JP2001352001A - Carrier for mounting electronic component, method for packaging the same, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier for mounting electronic components, that is used for packaging the electronic components onto a circuit board, can easily, accurately and efficiently achieve miniaturization and high-density packaging in the manufacture of a semiconductor device, and can appropriately transmit a high-frequency signal. SOLUTION: This carrier for mounting the electronic components is equipped with signal and power supply lines that are formed on the upper surface of a substrate, a ground layer that is formed inside the substrate, and an external connection terminal that is formed on the lower surface of the substrate and is connected to the ground layer via a via hole, that is formed in the thickness direction of the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of semiconductor devices, and more specifically, to a carrier for mounting electronic components which can be easily reduced in size, weight and cost in the manufacture of semiconductor devices. The present invention relates to a method of mounting used electronic components and a semiconductor device obtained by the method.
As used herein, the term "electronic component" includes various components that can be mounted on a carrier according to the present invention, and specifically includes, for example, an IC chip,
It refers to a semiconductor chip such as an LSI chip, a passive element, a power supply, and the like. Further, the electronic component mounting carrier of the present invention, as generally used in this technical field,
It can also be called a “chip carrier”.

[0002]

2. Description of the Related Art Conventionally, so-called "chip carriers" have been widely used for efficiently mounting electronic components on a circuit board. Recently, a chip carrier for a high-frequency device has been used for high-frequency (generally several GHz to several tens of GHz) devices used in satellite communication, ITS (Intelligent Transport System), microwave / millimeter wave radio, and the like. Has also been studied and used.

A conventional chip carrier for a high-frequency device is typically configured as shown in FIGS. That is, the chip carrier 50 has a configuration in which a ceramic plate 52 having an opening (cavity) 55 for accommodating a semiconductor chip (for example, a GaAs chip) is stacked on a metal base 51.
On the upper surface of the ceramic plate 52, a power supply line 2 and a high-frequency signal line 3, for example, a microstrip line are wired.

[0004] Manufacturing of a high-frequency device using a chip carrier as shown in the figure can be usually performed as shown in FIG. That is, after the semiconductor chip 15 is accommodated in the cavity 55 of each chip carrier 50 and mounted, the signal line 3 or the power supply line 2 is connected to the lead (not shown) of the semiconductor chip 15 by the Au ribbon 16. Next, the plurality of chip carriers 50 are positioned on a metal base (also referred to as a “module base”) 61 while being positioned using a dedicated mounting jig (a jig that presses the chip carrier 50 from above, not shown). Mount. At this time, the chip carriers are soldered and connected by the solder 62 while the signal lines 3 of the chip carrier 50 are positioned so as to be aligned. Subsequently, the signal line 3 and the power supply line 2 of the chip carriers 50 are connected by the Au ribbon 16.

[0005] However, the above-described method of manufacturing a high-frequency device has an advantage that a plurality of chip carriers can be connected at the same time, but it is necessary to use a dedicated mounting jig. Is desired. In other words, using a special jig not only increases the man-hours, but also complicates the work itself,
Furthermore, it is difficult to perform mounting with high accuracy because the jig is used.

Further, there is a problem in producing a high-frequency module using the chip carrier 50 as shown in FIGS. The high frequency module is
Normally, as shown in a plan view in FIG. 18 and a cross-sectional view in FIG. 19, semiconductor chips 15 (see FIG. 19) not shown in FIG. 18 for simplification are mounted on a plurality of chip carriers 50. Thereafter, the chip carriers 50 are mounted on the module base 61 by soldering while positioning using a special jig so that the signal lines 3 of the chip carriers 50 are aligned with each other in a straight line. can do. The signal lines 3 and the power supply lines 2 are connected by an Au ribbon 16 or an Au line (not shown), respectively, and are also connected to an input / output terminal of the module base 61 by an Au ribbon or an Au line (not shown). I do. In the illustrated high-frequency module 60, R
Flow of F signal (observed in the direction of arrow A in FIG. 18) and DC
The signal flow (observed in the direction of arrow B in FIG. 18) is shown in FIG.
Both are linear, as shown in FIG.

However, in the high-frequency module 60 shown in FIGS. 18 and 19, in addition to the above-described problem of the method of manufacturing the high-frequency device, the connection between carriers is diversified and complicated, and therefore, the mounting is difficult. There is a problem that efficiency is reduced.

[0008]

SUMMARY OF THE INVENTION One object of the present invention is to solve the above-mentioned problems of the prior art, and to easily reduce the size, weight, and cost in the manufacture of semiconductor devices. An object of the present invention is to provide a carrier for mounting electronic components, which is possible and does not require a dedicated mounting jig. Another object of the present invention is to provide a carrier for mounting an electronic component, which is useful for manufacturing a high-frequency device capable of transmitting a high-frequency signal of several tens of GHz or more satisfactorily.

Another object of the present invention is to provide an electronic component mounting method that can easily mount electronic components without using a dedicated mounting jig. Still another object of the present invention is to provide a semiconductor device which is small and lightweight, is mounted at a high density, and can transmit a high-frequency signal satisfactorily.

[0010]

According to one aspect of the present invention, there is provided an electronic component mounting carrier for mounting an electronic component to mount the electronic component on a circuit board, the carrier being formed on an upper surface of a base. A signal line and a power supply line, a ground layer formed inside the base, and an external connection formed on a lower surface of the base and connected to the ground layer through a via formed in a thickness direction of the base. And a carrier for mounting electronic components.

In another aspect of the present invention, in mounting an electronic component on a circuit board, a signal line and a power supply line formed on an upper surface of a base and a ground layer formed inside the base are provided. The electronic component is mounted on a carrier for mounting an electronic component, the electronic component being provided on a lower surface of the base and having an external connection terminal connected to the ground layer via a via formed in a thickness direction of the base. After electrically connecting and mounting the signal line and the power supply line, an external connection terminal of the carrier and a pad formed on the circuit board corresponding to the external connection terminal are connected by soldering. Electronic component mounting method.

Further, in another aspect, the present invention includes a circuit board, a plurality of electronic component mounting carriers mounted on the circuit board, and a plurality of electronic components respectively mounted on the carrier. A semiconductor device, wherein the electronic component is formed on a signal line and a power supply line formed on an upper surface of a base, a ground layer formed inside the base, and a lower surface of the base, and in a thickness direction of the base. And an external connection terminal connected to the ground layer through a via formed in the electronic component mounting carrier. The electronic component mounting carrier is electrically connected to the signal line and the power supply line. A semiconductor device is characterized in that connection terminals and pads formed on the circuit board corresponding to the external connection terminals are connected by soldering.

In the electronic component mounting carrier of the present invention, the base preferably has a cavity for accommodating the electronic component substantially at the center thereof, but may not have such a cavity if necessary. .

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The electronic component mounting carrier, the electronic component mounting method, and the semiconductor device of the present invention can be implemented in various forms. Hereinafter, preferred embodiments of the present invention will be described. The electronic component mounting carrier (chip carrier) of the present invention includes a base that may have a cavity for accommodating an electronic component as needed. This substrate is usually formed from a ceramic material such as alumina. When such a base is provided with a cavity, an opening (cavity) having a shape and a size suitable for an electronic component to be mounted can be opened substantially at the center of the base. Chip carrier
Although it can be produced according to various techniques, it can be usually produced by laminating and firing green sheets. As an example, an alumina powder is formed into a paste with a solvent and formed into a sheet to obtain a green sheet of alumina ceramic. (1) Metallization of tungsten, molybdenum, or the like is performed on the green sheet having an opening serving as a cavity. The paste is printed to form a green sheet for an upper layer having a power supply line, a signal line, and the like, and (2) a metallized paste such as tungsten, molybdenum or the like is printed on the green sheet having a hole to be a via. Then, a green sheet for a lower layer including a ground layer, a via, and a pad is formed, and then these green sheets are laminated and fired to manufacture a target chip carrier.

The electronic components housed in the chip carrier of the present invention are, as previously defined, IC chips, LSI chips, etc., for example, FETs, MICs, MMs made of GaAs.
Includes semiconductor chips such as ICs, passive elements such as coils, capacitors, and resistors, and power supplies. A carrier containing a passive element such as a coil can be particularly called a balun carrier. A carrier on which a power supply is mounted can be referred to as a power supply carrier. There are cases where only a wiring pattern is formed and cases where passive elements such as capacitors and resistors are mounted. That is, in the present invention, the term “chip carrier” refers to a balun carrier having a passive element for performing signal line matching, a passive element for controlling power supply and balancing, in addition to the semiconductor chip mounted. A power supply carrier on which elements are mounted, a carrier on which only a wiring pattern (signal line or power supply line) is formed, and the like are included. The semiconductor chip used in the present invention is preferably a high-frequency semiconductor chip, for example, an IC chip, for example, a GaAs chip.

The chip carrier of the present invention is (1) wiring such as a signal line and a power supply line formed on the upper surface of the base, and (2) formed widely inside the base, preferably extending in the horizontal direction. Ground layer, and (3) formed on the lower surface of the substrate,
It is essential to have an external connection terminal connected to the ground layer via a via formed in the thickness direction of the base.

The signal lines among the wirings formed on the base are preferably high-frequency signal lines. In addition, the signal lines and the power supply lines can be formed from the same material in the same pattern as that of the conventional chip carrier. The signal line and the power supply line can be formed from, for example, a metallized paste such as tungsten (W) or molybdenum (Mo). In addition, instead of using a metallized paste, such a wiring can be applied to the surface of the substrate in a predetermined pattern and thickness using a conventional film forming method such as sputtering or vapor deposition. Although the width and thickness of the wiring such as the signal line and the power supply line can be widely changed depending on the desired details of the semiconductor device, etc., usually, the width is about 50 to 300 μm and about 100 μm.
Preferably, the thickness is 200 μm. In the chip carrier of the present invention, a part of the wiring used as the power supply line is a ground wiring, and therefore,
It is connected via a via to the ground layer in the chip carrier.

The base used in the chip carrier of the present invention needs to have a wide ground layer formed as an inner layer. The ground layer can be generally formed from the same material as the above-described signal line and power supply line by the same method, but may be formed by another material and method as necessary. In general, as explained earlier,
The substrate can be manufactured from two upper and lower green sheets by laminating and firing them. Note that the width of the ground layer can be a width extending arbitrarily in the horizontal direction, and the thickness of the ground layer can be widely changed according to desired details of the semiconductor device and the like. However, it is usually preferred to have a thickness of about 100-200 μm.

Further, in the case of the substrate used in the present invention, it is necessary that external connection terminals are formed on the lower surface thereof. The external connection terminal can be formed in an arbitrary pattern according to the pattern of the wiring of the circuit board on which the chip carrier of the present invention is to be mounted or the external connection terminal. Further, such external connection terminals can be formed by various methods common in this technical field. It is generally preferable that the external connection terminal is formed by connecting a solder ball to a pad. For example, when solder paste is screen-printed on pads (lands) of the carrier and reflowed, solder balls can be formed. Next, this carrier is mounted so that the solder bumps are positioned on the pads of the circuit board, and when reflowing again, the carrier can be positioned by self-alignment. Alternatively, after the solder paste is screen-printed on the pads of the circuit board, the carrier may be positioned and mounted on the pads of the circuit board, and reflow may be performed to form the external connection terminals. The carrier and circuit board pads are
Like a normal pad, it can be formed from various materials, and an example is gold (Au) plating.

Further, in the chip carrier according to the present invention, the external connection terminal as described above is electrically connected to the ground layer through a via (via hole) formed in the thickness direction of the base. Is also necessary. In order to achieve such an electrical connection, it is preferable that a via formed in a base is filled with a conductor, that is, a filled via is used, as is common in this technical field. Filled vias can also be advantageously formed by filling the metallized paste as described above.

The chip carrier of the present invention preferably comprises
A cavity for mounting a semiconductor chip is provided substantially at the center of the base. As described above, the mounting of the semiconductor chip on the base can be performed by housing the chip in the cavity and then electrically connecting the chip to a signal line, a power supply line, and the like of the chip carrier. Specifically, the electrical connection can be made using an Au ribbon or an Au wire.

According to the present invention, there is also provided a method of mounting an electronic component on a circuit board using such a chip carrier in addition to a chip carrier for mounting electronic components. The mounting method of the present invention includes the following steps: a step of mounting an electronic component on the chip carrier of the present invention by connecting the electronic component and a signal line and a power supply line of the chip carrier (at substantially the center of the chip carrier, A jig for positioning the external connection terminals (preferably, pads) of the chip carrier and the pads (corresponding to the external connection terminals of the carrier) formed on the circuit board is preferably used. Instead, it can be advantageously implemented by a step of connecting by soldering.

When a semiconductor device is manufactured by mounting a plurality of semiconductor chips on one circuit board, the chips are mounted on each chip carrier, and then the signal lines of adjacent carriers are mounted on the circuit board. Align the position of
It is preferable to connect the external connection terminals of the carrier and the pads of the circuit board by soldering. This connection step can be preferably performed by reflow soldering using solder balls as described above. This is because pads to be connected can be accurately positioned and connected by a self-alignment effect without using a dedicated jig. That is, after the solder balls are formed on the external connection terminals of the carrier, the carrier is mounted so that the solder balls are positioned on the pads of the circuit board, and reflowed again. Even if there is a slight displacement, the surface tension of the molten solder ball acts as a driving force, so that the carrier can be accurately positioned at a predetermined position and soldered.

Further, in order to further enhance the self-alignment effect as described above, a pad formed on the surface of the circuit board for receiving an external connection terminal (pad) of the chip carrier is provided only in the connection portion of the pad. It is preferable to have a shape of a solder dam so as to open. The solder dam can be formed by surrounding the periphery of the pad with a bank such as a solder resist, for example.

As described here, the circuit board used in the embodiment of the present invention can be formed from various materials.
In contrast to the use of a metal base (board), it can be advantageously formed from a ceramic material or a resin material. As understood from the fact that such a material is already used for many circuit boards, it is not only inexpensive but also easy to process and excellent in characteristics. Suitable ceramic materials include, for example, alumina, and suitable resin materials include, for example, epoxy resin, polyimide resin, BT resin, and the like.

According to the present invention, in addition to the electronic component mounting chip carrier and the electronic component mounting method, a circuit board, a plurality of electronic component mounting carriers mounted on the circuit board, and A semiconductor device including a plurality of mounted electronic components is also provided. The semiconductor device of the present invention is characterized in that the above-described necessary electrical connection is made using the chip carrier for mounting electronic components of the present invention.

In the semiconductor device of the present invention, the signal line of the chip carrier is connected to the adjacent chip carrier in a plane direction, and the power supply line connects a part of the external connection terminal on the lower surface of the base of the chip carrier. It is preferable that the power supply pad is connected to the power supply pad in the vertical direction. Further, as described above, it is preferable that the circuit board used as the base is formed of a resin material, and includes a signal line ground and connection wiring for connecting carriers or between the carrier and the outside.

The semiconductor device of the present invention is particularly preferably
It constitutes a high frequency module. The high-frequency module is formed on a circuit board by combining the above-described chip carrier, balun carrier and power supply carrier. In the semiconductor device of the present invention, the chip carrier can be mounted on the circuit board by self-alignment, so that the RF signal can be mounted easily. Also,
At the time of alignment mounting on the circuit board, the wiring of DC signals can be completed at the same time, so that the connection between carriers is minimized and the mounting efficiency is improved. In other words, such a remarkable effect is derived from the fact that the present invention uses a chip carrier having a specific structure to perform “wire routing”.

[0029]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view showing a typical example of the chip carrier of the present invention, and FIG. 2 is a sectional view of the chip carrier shown in FIG. The illustrated chip carrier 10 includes an alumina base 1, and the base 1
A semiconductor chip (here, GaAs)
And a cavity 5 for accommodating the chip).
A power supply line 2 and a high-frequency signal line 3 are formed on the upper surface of the base 1. The illustrated power supply line 2 and high-frequency signal line 3
A microstrip line is formed from a metallized paste of tungsten (W). Further, a wide ground layer 4 is formed in the inner layer of the base 1 also from the metallized paste of tungsten. As shown in FIG. 2, pads 7 as external connection terminals are formed on the lower surface of the base 1. In the illustrated example, only a part of the pad 7 can be recognized, but the pad 7 has the same number and the same pattern as the area array according to the base (circuit board, not shown) to which the pad 7 is to be connected. It is formed in a shape.

The chip carrier 10 shown in FIGS. 1 and 2
Can be used for manufacturing various semiconductor devices.
FIG. 3 shows an example in which the illustrated chip carrier is used for manufacturing a high-frequency IC module. After the chip carrier 10 is manufactured in a predetermined shape and structure, an IC chip (GaAs chip) 15 is mounted in the cavity, and the signal lines 3 and the power supply lines 2 and external connection terminals (not shown) of the IC chip 15 are Au. Connect with ribbon 16. Next, a solder paste is screen-printed on the pads 7 of the chip carrier 10 and reflowed to form solder balls (Pb-Sn).
(Base alloy) 18 is formed. This chip carrier 10 is
The circuit board 11 is mounted on a circuit board 11 (for simplicity of illustration, formed wirings and elements are omitted) such that solder balls 18 are positioned on pads 17 formed on the upper surface thereof. And reflow again. The chip carrier 10 is positioned by the self-alignment. Subsequently, the signal lines 3 and the power supply lines 2 between the chip carriers 10
Are connected by an Au ribbon 16. According to this method, it is possible to perform accurate positioning and solder mounting between the pad 7 and the pad 17 of the chip carrier 10 by the self-alignment effect.
A C module 20 is obtained. The plan view of this IC module is similar to the plan view of FIG. 18 referred to above as prior art.

In the embodiment of the present invention, the circuit board may have various structures. In particular, the upper surface of the circuit board may further improve the self-alignment effect between the pads, for example, as shown in FIGS. In addition, a solder dam that opens only in the pad connection portion can be provided. The solder dam can be generally formed by using a solder resist as described below, but other methods may be used if necessary.

The circuit board 11 shown in FIG. 4 has a ground wiring 12 formed on an upper surface thereof, and a solder resist 14 is selectively formed thereon. The region of the ground wiring 12 that is not covered with the solder resist 14, that is, exposed, is plated with a conductive metal 19 to form a pad connection portion. Here, the plating 19 is formed by electrolytic plating of gold (Au).

The circuit board 11 of FIG. 5 has a ground wiring 12 and a power supply wiring 13 formed on an upper surface thereof, and a solder resist 14 is selectively formed thereon. Au plating 19 is applied to the regions not covered with the solder resist 14, that is, the exposed regions of the ground wiring 12 and the power supply wiring 13 as in the case of FIG.

FIG. 6 is a plan view showing another example of the high-frequency IC module according to the present invention. The illustrated IC module 20 includes a combination of a chip carrier 10-1, a balun carrier 10-2, and a power supply carrier 10-3, and is based on the chip carrier 10 described above with reference to FIGS. It can be formed by combining a balun carrier and a power supply carrier. In the drawings, chips, coils, and the like stored in respective carriers are omitted for simplification of description. Although not shown, the connection between the chip and the carrier and the connection between the carriers are made with an Au ribbon.

FIG. 7 is a plan view showing still another example of the high-frequency IC module according to the present invention. The illustrated IC module 20 is also formed by combining a chip carrier 10-1, a balun carrier 10-2, and a power supply carrier 10-3, similarly to that of FIG. Further, in the case of the IC module 20 shown in FIG.
6, power supply line vias 28 are formed in each carrier as shown in FIG. 6, and side wirings 27 (FIG.
) Is also formed. Connection between chip and carrier,
The connection between the carriers is made using the Au ribbon 16 (FIG. 8).
See). In the illustrated IC module 20, the flow of the RF signal (observed in the direction of arrow A in FIG. 7)
Is linear as shown in FIG. 8, while the flow of the DC signal (observed in the direction of arrow B in FIG. 7) is pulse-like.

More specifically, as shown in FIG. 8A, a metallized pattern (side wiring) 27 is formed on a side surface of the chip carrier 10-1, and a gap between adjacent chip carriers 10-1 is formed. Is filled with solder 18. In this example, since the metallized pattern 27 extends to the same height as the ground layer 4, the rising of the solder 18 becomes the same height as the ground layer 4. Further, since the metallized pattern 27 is connected to the ground layer 4, the raised solder 18 has the same potential as the ground layer 4. Therefore, the Au ribbon 16 serving as the connection conductor forms a microwave transmission line with the solder 18 that has risen, and the height of the solder 18 is equal to that of the ground layer 4. Extremely fluctuating transmission line characteristics are improved at the connection portions between the signal lines.

The metallization pattern 27 for rising is not limited to the connection between chip carriers.
Even when mounting a single chip carrier on a mounting board,
Similar to the above, improvement in transmission line characteristics can be expected. In other words, if a region where the solder can go up due to surface tension or the like between the metallized pattern 27 and the mounting board on which a single chip carrier is mounted is provided, when a signal is extracted by an external conductor such as an Au ribbon. A microwave transmission line is formed between the raised brazing material (eg, solder).

As described above, the metallization pattern 27 (side wiring) guides the brazing material to the same height as the ground layer when the ground layer is located in the intermediate layer of the chip carrier base. The effect of improving the transmission characteristics in the drawer portion is exhibited. FIG.
As shown in (B), a power supply line via 28 is formed in the chip carrier 10-1, and the power supply lines 2 of the chip carrier 10-1 are connected via the via 28 and the power supply wiring of the circuit board 11. Can be connected.

The high-frequency IC module 20 shown in FIGS. 7 and 8 can be manufactured using a chip carrier 10-1 as shown in FIG. Hereinafter, the internal structure of the chip carrier 10-1 will be described with reference to FIG. 10 which is a cross-sectional view along line AA in FIG. 9 and FIG. 11 which is a cross-sectional view along line BB in FIG. The description will be made with reference to the drawings. The illustrated chip carrier 10-1 includes an alumina base 1, and has a cavity 5 for accommodating a GaAs chip at substantially the center of the upper surface of the base 1. Also, the base 1
The power supply line 2 and the high-frequency signal line 3 are formed of tungsten (W) on the upper surface of the substrate. Via 2 at the end of power supply line 2
8 are formed. A side wiring 27 also made of tungsten is formed on a side surface of the base 1.
Further, in the inner layer of the base 1, a wide ground layer 4 also made of tungsten is formed. Pads 7 as external connection terminals are formed on the lower surface of the base 1, as shown in FIGS.

FIG. 12 is a sectional view showing an example of the chip carrier of the present invention, which is designed especially for flip chip connection. As can be understood from the cross-sectional views of FIG. 13 and FIG. 13, the illustrated chip carrier 10 has no cavity for accommodating a semiconductor chip, and has a pad 29 for flip chip connection. Chip carrier 1 described above with reference to FIG.
Similar to 0. When this chip carrier 10 is used, as shown in FIG. 14, the high-frequency IC module 20 can be manufactured by mounting the semiconductor chip 15 via the solder bumps 26 and electrically connecting them. Although not illustrated and described here, for example, the illustrated cavity is used for manufacturing the high-frequency IC module 20 and other similar semiconductor devices described above with reference to FIGS. 7 and 8. Not chip carrier 10
Can also be used.

[0041]

As described above, according to the present invention, it is possible to provide a small, lightweight, and low-cost carrier for mounting electronic components.
When mounting an electronic component such as a C chip on a circuit board, high-density mounting can be easily performed with high accuracy and high efficiency without using a dedicated mounting jig.

When the electronic component mounting carrier of the present invention is used, it is possible to provide a high-frequency device capable of favorably transmitting a high-frequency signal of several GHz to several tens of GHz, for example, a high-frequency module.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a typical example of a chip carrier of the present invention.

FIG. 2 is a sectional view of the chip carrier shown in FIG.

FIG. 3 is a sectional view showing an example of a high-frequency IC module according to the present invention.

FIG. 4 is a cross-sectional view showing an example of a circuit board that can be used for implementing the present invention.

FIG. 5 is a cross-sectional view showing another example of a circuit board that can be used for implementing the present invention.

FIG. 6 is a plan view showing another example of the high-frequency IC module according to the present invention.

FIG. 7 is a plan view showing still another example of the high-frequency IC module according to the present invention.

FIG. 8 is a graph showing the relationship between R in the high frequency IC module shown in FIG.
FIG. 4 is a cross-sectional view illustrating the flow of an F signal and a DC signal.

FIG. 9 is a perspective view of a chip carrier used for manufacturing the high-frequency IC module shown in FIG.

10 is a cross-sectional view of the chip carrier of FIG. 9 taken along line AA.

11 is a cross-sectional view of the chip carrier of FIG. 9 taken along line BB.

FIG. 12 is a perspective view showing an example of a chip carrier for flip chip connection according to the present invention.

FIG. 13 is a sectional view of the chip carrier shown in FIG.

FIG. 14 is a cross-sectional view of a high-frequency IC module manufactured using the chip carriers shown in FIGS. 12 and 13.

FIG. 15 is a perspective view showing a typical example of a conventional chip carrier.

FIG. 16 is a sectional view of the chip carrier shown in FIG.

FIG. 17 is a cross-sectional view for explaining a method of mounting the chip carrier shown in FIGS. 15 and 16;

FIG. 18 is a plan view showing a method for mounting a high-frequency module using the chip carriers shown in FIGS. 15 and 16;

FIG. 19 is a cross-sectional view showing flows of an RF signal and a DC signal in the high-frequency module of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Power supply line 3 ... Signal line 4 ... Ground layer 5 ... Cavity 6 ... Via 7 ... Pad 10 ... Carrier for electronic component mounting 11 ... Circuit board 12 ... Ground wiring 13 ... Power supply wiring 14 ... Solder resist 15 ... Semiconductor Chip 16 ... Au ribbon 17 ... Pad 18 ... Solder bump 19 ... Au plating 20 ... High frequency IC module 26 ... Solder bump 27 ... Side wiring 28 ... Power supply line via 29 ... Flip chip connection pad

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshimitsu Omiya Nagano Pref. Inside the Electric Industry Co., Ltd. Fujitsu Quantum Device Co., Ltd.

Claims (16)

[Claims] 1. A carrier for mounting an electronic component for mounting the electronic component on a circuit board, comprising: a signal line and a power supply line formed on an upper surface of a base; and a carrier formed inside the base. Electronic component mounting, comprising: a ground layer formed on the substrate; and external connection terminals formed on a lower surface of the base and connected to the ground layer via vias formed in a thickness direction of the base. For carrier. 2. The electronic component mounting carrier according to claim 1, wherein the base has a cavity for accommodating the electronic component at a substantially central portion thereof. 3. The electronic component mounting carrier according to claim 1, wherein the electronic component is a high-frequency semiconductor chip. In mounting the electronic component on a circuit board, a signal line and a power supply line formed on an upper surface of a base, a ground layer formed inside the base, and a ground layer formed on a lower surface of the base, Electrically connecting the electronic component to the signal line and the power supply line to an electronic component mounting carrier including an external connection terminal connected to the ground layer via a via formed in a thickness direction of the base; And mounting after mounting the external connection terminals of the carrier and pads formed on the circuit board corresponding to the external connection terminals by soldering. 5. The electronic component mounting method according to claim 4, wherein the electronic component is housed and mounted in a cavity formed substantially in the center of the base. 6. After mounting a plurality of electronic components on each carrier, positioning is performed between signal lines of adjacent electronic components, and external connection terminals of the carrier and pads of the circuit board are soldered. The electronic component mounting method according to claim 4, wherein the connection is performed by: 7. The method according to claim 4, wherein the soldering is performed by reflow soldering.
Item mounting method. 8. A semiconductor device comprising a circuit board, a plurality of electronic component mounting carriers mounted on the circuit board, and a plurality of electronic components respectively mounted on the carrier, wherein the electronic component is: A signal line and a power supply line formed on an upper surface of the base; a ground layer formed inside the base; and a ground layer formed on a lower surface of the base and formed in a thickness direction of the base via a via. An electronic component mounting carrier having an external connection terminal connected to the electronic component mounting carrier is electrically connected to the signal line and the power supply line, and mounted. The external connection terminal of the carrier corresponds to the external connection terminal. A semiconductor device, wherein a pad formed on the circuit board is connected by soldering. 9. The semiconductor device according to claim 8, wherein said base has a cavity for accommodating said electronic component at a substantially central portion thereof. 10. The power supply line, wherein the signal line is connected to an adjacent carrier in a plane direction, and the power supply line is connected to a part of an external connection terminal on a lower surface of the base by using the power supply pad. The semiconductor device according to claim 8, wherein the semiconductor device is connected in a vertical direction. 11. The circuit board according to claim 8, wherein the circuit board is formed of a resin material, and includes a signal line ground, and connection wiring for connecting carriers or between the carrier and the outside. 11. The semiconductor device according to claim 10. 12. The semiconductor device according to claim 8, wherein said semiconductor device constitutes a high-frequency module. 13. A carrier for mounting an electronic component on which an electronic component is mounted, wherein: a base of the carrier; a signal line provided on the base and to be led out of the carrier by an external conductor; A ground layer provided in a layer and at least in a region facing the signal line and constituting a transmission line together with the signal line; and provided on at least a side surface of the base corresponding to a position where the external conductor is to be arranged And a side wiring for guiding the brazing material from the back side of the base to the same potential as the ground layer and to the same height as the ground layer. 14. The electronic component mounting carrier according to claim 13, wherein a mounting pattern is partially provided on a back surface of said base, and is connected to said ground layer via a via. 15. The carrier according to claim 13, wherein the carrier is connected to the signal line by the external conductor, and the external conductor forms a transmission line with a brazing material induced by the side wiring. A semiconductor device comprising a constituent structure. 16. A plurality of carriers according to claim 13, wherein the signal lines of each carrier are conducted by the external conductor connecting the carriers, and a brazing material induced by the side wiring. Wherein the outer conductor forms a transmission line between the semiconductor devices.