JP2001352143A - Semiconductor module and printed wiring substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor module which relieves a malfunction semiconductor device and mounts a normal semiconductor device. SOLUTION: This semiconductor module comprises: a printed wiring substrate 1 having: an external connection terminal 11, a wiring 10 connected to the external connection terminal 11, a mounting region 12 for mounting a semiconductor substrate, a pad 5 which is disposed around the mounting region 12 and is connected to the wiring 10, and an auxiliary connection terminal 9 which is provided corresponding to the pad 5 around the pad 5, and is connected to the wiring 10; a semiconductor substrate 2 adhered to the mounting region 12 on the printed wiring substrate 1; a wire 6 one end of which is connected to the connection pad 4 of the semiconductor substrate 2, and the other end of which is connected to the pad 5 of the printed wiring substrate 1; and a sealing body 7 for coating the semiconductor substrate 2, the wire 6, the pad 4 and the mounting region 12. When a malfunction occurs in a semiconductor element, the wire 6 of the damaged semiconductor substrate is cut off, and a replacement semiconductor device is mounted by utilizing the auxiliary connection terminal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a structure of a semiconductor module connected to an information processing apparatus, and more particularly to a semiconductor module using a printed wiring board on which a plurality of semiconductor devices are mounted.

[0002]

2. Description of the Related Art In recent years, high-density and large-scale integration of semiconductor integrated circuits has progressed.
There is a case where a printed wiring board having an increased storage capacity by mounting M is mounted on an information processing apparatus as a module.
The module is provided with a connection terminal, which is connected to the connection terminal of the information processing device, and can be used as if it were a single DRAM. FIG. 6 shows an example of a module on which a conventional resin-encapsulated semiconductor device is mounted. The printed wiring board 50 has external connection terminals (not shown), and a wiring pattern 51 connected to the connection terminals is formed on the surface thereof. Four semiconductor devices 52 are mounted on the printed wiring board 50. Each semiconductor device 52 has an adhesive 53
A semiconductor substrate 54 is adhered to the printed wiring board 50 via the substrate. Each semiconductor substrate 54 has a plurality of connection pads 55 on its surface, and each connection pad 55 is connected to a pad 57 on the printed wiring board 50 via a wire 56. The pad 57 is connected to the wiring pattern 51 and is connected to the outside of the semiconductor module. The adhesive 53, the semiconductor substrate 54, the connection pads 55, the wires 56, and the pads 57 are covered with a chip coat resin 58.

As another example, SOJ (Small Out Li
ne J-Lead) There is also a module in which a semiconductor device such as a package is mounted. A conventional module in which a plurality of semiconductor devices are mounted on a printed wiring board is described in FIG. 4 of JP-A-8-255803. Such a semiconductor chip is mounted on a printed circuit board, and after performing wire bonding, the chip and the wire are covered with a chip coat resin.

[0004]

The following problems occur in the conventional semiconductor device as described above.

In a semiconductor module in which a plurality of semiconductor devices are mounted, if even one of the mounted semiconductor devices is found to be damaged, it is necessary to replace the semiconductor module itself. In other words, once a semiconductor substrate is fixed on a printed wiring board using an adhesive and a resin, once the semiconductor substrate is mounted on the printed wiring board, it can be removed without damaging the printed wiring board or other surrounding semiconductor devices. Is practically difficult because of high adhesion between the adhesive or resin and the printed wiring board. Therefore, even if a defect is found in a specific semiconductor device, it has been difficult to remove the defective semiconductor device from the printed wiring board and mount a replacement on the printed wiring board again. Further, even in the case of an SOJ type semiconductor device, it is inevitable that similar damages of different degrees occur in a process of removing a defective product once mounted on a printed wiring board. Also, Japanese Patent Application Laid-Open
It is preferable to use an auxiliary substrate or a sealing material as described in FIGS. 1 to 3 of JP-A-255803, or to use a process such as vacuuming because the material of the substrate is specialized or the process becomes complicated. Absent. An object of the present invention is to solve the above-mentioned problems of the prior art.

In particular, it is an object of the present invention to provide a semiconductor module which can replace a defective semiconductor device with an alternative semiconductor device when a defect is found in a semiconductor device mounted on a printed wiring board.

Another object of the present invention is to provide a printed wiring board which can be remedied when a semiconductor device to be mounted has a defect.

Another object of the present invention is to provide a semiconductor module in which semiconductor devices are mounted in multiple layers.

Still another object of the present invention is to provide a printed wiring board on which a semiconductor device can be mounted in multiple layers.

[0010]

In order to achieve the above object, the present invention provides an external connection terminal, a wiring connected to the external connection terminal, and a mounting area for mounting a semiconductor substrate. A printed circuit board having a pad arranged around the mounting area and connected to the wiring, and a preliminary connection terminal provided around the pad corresponding to the pad and connected to the wiring, and a circuit. An element is formed, a connection pad is provided on the surface, a semiconductor substrate adhered to a mounting area on the printed wiring board, and one end is connected to the connection pad of the semiconductor substrate, and the other end is a pad of the printed wiring board. And a sealing body covering the semiconductor substrate, the wire, the pad, and the mounting area, so that the half mounted on the printed wiring board is provided. Defective semiconductor device when a defective body apparatus is found capable of providing a fungible semiconductor modules alternative semiconductor device.

In another aspect of the invention, an external connection terminal;
A wiring connected to the external connection terminal, a mounting area for mounting the semiconductor substrate, a pad arranged around the mounting area, connected to the wiring, and provided around the pad corresponding to the pad; A printed wiring board having a preliminary connection terminal connected to the wiring, and a circuit element are formed;
A connection pad is provided on the surface, and a semiconductor substrate adhered to a mounting area on the printed wiring board, and one end connected to the connection pad of the semiconductor substrate and the other end connected to a pad of the printed wiring board. A wire having a connection portion,
A sealing body that covers the semiconductor substrate, the wire, the pad, and the mounting area, and has an opening on the non-connection portion, and a sealing pin provided on the sealing body, and a connection pin is connected to the preliminary connection terminal. With the provision of the semiconductor device provided above, when a defect of the semiconductor device mounted on the printed wiring board is found, a semiconductor module in which the defective semiconductor device is replaced with an alternative semiconductor device can be provided.

According to still another feature of the present invention, an external connection terminal, a wiring connected to the external connection terminal, a mounting area for mounting a semiconductor substrate, and a wiring board disposed around the mounting area and connected to the wiring are provided. By providing a pad and a preliminary connection terminal provided around the pad corresponding to the pad and connected to the wiring, a printed wiring board that can be rescued when a semiconductor device to be mounted has a defect is provided. Can be provided.

According to still another feature of the present invention, an external connection terminal, a wiring connected to the external connection terminal, a mounting area for mounting a semiconductor substrate, and a wiring board disposed around the mounting area and connected to the wiring are provided. A printed circuit board including a pad, a pad provided around the pad corresponding to the pad, connected to the wiring, and having a preliminary connection terminal having a first height; and a circuit element formed thereon and connected to the surface. A first pad provided in a mounting area on the printed wiring board, connected to the pad on the printed wiring board, and having a second height smaller than the first height of the preliminary connection terminal; By providing a semiconductor device and a second semiconductor device connected to the preliminary connection terminal and arranged on the first semiconductor device, a semiconductor module mounting the semiconductor device over multiple layers is provided. Can be provided.

According to still another feature of the present invention, an external connection terminal, a wiring connected to the external connection terminal, a mounting area for mounting a semiconductor device, and a wiring board disposed around the mounting area and connected to the wiring are provided. The semiconductor device can be mounted in multiple layers by having a pad and a preliminary connection terminal provided around the pad corresponding to the pad, connected to the wiring, and having a height greater than the height of the semiconductor device. It is possible to provide a simple printed wiring board.

[0015]

Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and the relationship between the thickness and the plane dimension, the ratio of the thickness of each layer, and the like are different from actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. In addition, the drawings include portions having different dimensional relationships and ratios. (First Embodiment) A semiconductor module according to a first embodiment of the present invention will be described with reference to FIGS.

FIG. 1A is a top view of the semiconductor module of the present embodiment. FIG. 1B is a sectional view taken along line AA ′ in FIG. 1A. As shown in FIG. 1B, here, four semiconductor substrates 2 are mounted on a printed wiring board 1 with an adhesive 3 interposed therebetween. FIG.
In A, the component requirement numbers are assigned only to the semiconductor devices formed of the rightmost semiconductor substrate. A plurality of connection pads 4 are provided on the surface of the semiconductor substrate 2. Each semiconductor device on the printed wiring board 1 is provided with a plurality of pads 5 corresponding to the connection pads 4 on the semiconductor substrate, and is connected to the connection pads 4 via wires 6. The semiconductor substrate 2, the adhesive 3, the connection pads 4, the pads 5, and the wires 6 are sealed with a sealing material 7 of a relatively flexible material such as silicone or epoxy to form a semiconductor device 8. are doing.

Here, in each semiconductor device 8, a plurality of preliminary connection terminals 9 are provided around each pad 5 corresponding to each pad 5. The spare connection terminals 9 are connected to the corresponding pads 5 of the semiconductor device. FIG.
As shown in FIG. 1A, the preliminary connection terminal 9 and the pad 5 are connected to an external connection terminal 11 provided at an end of the printed wiring board 1 via a signal wiring 10 on the printed wiring board 1. The signal wiring 10 is connected to each preliminary connection terminal 9 and each pad 5, but FIG. 1A shows only the signal wiring connected to the preliminary connection terminal 9 and the pad 5 located at the highest position in each semiconductor device. Is shown. In addition, since the preliminary connection terminal 9 is provided on the printed wiring board 1, it is necessary to provide a corresponding area between the semiconductor devices 8. For example, when the size of the semiconductor device 8 is 20 mm in length, 5 mm in width, and 5 mm in height, the preliminary connection terminal 9 is about 1 mm in height and provided along the pad 5 around each semiconductor device 8. Each semiconductor device 8 is separated by about 5 mm, and the preliminary connection terminal 9 is provided in that area.

In this example, pads 5 and preliminary connection terminals 9 are provided along the long side direction of the semiconductor device. The preliminary connection terminal 9 has a protrusion shape having the same composition as that of the printed wiring board 1, and has a surface on which a single wiring connected to the signal wiring 10 on the surface of the printed wiring board 1 is formed. In some cases, a metal protrusion may be provided on the printed wiring board 1. Alternatively, a pre-connection terminal 9 may be formed by attaching a metal to the insulating printed wiring board 1 by plating. FIGS. 1A and 1B show an example in which four semiconductor devices 8 are mounted on the printed wiring board 1, but the present invention is not limited to this, and is required as a semiconductor module. A number of semiconductor devices 8 are mounted on the printed wiring board 1.

FIG. 2 shows a top view of the printed wiring board 1 used in this semiconductor module. A plurality of pads 5 are provided on each semiconductor device mounting portion 12, and a plurality of preliminary connection terminals 9 are provided corresponding to the pads 5 around the pads 5. The signal wiring 10 is connected to each of the preliminary connection terminals 9 and each of the pads 5, but in FIG.
Only the signal wiring connected to the preliminary connection terminal 9 and the pad 5 located at the highest position in FIG.

Here, an operation test of the semiconductor module composed of the printed wiring board 1 provided with the semiconductor device 8 and the preliminary connection terminal 9 is performed. When a defect is confirmed, the semiconductor device 8 is specified which is defective. For the specified defective semiconductor device, the sealing material 7 and the wire 6 are cut by, for example, a laser, and a tester or the like is used to confirm that the defective semiconductor device 8 is surely separated from the signal wiring 10 on the printed wiring board 1. Confirm using FIG. 3A shows a case where the defective semiconductor device 13 is arranged second from the right.

In the defective semiconductor device 13, the sealing material 7 and the wire 6 are exposed at the opening 14, the wire 6 is cut at the opening 14, and the connection between the connection pad 4 and the pad 5 is connected. Not. Here, the defective semiconductor device 13
In, all the wires 6 have been cut. Note that the defective semiconductor device is not located at a specific position, and a spare connection terminal is provided so that the defective semiconductor device can be relieved by the alternative semiconductor device at any position as long as it is mounted on the printed wiring board 1.

Thereafter, the problem is solved by mounting the alternative semiconductor device 15 as shown in FIG. 3B by using the spare connection terminals 9 provided on the printed wiring board 1 in advance. In the alternative semiconductor device, each external lead 16 is connected to a spare connection terminal. Here, the external lead 16 of the alternative semiconductor device 15 is
Is required to be set to be longer than the height of the defective semiconductor device 13 from the surface of the mounting substrate. By setting the lead length of the alternative semiconductor device 15 in this manner, the bottom surface of the alternative semiconductor device 15 is prevented from contacting the upper surface of the defective semiconductor device 13. Further, since the position of the external lead 16 of the alternative semiconductor device 15 needs to be on the position of the spare connection terminal 9, the alternative semiconductor device 15 is set to have a larger planar size than the defective semiconductor device 13. ing.

The alternative semiconductor device 15 needs to be formed in the same function and lead arrangement order as the defective semiconductor device 13. Here, an example is shown in which the alternative semiconductor device uses an SOJ package. A semiconductor substrate 17 is mounted on a mount portion 18 and a pad portion on the surface of the semiconductor substrate is provided.
(Not shown) is connected to an internal lead 20 via a wire 19, and the internal lead 20 is connected to an external lead 16.

According to this embodiment, the step of removing the defective semiconductor device from the printed wiring board is unnecessary, and the electrical connection between the defective semiconductor device and the printed wiring board is simply cut off, and the alternative semiconductor device is mounted instead. By that
It is possible to provide a semiconductor module in which all semiconductor devices in the semiconductor module are normal in terms of circuit operation, and a printed wiring board therefor. (Second Embodiment) FIG. 4 is a cross-sectional view of a semiconductor module mounted with an alternative semiconductor device in a case where it can be adopted as an alternative semiconductor device even if it is not a specific type of package. For the purpose of removing the restriction on the length of the external lead as a substitute semiconductor device, the height of the preliminary connection terminal 21 previously provided on the printed wiring board is changed to the height of the semiconductor device directly mounted on the printed wiring board 22. Set equal or higher. Here, the semiconductor device 23 as a substitute has a thin package shape such as a TSOP (Thin Small Outline package). Spare connection terminal 2
The number of 1 is the same as the number of pads 5 provided on a commonly used printed wiring board.

By using this spare connection terminal 21, a normal semiconductor device can be used without setting the external lead length of the alternative semiconductor device 23 as a specific condition as in the first embodiment. However, the lateral width is larger than that of the semiconductor device directly mounted on the printed circuit board, and it is necessary to use a semiconductor device having a lateral width enough to connect to the preliminary connection terminal as an alternative semiconductor device. The preliminary connection terminal 21 has a protrusion having the same composition as that of the printed wiring board 22, and has a surface on which a single wire connected to wiring on the surface of the printed wiring board 22 is formed. In some cases, a metal protrusion may be provided on the printed wiring board 22.

By setting the height of the spare connection terminal 21 in this manner, the bottom surface of the substitute semiconductor device 23 is prevented from contacting the top surface of the defective semiconductor device 13. Also,
Since the position of the external lead 24 of the alternative semiconductor device 23 needs to be on the position of the spare connection terminal 21, the planar size of the alternative semiconductor device 23 is set to be larger than that of the defective semiconductor device 13. . The alternative semiconductor device 23 must have the same function and the same lead arrangement order as the defective semiconductor device 13. Here, an example is shown in which the alternative semiconductor device uses an SOJ package.

A semiconductor substrate 25 is mounted on a mount 26, and a pad (not shown) on the surface of the semiconductor substrate is connected to an internal lead 28 by a wire 27.
8 is connected to the external lead 24. FIG. 3 (A)
FIG. 3B shows an example in which four semiconductor devices 8 are mounted on the printed wiring board 1, but the present invention is not limited to this, and the number of semiconductor devices required for a semiconductor module is the same. 8 is mounted on the printed wiring board 1.

According to this embodiment, the step of removing the defective semiconductor device from the printed wiring board is unnecessary, and the electrical connection between the defective semiconductor device and the printed wiring board is simply cut off. By mounting the alternative semiconductor device instead, it is possible to provide a semiconductor module in which all semiconductor devices in the semiconductor module are normal in terms of circuit operation and a printed wiring board therefor. (Third Embodiment) In this embodiment, as shown in FIG. 5, by providing a preliminary connection terminal in advance, the mounting and mounting of a semiconductor device over a plurality of layers as a stack structure can be performed regardless of the occurrence of a defect. It is possible. In this embodiment, a semiconductor device is mounted on a printed circuit board 29 in a two-layer structure. The first layer semiconductor device 3 mounted on the printed circuit board 29 with the height of the preliminary connection terminal 30
1 is set higher than the height of the first semiconductor device 3.
2 prevents contact with the first-layer semiconductor device. The preliminary connection terminal 30 is connected to the first-layer semiconductor device 3.
A structure corresponding to the pad 33 on the printed circuit board 29 is partially covered with a space above 1. With this structure, the second-layer semiconductor device 32 is installed directly above the first-layer semiconductor device 31 with a space therebetween. Therefore, regardless of the shape of the semiconductor device such as the SOJ type or the TSOP type, the semiconductor device can be mounted on the first and second layers to form a high-density module. FIG. 5 shows the TSOP type as an example. The three semiconductor devices 31 are mounted on the printed wiring board 29 as the first layer. However, the number of semiconductor devices is not limited to three. Mounted on top.

In each of the semiconductor devices 31 and 32, a semiconductor substrate 34 is mounted on a mounting portion 35, respectively.
Pads (not shown) on the four surfaces are connected to internal leads 37 by wires 36, and the internal leads 37 are connected to external leads 38. The external lead 38 is connected to a wiring (not shown) provided on the preliminary connection terminal 30. The preliminary connection terminal 30 has a protrusion shape having the same composition as that of the printed wiring board 29, and has a surface on which a single wire connected to the wiring on the surface of the printed wiring board 29 is formed. In some cases, a metal protrusion may be provided on the printed wiring board 29.

Further, the second-layer semiconductor device is not mounted on all the first-layer semiconductor devices, for example, the second-layer semiconductor device is mounted on half of the first-layer semiconductor device. For example, the number of mounted second-layer semiconductor devices can be changed based on the functions of the semiconductor device required as one semiconductor module.

As in the first embodiment, only when a defect is found in the first-layer semiconductor device in the test process as in the first embodiment, it is provided as a substitute for the defective semiconductor device on the first-layer semiconductor device. A second-layer semiconductor device may be mounted.

The first layer is a semiconductor device having a shape which is directly adhered to the surface of a printed circuit board with an adhesive as described in the first embodiment and whose periphery is sealed with a silicon resin. It does not matter. In this case, the height of the first-layer semiconductor device is equal to the thickness of each of the adhesive, the semiconductor chip, and the resin on the semiconductor chip. On the other hand, in a semiconductor device having another shape, the space provided between the lower surface of the semiconductor chip and the printed circuit board and the thickness of the resin under the lower surface of the semiconductor chip are not necessary. For this reason,
Since the height of a semiconductor device that is directly adhered to the surface of a printed circuit board with an adhesive and sealed around with a silicone resin as described in the first embodiment is reduced, the height is reduced. The height of the connection terminals can be reduced, and the height of the module can be reduced. If the height of the module can be reduced, if the modules are mounted in the system so that the module surface on which the semiconductor device is mounted is vertical, the spacing between each module can be narrowed and the modules can be arranged more densely in the system. It becomes possible.

According to the present embodiment, it is possible to provide a semiconductor module on which a semiconductor device is mounted in multiple layers and a printed wiring board therefor.

[0034]

According to the present invention, it is possible to provide a semiconductor module capable of replacing a defective semiconductor device with an alternative semiconductor device when a defect of a semiconductor device mounted on a printed wiring board is found.

According to another feature of the present invention, it is possible to provide a printed wiring board which can be relieved when a semiconductor device to be mounted has a defect.

According to another feature of the present invention, it is possible to provide a semiconductor module in which semiconductor devices are mounted in multiple layers.

Further, according to another feature of the present invention, it is possible to provide a printed wiring board on which a semiconductor device can be mounted in multiple layers.

[Brief description of the drawings]

FIG. 1A is a top view of a semiconductor module according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view of the semiconductor module according to the first embodiment of the present invention. is there.

FIG. 2 is a top view of the printed wiring board according to the first embodiment of the present invention.

FIG. 3A is a cross-sectional view illustrating a step of a method for manufacturing a semiconductor module according to a second embodiment of the present invention, and FIG. 3B is a cross-sectional view illustrating the method according to the second embodiment of the present invention. It is sectional drawing of such a semiconductor module.

FIG. 4 is a sectional view of a semiconductor module according to a third embodiment of the present invention.

FIG. 5 is a sectional view of a semiconductor module according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view of a conventional semiconductor module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Semiconductor substrate 3 Adhesive 4 Connection pad 5 Pad 6 Wire 7 Sealing material 8 Semiconductor device 9 Preliminary connection terminal 10 Signal wiring 11 External connection terminal 12 Semiconductor device mounting part 13 Defective semiconductor device 14 Opening 15 Alternative semiconductor Device 16 External lead 17 Semiconductor substrate 18 Mounting part 19 Wire 20 Internal lead 21 Preliminary connection terminal 22 Printed wiring board 23 Alternative semiconductor device 24 External lead 25 Semiconductor substrate 26 Mounting part 27 Wire 28 Internal lead 29 Print mounting substrate 30 Preliminary connection terminal 31 First-layer semiconductor device 32 Second-layer semiconductor device 33 Pad 34 Semiconductor substrate 35 Mounting section 36 Wire 37 Internal lead 38 External lead

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E336 AA04 BB01 CC55 DD02 GG19 5F044 JJ00

Claims (6)

[Claims] An external connection terminal, a wiring connected to the external connection terminal, a mounting area for mounting a semiconductor substrate, a pad arranged around the mounting area and connected to the wiring,
A printed wiring board provided around the pad and corresponding to the pad and having a preliminary connection terminal connected to the wiring, a circuit element is formed, and a connection pad is provided on the surface; A semiconductor substrate adhered to the mounting area; a wire having one end connected to a connection pad of the semiconductor substrate and the other end connected to a pad of the printed wiring board; the semiconductor substrate, the wire, the pad, and the mounting A semiconductor module comprising: a sealing body covering a region. 2. An external connection terminal, a wiring connected to the external connection terminal, a mounting area for mounting a semiconductor substrate, and a pad arranged around the mounting area and connected to the wiring,
A printed wiring board provided around the pad and corresponding to the pad and having a preliminary connection terminal connected to the wiring, a circuit element is formed, and a connection pad is provided on the surface; A semiconductor substrate adhered to a mounting region, a wire having one end connected to a connection pad of the semiconductor substrate, and the other end having a non-connection portion between the pad of the printed wiring board; and the semiconductor substrate, the wire, A sealing member that covers the pad and the mounting region and has an opening on the non-connection portion; and a semiconductor device provided on the sealing member and having a connection pin connected to the preliminary connection terminal. A semiconductor module characterized in that: 3. The pre-connection terminal is formed higher than the height of the sealing body.
The semiconductor module according to any one of the above. 4. An external connection terminal, a wiring connected to the external connection terminal, a mounting area for mounting a semiconductor substrate, a pad arranged around the mounting area and connected to the wiring, and a pad surrounding the pad. A printed wiring board, comprising: a preliminary connection terminal provided corresponding to the pad and connected to the wiring. 5. An external connection terminal, a wiring connected to the external connection terminal, a mounting area for mounting a semiconductor substrate, and a pad arranged around the mounting area and connected to the wiring,
A printed wiring board provided around the pad corresponding to the pad, connected to the wiring and provided with a preliminary connection terminal having a first height, a circuit element is formed, and a connection pad is provided on the surface. A first semiconductor device provided in a mounting area on the printed wiring board, connected to a pad on the printed wiring board, and having a second height smaller than the first height of the preliminary connection terminal; A second semiconductor device connected to the preliminary connection terminal and disposed on the first semiconductor device. 6. An external connection terminal, a wiring connected to the external connection terminal, a mounting area for mounting the semiconductor device, a pad disposed around the mounting area and connected to the wiring, and a pad surrounding the pad. A printed wiring board, comprising: a preliminary connection terminal provided corresponding to the pad, connected to the wiring, and having a height greater than a height of the semiconductor device.