JP2001338933A5 - - Google Patents
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- Publication number
- JP2001338933A5 JP2001338933A5 JP2000157549A JP2000157549A JP2001338933A5 JP 2001338933 A5 JP2001338933 A5 JP 2001338933A5 JP 2000157549 A JP2000157549 A JP 2000157549A JP 2000157549 A JP2000157549 A JP 2000157549A JP 2001338933 A5 JP2001338933 A5 JP 2001338933A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000157549A JP2001338933A (ja) | 2000-05-29 | 2000-05-29 | 半導体パッケージの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000157549A JP2001338933A (ja) | 2000-05-29 | 2000-05-29 | 半導体パッケージの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001338933A JP2001338933A (ja) | 2001-12-07 |
| JP2001338933A5 true JP2001338933A5 (enExample) | 2007-03-01 |
Family
ID=18662165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000157549A Pending JP2001338933A (ja) | 2000-05-29 | 2000-05-29 | 半導体パッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001338933A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009164407A (ja) * | 2008-01-08 | 2009-07-23 | Sumitomo Heavy Ind Ltd | 樹脂封止装置および樹脂封止方法 |
| JP4462353B2 (ja) * | 2008-01-11 | 2010-05-12 | セイコーエプソン株式会社 | フレキシブル基板の製造方法及びフレキシブル基板打抜装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0329331A (ja) * | 1989-06-26 | 1991-02-07 | Mitsubishi Electric Corp | 半導体製造方法 |
| JPH0715926B2 (ja) * | 1990-09-14 | 1995-02-22 | 株式会社東芝 | ワイヤボンディング検査装置 |
| JP2710703B2 (ja) * | 1991-05-21 | 1998-02-10 | 三菱電機株式会社 | 半導体製品の成形・仕分け収納方法およびその収納装置 |
| KR100216840B1 (ko) * | 1996-12-06 | 1999-09-01 | 김규현 | 반도체 패키지용 인쇄회로기판 스트립 |
| JP2000068296A (ja) * | 1998-08-19 | 2000-03-03 | Nichiden Mach Ltd | ダイボンダ |
| JP2000174041A (ja) * | 1998-09-30 | 2000-06-23 | Shibaura Mechatronics Corp | ペレットボンディング装置 |
| JP3279306B2 (ja) * | 2000-04-10 | 2002-04-30 | 松下電器産業株式会社 | 電子部品製造方法 |
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2000
- 2000-05-29 JP JP2000157549A patent/JP2001338933A/ja active Pending