JP2001345236A - Composite laminated electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide small-sized composite laminated electronic parts by suppressing the effect of resin sags by surrounding an electronic parts chip arranged on the uppermost surface of a laminate with a bulkhead. SOLUTION: The composite laminated electronic parts 101 have the laminate 102 formed by laminating a plurality of dielectric sheets upon another and external electrodes 103 which are electrically connected to the input-output terminal and internal grounding electrode of an internal circuit, respectively, on the side faces of the laminate 102. The electronic parts chip 104 is arranged on the uppermost surface of the laminate 102 and a bulkhead 105 constituted of the laminate is formed around the chip 104. The chip 104 is fixed to the laminate 102 with an adhesive made of a resin, etc., and connected to electrode pads 107 formed on the uppermost surface of the laminate 102 through wires 106.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite laminated electronic component used for a radio device, a portable terminal device and the like.

[0002]

2. Description of the Related Art A perspective view of a conventional composite electronic component is shown in FIG.
Shown in The composite laminated electronic component 901 is a laminated body 902 formed by laminating a plurality of dielectric sheets.
An internal circuit (not shown) having an input / output terminal and an internal ground electrode (not shown) are interposed in the inner layer of. External electrodes 903 are formed on side surfaces of the multilayer body 902, and the external electrodes 903 are electrically connected to input / output terminals of an internal circuit and internal ground electrodes, respectively. The external electrode 903 is formed by applying a metal film to a specific portion on the side surface of the stacked body 902.

An electronic component chip 904 is arranged on the uppermost surface of the laminate 902. A bare chip is often used for the electronic component chip 904 and is fixed to the laminate 902 using an adhesive such as a resin. The electronic component chip 904 is connected by a wire 905 to an electrode pad 906 formed on the uppermost surface of the multilayer body 902. The electrode pad 906 is connected to an internal circuit in the multilayer body 902 and an internal ground electrode.

[0004]

As described above, in the conventional composite multilayer electronic component, the electronic component chip is fixed to the uppermost surface of the laminate using an adhesive such as a resin, so that resin dripping occurs. The electrode pad needs to be formed at a certain distance from the electronic component chip, and a large occupation area is required for mounting the electronic component chip on the upper surface of the laminate. Also, when arranging a plurality of electronic component chips, it is necessary to increase the distance between the electronic component chips in order to eliminate the effect of mutual resin dripping, which requires a large occupied area.

The present invention has been made to solve the above-mentioned conventional problems. For example, an electronic component chip disposed on the uppermost surface of a laminate is surrounded by a partition formed by the laminate. An object of the present invention is to provide a small-sized composite multilayer electronic component by suppressing the influence of resin dripping by forming a step or a slope between a component chip and an electronic component such as an electrode pad.

[0006]

Means for Solving the Problems The first invention (claim 1)
A) a laminate in which a plurality of dielectric sheets are laminated and integrated, at least one internal circuit having input / output terminals disposed inside the laminate, and disposed inside the laminate. At least one internal ground electrode, an external electrode formed on the outer surface of the laminate, an electronic component chip mounted on the upper surface of the laminate, and an electronic component formed on the upper surface of the laminate. A step or a slope having a higher position on the electronic component side than the electronic component chip is formed between the electronic component chip and the electronic component, and the high position is substantially vertically above A composite laminated electronic component characterized by being held.

A second aspect of the present invention (corresponding to claim 2) is the composite laminated electronic component according to the first aspect of the present invention, wherein the step or the hill is a partition.

According to a third aspect of the present invention (corresponding to claim 3), the partition wall surrounds the electronic component chip.
Of the present invention.

According to a fourth aspect of the present invention (corresponding to claim 4), the electronic component chip is mounted in a concave portion on the upper surface of the multilayer body. Parts.

According to a fifth aspect of the present invention (corresponding to claim 5), the electronic component is embedded in the laminated body.
A part is provided on the upper surface of the laminate, on the upper surface of the partition wall, or on the surface of the convex portion relatively to the concave portion, and electrically connected to the internal circuit or the internal ground electrode. The composite multilayer electronic component according to any one of the second to fourth aspects of the present invention, wherein the composite multilayer electronic component is an electrode pad connected to the electronic pad.

According to a sixth aspect of the present invention (corresponding to claim 6), any one of the second, third and fifth aspects of the present invention is further provided with a partition shield electrode buried inside the partition. 2 is a composite laminated electronic component.

A seventh invention (corresponding to claim 7) is the composite laminate according to the sixth invention, wherein the partition shield electrode is electrically connected to the internal ground electrode. Electronic components.

According to an eighth aspect of the present invention (corresponding to claim 8), the height of the partition wall is higher than the height of the electronic component chip, the composite multilayer electronic device according to the sixth or seventh aspect of the present invention. Parts.

According to a ninth aspect of the present invention (corresponding to claim 9), the semiconductor device is buried in a relative convex portion around the concave portion on the upper surface of the laminate, and is connected to an internal ground electrode inside the laminate. The composite laminated electronic component according to the fourth or fifth aspect of the present invention, further comprising a shielded electrode.

[0015] A tenth aspect of the present invention (corresponding to claim 10) is:
The ninth aspect of the present invention is the composite multilayer electronic component according to the ninth aspect, wherein a depth of the concave portion is larger than a height of the electronic component chip.

The eleventh invention (corresponding to claim 11) provides:
The present invention according to any one of the second to tenth aspects of the present invention, wherein a plurality of the electronic component chips are present, and the partition wall or the concave portion is provided corresponding to each of the plurality of the electronic component chips. It is a composite laminated electronic component.

The twelfth invention (corresponding to claim 12) provides:
The composite multilayer electronic component according to any one of the first to eleventh aspects of the present invention, wherein the electronic component chip is a surface acoustic wave element, and the laminate is hermetically sealed with ceramic.

A thirteenth aspect of the present invention (corresponding to claim 13) is:
The dielectric sheet is formed of a crystal phase and a glass phase, wherein the crystal phase contains at least one of Al ₂ O ₃ , MgO, SiO ₂ , and RO _x , and R is La,
The first to twelfth elements are at least one element selected from the group consisting of Ce, Pr, Nd, Sm and Gd, wherein x is a stoichiometric value determined according to the valence of R. It is any one of the composite laminated electronic components according to the present invention.

The fourteenth invention (corresponding to claim 14) is:
The composite laminated electronic component according to any one of the first to twelfth aspects, wherein the dielectric sheet contains Bi ₂ O ₃ and Nb ₂ O ₅ as main components.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION The composite laminated electronic component of the present invention is characterized in that the periphery of an electronic component chip disposed on the uppermost surface of the laminate is surrounded by a partition formed by the laminate. I do.

Hereinafter, embodiments of the composite laminated electronic component according to the present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 is a view showing a composite laminated electronic component according to a first embodiment of the present invention. In FIG. 1, a composite laminated electronic component 101 is a laminated body 102 formed by laminating a plurality of dielectric sheets, and an inner layer of the laminated body 102 includes an internal circuit (not shown) having input / output terminals; An internal ground electrode (not shown) intervenes. The dielectric sheet has a relative permittivity εr = 7 and a dielectric loss ta.
It consists of a crystal phase and a glass phase where nδ = 2.0 × 10 ⁻⁴ .

External electrodes 103 are formed on side surfaces of the laminate 102. The external electrodes 103 are electrically connected to input / output terminals of an internal circuit and internal ground electrodes, respectively. The external electrode 103 is formed by applying a metal film to a specific portion on the side surface of the stacked body 102.

An electronic component chip 104 is arranged on the uppermost surface of the multilayer body 102, and a partition 105 composed of the multilayer body 102 is formed around the electronic component chip 104. The electronic component chip 104 is fixed to the laminate 102 using an adhesive such as a resin, and the electronic component chip 104 is connected to an electrode pad 107 formed on the uppermost surface of the laminate 102 by a wire 106. The electrode pad 107 is connected to an internal circuit in the multilayer body 102 and an internal ground electrode.

FIG. 10 is an exploded perspective view showing an example of an internal circuit in the laminated electronic component 101 shown in FIG. As shown in FIG. 10, the internal circuit in the multilayer electronic component 101 includes dielectric layers 1001 to 1008
Are stacked in order. An internal ground electrode 1009 is disposed on the dielectric layer 1001, and a capacitor electrode 1010 is disposed on the dielectric layer 1002. Also, a strip line 1011 and a strip line 1012 are arranged on the dielectric layer 1003, and are connected at a connection point 1013.

The dielectric layers 1004, 1005, 1006,
In 1007, a capacitor electrode 1014, an internal ground electrode 1015, a capacitor electrode 1016, and an internal ground electrode 1017 are arranged. Further, capacitor electrode 1010 is connected to connection point 1018 of strip line 1011 via via hole 1101, and capacitor electrode 1014 is connected to connection point 10118 via via hole 1102.
3 is connected. Further, the capacitor electrode 1016
Is the strip line 101 through the via hole 1103
2 connection point 1019.

The internal ground electrodes 1015 and 1017 are connected to the internal ground electrode 1009 via external electrodes 1020 formed on the side surfaces of the composite multilayer electronic component, and the input terminal of the internal circuit is connected to one end of the strip line 1011 at the end of the composite multilayer electronic component. It is connected to the external input terminal electrode 1021 formed on the side of the composite multilayer electronic component, and the output terminal of the internal circuit extends one end of the strip line 1012 to the end surface of the composite multilayer electronic component, and is formed on the side of the composite multilayer electronic component. It is connected to the external input terminal electrode 1022.

However, in the above description, the positions of the via holes in the figure are schematically shown by dotted lines in an exploded perspective view in principle for simplicity. FIG. 10 is a diagram for explaining an example of the internal circuit, in which the upper surface of the multilayer body 102, electronic components to be mounted, and the like are omitted.

FIG. 11 shows an equivalent circuit of the laminated electronic component of FIG. 10, and the elements corresponding to FIG. 10 use the same element numbers. The capacitance C1 is the capacitor electrode 1
010 and the internal ground electrode 1009, and the capacitance C2 is formed between the capacitor electrode 1014 and the ground electrode 109.
15 are formed. The capacitance C3 is formed between the capacitor electrode 1016 and the ground electrode 1017, and the inductances L1 and L2 are formed by the strip lines 1011 and 1012, respectively. L1 is connected in series to the external input terminal electrode 1021, and C1 is connected in parallel. L2 is connected in series to the external output terminal electrode 1022, and C1 is connected in parallel.
3 are connected. Further, at the connection point 1013, L1 and L2 are connected in series and C2 is
The element constitutes a low-pass filter.

The internal ground electrodes 1009, 1015,
Although 1017 is connected to the external electrode 1020, in this embodiment, it may be connected to the electrode pad 107 via a via hole or the like. The input terminal of the internal circuit extends one end of the strip line 1011 to the end face of the composite multilayer electronic component, is connected to the external input terminal electrode 1021 formed on the side surface of the composite multilayer electronic component, and the output terminal of the internal circuit is the One end is extended to the end face of the composite multilayer electronic component and is connected to the external input terminal electrode 1022 formed on the side surface of the composite multilayer electronic component. In the present embodiment, however, it is connected to the electrode pad 107 by a via hole or the like. These connections should be adapted to the overall circuit configuration of the composite multilayer electronic component.

The above description of the configuration of the internal circuit is merely an example, and the present invention is not limited to this.

With the above-described configuration, the composite multilayer electronic component of the first embodiment of the present invention suppresses the influence of resin dripping when the electronic component chip 104 is fixed to the uppermost surface of the multilayer body 102. Thus, the area occupied by mounting the electronic component chip 104 can be reduced by bringing the positions of the electrode pads 107 closer to each other, and the miniaturization of the composite multilayer electronic component can be realized.

When a plurality of electronic component chips are mounted, the configuration shown in FIG. 2 may be used. In FIG.
The composite laminated electronic component 201 is a laminated body 202 formed by laminating a plurality of dielectric sheets. An internal circuit (not shown) having input / output terminals is provided in an inner layer of the laminated body 202.
An internal ground electrode (not shown) intervenes. The dielectric sheet has a relative permittivity εr = 7 and a dielectric loss tan δ = 2.0 × 10
^It consists of a crystal phase of ^-4 and a glass phase.

External electrodes 203 are formed on side surfaces of the multilayer body 202. The external electrodes 203 are electrically connected to input / output terminals of an internal circuit and internal ground electrodes, respectively. The external electrode 203 is formed by applying a metal film to a specific portion on the side surface of the stacked body 202.

The first and second layers are placed on the uppermost surface of the laminate 202.
Electronic component chips 204a and 204b are arranged, and first and second partition walls 205a and 205b formed of a laminate 202 are formed around the first and second electronic component chips 204a and 204b. .

First and second electronic component chips 204
a and 204b are fixed to the laminated body 202 using an adhesive such as resin, and the first and second electronic component chips 204a and 204b are connected to the first and second wires 206, respectively.
The first and second electrode pads 207a and 207b formed on the uppermost surface of the stacked body 202 are connected by the electrodes a and 206b. First and second electrode pads 207a, 20
7b is configured to be connected to an internal circuit in the multilayer body 202 and an internal ground electrode.

With the above-described configuration, the composite laminated electronic component of the first embodiment of the present invention has resin dripping even when a plurality of electronic component chips are fixed on the uppermost surface of the laminate. In this case, a plurality of electronic component chips can be arranged close to each other while suppressing the influence of the electronic component chip, the area occupied by mounting the electronic component chips can be reduced, and the size of the composite multilayer electronic component can be reduced.

In FIG. 2, the partition wall between the first and second electronic component chips 204a and 204b in the first and second partition walls 205a and 205b is, as shown in FIG. Even if they are shared, the effect on miniaturization is the same.

Further, in the present embodiment, as shown in FIG. 4, a partition shield electrode 401 is provided inside the partition around the electronic component chip, and the partition shield electrode 401 is connected to the internal ground electrode. In addition, the shielding of the electronic component chip is improved. In this case, by configuring the height of the barrier higher than the height of the electronic component chip,
The shielding effect is further improved.

When a plurality of electronic component chips are mounted, the configuration shown in FIG. 5 may be used. In FIG. 5, a composite laminated electronic component 501 is a laminated body 502 formed by laminating a plurality of dielectric sheets.
An internal circuit (not shown) having input / output terminals and an internal ground electrode (not shown) are interposed. The dielectric sheet is composed of a crystal phase and a glass phase having a relative dielectric constant εr = 7 and a dielectric loss tan δ = 2.0 × 10 ⁻⁴ .

External electrodes 503 are formed on side surfaces of the laminate 502, and the external electrodes 503 are electrically connected to input / output terminals of an internal circuit and internal ground electrodes, respectively. The external electrode 503 is formed by applying a metal film to a specific portion on a side surface of the stacked body 502. First and second electronic component chips 504a and 504b are provided on the uppermost surface of the laminate 502.
Are arranged, and the first and second electronic component chips 504 are disposed.
A partition 505 composed of a laminated body is formed between a and 504b.

First and second electronic component chips 504
a and 504b are fixed to the laminated body 502 using an adhesive such as a resin, and the first and second electronic component chips 504a and 504b are first and second wires 506.
The first and second electrode pads 507a and 507b formed on the uppermost surface of the stacked body 502 are connected by a and 506b.

First and second electrode pads 507a, 507
Reference numeral 07b is configured to be connected to an internal circuit in the multilayer body 502 and an internal ground electrode. Further, a partition wall shield electrode 508 is provided inside the partition wall 505 between the electronic component chips 504a and 504b, and the partition wall shield electrode 508 is connected to an internal ground electrode.

With the above configuration, even when a plurality of electronic component chips are fixed on the uppermost surface of the laminate, the plurality of electronic component chips are arranged close to each other while suppressing the influence of resin dripping. Thus, the same effect that the occupied area when mounting the electronic component chip can be reduced and the miniaturization of the composite laminated electronic component can be realized is obtained. Further, the shielding of the electronic component chip is improved by the partition shield electrode provided inside the partition. In this case, the shielding effect is further improved by configuring the height of the barrier higher than the height of the electronic component chip.

In the present embodiment, a configuration may be adopted in which the ground terminal of the electronic component chip is connected to the partition wall shield electrode via a conductive wire.

Further, in the present embodiment, the number of electronic component chips, external electrodes, and electrode pads, and the arrangement positions thereof are not limited to those described above, but are adapted to the internal circuit of the laminate and the internal ground electrode. Is what you do. A bare chip is often used as an electronic component chip. In particular, in the case of a surface acoustic wave element, it is necessary to provide a hermetically sealed structure with ceramic or the like. Although the electronic component chip is fixed to the laminate using an adhesive such as a resin, the effect of the partition is the same even if solder or silver paste is used.

Further, in the present embodiment, the partition is formed of a laminate, but it is not necessarily required to be a laminate of the same material. The effect of miniaturization can be realized by suppressing the influence of the above.

In this embodiment, one internal ground electrode has been described. However, even if there are a plurality of internal ground electrodes, the laminated body may be connected by providing a via hole or connected by an external ground electrode. And increasing the number of internal ground electrodes leads to strengthening of the ground and improvement of the shielding effect.

The partition formed in the laminate may be bonded to the laminate having the internal circuit and the internal ground electrode interposed therebetween after the laminate and partition are separately formed, or may be bonded to the internal circuit and the internal ground electrode. The effect of the present invention is the same even if the laminated body and the partition wall are integrally formed.

Further, the partition wall shield electrode formed inside the partition wall is formed by forming a hole in the laminate by a drill or the like after forming the laminate, and applying or plating a conductive material. Alternatively, a configuration may be adopted in which an electrode pattern is formed on a dielectric sheet constituting the laminate by printing or the like and the laminate is formed as an inner layer.

In this embodiment, the external electrode is formed by applying a metal film to a specific portion on the side surface of the laminate. However, the external electrode in the present invention is formed by forming the laminate. Even if the laminate is formed by drilling holes in the laminate and applying or plating a conductive material, an electrode pattern is formed by printing on a dielectric sheet constituting the laminate. Alternatively, a configuration may be adopted in which the laminate is formed as an inner layer.

Further, in the present embodiment, the relative dielectric constant εr = 7 and the dielectric loss tan δ = 2.0
Although a dielectric sheet composed of a crystal phase and a glass phase of × 10 ⁻⁴ has been described as an example, similar effects can be obtained by using a dielectric sheet composed of a crystal phase and a glass phase having a relative dielectric constant εr of 5 to 10. Is obtained. Moreover, similar effects by using a dielectric sheet composed mainly of _{Bi 2 O 3, Nb 2 O} 5 is the relative dielectric constant .epsilon.r = 50 to 100 degree are obtained.

(Second Embodiment) FIG. 6 is a view showing a composite laminated electronic component according to a second embodiment of the present invention. In FIG. 6, a composite laminated electronic component 601 is a laminated body 602 formed by laminating a plurality of dielectric sheets, and an internal circuit (not shown) having input / output terminals is provided on an inner layer of the laminated body 602. An internal ground electrode (not shown) intervenes. The dielectric sheet has a relative permittivity εr = 7 and a dielectric loss ta.
It consists of a crystal phase and a glass phase where nδ = 2.0 × 10 ⁻⁴ .

External electrodes 603 are formed on side surfaces of the laminate 602, and the external electrodes 603 are electrically connected to input / output terminals of an internal circuit and internal ground electrodes, respectively. The external electrode 603 is formed by applying a metal film to a specific portion on the side surface of the stacked body 602.

An electronic component chip 604 is arranged on the uppermost surface of the laminate 602, and a partition 605 composed of the laminate 602 is formed around the electronic component chip 604. The electronic component chip 604 is fixed to the laminate 602 using an adhesive such as a resin, and the electronic component chip 604 is connected to the electrode pad 607 formed on the upper surface of the partition 605 by a wire 606. The electrode pad 607 is connected to an internal circuit in the multilayer body 602 and an internal ground electrode.

With the above configuration, the composite multilayer electronic component of the second embodiment of the present invention suppresses the influence of resin dripping when the electronic component chip is fixed to the uppermost surface of the multilayer body by the partition walls. Further, by arranging the electrode pads on the upper surface of the partition wall, the occupied area when mounting the electronic component chip can be further reduced, and the miniaturization of the composite laminated electronic component can be realized.

As shown in FIG. 7, a partition wall shield electrode 701 is formed inside the partition wall except for the electrode pad 607 formed on the upper surface of the partition wall 605.
Is connected to the internal ground electrode, the shielding of the electronic component chip is improved. In this case, the shielding effect is further improved by configuring the height of the barrier higher than the height of the electronic component chip.

The ground terminal of the electronic component chip may be connected to the partition wall shield electrode via a conductive wire.

Further, in the present embodiment, the number of electronic component chips, external electrodes, and electrode pads, and the arrangement positions thereof are not limited to those described above, but are adapted to the internal circuit of the laminate and the internal ground electrode. Is what you do. A bare chip is often used as an electronic component chip. In particular, in the case of a surface acoustic wave element, it is necessary to provide a hermetically sealed structure with ceramic or the like. Although the electronic component chip is fixed to the laminate using an adhesive such as a resin, the effect of the partition is the same even if solder or silver paste is used.

Further, in the present embodiment, the partition is formed of a laminate. However, the partition is not always required to be a laminate of the same material. The effect of miniaturization can be realized by suppressing the influence of the above.

In the present embodiment, one internal ground electrode has been described. However, even if a plurality of internal ground electrodes are present, it is necessary to connect via a via hole in the laminate or to connect via an external ground electrode. And increasing the number of internal ground electrodes leads to strengthening of the ground and improvement of the shielding effect.

The partition walls formed in the laminated body may be bonded to each other after the internal circuit and the laminated body having the internal ground electrode interposed therebetween are formed separately, or may be bonded to the internal circuit and the internal ground electrode. The effect of the present invention is the same even when the intervening laminate and the partition are integrally formed.

The barrier rib shield electrode formed inside the barrier rib is formed by forming a hole in the laminated body by a drill or the like after forming the laminated body, and applying or plating a conductive material. Alternatively, an electrode pattern may be formed on a dielectric sheet constituting the laminate by printing or the like, and the dielectric sheet may be formed as an inner layer on the laminate.

In this embodiment, the external electrode is formed by applying a metal film to a specific portion on the side surface of the laminate. However, the external electrode in the present invention is formed by forming the laminate. Even when the laminate is formed by forming a hole in the laminate with a drill or the like and applying or plating a conductive material, the electrode pattern is formed by printing or the like on a dielectric sheet constituting the laminate. May be formed and formed as an inner layer in the laminate.

In this embodiment, the dielectric sheet is made of a dielectric constant εr = 7, a dielectric loss tan δ = 2.0 ×
Although a dielectric sheet composed of a crystal phase and a glass phase of 10 ⁻⁴ has been described as an example, a similar effect can be obtained by using a dielectric sheet composed of a crystal phase and a glass phase having a relative dielectric constant εr of 5 to 10. can get. Similar effects can be obtained by using a dielectric sheet containing Bi ₂ O ₃ and Nb ₂ O ₅ as the main components having a relative dielectric constant εr of about 50 to 100.

(Third Embodiment) FIG. 8 is a view showing a composite laminated electronic component according to a third embodiment of the present invention. In FIG. 8, a composite laminated electronic component 801 is a laminated body 802 formed by laminating a plurality of dielectric sheets, and an internal circuit (not shown) having input / output terminals is provided on an inner layer of the laminated body 802. An internal ground electrode (not shown) intervenes. The dielectric sheet has a relative permittivity εr = 7 and a dielectric loss ta.
It consists of a crystal phase and a glass phase where nδ = 2.0 × 10 ⁻⁴ .

External electrodes 803 are formed on side surfaces of the laminate 802, and the external electrodes 803 are electrically connected to input / output terminals of an internal circuit and internal ground electrodes, respectively. The external electrode 803 is formed by applying a metal film to a specific portion on the side surface of the stacked body 802.

First and second concave portions 804 a and 804 b are formed on the uppermost surface of the laminated body 802, and the first and second concave portions 8 are formed.
04a and 804b include the first and second electronic component chips 80.
5a and 805b are arranged. The first and second electronic component chips 805a and 805b are fixed to the laminated body 802 using an adhesive such as a resin, and the first and second electronic component chips 805a and 805b are connected to wires 806a and 806.
b, the first and second electrode pads 807a, 807
7b.

First and second electrode pads 807a, 807
07b is connected to the internal circuit in the multilayer body 802 and the internal ground electrode. Further, the first and second concave portions 8 in which the first and second electronic component chips 805a and 805b are arranged.
04a and 804b are provided with a shield electrode 808,
Shield electrode 808 is connected to an internal ground electrode.

With the above configuration, the composite multilayer electronic component of the third embodiment of the present invention suppresses the influence of resin dripping when the electronic component chip is fixed to the uppermost surface of the multilayer body by the concave portion. Further, by disposing the shield electrode between the electronic component chips, the shielding of the electronic component chips is improved. In this case, if the depth of the concave portion is set to be deeper than the height of the electronic component chip, and the shield electrode is formed to be equal to or deeper than the depth of the concave portion, the shielding effect is further improved.

The ground terminal of the electronic component chip may be connected to the shield electrode via a conductive wire.

In the present embodiment, even when there is no shield electrode, the same effect can be obtained in terms of realizing miniaturization by suppressing the influence of resin dripping.

Further, in the present embodiment, the number of electronic component chips, external electrodes, and electrode pads, and the arrangement positions thereof are not limited to those described above, but are adapted to the internal circuit of the laminate and the internal ground electrode. Is what you do. A bare chip is often used as an electronic component chip. In particular, in the case of a surface acoustic wave element, it is necessary to provide a hermetically sealed structure with ceramic or the like. Although the electronic component chip is fixed to the laminate using an adhesive such as a resin, the effect of the partition is the same even if solder or silver paste is used.

In the present embodiment, one internal ground electrode has been described. However, even if there are a plurality of internal ground electrodes, the laminated body may be connected by providing a via hole or connected by an external ground electrode. And increasing the number of internal ground electrodes leads to strengthening of the ground and improvement of the shielding effect.

Further, the shield electrode formed between the electronic component chips may be formed by forming an electrode pattern on a dielectric sheet constituting the laminate by printing or the like and forming an inner layer on the laminate. .

In this embodiment, the external electrode is formed by applying a metal film to a specific portion on the side surface of the laminate. However, the external electrode in the present invention is formed by forming the laminate. Even when the laminate is formed by forming a hole in the laminate with a drill or the like and applying or plating a conductive material, the electrode pattern is formed by printing or the like on a dielectric sheet constituting the laminate. May be formed and formed as an inner layer in the laminate.

In this embodiment, the dielectric sheet is made of a dielectric constant εr = 7, a dielectric loss tan δ = 2.0 ×
Although a dielectric sheet composed of a crystal phase and a glass phase of 10 ⁻⁴ has been described as an example, a similar effect can be obtained by using a dielectric sheet composed of a crystal phase and a glass phase having a relative dielectric constant εr of 5 to 10. can get. Similar effects can be obtained by using a dielectric sheet containing Bi ₂ O ₃ and Nb ₂ O ₅ as the main components having a relative dielectric constant εr of about 50 to 100.

Further, in the above-described embodiment, the electronic component chip is assumed to be surrounded by the partition walls or arranged in the concave portion on the upper surface of the laminate. A slope or a step having a higher position on the electrode pad side than the electronic component chip may be provided. Even in such a case, the influence of resin dripping when the electronic component chip is fixed to the uppermost surface of the laminate. And a compact composite electronic component can be obtained. In this case, it is necessary that the above-mentioned high position is substantially held in the vertical information.

Further, in the above-described embodiment, the electrode pad is used as the electronic component formed on the laminate of the composite multilayer electronic component of the present invention, but the electronic component is not limited to the electrode pad.

Further, the dielectric sheet constituting the laminate of the composite laminated electronic component of the present invention may be formed of a crystal phase and a glass phase, in which case the crystal phase may be Al ₂ O ₃ ,
A crystal phase containing at least one of MgO, SiO ₂ , and RO _x may be used. Note that R is La, C
It is at least one element selected from e, Pr, Nd, Sm and Gd, and x is a numerical value determined stoichiometrically according to the valence of R.

[0081]

As is apparent from the above description, the present invention provides a small-sized composite laminated electronic component by suppressing the influence of resin dripping of an electronic component chip disposed on the uppermost surface of the laminate. it can.

[Brief description of the drawings]

FIG. 1 is a diagram of a composite laminated electronic component according to a first embodiment of the present invention.

FIG. 2 is another configuration diagram of the composite multilayer electronic component according to the first embodiment of the present invention.

FIG. 3 is another configuration diagram of the composite multilayer electronic component according to the first embodiment of the present invention.

FIG. 4 is another configuration diagram of the composite multilayer electronic component according to the first embodiment of the present invention.

FIG. 5 is another configuration diagram of the composite multilayer electronic component according to the first embodiment of the present invention.

FIG. 6 is a view of a composite laminated electronic component according to a second embodiment of the present invention.

FIG. 7 is another configuration diagram of the composite multilayer electronic component according to the second embodiment of the present invention.

FIG. 8 is a diagram of a composite laminated electronic component according to a third embodiment of the present invention.

FIG. 9 is a diagram of a conventional composite laminated electronic component.

10 is an exploded perspective view showing an example of an internal circuit in the multilayer electronic component 101 in FIG.

FIG. 11 is a diagram showing an equivalent circuit of the multilayer electronic component in FIG. 11;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 Composite laminated electronic component 102 Laminated body 103 External electrode 104 Electronic component chip 105 Partition 106 Wire 107 Electrode pad 201 Composite laminated electronic component 202 Laminated body 203 External electrode 204a 1st electronic component chip 204b 2nd electronic component chip 205a 1st Partition wall 205b second partition wall 206a first wire 206b second wire 207a first electrode pad 207b second electrode pad 301 partition wall 401 partition shield electrode 501 composite laminated electronic component 502 laminated body 503 external electrode 504a first Electronic component chip 504b Second electronic component chip 505 Partition 506a First wire 506b Second wire 507a First electrode pad 507b Second electrode pad 508 Partition shield electrode 601 Composite laminated electronic component 6 02 laminate 603 external electrode 604 electronic component chip 605 partition wall 606 wire 607 electrode pad 701 partition shield electrode 801 composite laminated electronic component 802 laminate 803 external electrode 804a first concave portion 804b second concave portion 805a first electronic component chip 805b Second electronic component chip 806a First wire 806b Second wire 807a First electrode pad 807b Second electrode pad 901 Composite multilayer electronic component 902 Stack 903 External electrode 904 Electronic component chip 905 Wire 906 Electrode pad

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H01F 15/00 D H01G 4/40 A // H01L 25/04 H01L 23/12 F 25 / 18 25/04 Z (72) Inventor Kazuhide Uryu 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Tsutomu Matsumura 55-12 Osumihama, Kyotanabe, Kyoto Matsushita Nitto Electric (72) Inventor Hiroshi Kagata 1006 Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. AB01 BA11 CB03 CB12 CB17 5E082 AA01 AB03 BB02 DD08 DD13 EE04 EE16 EE23 EE35 FF05 FG06 FG26 GG10 GG28 JJ03 JJ06 JJ23 KK08 LL15 5E346 AA04 AA13 AA15 AA27 AA29 BB33 20 CC16 CC18 CC21 CC53 CC54 DD13 DD24 FF01 FF42 GG15 GG17 GG19 GG28 GG40 HH06 HH22

Claims (14)

[Claims] 1. A laminate in which a plurality of dielectric sheets are laminated and integrated, at least one internal circuit having input / output terminals disposed in the laminate, and disposed in the laminate. At least one internal ground electrode, an external electrode formed on the outer surface of the laminate, an electronic component chip mounted on the upper surface of the laminate, and an electronic component formed on the upper surface of the laminate. A step or hill having a position higher on the electronic component side than the electronic component chip is formed between the electronic component chip and the electronic component, and the high position is substantially vertically above A composite multilayer electronic component characterized by being held. 2. The composite electronic component according to claim 1, wherein the step or the hill is a partition. 3. The composite multilayer electronic component according to claim 2, wherein the partition surrounds the electronic component chip. 4. The composite multilayer electronic component according to claim 2, wherein the electronic component chip is mounted in a concave portion on an upper surface of the multilayer body. 5. The electronic component is embedded inside the laminate, and a part of the electronic component is on the upper surface of the laminate, on the upper surface of the partition wall, or on the surface of the convex portion relative to the concave portion. 5. The composite multilayer electronic component according to claim 2, wherein the composite multilayer electronic component is an electrode pad that is provided so as to be substantially located on the internal circuit, and is electrically connected to the internal circuit or the internal ground electrode. 6. . 6. The device according to claim 2, further comprising a partition shield electrode embedded inside the partition.
2. The composite laminated electronic component according to item 1. 7. The partition shield electrode is electrically connected to the internal ground electrode.
2. The composite laminated electronic component according to item 1. 8. The composite multilayer electronic component according to claim 6, wherein the height of the partition wall is higher than the height of the electronic component chip. 9. The semiconductor device according to claim 1, further comprising a shield electrode embedded in a relative convex portion around the concave portion on the upper surface of the laminate and connected to an internal ground electrode inside the laminate. The composite multilayer electronic component according to claim 4. 10. The composite multilayer electronic component according to claim 9, wherein the depth of the recess is larger than the height of the electronic component chip. 11. The electronic component chip according to claim 2, wherein a plurality of said electronic component chips are present, and said partition wall or said concave portion is provided corresponding to each of said plurality of electronic component chips. The composite laminated electronic component according to the above. 12. The composite multilayer electronic component according to claim 1, wherein the electronic component chip is a surface acoustic wave device, and the laminate is hermetically sealed with ceramic. 13. The dielectric sheet is formed of a crystal phase and a glass phase, wherein the crystal phase is composed of Al ₂ O ₃ , MgO,
Containing at least one of SiO ₂ and RO _x ;
R is at least one element selected from La, Ce, Pr, Nd, Sm and Gd, and x is the R
The composite multilayer electronic component according to any one of claims 1 to 4, wherein the numerical value is stoichiometrically determined according to the valence of the composite multilayer electronic component. 14. The dielectric sheet is made of Bi ₂ O ₃ , Nb ₂
The composite multilayer electronic component according to any one of claims 1 to 4, wherein O ₅ is a main component.