JP2001338902A5 - - Google Patents
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- JP2001338902A5 JP2001338902A5 JP2000157007A JP2000157007A JP2001338902A5 JP 2001338902 A5 JP2001338902 A5 JP 2001338902A5 JP 2000157007 A JP2000157007 A JP 2000157007A JP 2000157007 A JP2000157007 A JP 2000157007A JP 2001338902 A5 JP2001338902 A5 JP 2001338902A5
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- Japan
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000157007A JP3916846B2 (ja) | 2000-05-26 | 2000-05-26 | 基板研磨装置及び基板研磨方法 |
| US09/864,208 US20020023715A1 (en) | 2000-05-26 | 2001-05-25 | Substrate polishing apparatus and substrate polishing mehod |
| US11/806,581 US20070238395A1 (en) | 2000-05-26 | 2007-06-01 | Substrate polishing apparatus and substrate polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000157007A JP3916846B2 (ja) | 2000-05-26 | 2000-05-26 | 基板研磨装置及び基板研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001338902A JP2001338902A (ja) | 2001-12-07 |
| JP2001338902A5 true JP2001338902A5 (hu) | 2005-07-07 |
| JP3916846B2 JP3916846B2 (ja) | 2007-05-23 |
Family
ID=18661708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000157007A Expired - Fee Related JP3916846B2 (ja) | 2000-05-26 | 2000-05-26 | 基板研磨装置及び基板研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3916846B2 (hu) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3916375B2 (ja) | 2000-06-02 | 2007-05-16 | 株式会社荏原製作所 | ポリッシング方法および装置 |
| JP4698144B2 (ja) | 2003-07-31 | 2011-06-08 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| KR101958874B1 (ko) | 2008-06-04 | 2019-03-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법 |
| JP5744382B2 (ja) * | 2008-07-24 | 2015-07-08 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
| KR101065168B1 (ko) | 2009-09-09 | 2011-09-16 | 주식회사 아이매스 | 웨이퍼용 회전식 연마장치 |
| CN103367105B (zh) * | 2012-03-26 | 2016-08-10 | 上海华虹宏力半导体制造有限公司 | 一种笔形海绵固定装置 |
| JP6740065B2 (ja) * | 2016-09-13 | 2020-08-12 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法 |
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2000
- 2000-05-26 JP JP2000157007A patent/JP3916846B2/ja not_active Expired - Fee Related