JP2001351707A - Card edge connector - Google Patents
Card edge connectorInfo
- Publication number
- JP2001351707A JP2001351707A JP2000165561A JP2000165561A JP2001351707A JP 2001351707 A JP2001351707 A JP 2001351707A JP 2000165561 A JP2000165561 A JP 2000165561A JP 2000165561 A JP2000165561 A JP 2000165561A JP 2001351707 A JP2001351707 A JP 2001351707A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board
- holding
- contact
- contact portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はカードエッジコネク
タに関し、特に第1の回路基板及び第2の回路基板それ
ぞれの、1辺に沿って複数の電極が配列形成された基板
コネクタ部分が挿入されてこれら回路基板を互いに平行
に保持し、これら回路基板間を電気的に接続するカード
エッジコネクタに属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card edge connector, and more particularly, to a card connector in which a plurality of electrodes are arranged along one side of a first circuit board and a second circuit board. It belongs to a card edge connector that holds these circuit boards in parallel with each other and electrically connects the circuit boards.
【0002】[0002]
【従来の技術】第1の回路基板と第2の回路基板との間
を電気的に接続する従来のカードエッジコネクタにおい
て、構造が比較的単純で安価な例(第1の例)は、図4
(a),(b)に示すように、一方の回路基板にはんだ
付け接続するタイプのものである。2. Description of the Related Art In a conventional card edge connector for electrically connecting a first circuit board and a second circuit board, an example of a relatively simple and inexpensive structure (first example) is shown in FIG. 4
As shown in (a) and (b), it is of a type that is connected to one circuit board by soldering.
【0003】図4(a)に示された例では、インシュレ
ータ300xの1つの側面に沿って、複数のコンタクト
100xのはんだ付け部が外側に突出するように配列さ
れ、その接触部がインシュレータ300xの内部に配列
され、その保持固定部がインシュレータ300xに保持
固定されて、これら複数のコンタクト100xがインシ
ュレータ300xに配列、保持固定されている。そし
て、複数のコンタクト100xのはんだ付け部が回路基
板900xの複数の電極にはんだ付け接続(500)さ
れて、このカードエッジコネクタが、回路基板900x
に搭載、実装される。In the example shown in FIG. 4A, soldering portions of a plurality of contacts 100x are arranged so as to protrude outward along one side surface of the insulator 300x, and the contact portions are formed on the insulator 300x. The plurality of contacts 100x are arranged and held and fixed to the insulator 300x. The holding and fixing portions are held and fixed to the insulator 300x. Then, the soldered portions of the plurality of contacts 100x are soldered (500) to the plurality of electrodes of the circuit board 900x, and the card edge connector is connected to the circuit board 900x.
To be mounted and implemented.
【0004】また、このカードエッジコネクタに回路基
板800xを装着、嵌合させる際に、回路基板800x
をインシュレータ300xに対して斜め方向から挿入し
て挿入力を小さく(ほぼゼロ)にして、コンタクト等の
損傷を防ぎ、この後、回路基板900xと平行になるよ
うに移動させて複数のコンタクト100xそれぞれの接
触部と回路基板800xの対応する電極とを加圧接触さ
せる。この状態で、回路基板800x,900x間は互
いに保持固定され、かつ電気的に接続される。When the circuit board 800x is mounted and fitted to the card edge connector, the circuit board 800x
Is inserted obliquely into the insulator 300x to reduce the insertion force (substantially zero) to prevent damage to the contacts and the like, and then to move the plurality of contacts 100x in parallel with the circuit board 900x. Is brought into pressure contact with the corresponding electrode of the circuit board 800x. In this state, the circuit boards 800x and 900x are held and fixed to each other and are electrically connected.
【0005】図4(b)に示された例では、インシュレ
ータ300yに、複数の第1のコンタクト100yと複
数の第2のコンタクト200yが、相対向する辺に、そ
のそれぞれのはんだ付け部を外側に突出するように配列
し、そのそれぞれの接触部をインシュレータ300yの
内側に配列し、そのそれぞれの保持固定部を保持、固定
して、配列、保持固定されている。そして、複数の第1
のコンタクト100y及び複数の第2のコンタクト20
0yのはんだ付け部が、回路基板900yの複数の電極
にはんだ付け接続されて、このカードエッジコネクタが
回路基板900yに搭載実装される。In the example shown in FIG. 4 (b), a plurality of first contacts 100y and a plurality of second contacts 200y are provided on an insulator 300y on opposite sides, and their respective soldered portions are placed outside. The respective contact portions are arranged inside the insulator 300y, and the respective holding and fixing portions are held and fixed, arranged and held and fixed. And a plurality of first
Contact 100y and the plurality of second contacts 20
The soldering portion 0y is connected by soldering to a plurality of electrodes of the circuit board 900y, and the card edge connector is mounted on the circuit board 900y.
【0006】このカードエッジコネクタへの回路基板8
00yの装着、嵌合、回路基板800y,900y間の
保持固定、電気的接続は、図4(a)の場合と同様であ
る。これらの例では、複数のコンタクト(100x,1
00y,200y)を、回路基板(900x,900
y)にはんだ付け接続する必要があり、そのための工具
や設備、及び作業が必要となるため、2枚の回路基板間
の電気的接続が煩雑となる。そこで、工具や設備等を使
用することなく、手軽に2枚の回路基板間を電気的に接
続することができる、カードエッジコネクタが登場する
ようになった。The circuit board 8 to this card edge connector
The mounting and fitting of 00y, the holding and fixing between the circuit boards 800y and 900y, and the electrical connection are the same as those in the case of FIG. In these examples, a plurality of contacts (100x, 1
00y, 200y) to the circuit board (900x, 900y).
It is necessary to perform the soldering connection in step y), which requires tools, equipment, and work, which complicates the electrical connection between the two circuit boards. Therefore, a card edge connector has been introduced, which can easily electrically connect two circuit boards without using a tool or equipment.
【0007】図5は、2枚の回路基板を挿入するだけ
で、これら回路基板を電気的に接続することができるカ
ードエッジコネクタである(従来の第2の例)。この第
2の例のカードエッジコネクタは、複数のコンタクト1
00zと、これら複数のコンタクト100zを配列、保
持固定するインシュレータ300zと、を備えて構成さ
れ、これら各部の詳細は次のとおりである。FIG. 5 shows a card edge connector which can electrically connect two circuit boards by simply inserting the two circuit boards (second conventional example). The card edge connector of the second example includes a plurality of contacts 1
00z and an insulator 300z for arranging, holding and fixing the plurality of contacts 100z. Details of these components are as follows.
【0008】まず、複数のコンタクト100zそれぞれ
は、(第1の)回路基板800zの、1つの辺に沿って
その表面に配列形成された複数の電極を含む基板コネク
タ部分が挿入されて、この基板コネクタ部分を両面から
挟持すると同時にこれら複数の電極と対応・加圧接触す
る第1の挟持・接触部151、及びこれらをコの字状に
つなぐ第1のばね部131と、(第2の)回路基板90
0zの、1つの辺に沿ってその表面に配列形成された複
数の電極を含む基板コネクタ部分が挿入されて、この基
板コネクタ部分を両面から挟持すると同時にこれら複数
の電極と対応・加圧接触する第2の挟持・接触部15
2、及びこれらをコの字状につなぐ第2のばね部132
と、第1のばね部131及び第2のばね部132との間
を、これらを含めてコの字状につなぐ保持固定部140
zと、を備え、弾性導電体(金属等)で一体形成されて
いる。First, a substrate connector portion including a plurality of electrodes arranged and formed on one surface of a (first) circuit board 800z is inserted into each of the plurality of contacts 100z. (2) a first holding / contacting portion 151 that holds and presses the plurality of electrodes in correspondence and pressure while holding the connector portion from both sides, and a first spring portion 131 that connects these in a U-shape; Circuit board 90
0z, a board connector part including a plurality of electrodes arranged and formed on the surface thereof is inserted along one side, and the board connector part is sandwiched from both sides, and at the same time, correspondingly and in pressure contact with the plurality of electrodes. Second clamping / contact portion 15
2 and a second spring portion 132 connecting these in a U-shape.
And the holding and fixing portion 140 connecting the first spring portion 131 and the second spring portion 132 to each other in a U-shape including the first and second spring portions 131 and 132.
z, and are integrally formed of an elastic conductor (metal or the like).
【0009】インシュレータ300zは、複数のコンタ
クト100zを挿入、保持固定するための複数のスリッ
ト320zと、第1の回路基板800zが挿入される第
1の基板挿入部(記号、名称は図示省略)と、第2の回
路基板900zが挿入される第2の基板挿入部(記号、
名称は図示省略)と、を備えて形成され、複数のコンタ
クト100zを、その第1の挟持・接触部151が第1
の基板挿入部内に配置され、その第2の挟持・接触部1
52が第2の基板挿入部内に配置されるように、対応す
るスリット320zに挿入して、その保持固定部140
zで保持固定する。The insulator 300z includes a plurality of slits 320z for inserting, holding and fixing a plurality of contacts 100z, and a first board insertion portion (symbols and names are omitted) into which the first circuit board 800z is inserted. , A second circuit board insertion portion (symbol,
(The name is omitted in the drawing), and the first holding / contact portion 151 of the plurality of contacts 100z
And its second pinching / contacting portion 1
52 is inserted into the corresponding slit 320z so that the holder 52 is disposed in the second substrate insertion portion, and the holding and fixing portion 140
Hold and fix with z.
【0010】この第2の例のカードエッジコネクタで
は、2枚の回路基板800z,900zが互いに平行な
状態で挿入されて、そのままの状態でこれら回路基板8
00z,900zを、その基板コネクタ部分の両面から
挟持して保持する。In the card edge connector of the second example, two circuit boards 800z and 900z are inserted in parallel with each other, and these circuit boards 8
00z and 900z are sandwiched and held from both sides of the board connector portion.
【0011】この第2の例のカードエッジコネクタで
は、基板コネクタ部分を挟持してその電極と加圧接触す
るようになっていて、回路基板800z(900z)の
厚さ寸法より狭い、向い合う1対の挟持・接触部151
(152)間に、その基板コネクタを挿入するようにな
っているので、挿入力が大きくなり、コンタクト100
zや基板コネクタの電極が損傷する危険性があり、ま
た、複数のコンタクト100zをインシュレータ300
zに挿入して保持固定するため、その組立作業に時間が
かかる。そこで、これら問題点を解決するために、図6
(a),(b)に示すように、絶縁フィルム600に弾
性金属導体700による複数のパターン電極を形成して
これを折り曲げ、基板挿入開口部の寸法が回路基板80
0z,900zの厚さ寸法と同程度で、基板挿入方向が
その延長線上で交差するような第1,第2の基板コネク
タ挿入部651,652を形成すると同時にこれら基板
コネクタ挿入部651,652間がつながった形状と
し、回路基板800z,900zをこれら基板コネクタ
挿入部651,652に挿入した後、これら回路基板8
00z,900zを互いに平行となるように、基板保持
部材400zで保持することにより、絶縁フィルム60
0及び弾性金属導体700のわん曲する力で、回路基板
800z,900zの基板コネクタ部の複数の電極と、
弾性金属導体700による複数のパターン電極とを対
応、加圧接触させるようにした例(従来の第3の例)が
ある(例えば特開平9−320707号公報参照)。In the card edge connector according to the second example, the board connector portion is sandwiched between and makes pressure contact with its electrodes, so that the opposed edge portions are narrower than the thickness of the circuit board 800z (900z). Pair sandwiching / contact part 151
Since the board connector is inserted between (152), the insertion force increases, and the contact 100
There is a risk of damaging the electrodes of the z connector and the board connector.
Since it is inserted into z and held and fixed, it takes time to assemble it. In order to solve these problems, FIG.
As shown in (a) and (b), a plurality of pattern electrodes made of an elastic metal conductor 700 are formed on an insulating film 600 and are bent.
The first and second board connector insertion portions 651 and 652 are formed so that the board insertion directions intersect on the extension line thereof at the same level as the thickness dimensions of 0z and 900z. After the circuit boards 800z and 900z are inserted into the board connector insertion portions 651 and 652, the circuit boards 8
00z and 900z are held by the substrate holding member 400z so as to be parallel to each other, so that the insulating film 60
0 and the plurality of electrodes of the board connector portion of the circuit boards 800z and 900z by the bending force of the elastic metal conductor 700;
There is an example (third conventional example) in which a plurality of pattern electrodes made of an elastic metal conductor 700 are brought into pressure contact with each other (for example, see Japanese Patent Application Laid-Open No. 9-320707).
【0012】[0012]
【発明が解決しようとする課題】上述した従来のカード
エッジコネクタは、第1の例では、複数のコンタクト1
00x,100y,200yを、回路基板900x,9
00yにはんだ付け接続する構成、構造となっているの
で、そのための工具や設備、及び作業が必要となって、
2枚の回路基板間の電気的接続作業が煩雑になる、とい
う問題点があり、第2の例では、回路基板800z,9
00zの基板コネクタ部分それぞれを、両面から挟持
し、かつその電極と加圧接触するための挟持・接触部1
51,152に、基板コネクタ部分を挿入することにな
るので、挿入力が大きくなって基板コネクタ部分の電極
やコンタクト100zの挟持・接触部151,152が
損傷する危険性があるという問題点や、2枚の回路基板
それぞれを挟持するために、これら回路基板間の間隔を
狭くすることができない、という問題点、更に、各コン
タクト100zの挟持・接触部151,152それぞれ
はばね部131,132及び保持固定部140zでつな
がっているため、基板コネクタ部分の両面それぞれに複
数の電極を形成して多芯化することができないという問
題点があり、第3の例では、絶縁フィルム600に弾性
金属導体700による複数のパターン電極を形成してこ
れを折り曲げ、基板挿入開口部の寸法が回路基板厚と同
程度で基板挿入方向がその延長線上で交差するような基
板コネクタ挿入部651,652を形成し、かつこれら
がつながった形状とし、これら基板コネクタ挿入部65
1,652に各回路基板の基板コネクタ部を挿入した
後、これら回路基板を互いに平行に保持することによ
り、絶縁フィルム600及び弾性金属導体700がわん
曲した力で回路基板の電極と弾性金属導体700による
パターン電極とを加圧接触させる構成、構造となってい
るので、挿入力は小さく、かつ回路基板の電極やコンタ
クトが損傷するのを防止できるものの、弾性金属導体7
00による複数のパターン電極は絶縁フィルム600と
いう1つの平面に形成されていて互いにつながっている
ため、その平面度を高精度で押える必要があり、平面度
の精度が低下したり、変形したりすると、接触不良が発
生する危険性があり、また、絶縁フィルム600及び弾
性金属導体700をわん曲させてその力で電極・コンタ
クト間の接触圧力を得る構造となっているので、2枚の
回路基板間の間隔縮小化が制限される、という問題点が
ある。In the first example, the conventional card edge connector described above has a plurality of contacts 1.
00x, 100y, 200y to the circuit boards 900x, 9
Since it has a configuration and structure for soldering connection to 00y, tools and equipment and work for it are required,
There is a problem that the electrical connection work between the two circuit boards becomes complicated, and in the second example, the circuit boards 800z, 9
A pinch / contact portion 1 for pinching each of the 00z board connector portions from both surfaces and making pressure contact with the electrodes.
Since the board connector portion is inserted into the board connectors 51 and 152, there is a problem that the insertion force is increased and the electrodes of the board connector portion and the holding / contact portions 151 and 152 of the contacts 100z may be damaged. The problem that the distance between the two circuit boards cannot be reduced because the two circuit boards are sandwiched, and the sandwiching / contact portions 151 and 152 of the contacts 100z are formed by the spring portions 131 and 132 and There is a problem that a plurality of electrodes cannot be formed on both sides of the board connector portion to be multi-core because the connection is made by the holding and fixing portion 140z. In the third example, the elastic metal conductor is formed on the insulating film 600. A plurality of pattern electrodes are formed and bent by the method 700, and the size of the board insertion opening is substantially equal to the thickness of the circuit board, and the board insertion method is There is formed a board connector insertion portion 651 so as to intersect By extension, and then these are led shape, these substrates connector insertion portion 65
After inserting the board connector portions of the respective circuit boards into 1,652, these circuit boards are held in parallel with each other, so that the insulating film 600 and the elastic metal conductor 700 are bent by the bending force. Since the structure and structure of the pattern electrode 700 are brought into pressure contact with each other, the insertion force is small and the electrodes and contacts on the circuit board can be prevented from being damaged.
Since the plurality of pattern electrodes of 00 are formed on one plane of the insulating film 600 and are connected to each other, it is necessary to press the flatness with high precision, and if the flatness precision is reduced or deformed, In addition, there is a risk that a contact failure may occur, and the insulating film 600 and the elastic metal conductor 700 are bent to obtain a contact pressure between the electrode and the contact by the force. There is a problem in that the reduction of the interval between them is limited.
【0013】本発明の目的は、はんだ付けすることなく
手軽に2つの回路基板を電気的に接続することができる
ようにした上で、回路基板を挿入力ゼロで挿入すること
ができてコンタクトや回路基板の電極が損傷するのを防
止すると同時に2枚の回路基板間の間隔を狭くすること
ができ、かつ接触不良が発生する危険性をなくし、しか
も基板コネクタの両面の電極に対する接続が容易となっ
て、更に多芯化することができるカードエッジコネクタ
を提供することにある。[0013] An object of the present invention is to make it possible to easily connect two circuit boards electrically without soldering, and to insert the circuit board with zero insertion force, thereby making it possible to connect the circuit boards. It is possible to prevent the electrodes of the circuit board from being damaged, and at the same time, to narrow the distance between the two circuit boards, to eliminate the risk of poor contact, and to easily connect the electrodes on both sides of the board connector. Accordingly, an object of the present invention is to provide a card edge connector which can be further multi-core.
【0014】[0014]
【課題を解決するための手段】本願第1の発明のカード
エッジコネクタは、第1の回路基板及び第2の回路基板
それぞれの、1辺に沿ってその一方の面に配列形成され
た複数の電極を含む基板コネクタ部分が挿入されて、こ
れら第1の回路基板及び第2の回路基板を、互いに平行
に、かつその基板コネクタの電極形成面が外側となるよ
うに保持し、これら第1の回路基板と第2の回路基板と
の間を電気的に接続するカードエッジコネクタであっ
て、上記目的を達成するために次の各構成を有すること
を特徴とする。 (イ)それぞれが、前記第1の回路基板の対応する電極
と接触接続するための第1の接触部と、前記第2の回路
基板の対応する電極と接触接続するための第2の接触部
と、前記第1の接触部と前記第2の接触部との間をコの
字状につなぐばね部と、このばね部の予め定められた部
位に設けられた保持固定部と、を備え、弾性導電体で一
体形成された、複数の外側電極間接続用コンタクト (ロ)前記第1の回路基板及び第2の回路基板それぞれ
の基板コネクタ部分が挿入されてこれを保持するとき
に、前記基板コネクタの先端部分を当接させる基板先端
保持壁を含む基板コネクタ保持部と、前記複数の外側電
極間接続用コンタクトを、その第1の接触部及び第2の
接触部が前記基板コネクタ保持部内に配置されて弾性変
位可能なように、それぞれの保持固定部で保持、固定し
て配列するコンタクト保持部と、前記第1の回路基板及
び第2の回路基板を、そのそれぞれの内側の面に接触し
て互いに平行に保持する第1の平面及び第2の平面、並
びに、これら第1の平面及び第2の平面それぞれとつな
がり、1つの辺に近づく程その間隔が狭くなる第1の斜
面及び第2の斜面を含む仕切板と、を備え、この仕切板
の第1の斜面及び第2の斜面並びに前記1つの辺の部分
が、前記複数の外側電極間接続用コンタクトの第1の接
触部及び第2の接触部の間に、前記1つの辺と前記基板
コネクタ保持部の基板先端保持壁との間に予め設定され
た間隙を隔てて配置され、かつ、前記第1の斜面及びそ
の延長面と前記第1の接触部との間の間隔が前記第1の
回路基板の厚さ寸法と同程度かそれ以上、前記第2の斜
面及びその延長面と前記第2の接触部との間の間隔が前
記第2の回路基板の厚さ寸法と同程度かそれ以上であ
り、前記第1の平面及びその延長面と前記第1の接触部
との間の間隔が前記第1の回路基板の厚さ寸法より狭
く、前記第2の平面及びその延長面と前記第2の接触部
との間の間隔が前記第2の回路基板の厚さ寸法より狭く
なるように配置されたインシュレータAccording to a first aspect of the present invention, there is provided a card edge connector comprising a plurality of first and second circuit boards arranged along one side on one surface thereof. A board connector portion including an electrode is inserted, and the first circuit board and the second circuit board are held in parallel with each other and such that the electrode forming surface of the board connector faces outside, and the first circuit board and the second circuit board are held together. A card edge connector for electrically connecting a circuit board and a second circuit board, wherein the card edge connector has the following configurations to achieve the above object. (A) a first contact portion for contacting and connecting to a corresponding electrode of the first circuit board, and a second contact portion for contacting and connecting to a corresponding electrode of the second circuit board, respectively. And a spring portion for connecting the first contact portion and the second contact portion in a U-shape, and a holding and fixing portion provided at a predetermined portion of the spring portion, A plurality of contacts for connection between outer electrodes integrally formed of an elastic conductor; (b) when the board connector portions of the first circuit board and the second circuit board are inserted and held, A board connector holding portion including a board tip holding wall for contacting a tip portion of the connector, and the plurality of outer electrode connection contacts are provided with first and second contact portions in the board connector holding portion. So that they can be placed and elastically displaced A first contact holding portion that is held, fixed and arranged by the holding and fixing portion, and a first circuit board that holds the first circuit board and the second circuit board in parallel with each other by contacting their inner surfaces. A partition including a first plane and a second plane, and a first slope and a second slope connected to the first plane and the second plane, respectively, and the distance between the first plane and the second plane is reduced as approaching one side. The first slope and the second slope of the partition plate and the one side portion are provided between the first contact portion and the second contact portion of the plurality of outer electrode connection contacts. A predetermined gap is arranged between one side and a board tip holding wall of the board connector holding section, and a gap is provided between the first slope and its extension face and the first contact section. Is equal to or greater than the thickness dimension of the first circuit board, The distance between the second inclined surface and its extension surface and the second contact portion is substantially equal to or greater than the thickness dimension of the second circuit board, and the first plane and its extension surface The distance between the first contact portion and the second contact portion is smaller than the thickness dimension of the first circuit board, and the distance between the second contact surface and the second plane and the extension surface thereof is the second contact portion. An insulator arranged so as to be narrower than the thickness of the circuit board of No. 2.
【0015】本願第2の発明のカードエッジコネクタ
は、第1の回路基板及び第2の回路基板それぞれの、1
辺に沿ってその一方の面に配列形成された複数の電極を
含む基板コネクタ部分が挿入されて、これら第1の回路
基板及び第2の回路基板を、互いに平行に、かつその基
板コネクタの電極形成面が内側となるように保持し、こ
れら第1の回路基板と第2の回路基板との間を電気的に
接続するカードエッジコネクタであって、上記目的を達
成するために次の各構成を有することを特徴とする。 (イ)それぞれが、前記第1の回路基板の対応する電極
と接触接続するための第1の接触部と、前記第2の回路
基板の対応する電極と接触接続するための第2の接触部
と、前記第1の接触部と前記第2の接触部との間を略U
字状につなぎ、この略U字状の開口側では、これら第1
の接触部及び第2の接触部を含む開口端に近づく程その
間隔が広くなる形状のばね部と、を備え、弾性導電体で
一体形成された、複数の内側電極間接続用コンタクト (ロ)前記第1の回路基板及び第2の回路基板それぞれ
の基板コネクタ部分が挿入されてこれを保持するとき
に、これら第1,第2の回路基板それぞれの外側の面を
接触させる、互いに平行な第1の基板外面保持壁及び第
2の基板外面保持壁、並びに、基板挿入、保持時にこれ
ら第1,第2の回路基板の基板コネクタ先端部分を当接
させる基板先端保持壁を含む基板コネクタ保持部と、前
記第1の基板外面保持壁の壁面を含む平面と平行でその
間隔が前記第1の回路基板の厚さ寸法より広い第1の平
面、及び前記第2の基板外面保持壁の壁面を含む平面と
平行でその間隔が前記第2の回路基板の厚さ寸法より広
い第2の平面、並びにこれら第1,第2の平面それぞれ
とつながり、1つの辺に近づく程その間隔が狭くなる第
1の斜面及び第2の斜面を含み、前記第1の平面及び第
2の平面を成す部分に、前記複数の内側電極間接続用コ
ンタクトを、そのそれぞれの第1の接触部が前記第1の
斜面の延長面からは突出することなく前記第1の平面か
らは突出し、そのそれぞれの第2の接触部が前記第2の
斜面の延長面からは突出することなく前記第2の平面か
らは突出して弾性変位可能なように配列保持固定するコ
ンタクト保持部が設けられた仕切板と、を備え、この仕
切板の第1の斜面及び第2の斜面並びに1つの辺の部分
が、前記基板コネクタ保持部内に、前記1つの辺と前記
基板先端保持壁との間に予め設定された間隙を隔てて配
置され、かつ、前記第1の斜面及びその延長面と前記第
1の基板外面保持壁との間の最小間隔が前記第1の回路
基板の厚さ寸法と同程度かそれ以上、前記第2の斜面及
びその延長面と前記第2の基板外面保持壁との間の最小
間隔が前記第2の回路基板の厚さ寸法と同程度かそれ以
上であり、前記第1の基板外面保持壁の壁面を含む平面
と前記第1の接触部との間の間隔が前記第1の回路基板
の厚さ寸法より狭く、前記第2の基板外面保持壁の壁面
を含む平面と前記第2の接触部との間の間隔が前記第2
の回路基板の厚さ寸法より狭くなるように配置されたイ
ンシュレータA card edge connector according to a second aspect of the present invention comprises a first circuit board and a second circuit board.
A board connector portion including a plurality of electrodes arranged and formed on one surface thereof is inserted along the side, and the first circuit board and the second circuit board are connected in parallel with each other and the electrodes of the board connector are connected to each other. A card edge connector for holding a forming surface inside and electrically connecting between a first circuit board and a second circuit board. It is characterized by having. (A) a first contact portion for contacting and connecting to a corresponding electrode of the first circuit board, and a second contact portion for contacting and connecting to a corresponding electrode of the second circuit board, respectively. And approximately U between the first contact portion and the second contact portion.
The first U-shaped opening is connected to the first
A spring portion having a shape in which the distance between the contact portion and the opening end including the second contact portion increases as the distance from the contact portion increases. When the board connector portions of the first circuit board and the second circuit board are inserted and held, the outer surfaces of the first and second circuit boards are brought into contact with each other. A board connector holding section including a first board outer holding wall and a second board outer wall, and a board tip holding wall that abuts the board connector tip portions of the first and second circuit boards during insertion and holding of the board. A first plane parallel to a plane including the wall surface of the first substrate outer surface holding wall and having an interval larger than the thickness dimension of the first circuit board, and a wall surface of the second substrate outer surface holding wall. Parallel to the plane containing A second plane larger than the thickness dimension of the second circuit board, and a first slope and a second slope connected to each of the first and second planes, and the distance between the first and second planes is reduced as approaching one side. A plurality of the inner-electrode connection contacts, each of which has a first contact portion protruding from an extension surface of the first slope in a portion forming the first plane and the second plane. And the second contact portions thereof protrude from the second plane without protruding from the extension surface of the second slope, and are arranged so as to be elastically displaceable. A partition plate provided with a contact holding portion to be fixed, wherein a first slope and a second slope of the partition plate and a portion of one side are provided in the board connector holding portion with the one side and the one side. Set in advance between the substrate tip holding wall The minimum distance between the first inclined surface and its extension surface and the first substrate outer surface holding wall is set to be equal to or greater than the thickness dimension of the first circuit board. A minimum distance between the second inclined surface and its extension surface and the second substrate outer surface holding wall is equal to or greater than a thickness dimension of the second circuit board, and the first substrate An interval between a plane including the wall surface of the outer surface holding wall and the first contact portion is smaller than a thickness dimension of the first circuit board, and a plane including the wall surface of the second substrate outer surface holding wall and the second surface. The distance between the second contact portion and the second contact portion is the second
Insulators arranged to be narrower than the thickness of the circuit board
【0016】本願第3の発明のカードエッジコネクタ
は、第1の回路基板及び第2の回路基板それぞれの、1
辺に沿ってその両面に配列形成された複数の電極を含む
基板コネクタ部分が挿入されて、これら第1の回路基板
及び第2の回路基板を互いに平行に保持し、これら第1
の回路基板と第2の回路基板との間を電気的に接続する
カードエッジコネクタであって、前記第1の回路基板及
び第2の回路基板それぞれの外側の面に配列形成された
複数の電極の間を対応接続する、前記第1の発明のカー
ドエッジコネクタに加え、それぞれが、前記第1の回路
基板の内側の面の対応する電極と接触接続するための第
1の接触部と、前記第2の回路基板の内側の面の対応す
る電極と接触接続するための第2の接触部と、前記第1
の接触部と前記第2の接触部との間を略U字状につな
ぎ、この略U字状の開口側では、これら第1の接触部及
び第2の接触部を含む開口端に近づく程その間隔が広く
なる形状のばね部と、を備え、弾性導電体で一体形成さ
れた、複数の内側電極間接続用コンタクトを、そのイン
シュレータの仕切板の、第1の平面及び第2の平面を成
す部分に、それぞれの第1の接触部が前記仕切板の第1
の斜面の延長面からは突出することなく前記第1の平面
からは突出し、それぞれの第2の接触部が前記仕切板の
第2の斜面の延長面からは突出することなく前記第2の
平面からは突出して弾性変位可能なように配列、保持固
定して成るものである。According to a third aspect of the present invention, there is provided a card edge connector comprising: a first circuit board and a second circuit board;
A board connector portion including a plurality of electrodes arranged and formed on both sides thereof is inserted along the side to hold the first circuit board and the second circuit board in parallel with each other.
A card edge connector for electrically connecting between the first circuit board and the second circuit board, the plurality of electrodes being arrayed on outer surfaces of the first circuit board and the second circuit board, respectively. And a first contact portion for contact-connecting with a corresponding electrode on an inner surface of the first circuit board, in addition to the card edge connector of the first invention, wherein A second contact portion for contacting connection with a corresponding electrode on the inner surface of the second circuit board;
And the second contact portion are connected in a substantially U-shape. On the substantially U-shaped opening side, the closer to the opening end including the first contact portion and the second contact portion, And a spring portion having a shape with a widened interval, wherein a plurality of contacts for connection between the inner electrodes, which are integrally formed of an elastic conductor, are connected to a first plane and a second plane of a partition plate of the insulator. The first contact portion is formed on the first portion of the partition plate.
Protruding from the first plane without protruding from the extension surface of the slope of the second plane, and each second contact portion does not protrude from the extension surface of the second slope of the partition plate. , And are arranged and held so as to be elastically displaceable.
【0017】また、本願第1の発明又は第2の発明又は
第3の発明のカードエッジコネクタに加え、第1の回路
基板及び第2の回路基板を互いに平行に保持固定する、
基板保持部材を備えて構成される。Further, in addition to the card edge connector of the first invention, the second invention or the third invention of the present application, the first circuit board and the second circuit board are held and fixed in parallel with each other.
It comprises a substrate holding member.
【0018】[0018]
【発明の実施の形態】本発明の第1の実施の形態は、第
1の回路基板及び第2の回路基板それぞれの、1辺に沿
ってその一方の面に配列形成された複数の電極を含む基
板コネクタ部分が挿入されて、これら第1の回路基板及
び第2の回路基板を、互いに平行に、かつその基板コネ
クタの電極形成面が外側となるように保持し、これら第
1の回路基板と第2の回路基板との間を電気的に接続す
るカードエッジコネクタであって、複数の外側電極間接
続用コンタクトとインシュレータとを有して構成され、
これら各部の詳細は次のとおりである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a first embodiment of the present invention, a plurality of electrodes arrayed and formed on one surface of a first circuit board and a second circuit board along one side thereof. And the first circuit board and the second circuit board are held in parallel with each other and with the electrode forming surface of the board connector facing outside. A card edge connector for electrically connecting between the second electrode and the second circuit board, comprising: a plurality of outer electrode connection contacts and an insulator;
Details of these components are as follows.
【0019】複数の外側電極間接続用コンタクトは、そ
れぞれが、上記第1の回路基板の対応する電極と接触接
続するための第1の接触部と、上記第2の回路基板の対
応する電極と接触接続するための第2の接触部と、上記
第1の接触部と上記第2の接触部との間をコの字状につ
なぐばね部と、このばね部の予め定められた部位に設け
られた保持固定部と、を備え、弾性導電体で一体形成さ
れている。Each of the plurality of outer electrode-to-electrode connection contacts has a first contact portion for making contact connection with a corresponding electrode of the first circuit board, and a corresponding contact electrode of the second circuit board. A second contact portion for contact connection, a spring portion for connecting the first contact portion and the second contact portion in a U-shape, and a spring portion provided at a predetermined portion of the spring portion And a holding / fixing portion, and are integrally formed of an elastic conductor.
【0020】インシュレータは、上記第1の回路基板及
び第2の回路基板それぞれの基板コネクタ部分が挿入さ
れてこれを保持するときに、上記基板コネクタの先端部
分を当接させる基板先端保持壁を含む基板コネクタ保持
部と、上記複数の外側電極間接続用コンタクトを、その
第1の接触部及び第2の接触部が上記基板コネクタ保持
部内に配置されて弾性変位可能なように、それぞれの保
持固定部で保持、固定して配列するコンタクト保持部
と、上記第1の回路基板及び第2の回路基板を、そのそ
れぞれの内側の面に接触して互いに平行に保持する第1
の平面及び第2の平面、並びに、これら第1の平面及び
第2の平面それぞれとつながり、1つの辺に近づく程そ
の間隔が狭くなる第1の斜面及び第2の斜面を含む仕切
板と、を備え、この仕切板の第1の斜面及び第2の斜面
並びに上記1つの辺の部分が、上記複数の外側電極間接
続用コンタクトの第1の接触部及び第2の接触部の間
に、上記1つの辺と上記基板コネクタ保持部の基板先端
保持壁との間に予め設定された間隙を隔てて配置され、
かつ、上記第1の斜面及びその延長面と上記第1の接触
部との間の間隔が上記第1の回路基板の厚さ寸法と同程
度かそれ以上、上記第2の斜面及びその延長面と上記第
2の接触部との間の間隔が上記第2の回路基板の厚さ寸
法と同程度かそれ以上であり、上記第1の平面及びその
延長面と上記第1の接触部との間の間隔が上記第1の回
路基板の厚さ寸法より狭く、上記第2の平面及びその延
長面と上記第2の接触部との間の間隔が上記第2の回路
基板の厚さ寸法より狭くなるように配置されている。The insulator includes a board tip holding wall for abutting the tip of the board connector when the board connector portion of each of the first circuit board and the second circuit board is inserted and held. The board connector holding portion and the plurality of outer electrode connection contacts are respectively held and fixed such that the first contact portion and the second contact portion are disposed in the board connector holding portion and can be elastically displaced. And a first holding unit that holds the first circuit board and the second circuit board in parallel with each other by contacting the inner surfaces thereof.
And a partition plate including a first slope and a second slope connected to the first plane and the second plane, respectively, and the distance between the first and second planes is reduced as approaching one side. Wherein the first slope and the second slope of the partition plate and the one side portion are located between the first contact portion and the second contact portion of the plurality of outer electrode-to-electrode connection contacts. A predetermined gap is arranged between the one side and the board tip holding wall of the board connector holding unit,
The distance between the first slope and the extension thereof and the first contact portion is equal to or greater than the thickness of the first circuit board, and the second slope and the extension thereof are provided. A distance between the first contact portion and the first contact portion is equal to or greater than a thickness dimension of the second circuit board; The distance between the second contact surface and the second plane is smaller than the thickness of the second circuit board, and the distance between the second plane and its extended surface and the second contact portion is smaller than the thickness of the second circuit board. It is arranged to be narrow.
【0021】このような構成、構造とすることにより、
はんだ付け作業をすることなく、またそのための工具や
設備なしに手軽に2枚の回路基板間を電気的に接続する
ことができるようにした上で、2枚の回路基板を斜め挿
入することにより、その挿入力をゼロにすることができ
てコンタクトや基板コネクタの電極が損傷するのを防止
することができ、しかも、2枚の回路基板及び仕切板を
1つのコンタクトの第1,第2の接触部で挟みつけてこ
れら回路基板を電気的に接続する構造となっているの
で、これら回路基板間の間隔を狭くすることができ、か
つ複数のコンタクトはその接触部が互いに独立している
ので、それぞれに適正な接触圧力を与えることができ
て、接触不良が発生する危険性をなくすことができる。With such a configuration and structure,
By making it possible to easily electrically connect the two circuit boards without soldering and without any tools or equipment for that purpose, by inserting the two circuit boards diagonally The insertion force can be reduced to zero to prevent the contacts and the electrodes of the board connector from being damaged. In addition, the two circuit boards and the partition plate can be connected to the first and second contacts of one contact. Since the structure is such that these circuit boards are electrically connected to each other by being sandwiched between the contact portions, the interval between the circuit boards can be reduced, and since the contact portions of the plurality of contacts are independent of each other, In addition, it is possible to apply an appropriate contact pressure to each of them, and it is possible to eliminate a risk of occurrence of poor contact.
【0022】本発明の第2の実施の形態は、第1の回路
基板及び第2の回路基板それぞれの、1辺に沿ってその
一方の面に配列形成された複数の電極を含む基板コネク
タ部分が挿入されて、これら第1の回路基板及び第2の
回路基板を、互いに平行に、かつその基板コネクタの電
極形成面が内側となるように保持し、これら第1の回路
基板と第2の回路基板との間を電気的に接続するカード
エッジコネクタであって、複数の内側電極間接続用コン
タクトとインシュレータとを有して構成され、これら各
部の詳細は次のとおりである。A second embodiment of the present invention is directed to a board connector portion including a plurality of electrodes arrayed on one surface along one side of each of a first circuit board and a second circuit board. Is inserted to hold the first circuit board and the second circuit board in parallel with each other and with the electrode forming surface of the board connector facing inward. A card edge connector for electrically connecting with a circuit board, the card edge connector including a plurality of contacts for connection between inner electrodes and an insulator, and details of these components are as follows.
【0023】複数の内側電極間接続用コンタクトは、そ
れぞれが、上記第1の回路基板の対応する電極と接触接
続するための第1の接触部と、上記第2の回路基板の対
応する電極と接触接続するための第2の接触部と、上記
第1の接触部と上記第2の接触部との間を略U字状につ
なぎ、この略U字状の開口側では、これら第1の接触部
及び第2の接触部を含む開口端に近づく程その間隔が広
くなる形状のばね部と、を備え、弾性導電体で一体形成
されている。Each of the plurality of inner-electrode connection contacts has a first contact portion for contacting connection with a corresponding electrode of the first circuit board, and a corresponding contact electrode of the second circuit board. A second contact portion for contact connection is connected in a substantially U-shape between the first contact portion and the second contact portion, and the first U-shaped opening side connects the first contact portion with the first contact portion. A spring portion having a shape in which the distance between the contact portion and the second contact portion is increased as approaching the opening end including the contact portion and the second contact portion.
【0024】インシュレータは、上記第1の回路基板及
び第2の回路基板それぞれの基板コネクタ部分が挿入さ
れてこれを保持するときに、これら第1,第2の回路基
板それぞれの外側の面を接触させる、互いに平行な第1
の基板外面保持壁及び第2の基板外面保持壁、並びに、
基板挿入、保持時にこれら第1,第2の回路基板の基板
コネクタ先端部分を当接させる基板先端保持壁を含む基
板コネクタ保持部と、上記第1の基板外面保持壁の壁面
を含む平面と平行でその間隔が上記第1の回路基板の厚
さ寸法より広い第1の平面、及び上記第2の基板外面保
持壁の壁面を含む平面と平行でその間隔が上記第2の回
路基板の厚さ寸法より広い第2の平面、並びにこれら第
1,第2の平面それぞれとつながり、1つの辺に近づく
程その間隔が狭くなる第1の斜面及び第2の斜面を含
み、上記第1の平面及び第2の平面を成す部分に、上記
複数の内側電極間接続用コンタクトを、そのそれぞれの
第1の接触部が上記第1の斜面の延長面からは突出する
ことなく上記第1の平面からは突出し、そのそれぞれの
第2の接触部が上記第2の斜面の延長面からは突出する
ことなく上記第2の平面からは突出して弾性変位可能な
ように配列保持固定するコンタクト保持部が設けられた
仕切板と、を備え、この仕切板の第1の斜面及び第2の
斜面並びに1つの辺の部分が、上記基板コネクタ保持部
内に、上記1つの辺と上記基板先端保持壁との間に予め
設定された間隙を隔てて配置され、かつ、上記第1の斜
面及びその延長面と上記第1の基板外面保持壁との間の
最小間隔が上記第1の回路基板の厚さ寸法と同程度かそ
れ以上、上記第2の斜面及びその延長面と上記第2の基
板外面保持壁との間の最小間隔が上記第2の回路基板の
厚さ寸法と同程度かそれ以上であり、上記第1の基板外
面保持壁の壁面を含む平面と上記第1の接触部との間の
間隔が上記第1の回路基板の厚さ寸法より狭く、上記第
2の基板外面保持壁の壁面を含む平面と上記第2の接触
部との間の間隔が上記第2の回路基板の厚さ寸法より狭
くなるように配置されている。When the board connector portions of the first circuit board and the second circuit board are inserted and held, the insulator contacts the outer surfaces of the first and second circuit boards. Let the first parallel to each other
A substrate outer surface holding wall and a second substrate outer surface holding wall, and
A board connector holding portion including a board tip holding wall for bringing the board connector tip portions of the first and second circuit boards into contact when the board is inserted and held, and a plane parallel to the plane including the wall surface of the first board outer surface holding wall. The distance between the first plane and the plane including the wall surface of the second substrate outer surface holding wall is larger than the thickness of the first circuit board, and the distance is parallel to the thickness of the second circuit board. A second plane wider than the dimension, and a first slope and a second slope connected to each of the first and second planes, and the distance between the first plane and the second plane decreases as approaching one side; The plurality of inner electrode-to-electrode connection contacts are provided on the portion forming the second plane, and the respective first contact portions are not protruded from the extension surface of the first slope but are protruded from the first plane. Protruding, the respective second contact portions of which A partition plate provided with a contact holding portion that projects from the second flat surface without protruding from the extension surface of the second inclined surface and is arranged and fixed so as to be elastically displaceable. The first slope, the second slope, and one side portion are disposed in the board connector holding portion with a preset gap between the one side and the board tip holding wall, and A minimum distance between the first slope and its extension surface and the first board outer surface holding wall is equal to or greater than a thickness dimension of the first circuit board, and the second slope and its extension A minimum distance between the surface and the second board outer surface holding wall is equal to or greater than a thickness dimension of the second circuit board, and a plane including a wall surface of the first board outer surface holding wall; The distance between the first contact portion and the first contact portion is the thickness dimension of the first circuit board. Ri narrow spacing between the planar and the second contact portion including the wall surface of the second substrate outer surface retaining wall is arranged to be narrower than the thickness of the second circuit board.
【0025】このような構成、構造とすることにより、
2枚の回路基板の間には、これら回路基板それぞれの、
内側の面に形成された電極間を加圧接触接続する、内側
電極間接続用コンタクトが、仕切板に配列保持固定され
て挟持されるだけであるので、これら2枚の回路基板間
の間隔を狭くすることができる。また、その他の作用効
果は第1の実施の形態と同様である。With such a configuration and structure,
Between the two circuit boards, each of these circuit boards,
The contact between the electrodes formed on the inner surface is press-contacted and connected between the two electrodes. Can be narrow. Other functions and effects are the same as those of the first embodiment.
【0026】本発明の第3の実施の形態は、第1の回路
基板及び第2の回路基板それぞれの、1辺に沿ってその
両面に配列形成された複数の電極を含む基板コネクタ部
分が挿入されて、これら第1の回路基板及び第2の回路
基板を互いに平行に保持し、これら第1の回路基板と第
2の回路基板との間を電気的に接続するカードエッジコ
ネクタであって、前述した第1の実施の形態に第2の実
施の形態の複数の内側電極間接続用コンタクトを結合さ
せた構成、構造を有している。According to a third embodiment of the present invention, a board connector portion including a plurality of electrodes arrayed on both sides of one side of a first circuit board and a second circuit board is inserted. A card edge connector for holding the first circuit board and the second circuit board in parallel with each other and electrically connecting the first circuit board and the second circuit board, It has a configuration and structure in which the plurality of contacts for connection between inner electrodes of the second embodiment are coupled to the first embodiment described above.
【0027】このような構成、構造とすることにより、
前述した第1,第2の実施の形態と同様の作用効果を有
すると同時に、2枚の回路基板それぞれの両面に形成さ
れた電極に対する電気的接続が容易になって、より一層
多芯接続することができる、という作用効果がある。With such a configuration and structure,
It has the same function and effect as the above-described first and second embodiments, and at the same time, the electrical connection to the electrodes formed on both surfaces of each of the two circuit boards is facilitated, and the multi-core connection is further achieved. There is an operational effect that it can be performed.
【0028】[0028]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。図1(a),(b)は本発明の第1の実施
例を示す、部分断面平面図及びそのA−A矢視断面側面
図である。この第1の実施例は、第1の回路基板800
及び第2の回路基板900それぞれの、1辺に沿ってそ
の一方の面に配列形成された複数の電極を含む基板コネ
クタ部分が挿入されてこれら回路基板800,900
を、互いに平行に、かつその基板コネクタの電極形成面
が外側となるように保持し、これら回路基板800,9
00間を電気的に接続するカードエッジコネクタであっ
て、複数の、外側電極間接続用のコンタクト100と、
インシュレータ300と、基板保持部材400と、を有
する構成となっており、これらの詳細は次のとおりであ
る。Next, embodiments of the present invention will be described with reference to the drawings. FIGS. 1A and 1B are a partial cross-sectional plan view and a cross-sectional side view taken along the line AA of the first embodiment of the present invention. The first embodiment is different from the first circuit board 800 in FIG.
And a board connector portion including a plurality of electrodes arrayed on one surface along one side of each of the second circuit board 900 and the second circuit board 900, and these circuit boards 800 and 900 are inserted.
Are held in parallel with each other and with the electrode forming surface of the board connector on the outside.
A card edge connector for electrically connecting between the outer electrodes, a plurality of contacts 100 for connection between outer electrodes,
It has a configuration including an insulator 300 and a substrate holding member 400, and details thereof are as follows.
【0029】複数の外側電極間接続用のコンタクト10
0(以下、単にコンタクト100という)は、それぞれ
が、回路基板800の(基板コネクタ部分の)対応する
電極と接触接続するための第1の接触部110と、回路
基板900の(基板コネクタ部分の)対応する電極と接
触接続するための第2の接触部120と、接触部110
と接触部120との間をコの字状につなぐばね部130
と、このばね部130の、コの字状の縦棒部分の中間部
位に、コの字状の内側に突出するよう設けられた保持固
定部140と、を備え、弾性導電体(例えば金属)で一
体形成されている。A plurality of contacts 10 for connection between outer electrodes
0 (hereinafter, simply referred to as contacts 100) are first contact portions 110 for contacting and connecting to corresponding electrodes (of the board connector portion) of the circuit board 800, respectively. A) a second contact 120 for contacting connection with a corresponding electrode;
Spring portion 130 connecting between the contact portion 120 and the contact portion 120
And a holding and fixing portion 140 provided at an intermediate portion of the U-shaped vertical bar portion of the spring portion 130 so as to protrude inwardly of the U-shape, and an elastic conductor (for example, metal) It is formed integrally.
【0030】インシュレータ300は、回路基板80
0,900の基板コネクタ部分が挿入されてこれを保持
するための、基板挿入時、保持時に、基板コネクタの先
端部分を当接させる基板先端保持壁341を含む基板コ
ネクタ保持部340と、複数のコンタクト100を、そ
の接触部110,120が基板コネクタ保持部340内
に配置されて弾性変位可能なように、対応するスリット
320に挿入してそれぞれの保持固定部140で保持、
固定し、配列するコンタクト保持部310と、回路基板
800,900を、そのそれぞれの内側の面に接触して
互いに平行に保持する第1の平面及び第2の平面、並び
に、これら2つの平面それぞれとつながり、1つの辺に
近づく程、その間隔が狭くなる第1の斜面及び第2の斜
面を含む、仕切板330と、を備え、この仕切板330
の、2つの斜面及び1つの辺の部分が、複数のコンタク
ト100の接触部110,120の間に、1つの辺と基
板先端保持壁341との間に予め設定された間隙を隔て
て配置され、かつ、第1の斜面及びその延長面と第1の
接触部110との間の間隔が第1の回路基板800の厚
さ寸法と同程度かそれ以上、第2の斜面及びその延長面
と第2の接触部120との間の間隔が第2の回路基板9
00の厚さ寸法と同程度かそれ以上であり、第1の平面
及びその延長面と第1の接触部110との間の間隔が第
1の回路基板800の厚さ寸法より狭く、第2の平面及
びその延長面と第2の接触部120との間の間隔が第2
の回路基板900の厚さ寸法より狭くなるように配置さ
れている。The insulator 300 is mounted on the circuit board 80.
A board connector holding portion 340 including a board tip holding wall 341 for contacting the tip portion of the board connector at the time of inserting and holding the board for inserting and holding the board connector portion of 0,900; The contacts 100 are inserted into the corresponding slits 320 and held by the respective holding / fixing portions 140 so that the contact portions 110 and 120 are disposed within the board connector holding portion 340 and can be elastically displaced.
First and second planes for fixing and arranging the contact holding portion 310 and the circuit boards 800 and 900 in parallel with each other by contacting the inner surfaces thereof, and each of these two planes. And a partition plate 330 including a first slope and a second slope, the spacing of which decreases as approaching one side.
Are disposed between the contact portions 110 and 120 of the plurality of contacts 100 with a predetermined gap between one side and the substrate tip holding wall 341. The distance between the first contact surface 110 and the first slope and the extension surface thereof is equal to or greater than the thickness dimension of the first circuit board 800, and the distance between the second slope and the extension surface thereof is The interval between the second contact portion 120 and the second circuit board 9
00, the distance between the first contact surface 110 and the first plane and its extended surface and the first contact portion 110 is smaller than the thickness of the first circuit board 800, The distance between the second contact portion 120 and the plane of the
Are arranged to be smaller than the thickness dimension of the circuit board 900 of FIG.
【0031】また、基板保持部材400は、2枚の回路
基板800,900を、その保持時に、その基板コネク
タとは逆側の辺の部分を保持固定して、互いに平行に保
持する。The board holding member 400 holds the two circuit boards 800 and 900 in parallel with each other when holding the two circuit boards 800 and 900 by holding and fixing the side of the side opposite to the board connector.
【0032】この第1の実施例において、回路基板80
0,900の基板コネクタ部分は、図1(b)の2点鎖
線及び矢印で示すように、第1の斜面と第1の接触部1
10との間、及び第2の斜面と第2の接触部120との
間に、その内側の面がそれぞれの斜面に接触するように
挿入されてその1つの辺(回路基板の先端)が基板先端
保持壁341に当接するまで挿入される。この後、回路
基板800,900を、その内側の面が仕切板330の
第1,第2の平面に接触するように回転させて互いに平
行となるようにし、その基板コネクタとは逆側の辺の部
分を基板保持部材400で保持固定する。In the first embodiment, the circuit board 80
As shown by a two-dot chain line and an arrow in FIG. 1B, the substrate connector portion 0,900 has a first slope and a first contact portion 1.
10 and between the second inclined surface and the second contact portion 120 such that the inner surface thereof is in contact with each inclined surface, and one side thereof (the front end of the circuit board) is connected to the substrate. It is inserted until it comes into contact with the tip holding wall 341. Thereafter, the circuit boards 800 and 900 are rotated so that the inner surfaces thereof come into contact with the first and second planes of the partition plate 330 so as to be parallel to each other, and the side opposite to the board connector Is held and fixed by the substrate holding member 400.
【0033】回路基板800,900の挿入時には、斜
面と接触部(110,120)との間の間隔がこれら回
路基板800,900の厚さ寸法と同程度かそれ以上と
なっているので、挿入力ゼロで挿入することができ、コ
ンタクト100の接触部110,120や回路基板80
0,900の基板コネクタ部分の電極を損傷することは
ない。また、回路基板800,900が互いに平行に保
持されると、その内側の面を接触させている仕切板33
0の第1,第2の平面及びその延長面と、第1,第2の
接触部110,120との間の間隔が、これら回路基板
の厚さ寸法より小さくなっているので、接触部110,
120は、これら回路基板800,900の対応する電
極に加圧接触する。このとき、接触部110,120
は、複数のコンタクト100それぞれのスリット320
内でその変位が妨げられることはなく、かつ互いに独立
しているので、それぞれ適正な接触圧力で対応する電極
に加圧接触することになり、接触不良が発生することは
ない。When the circuit boards 800 and 900 are inserted, the distance between the slopes and the contact portions (110 and 120) is equal to or greater than the thickness of the circuit boards 800 and 900. It can be inserted with zero force, and the contact portions 110 and 120 of the contact 100 and the circuit board 80
The electrodes of the 0,900 board connector are not damaged. Further, when the circuit boards 800 and 900 are held in parallel with each other, the partition plate 33 contacting the inner surface thereof.
Since the distance between the first and second planes 0 and the extension surfaces thereof and the first and second contact portions 110 and 120 is smaller than the thickness dimension of these circuit boards, the contact portion 110 ,
120 makes pressure contact with the corresponding electrodes of these circuit boards 800 and 900. At this time, the contact portions 110 and 120
Is a slit 320 of each of the plurality of contacts 100.
Since the displacements are not hindered and are independent of each other, they come into pressure contact with the corresponding electrodes with appropriate contact pressures, and no contact failure occurs.
【0034】また、この第1の実施例においては、2枚
の回路基板800,900及び仕切板330を、1つの
コンタクト100の接触部110,120の間に挟みつ
けてこれら回路基板800,900間を電気的に接続す
る構造となっているので、これら回路基板800,90
0間の間隔を狭くすることができる。また、これまでの
説明でも分かるように、はんだ付け作業やそのための工
具・設備は必要なく、2枚の回路基板を挿入して互いに
平行に保持する、という単純な作業で、手軽にこれら2
枚の回路基板間を電気的に接続することができる。In the first embodiment, two circuit boards 800 and 900 and a partition plate 330 are sandwiched between the contact portions 110 and 120 of one contact 100, and these circuit boards 800 and 900 The circuit boards 800 and 90 are electrically connected to each other.
The interval between zeros can be narrowed. Also, as can be seen from the above description, there is no need for a soldering operation or tools and equipment for the soldering operation, and a simple operation of inserting two circuit boards and holding them in parallel with each other is simple.
The two circuit boards can be electrically connected.
【0035】図2(a),(b)は本発明の第2の実施
例を示す、部分断面平面図及びそのA−A矢視断面側面
図である。この第2の実施例は、第1の回路基板800
a及び第2の回路基板900aそれぞれの、1辺に沿っ
てその一方の面に配列形成された複数の電極を含む基板
コネクタ部分が挿入されてこれら回路基板800a,9
00aを、互いに平行に、かつその基板コネクタの電極
形成面が内側となるように保持し、これら回路基板80
0a,900aを電気的に接続するカードエッジコネク
タであって、複数の、内側電極間接続用のコンタクト2
00と、インシュレータ300aと、基板保持部材40
0と、を有して構成され、これらの詳細は次のとおりで
ある。FIGS. 2A and 2B are a partial cross-sectional plan view and a cross-sectional side view taken along the line AA of the second embodiment of the present invention. In the second embodiment, the first circuit board 800
a and a second circuit board 900a, a board connector portion including a plurality of electrodes arrayed on one side thereof is inserted along one side of each of the circuit boards 800a and 900a.
00a are held in parallel with each other and the electrode forming surface of the board connector faces inward.
And a plurality of contacts 2 for connection between inner electrodes.
00, the insulator 300a, and the substrate holding member 40
0, and details thereof are as follows.
【0036】複数の内側電極間接続用のコンタクト20
0(以下、単にコンタクト200という)は、それぞれ
が、回路基板800aの(基板コネクタ部分の)対応す
る電極と接触接続するための第1の接触部210と、回
路基板900aの対応する電極と接触接続するための第
2の接触部220と、これら接触部210,220間を
略U字状につなぎ、この略U字状の開口側では、これら
接触部210,220を含む開口端に近づく程、その間
隔が広くなるような形状のばね部230と、を備え、弾
性導電体(金属等)で一体形成されている。A plurality of contacts 20 for connection between inner electrodes
0 (hereinafter simply referred to as a contact 200) is a first contact portion 210 for contacting and connecting with a corresponding electrode (of the board connector portion) of the circuit board 800a, and a contact portion with a corresponding electrode of the circuit board 900a. The second contact portion 220 for connection and the contact portions 210 and 220 are connected to each other in a substantially U-shape. On the substantially U-shaped opening side, the closer to the opening end including these contact portions 210 and 220, And a spring portion 230 having such a shape that the interval is widened, and is integrally formed of an elastic conductor (metal or the like).
【0037】インシュレータ300aは、回路基板80
0a,900aそれぞれの基板コネクタ部分が挿入され
てこれを保持するときに、これら回路基板800a,9
00aの外側の面を接触させる、互いに平行な第1の基
板外面保持壁342及び第2の基板外面保持壁343、
並びに基板挿入、保持時にこれら回路基板800a,9
00aの基板コネクタ先端部分を当接させる基板先端保
持壁341を含む基板コネクタ保持部340aと、第1
の基板外面保持壁342の壁面を含む平面と平行でその
間隔が第1の回路基板800aの厚さ寸法より広い第1
の平面、及び第2の基板外面保持壁343の壁面を含む
平面と平行でその間隔が第2の回路基板900aの厚さ
寸法より広い第2の平面、並びに、これら第1,第2の
平面それぞれとつながり、1つの辺に近づく程、その間
隔が狭くなる第1の斜面及び第2の斜面を含み、これら
第1の平面及び第2の平面を成す部分に、複数の溝33
1aが形成されていてこれらの溝331aに複数のコン
タクト200を挿入、保持固定して、その接触部21
0,220の部分が、第1,第2の平面から突出し、か
つ第1,第2の斜面の延長面より突出しないように配列
するコンタクト保持部が設けられた仕切板330aと、
を備え、この仕切板330aの、第1,第2の斜面及び
1つの辺の部分が、基板コネクタ保持部340a内に、
この1つの辺と基板先端保持壁341との間に予め設定
された間隙を隔てて配置され、かつ、第1の斜面及びそ
の延長面と第1の基板外面保持壁342との間の最小間
隔が第1の回路基板800aの厚さ寸法と同程度かそれ
以上、第2の斜面及びその延長面と第2の基板外面保持
壁343との間の最小間隔が第2の回路基板900aの
厚さ寸法と同程度かそれ以上であり、第1の基板外面保
持壁342の壁面を含む平面と第1の接触部210との
間の間隔が第1の回路基板800aの厚さ寸法より狭
く、第2の基板外面保持壁343の壁面を含む平面と第
2の接触部220との間の間隔が第2の回路基板900
aの厚さ寸法より狭くなるように配置されている。The insulator 300a is connected to the circuit board 80.
When the circuit board connectors of the circuit boards 800a and 900a are inserted and held, respectively.
A first substrate outer surface holding wall 342 and a second substrate outer surface holding wall 343 which are in parallel with each other,
In addition, these circuit boards 800a, 9
A board connector holding portion 340a including a board tip holding wall 341 for abutting a board connector tip portion of the first board connector 340a;
The first surface of the first circuit board 800a is parallel to a plane including the wall surface of the board outer surface holding wall 342 and the interval thereof is larger than the thickness dimension of the first circuit board 800a.
And a second plane parallel to the plane including the wall surface of the second substrate outer surface holding wall 343 and having an interval larger than the thickness dimension of the second circuit board 900a, and the first and second planes It includes a first slope and a second slope, which are connected to each other and the distance between them becomes smaller as approaching one side, and a plurality of grooves 33 are formed in a portion forming the first plane and the second plane.
1a is formed, a plurality of contacts 200 are inserted and held and fixed in these grooves 331a, and the contact portions 21 are formed.
A partition plate 330a provided with a contact holding portion in which a portion 0, 220 protrudes from the first and second planes and does not protrude from an extension surface of the first and second slopes;
The first and second slopes and one side portion of the partition plate 330a are disposed in the board connector holding portion 340a.
A predetermined gap is provided between the one side and the substrate tip holding wall 341, and a minimum distance between the first inclined surface and its extension surface and the first substrate outer surface holding wall 342. Is equal to or greater than the thickness dimension of the first circuit board 800a, and the minimum distance between the second slope and its extension and the second board outer surface holding wall 343 is the thickness of the second circuit board 900a. The distance between the first contact portion 210 and a plane including the wall surface of the first substrate outer surface holding wall 342 is smaller than the thickness dimension of the first circuit board 800a. The distance between the plane including the wall surface of the second substrate outer surface holding wall 343 and the second contact portion 220 is the second circuit substrate 900.
It is arranged to be smaller than the thickness dimension of a.
【0038】また、基板保持部材400は、2枚の回路
基板800a,900aを、その保持時に、その基板コ
ネクタとは逆側の辺の部分を保持固定して、互いに平行
に保持する。The board holding member 400 holds the two circuit boards 800a and 900a in parallel with each other when holding the circuit boards 800a and 900a by holding and fixing the side of the side opposite to the board connector.
【0039】この第2の実施例において、回路基板80
0a,900aの基板コネクタ部分は、第1の実施例と
同様に、その内側の面を仕切板330aの第1,第2の
斜面に接触させるように斜め方向に挿入されて、その1
つの辺(回路基板の先端)が基板先端保持壁341に当
接するまで挿入される。そして、これら回路基板800
a,900aを、それぞれの外側の面が基板外面保持壁
342,343に接触するまで回転させて、これら基板
外面保持壁342,343と基板保持部材400とによ
り、互いに平行に保持、固定する。このとき、回路基板
800a,900aそれぞれの内側の面に配列形成され
ている複数の電極間が、対応するコンタクト200によ
って加圧接触接続される。In the second embodiment, the circuit board 80
As in the first embodiment, the board connector portions 0a and 900a are inserted obliquely so that the inner surface thereof contacts the first and second slopes of the partition plate 330a.
One side (tip of the circuit board) is inserted until it contacts the board tip holding wall 341. And these circuit boards 800
a, 900a are rotated until their outer surfaces contact the substrate outer surface holding walls 342, 343, and are held and fixed in parallel by the substrate outer surface holding walls 342, 343 and the substrate holding member 400. At this time, the plurality of electrodes arranged and formed on the inner surfaces of the circuit boards 800a and 900a are connected under pressure by the corresponding contacts 200.
【0040】回路基板800a,900a挿入時の、仕
切板330aの第1,第2の斜面に対する基板外面保持
壁342,343の最小間隔は、これら回路基板の厚さ
寸法と同程度となっており、その延長部分にコンタクト
200がはみ出すこともないので、これら回路基板80
0a,900aを挿入力ゼロで挿入することができ、そ
の電極やコンタクト200に損傷を与えることはない。
また、複数のコンタクト200それぞれの接触部21
0,220は、その変位が妨げられることなく、かつ、
これらは互いに独立しているので、それぞれ適正な接触
圧力で対応する電極に接触し、接触不良が発生すること
はない。When the circuit boards 800a and 900a are inserted, the minimum distance between the board outer surface holding walls 342 and 343 with respect to the first and second slopes of the partition plate 330a is substantially equal to the thickness of these circuit boards. Since the contact 200 does not protrude from the extension of the circuit board 80,
0a and 900a can be inserted with no insertion force, and the electrodes and contacts 200 are not damaged.
Also, the contact portions 21 of each of the plurality of contacts 200
0,220, without its displacement being impeded, and
Since these are independent of each other, they come into contact with the corresponding electrodes at appropriate contact pressures, and no contact failure occurs.
【0041】また、回路基板800a,900a間に
は、仕切板330aに保持固定されたコンタクト200
が挟み込まれるだけであるので、これら回路基板間の間
隔を狭くすることができる。なお、はんだ付け作業がな
く手軽に2枚の回路基板間を電気的に接続できる点につ
いても、第1の実施例と同様である。A contact 200 held and fixed to a partition plate 330a is provided between the circuit boards 800a and 900a.
Is merely sandwiched, so that the space between these circuit boards can be reduced. The point that two circuit boards can be easily electrically connected without soldering is also the same as in the first embodiment.
【0042】図3(a),(b)は本発明の第3の実施
例を示す、部分断面平面図、及びそのA−A矢視断面側
面図である。この第3の実施例は、前述の第1の実施例
のカードエッジコネクタに加え、そのインシュレータの
仕切板330を、その第1,第2の平面を成す部分に複
数の溝331bを形成して仕切板330bとし、前述の
第2の実施例における複数の内側電極間接続用のコンタ
クト200を、仕切板330bの複数の溝331bに、
それぞれの第1の接触部210が仕切板330bの第1
の斜面の延長面からは突出することなく第1の平面から
は突出し、それぞれの第2の接触部220が第2の斜面
の延長面からは突出することなく第2の平面からは突出
して弾性変位可能なように保持固定して配列した構成、
構造となっている。FIGS. 3A and 3B are a partial cross-sectional plan view and a cross-sectional side view taken along the line AA of the third embodiment of the present invention. In the third embodiment, in addition to the card edge connector of the above-described first embodiment, a partition plate 330 of the insulator is formed by forming a plurality of grooves 331b in portions forming the first and second planes. As the partition plate 330b, the plurality of contacts 200 for connection between the inner electrodes in the second embodiment described above are inserted into the plurality of grooves 331b of the partition plate 330b.
Each of the first contact portions 210 is the first contact portion 210 of the partition plate 330b.
The second contact portions 220 protrude from the second plane without protruding from the extension surface of the second slope without protruding from the extension surface of the second slope. A configuration in which it is held and fixed so that it can be displaced,
It has a structure.
【0043】この第3の実施例においては、前述の第1
の実施例及び第2の実施例と同様の作用効果を有するほ
か、2枚の回路基板それぞれの両面に形成された複数の
電極間の電気的接続が容易になって、より一層、多芯接
続することができる、という効果がある。In the third embodiment, the first
In addition to having the same operation and effect as the embodiments and the second embodiment, the electrical connection between a plurality of electrodes formed on both surfaces of each of the two circuit boards is facilitated, and the multi-core connection is further improved. There is an effect that can be.
【0044】[0044]
【発明の効果】以上説明したように本発明は、接続対象
の第1,第2の回路基板それぞれの外側の面に形成され
た複数の電極間を電気的に接続する場合には、それぞれ
が、第1,第2の接触部をコの字状につなぐばね部を備
えて成る、複数の外側電極間接続用のコンタクトを、イ
ンシュレータに、第1,第2の接触部から弾性変位可能
なように保持固定配列し、このインシュレータには、互
いに平行な第1,第2の平面と、これら平面につなが
り、1つの辺に近づく程その間隔が狭くなる、第1,第
2の斜面とを含む仕切板を、その斜面及び1つの辺の部
分を、複数の外側電極間接続用のコンタクトの第1,第
2の接触部の間に配置されるように設け、かつ、第1の
斜面及びその延長面と第1の接触部との間の間隔は、挿
入接続対象の第1の回路基板の厚さ寸法と同程度かそれ
以上とし、第2の斜面及びその延長面と第2の接触部と
の間の間隔は、挿入接続対象の第2の回路基板の厚さ寸
法と同程度かそれ以上とし、また、第1の平面及びその
延長面と第1の接触部との間の間隔は第1の回路基板の
厚さ寸法より狭く、第2の平面及びその延長面と第2の
接触部との間の間隔は第2の回路基板の厚さ寸法より狭
くなるように配置する構成、構造とし、第1,第2の回
路基板を、その内側の面を第1,第2の斜面に接触させ
ながら挿入した後、互いに平行となるように保持、固定
することにより、はんだ付け接続することなく、手軽
に、これら第1,第2の回路基板を挿入力ゼロで挿入す
ることができて接触部及び基板電極が損傷するのを防止
することができると同時に、これら回路基板間の間隔を
狭くすることができ、かつ接触不良が発生するのを防止
することができる、という効果があり、第1,第2の回
路基板それぞれの内側の面に形成された複数の電極間を
電気的に接続する場合には、それぞれが、第1,第2の
接触部を略U字状に、その開口側ほど広くなるようにつ
なくばね部を備えて成る、複数の内側電極間接続用のコ
ンタクトを、互いに平行な第1,第2の平行な平面及び
これら平面とつながり1つの辺に近づく程その間隔が狭
くなる、第1,第2の斜面を含んで成る仕切板をインシ
ュレータに設け、この仕切板の平面部分に、その接触部
が、斜面の延長面からは突出することなく平面からは突
出するように保持固定して配列し、そのインシュレータ
には、第1,第2の回路基板それぞれの外側の面と接触
してこれらを平行に保持する第1,第2の基板外面保持
壁と、回路基板の先端が当接する基板先端保持壁とを含
む基板コネクタ保持部を設けて、この基板コネクタ保持
部内に、第1,第2の斜面及び1つの辺の部分が、第1
の斜面及びその延長面と第1の基板外面保持部との間の
最小間隔が第1の回路基板の厚さ寸法と同程度かそれ以
上、第2の斜面及びその延長面と第2の基板外面保持部
との間の最小間隔が第2の回路基板の厚さ寸法と同程度
かそれ以上であり、第1の基板外面保持壁の壁面を含む
平面に対し、第1の接触部との間隔は第1の回路基板の
厚さ寸法より狭く、かつ第1の平面との間隔は第1の回
路基板の厚さ寸法より広く、また、第2の基板外面保持
壁に対し、第2の接触部との間隔は第2の回路基板の厚
さ寸法より狭く、かつ第2の平面との間隔は第2の回路
基板の厚さ寸法より広くなるように配置した構成、構造
とし、第1,第2の回路基板を、その内側の面を第1,
第2の斜面に接触させて挿入した後、互いに平行となる
ように保持、固定することにより、前述の外側電極間接
続の場合と同様の効果があり、また、前述の外側電極間
接続の場合の構成に、前述の内側電極間接続の場合の複
数の内側電極間接続用のコンタクトを組込んだ構成、構
造とすることにより、前述の場合と同様の効果があるほ
か、2つの回路基板それぞれの両面に形成された複数の
電極間を容易に接続することができて、更なる多芯接続
が可能になる、という効果がある。As described above, the present invention is applicable to a case where a plurality of electrodes formed on the outer surfaces of the first and second circuit boards to be connected are electrically connected to each other. A plurality of contacts for connecting between the outer electrodes, each having a spring portion connecting the first and second contact portions in a U-shape, can be elastically displaced from the first and second contact portions to the insulator by the insulator. The insulator is provided with the first and second planes parallel to each other, and the first and second slopes which are connected to these planes and whose distance decreases as approaching one side. A partition plate including the inclined surface and one side portion so as to be arranged between the first and second contact portions of the plurality of contacts for connection between the outer electrodes; The distance between the extension surface and the first contact portion is the distance between the first contact to be inserted and connected. The distance between the second inclined surface and its extended surface and the second contact portion is the same as or larger than the thickness of the second circuit board to be inserted and connected. The distance between the first plane and its extended surface and the first contact portion is smaller than the thickness dimension of the first circuit board, and the distance between the second plane and its extended surface and the The distance between the second contact portion and the second contact portion is smaller than the thickness dimension of the second circuit board. After being inserted while being in contact with the inclined surface of No. 2, the first and second circuit boards are easily inserted with zero insertion force without soldering connection by holding and fixing them so as to be parallel to each other. This can prevent the contact part and the substrate electrode from being damaged, and at the same time, There is an effect that the distance between the boards can be reduced and the occurrence of poor contact can be prevented, and a plurality of electrodes formed on the inner surfaces of the first and second circuit boards, respectively. When electrical connection is made between the plurality of inner electrodes, each of the first and second contact portions is provided in a substantially U-shape and has a spring portion so as to become wider toward the opening side. The contact for inter-connection is formed by a first and second parallel planes parallel to each other and a partition plate including the first and second slopes which are connected to these planes and whose interval decreases as approaching one side. Provided on the insulator, the contact portion is held and fixed on the plane portion of the partition plate so that the contact portion protrudes from the flat surface without protruding from the extension surface of the slope, and the insulator has first and second portions. In contact with the outer surface of each of the two circuit boards A board connector holding portion including first and second board outer surface holding walls for holding them in parallel and a board tip holding wall with which the tip of the circuit board contacts is provided. The second slope and one side portion are the first slope.
The minimum distance between the inclined surface and its extended surface and the first substrate outer surface holding portion is equal to or greater than the thickness dimension of the first circuit board, and the second inclined surface and its extended surface and the second substrate The minimum distance between the first holding portion and the outer surface holding portion is equal to or greater than the thickness dimension of the second circuit board, and the first space between the first contact portion and the flat surface including the wall surface of the first board outer surface holding wall. The interval is smaller than the thickness dimension of the first circuit board, and the interval from the first plane is larger than the thickness dimension of the first circuit board. The structure and the structure are such that the distance from the contact portion is smaller than the thickness of the second circuit board, and the distance from the second plane is larger than the thickness of the second circuit board. , The second circuit board, the inner surface of which is the first,
After being inserted into contact with the second inclined surface, by holding and fixing them so as to be parallel to each other, the same effect as in the case of the above-described connection between the outer electrodes is obtained. By incorporating a plurality of contacts for connection between the inner electrodes in the case of the connection between the inner electrodes described above, the same effect as in the above case can be obtained. In this case, it is possible to easily connect a plurality of electrodes formed on both surfaces of the device, thereby enabling further multi-core connection.
【図1】本発明の第1の実施例を示す、部分断面平面図
及びA−A矢視断面側面図である。FIG. 1 is a partial cross-sectional plan view and a cross-sectional side view taken along the line AA, showing a first embodiment of the present invention.
【図2】本発明の第2の実施例を示す、部分断面平面図
及びA−A矢視断面側面図である。FIG. 2 is a partial cross-sectional plan view and a cross-sectional side view taken along line AA, showing a second embodiment of the present invention.
【図3】本発明の第3の実施例を示す、部分断面平面図
及びA−A矢視断面側面図である。FIG. 3 is a partial cross-sectional plan view and a cross-sectional side view taken along AA, showing a third embodiment of the present invention.
【図4】従来のカードエッジコネクタの第1の例を示す
側面図である。FIG. 4 is a side view showing a first example of a conventional card edge connector.
【図5】従来のカードエッジコネクタの第2の例を示す
断面側面図である。FIG. 5 is a cross-sectional side view showing a second example of a conventional card edge connector.
【図6】従来のカードエッジコネクタの第3の例を示
す、回路基板挿入前の側面図、及び挿入後、平行に保持
した状態の側面図である。FIG. 6 is a side view showing a third example of a conventional card edge connector before a circuit board is inserted, and a side view of a state where the card edge connector is held parallel after the insertion.
100,100x〜100z コンタクト 110,120 接触部 130,131,132 ばね部 140,140z 保持固定部 151,152 挟持・接触部 200,200y コンタクト 210,220 接触部 230 ばね部 300,300a,300b,300x〜300z イ
ンシュレータ 310,310z コンタクト保持部 320,320z スリット 330,330a,330b 仕切板 331a,331b 溝 340,340a 基板コネクタ保持部 341 基板先端保持壁 342,343 基板外面保持壁 400,400z 基板保持部材 500 はんだ付け接続部 600 絶縁フィルム 651,652 基板コネクタ挿入部 700 弾性金属導体 710,720 接触部 800,800a,800b,800x〜800z 回
路基板 900,900a,900b,900x〜900z 回
路基板100, 100x to 100z Contact 110, 120 Contact part 130, 131, 132 Spring part 140, 140z Holding and fixing part 151, 152 Nipping / contact part 200, 200y Contact 210, 220 Contact part 230 Spring part 300, 300a, 300b, 300x 300300z insulator 310, 310z contact holding part 320, 320z slit 330, 330a, 330b partition plate 331a, 331b groove 340, 340a substrate connector holding part 341 substrate tip holding wall 342, 343 substrate outer surface holding wall 400, 400z substrate holding member 500 Solder connection part 600 Insulating film 651, 652 Board connector insertion part 700 Elastic metal conductor 710, 720 Contact part 800, 800a, 800b, 800x to 800z Circuit board 900, 900a, 900b, 900x to 900z circuit board
Claims (4)
ぞれの、1辺に沿ってその一方の面に配列形成された複
数の電極を含む基板コネクタ部分が挿入されて、これら
第1の回路基板及び第2の回路基板を、互いに平行に、
かつその基板コネクタの電極形成面が外側となるように
保持し、これら第1の回路基板と第2の回路基板との間
を電気的に接続するカードエッジコネクタであって、次
の各構成を有することを特徴とするカードエッジコネク
タ。 (イ)それぞれが、前記第1の回路基板の対応する電極
と接触接続するための第1の接触部と、前記第2の回路
基板の対応する電極と接触接続するための第2の接触部
と、前記第1の接触部と前記第2の接触部との間をコの
字状につなぐばね部と、このばね部の予め定められた部
位に設けられた保持固定部と、を備え、弾性導電体で一
体形成された、複数の外側電極間接続用コンタクト (ロ)前記第1の回路基板及び第2の回路基板それぞれ
の基板コネクタ部分が挿入されてこれを保持するとき
に、前記基板コネクタの先端部分を当接させる基板先端
保持壁を含む基板コネクタ保持部と、前記複数の外側電
極間接続用コンタクトを、その第1の接触部及び第2の
接触部が前記基板コネクタ保持部内に配置されて弾性変
位可能なように、それぞれの保持固定部で保持、固定し
て配列するコンタクト保持部と、前記第1の回路基板及
び第2の回路基板を、そのそれぞれの内側の面に接触し
て互いに平行に保持する第1の平面及び第2の平面、並
びに、これら第1の平面及び第2の平面それぞれとつな
がり、1つの辺に近づく程その間隔が狭くなる第1の斜
面及び第2の斜面を含む仕切板と、を備え、この仕切板
の第1の斜面及び第2の斜面並びに前記1つの辺の部分
が、前記複数の外側電極間接続用コンタクトの第1の接
触部及び第2の接触部の間に、前記1つの辺と前記基板
コネクタ保持部の基板先端保持壁との間に予め設定され
た間隙を隔てて配置され、かつ、前記第1の斜面及びそ
の延長面と前記第1の接触部との間の間隔が前記第1の
回路基板の厚さ寸法と同程度かそれ以上、前記第2の斜
面及びその延長面と前記第2の接触部との間の間隔が前
記第2の回路基板の厚さ寸法と同程度かそれ以上であ
り、前記第1の平面及びその延長面と前記第1の接触部
との間の間隔が前記第1の回路基板の厚さ寸法より狭
く、前記第2の平面及びその延長面と前記第2の接触部
との間の間隔が前記第2の回路基板の厚さ寸法より狭く
なるように配置されたインシュレータ1. A board connector portion including a plurality of electrodes arranged and formed on one surface along one side of each of a first circuit board and a second circuit board is inserted into the first circuit board and the second circuit board. The circuit board and the second circuit board are parallel to each other,
And a card edge connector for holding the electrode formation surface of the board connector on the outside and electrically connecting the first circuit board and the second circuit board with each other. A card edge connector comprising: (A) a first contact portion for contacting and connecting to a corresponding electrode of the first circuit board, and a second contact portion for contacting and connecting to a corresponding electrode of the second circuit board, respectively. And a spring portion for connecting the first contact portion and the second contact portion in a U-shape, and a holding and fixing portion provided at a predetermined portion of the spring portion, A plurality of contacts for connection between outer electrodes integrally formed of an elastic conductor; (b) when the board connector portions of the first circuit board and the second circuit board are inserted and held, A board connector holding portion including a board tip holding wall for contacting a tip portion of the connector, and the plurality of outer electrode connection contacts are provided with first and second contact portions in the board connector holding portion. So that they can be placed and elastically displaced A first contact holding portion that is held, fixed and arranged by the holding and fixing portion, and a first circuit board that holds the first circuit board and the second circuit board in parallel with each other by contacting their inner surfaces. A partition including a first plane and a second plane, and a first slope and a second slope connected to the first plane and the second plane, respectively, and the distance between the first plane and the second plane is reduced as approaching one side. The first slope and the second slope of the partition plate and the one side portion are provided between the first contact portion and the second contact portion of the plurality of outer electrode connection contacts. A predetermined gap is arranged between one side and a board tip holding wall of the board connector holding section, and a gap is provided between the first slope and its extension face and the first contact section. Is equal to or greater than the thickness dimension of the first circuit board, The distance between the second inclined surface and its extension surface and the second contact portion is substantially equal to or greater than the thickness dimension of the second circuit board, and the first plane and its extension surface The distance between the first contact portion and the second contact portion is smaller than the thickness dimension of the first circuit board, and the distance between the second contact surface and the second plane and the extension surface thereof is the second contact portion. An insulator arranged so as to be narrower than the thickness of the circuit board of No. 2.
ぞれの、1辺に沿ってその一方の面に配列形成された複
数の電極を含む基板コネクタ部分が挿入されて、これら
第1の回路基板及び第2の回路基板を、互いに平行に、
かつその基板コネクタの電極形成面が内側となるように
保持し、これら第1の回路基板と第2の回路基板との間
を電気的に接続するカードエッジコネクタであって、次
の各構成を有することを特徴とするカードエッジコネク
タ。 (イ)それぞれが、前記第1の回路基板の対応する電極
と接触接続するための第1の接触部と、前記第2の回路
基板の対応する電極と接触接続するための第2の接触部
と、前記第1の接触部と前記第2の接触部との間を略U
字状につなぎ、この略U字状の開口側では、これら第1
の接触部及び第2の接触部を含む開口端に近づく程その
間隔が広くなる形状のばね部と、を備え、弾性導電体で
一体形成された、複数の内側電極間接続用コンタクト (ロ)前記第1の回路基板及び第2の回路基板それぞれ
の基板コネクタ部分が挿入されてこれを保持するとき
に、これら第1,第2の回路基板それぞれの外側の面を
接触させる、互いに平行な第1の基板外面保持壁及び第
2の基板外面保持壁、並びに、基板挿入、保持時にこれ
ら第1,第2の回路基板の基板コネクタ先端部分を当接
させる基板先端保持壁を含む基板コネクタ保持部と、前
記第1の基板外面保持壁の壁面を含む平面と平行でその
間隔が前記第1の回路基板の厚さ寸法より広い第1の平
面、及び前記第2の基板外面保持壁の壁面を含む平面と
平行でその間隔が前記第2の回路基板の厚さ寸法より広
い第2の平面、並びにこれら第1,第2の平面それぞれ
とつながり、1つの辺に近づく程その間隔が狭くなる第
1の斜面及び第2の斜面を含み、前記第1の平面及び第
2の平面を成す部分に、前記複数の内側電極間接続用コ
ンタクトを、そのそれぞれの第1の接触部が前記第1の
斜面の延長面からは突出することなく前記第1の平面か
らは突出し、そのそれぞれの第2の接触部が前記第2の
斜面の延長面からは突出することなく前記第2の平面か
らは突出して弾性変位可能なように配列保持固定するコ
ンタクト保持部が設けられた仕切板と、を備え、この仕
切板の第1の斜面及び第2の斜面並びに1つの辺の部分
が、前記基板コネクタ保持部内に、前記1つの辺と前記
基板先端保持壁との間に予め設定された間隙を隔てて配
置され、かつ、前記第1の斜面及びその延長面と前記第
1の基板外面保持壁との間の最小間隔が前記第1の回路
基板の厚さ寸法と同程度かそれ以上、前記第2の斜面及
びその延長面と前記第2の基板外面保持壁との間の最小
間隔が前記第2の回路基板の厚さ寸法と同程度かそれ以
上であり、前記第1の基板外面保持壁の壁面を含む平面
と前記第1の接触部との間の間隔が前記第1の回路基板
の厚さ寸法より狭く、前記第2の基板外面保持壁の壁面
を含む平面と前記第2の接触部との間の間隔が前記第2
の回路基板の厚さ寸法より狭くなるように配置されたイ
ンシュレータ2. A board connector portion including a plurality of electrodes arranged and formed on one surface of one side of each of a first circuit board and a second circuit board is inserted into each of the first circuit board and the second circuit board. The circuit board and the second circuit board are parallel to each other,
And a board edge connector for holding the electrode forming surface of the board connector on the inside and electrically connecting the first circuit board and the second circuit board with each other. A card edge connector comprising: (A) a first contact portion for contacting and connecting to a corresponding electrode of the first circuit board, and a second contact portion for contacting and connecting to a corresponding electrode of the second circuit board, respectively. And approximately U between the first contact portion and the second contact portion.
The first U-shaped opening is connected to the first
A spring portion having a shape in which the distance between the contact portion and the opening end including the second contact portion increases as the distance from the contact portion increases. When the board connector portions of the first circuit board and the second circuit board are inserted and held, the outer surfaces of the first and second circuit boards are brought into contact with each other. A board connector holding section including a first board outer holding wall and a second board outer wall, and a board tip holding wall that abuts the board connector tip portions of the first and second circuit boards during insertion and holding of the board. A first plane parallel to a plane including the wall surface of the first substrate outer surface holding wall and having an interval larger than the thickness dimension of the first circuit board, and a wall surface of the second substrate outer surface holding wall. Parallel to the plane containing A second plane larger than the thickness dimension of the second circuit board, and a first slope and a second slope connected to each of the first and second planes, and the distance between the first and second planes is reduced as approaching one side. A plurality of the inner-electrode connection contacts, each of which has a first contact portion protruding from an extension surface of the first slope in a portion forming the first plane and the second plane. And the second contact portions thereof protrude from the second plane without protruding from the extension surface of the second slope, and are arranged so as to be elastically displaceable. A partition plate provided with a contact holding portion to be fixed, wherein a first slope and a second slope of the partition plate and a portion of one side are provided in the board connector holding portion with the one side and the one side. Set in advance between the substrate tip holding wall The minimum distance between the first inclined surface and its extension surface and the first substrate outer surface holding wall is set to be equal to or greater than the thickness dimension of the first circuit board. A minimum distance between the second inclined surface and its extension surface and the second substrate outer surface holding wall is equal to or greater than a thickness dimension of the second circuit board, and the first substrate An interval between a plane including the wall surface of the outer surface holding wall and the first contact portion is smaller than a thickness dimension of the first circuit board, and a plane including the wall surface of the second substrate outer surface holding wall and the second surface. The distance between the second contact portion and the second contact portion is the second
Insulators arranged to be narrower than the thickness of the circuit board
ぞれの、1辺に沿ってその両面に配列形成された複数の
電極を含む基板コネクタ部分が挿入されて、これら第1
の回路基板及び第2の回路基板を互いに平行に保持し、
これら第1の回路基板と第2の回路基板との間を電気的
に接続するカードエッジコネクタであって、前記第1の
回路基板及び第2の回路基板それぞれの外側の面に配列
形成された複数の電極の間を対応接続する、請求項1に
記載のカードエッジコネクタに加え、それぞれが、前記
第1の回路基板の内側の面の対応する電極と接触接続す
るための第1の接触部と、前記第2の回路基板の内側の
面の対応する電極と接触接続するための第2の接触部
と、前記第1の接触部と前記第2の接触部との間を略U
字状につなぎ、この略U字状の開口側では、これら第1
の接触部及び第2の接触部を含む開口端に近づく程その
間隔が広くなる形状のばね部と、を備え、弾性導電体で
一体形成された、複数の内側電極間接続用コンタクト
を、そのインシュレータの仕切板の、第1の平面及び第
2の平面を成す部分に、それぞれの第1の接触部が前記
仕切板の第1の斜面の延長面からは突出することなく前
記第1の平面からは突出し、それぞれの第2の接触部が
前記仕切板の第2の斜面の延長面からは突出することな
く前記第2の平面からは突出して弾性変位可能なように
配列、保持固定した、カードエッジコネクタ。3. A board connector portion including a plurality of electrodes arranged and formed on both sides thereof along one side of each of the first circuit board and the second circuit board, and the first and second circuit boards are inserted.
Holding the circuit board and the second circuit board in parallel with each other,
A card edge connector for electrically connecting between the first circuit board and the second circuit board, the card edge connector being arranged and formed on an outer surface of each of the first circuit board and the second circuit board. 2. The card edge connector according to claim 1, wherein each of the plurality of electrodes has a corresponding connection, and a first contact portion for making contact connection with a corresponding electrode on an inner surface of the first circuit board. And a second contact portion for contacting connection with a corresponding electrode on the inner surface of the second circuit board, and substantially U between the first contact portion and the second contact portion.
The first U-shaped opening is connected to the first
A spring portion having a shape in which the distance increases as approaching the opening end including the contact portion and the second contact portion, and a plurality of internal electrode connection contacts integrally formed of an elastic conductor. The first plane does not protrude from a portion of the partition plate of the insulator that forms the first plane and the second plane from the extension surface of the first slope of the partition plate. And the second contact portions are arranged, held and fixed so as to be elastically displaceable by projecting from the second plane without projecting from the extension surface of the second slope of the partition plate. Card edge connector.
載のカードエッジコネクタに加え、第1の回路基板及び
第2の回路基板を互いに平行に保持固定する、基板保持
部材を備えて成る、カードエッジコネクタ。4. The card edge connector according to claim 1, further comprising a board holding member for holding and fixing the first circuit board and the second circuit board in parallel with each other. Consisting of a card edge connector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000165561A JP3584354B2 (en) | 2000-06-02 | 2000-06-02 | Card edge connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000165561A JP3584354B2 (en) | 2000-06-02 | 2000-06-02 | Card edge connector |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001351707A true JP2001351707A (en) | 2001-12-21 |
JP3584354B2 JP3584354B2 (en) | 2004-11-04 |
Family
ID=18669017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000165561A Expired - Fee Related JP3584354B2 (en) | 2000-06-02 | 2000-06-02 | Card edge connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3584354B2 (en) |
-
2000
- 2000-06-02 JP JP2000165561A patent/JP3584354B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3584354B2 (en) | 2004-11-04 |
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