその製造方法 |
| JP5178277B2 (ja) * | 2008-03-27 | 2013-04-10 | 京セラ株式会社 | セラミック基板およびセラミック基板の製造方法 |
| US8273995B2 (en) * | 2008-06-27 | 2012-09-25 | Qualcomm Incorporated | Concentric vias in electronic substrate |
| KR101167427B1 (ko) * | 2010-09-29 | 2012-07-19 | 삼성전기주식회사 | 양극산화 방열기판 및 그 제조방법 |
| US9123738B1 (en) * | 2014-05-16 | 2015-09-01 | Xilinx, Inc. | Transmission line via structure |
| JP6922177B2 (ja) * | 2016-09-20 | 2021-08-18 | 日本電気株式会社 | 配線構造体の積層造形工法における製造方法 |
| KR20220146907A (ko) | 2021-04-26 | 2022-11-02 | 삼성전기주식회사 | 인쇄회로기판 |
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2000
- 2000-06-08 JP JP2000171955A patent/JP4390368B2/ja not_active Expired - Fee Related