JP2001338933A5 - - Google Patents

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Publication number
JP2001338933A5
JP2001338933A5 JP2000157549A JP2000157549A JP2001338933A5 JP 2001338933 A5 JP2001338933 A5 JP 2001338933A5 JP 2000157549 A JP2000157549 A JP 2000157549A JP 2000157549 A JP2000157549 A JP 2000157549A JP 2001338933 A5 JP2001338933 A5 JP 2001338933A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000157549A
Other languages
Japanese (ja)
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JP2001338933A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000157549A priority Critical patent/JP2001338933A/ja
Priority claimed from JP2000157549A external-priority patent/JP2001338933A/ja
Publication of JP2001338933A publication Critical patent/JP2001338933A/ja
Publication of JP2001338933A5 publication Critical patent/JP2001338933A5/ja
Pending legal-status Critical Current

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JP2000157549A 2000-05-29 2000-05-29 半導体パッケージの製造方法 Pending JP2001338933A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000157549A JP2001338933A (ja) 2000-05-29 2000-05-29 半導体パッケージの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000157549A JP2001338933A (ja) 2000-05-29 2000-05-29 半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JP2001338933A JP2001338933A (ja) 2001-12-07
JP2001338933A5 true JP2001338933A5 (cg-RX-API-DMAC7.html) 2007-03-01

Family

ID=18662165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000157549A Pending JP2001338933A (ja) 2000-05-29 2000-05-29 半導体パッケージの製造方法

Country Status (1)

Country Link
JP (1) JP2001338933A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009164407A (ja) * 2008-01-08 2009-07-23 Sumitomo Heavy Ind Ltd 樹脂封止装置および樹脂封止方法
JP4462353B2 (ja) * 2008-01-11 2010-05-12 セイコーエプソン株式会社 フレキシブル基板の製造方法及びフレキシブル基板打抜装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0329331A (ja) * 1989-06-26 1991-02-07 Mitsubishi Electric Corp 半導体製造方法
JPH0715926B2 (ja) * 1990-09-14 1995-02-22 株式会社東芝 ワイヤボンディング検査装置
JP2710703B2 (ja) * 1991-05-21 1998-02-10 三菱電機株式会社 半導体製品の成形・仕分け収納方法およびその収納装置
KR100216840B1 (ko) * 1996-12-06 1999-09-01 김규현 반도체 패키지용 인쇄회로기판 스트립
JP2000068296A (ja) * 1998-08-19 2000-03-03 Nichiden Mach Ltd ダイボンダ
JP2000174041A (ja) * 1998-09-30 2000-06-23 Shibaura Mechatronics Corp ペレットボンディング装置
JP3279306B2 (ja) * 2000-04-10 2002-04-30 松下電器産業株式会社 電子部品製造方法

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