JP2001338849A - Resin coating laminated aluminum plate for electronic component case and its manufacturing method as well as capacitor case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin coating laminated aluminum plate, for an electronic component case in which a resin layer is not discolored while a molding and working property is being maintained and whose printability is superior, and to provide its manufacturing method as well as to provide a capacitor case. SOLUTION: The resin coating laminated aluminum plate 1 for the electronic component case is constituted so as to be provided with an aluminum plate 2, a thermoplastic resin film 3 which is formed on one face or both faces of the aluminum plate 2 and a thermosetting resin coating layer 4 which is formed on the surface of the film 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-coated laminated aluminum plate for an electronic component case having a resin coating layer on one or both sides of an aluminum plate, a method for producing the same, and a molding from the resin-coated laminated aluminum for the electronic component case. The present invention relates to a capacitor case to be processed.

[0002]

2. Description of the Related Art In general, in order to reduce the size of electronic parts, instead of the conventional manufacturing method for coating a heat-shrinkable tube,
2. Description of the Related Art Conventionally, resin-coated laminated aluminum for electronic component cases has been proposed in which a resin is provided on the surface of an aluminum plate in advance. As one example, as disclosed in JP-A-8-1857, a resin-coated laminated aluminum plate for an electronic component case has a polyamide resin layer having a maximum spherulite diameter of 10 μm or less laminated on at least one surface of the aluminum plate. There is a configuration.

[0003] The resin-coated laminated aluminum plate for an electronic part case has an advantage that the polyamide resin layer has a spherulite of 10 µm or less and is excellent in secondary workability such as drawing workability, so that it is easy to produce. Then, it can be suitably used for a drawn product such as a capacitor outer container.

Another example is disclosed in Japanese Patent Application Laid-Open No. H11-1237.
JP-A-5-326347 and JP-A-5-326347 have also proposed an embodiment in which a polyester resin is provided on the surface of an aluminum plate as a configuration of a resin-coated laminated aluminum plate for an electronic component case.

[0005] Each of the above-mentioned resin-coated laminated aluminum plates for electronic component cases is subjected to drawing and ironing in the step of forming into a capacitor case as an electronic component case, for example, to degrease oil used at the time of processing. After that, letters and the like are printed on the surface of the capacitor case with ink to form a molded product.

[0006]

However, the structure of the conventional resin-coated laminated aluminum plate for an electronic component case has the following problems. That is, the resin-coated laminated aluminum plate for the electronic component case is subjected to a degreasing treatment with an organic solvent such as trichlene or alcohol or a chemical such as an acid or an alkali in a state where the resin layer is laminated on the aluminum plate. ) Dissolves the resin layer and deforms the surface. As a result, the resin layer of the resin-coated laminated aluminum plate for an electronic component case was discolored such as becoming cloudy.

Further, in a resin-coated laminated aluminum plate for an electronic part case or a molded capacitor case, irregularities are generated on the surface of the resin layer in the manufacturing process, and oligomers may not precipitate. At the same time, the resin layer is in a state of increasing irregularities.
Therefore, when printing is performed on the resin layer, blurring may occur in a printing result depending on printing conditions.

The present invention has been made in view of the above-mentioned problems, and has a resin-coated laminated aluminum plate for an electronic component case which is excellent in printability without causing discoloration of a resin layer while maintaining moldability. And a method for manufacturing the same, and a capacitor case.

[0009]

In order to achieve the above object, the present invention has the following arrangement. That is, the resin-coated laminated aluminum plate for an electronic component case includes an aluminum plate, a thermoplastic resin film provided on one or both surfaces of the aluminum plate, and a thermosetting resin coating layer provided on the surface of the thermoplastic resin film. And a configuration including: With this configuration, the thermoplastic resin film does not come into contact with the degreasing agent, and is protected by the thermosetting resin coating layer having excellent chemical resistance. In addition, since the surface of the thermosetting resin coating layer is hardly roughened by the degreasing agent,
The printing performance can also be improved.

The thermoplastic resin film of the resin-coated laminated aluminum plate for an electronic component case is formed of a polyamide resin or a polyester resin.
With this configuration, the resin-coated laminated aluminum plate for the electronic component case protects the thermoplastic resin film with the thermosetting resin coating layer, so that the thermoplastic film is roughened by a degreasing agent such as an organic solvent. However, the moldability can be maintained.

Further, the thermosetting resin coating layer of the resin-coated laminated aluminum plate for an electronic component case is formed of a polyester resin containing a curing agent or an epoxy resin. With this configuration, it is possible to improve the adhesiveness between the thermosetting resin coating layer and the thermoplastic resin film, and to protect the thermoplastic resin film with the thermosetting resin coating layer in an electronic component case. Molding workability of the resin-coated laminated aluminum plate for use.

The thickness of the thermoplastic resin film of the resin-coated laminated aluminum plate for the electronic component case is 5 to 300 μm. With such a configuration, the moldability can be appropriately secured.

Further, the thermosetting resin coating layer of the resin-coated laminated aluminum plate for an electronic component case has a thickness of 0.5 to 100 μm. With this configuration, the thermosetting resin coating layer can secure the thickness sufficient to flatten the unevenness of the thermoplastic resin film and protect the thermoplastic resin film.

A method for producing a resin-coated laminated aluminum plate for an electronic part case is described in the following. A resin for an electronic part case is provided with a thermosetting resin coating layer on the surface of a thermoplastic resin film provided on one or both sides of the aluminum plate. In the method for producing a coated laminated aluminum plate, the thermosetting resin coating layer is provided in advance on the thermoplastic resin film to form a laminated film, and the laminated film is provided on the aluminum plate. With this configuration, a simple configuration is sufficient for a production line when laminating on an aluminum plate.

Further, another method for producing a resin-coated laminated aluminum plate for an electronic component case includes a method of forming a thermosetting resin coating layer on a surface of a thermoplastic resin film provided on one or both surfaces of the aluminum plate. A method for producing a resin-coated laminated aluminum plate for use, comprising laminating a thermoplastic resin film on the aluminum plate, providing the thermosetting resin coating layer on the thermoplastic resin film, and performing heat treatment. With this configuration, the thermoplastic resin film melts and adheres to the aluminum plate, and the thermosetting resin coating layer thermally cures and adheres to the thermoplastic resin film.

Further, a capacitor case is formed by using the resin-coated laminated aluminum plate for an electronic component case having the above-described structure. With this configuration, the capacitor case has good moldability even when formed by drawing or ironing. Further, since the printing is performed in a state where the thermoplastic resin film is covered with the thermosetting resin coating film layer, problems such as bleeding do not occur.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an enlarged cross-sectional view showing a resin-coated laminated aluminum plate for an electronic component case, FIGS. 2 to 4 are schematic views showing steps of manufacturing the resin-coated laminated aluminum plate for an electronic component case, respectively, and FIG. 5 is an electronic component. It is a schematic diagram which shows the state which shape | molds the resin case laminated resin sheet for a case, and shapes a capacitor case.

As shown in FIG. 1, a resin-coated laminated aluminum plate 1 for an electronic component case includes a thermoplastic resin film 3 provided on at least one surface of an aluminum plate 2 with an adhesive layer 5 interposed therebetween. 3 and a thermosetting resin coating film layer 4 provided on the surface.

The aluminum plate 2 is formed of a pure aluminum material or an aluminum alloy material, and is not particularly limited to a material.
A1050, A1100, and A120 defined in “00”
Pure aluminum such as A3003, A3004
It is preferable to use an alloy material such as aluminum and manganese having a thickness of about 0.2 to 0.6 mm.

Further, in order to improve the adhesion between the aluminum material and the resin, the aluminum surface contains a phosphoric acid chromate treatment film, a chromate chromate treatment film, a film composed of an organic resin and chromium, zirconium or titanium. A chemical conversion coating, or a coating on which one type of coating selected from the group consisting of etching treatments such as electrolytic etching is formed can also be used.

As shown in FIG. 1, the adhesive layer 5 is a layer provided as needed. When the adhesive layer 5 is provided, for example, an epoxy-based adhesive or a silane coupling agent is used. Can be mentioned. When the adhesion between the aluminum plate 2 and the thermoplastic resin film 3 is sufficient by heat treatment, it is not necessary to provide the adhesive layer 5.

As shown in FIG. 1, the thermoplastic resin film 3 is not particularly limited, but is made of a polyamide resin, a polyester resin, a fluorine resin, a polyolefin resin, or other resin suitable for workability such as drawing. Can be used. As the polyamide resin, for example, nylon 6, nylon 66, or a copolymer resin thereof can be used.

Examples of the polyester-based resin include polyethylene terephthalate resin, polyethylene naphthalate resin, polyethylene isophthalate resin, polybutylene terephthalate resin and the like, and isophthalic acid,
Adipic acid, sebacic acid, neopentyglycol, diethylene glycol, 1-cyclohexanedimetal, 4
-Copolymer resins with cyclohexanedimetal and the like can be used.

OLE_LINK1 thermoplastic resin film 3
OLE_LINK1 has a thickness of 5 to 300 μm. With such a configuration, the moldability can be appropriately secured. Thermoplastic resin film 3
When the thickness is 5 μm or less, the formability is poor, and when the thickness is 300 μm or more, the performance such as the formability is saturated, cracks may be generated, and Values are undesirable.

As shown in FIG. 1, the thermosetting resin coating layer 4
The resin is not particularly limited as long as it has excellent chemical resistance. For example, a polyester resin containing a curing agent or an epoxy resin is used.

As the polyester resin, those having the above-mentioned constitutions can be used, and the following curing agents can be suitably used as the curing agent added to the polyester resin. For example,
Amino resin, phenol resin, urethane resin and the like. By adding a curing agent, a polyester resin is promoted in a cross-linked state, and can improve chemical resistance.

As the epoxy resin, bisphenol A comprising bisphenol A and epichlorohydrin is used.
A type epoxy resin, a novolak type epoxy resin or a bisphenol F type epoxy resin can be preferably used.

Further, the thermosetting resin coating layer 4 has a thickness of 0.5 to 100 μm. With this configuration, the thermosetting resin coating layer 4 can secure the thickness sufficient to flatten the irregularities of the thermoplastic resin film 3 and protect the thermoplastic resin film 3. .

The thermosetting resin coating layer 4 has a thickness of 0.1 mm.
When it is 5 μm or less, if the thermosetting resin coating layer 4 has irregularities, or if oligomers are deposited to form irregularities, it is not appropriate to flatten the irregularities,
In addition, there is a high possibility that the thermoplastic resin film 3 will be exposed after the molding process, and appropriate protection cannot be performed. Further, when the thermosetting resin coating layer has a thickness of 100 μm or more,
Molding processability deteriorates.

In the method of manufacturing the resin-coated laminated aluminum plate 1 for an electronic component case, the resin-coated laminated aluminum plate 1 is manufactured by a film lamination or extrusion lamination method. A film laminate generally refers to one having a process as shown in FIG. As shown in FIG. 2, the aluminum plate 2 unwound from the coil 10 is heated by an oven 12 after applying an adhesive by a roll coater 11.

The heated aluminum plate 2 with the adhesive applied thereto is placed on two heated rolls 1 of a laminating apparatus 13.
When it passes between 3a and 13b while being pressurized, it is laminated with a laminated film 6 composed of a thermoplastic resin film 3 provided with a thermosetting resin coating layer 4 which is formed into a film and wound in a coil shape in advance. Then, the aluminum plate 1 provided with the laminated film 6 is wound around the coil 14 again. In this method, an adhesive is applied on the aluminum plate 2 in advance to improve the adhesiveness.

Extrusion lamination generally means that a molten resin extruded into a film from an extruder is placed on an aluminum plate and passed through two rolls cooled below the melting point of the resin while applying pressure. And a method of laminating an aluminum plate and a film (not shown).

In both of the above methods, as shown in FIG. 3, if necessary, the coil 14 is produced by the above method, rewound, heated by an oven 21 to the melting point of the resin or higher, and then cooled by a cooler 22. A step of cooling by water cooling or air cooling and rewinding the coil 23 again can be provided. In both of the above-described methods, for example, the step of manufacturing a laminated material and the step of heat treatment as shown in FIG. 3 can be performed continuously in one pass.

FIG. 4 shows another method of manufacturing the resin-coated laminated aluminum plate 1 for an electronic component case. In FIG. 4, the same members as those in FIGS. 2 and 3 are denoted by the same reference numerals and described. As shown in FIG. 4, the aluminum plate 2 unwound from the coil 10 is applied with an adhesive by a roll coater 11 and then dried by heating in an oven 12.

The aluminum plate 2 coated with the adhesive and heated is heated in a laminating device 13 with the thermoplastic resin film 3 previously formed into a film and wound into a coil.
The books are stacked by passing between the rolls 13a and 13b while applying pressure. Further, the thermoplastic resin film 3
A thermosetting resin coating layer 4 is provided on the surface of the coating roll coater 1 for coating.
5 is applied. Thereafter, the resin is heated to a temperature equal to or higher than the melting point of the resin in the oven 21, then cooled by water or air in the cooler 22, and wound around the coil 23 again, thereby manufacturing the resin-coated laminated aluminum plate for electronic component case 1.

The resin-coated laminated aluminum plate 1 for an electronic component case manufactured in this manner is, as shown in FIG.
It is cut into a predetermined size, deep drawn and ironed by press forming, and formed into a bottomed cylindrical container. Then, a degreasing treatment is performed. Thereafter, the electrolytic element is inserted into the case, sealed, and tightened. Then, printing for performance notation is performed to form a capacitor case.

At this time, the resin-coated laminated aluminum plate 1 for the electronic component case has good adhesion between the aluminum plate and the thermoplastic resin film and the thermosetting resin coating layer, and good workability of the thermoplastic resin film. No delamination will occur for such reasons. Since the thermosetting resin coating layer is provided on the thermoplastic resin film, the processability of the resin-coated laminated aluminum plate 1 for the electronic component case can be maintained as a whole by the followability of the thermoplastic resin film. .

As shown in FIG. 5, the molded article is degreased with an organic solvent. At this time, since the thermosetting resin coating layer is formed, the molded article is deteriorated by the organic solvent (dissolution of the plasticizer). Etc.). Further, when characters are printed on the molded article by the ink jet method and the ink is dried, printing can be performed without blurring. This is because, since the thermosetting resin coating layer is formed on the surface side of the molded product, the unevenness of the thermoplastic resin film is formed flat (flattened), and there is almost no unevenness into which the ink enters. .

[0039]

Next, embodiments of the present invention will be described. Note that the present invention is not limited to this embodiment. The resin-coated laminated aluminum plate for an electronic component case is a 0.3 mm thick AA1100 aluminum plate subjected to a phosphoric acid chromate treatment, an isocyanate-based adhesive layer, a homo-PET (polyester-based resin), nylon 6 Each film (thermoplastic resin film) made of (polyamide resin), epoxy phenol paint, and each paint (thermosetting resin coating layer) made of polyester paint obtained by adding amino resin to the curing agent. It consisted of.

The film was laminated after forming an adhesive layer on an aluminum plate. Then, the coating material was provided on the surface of the film, heated at 265 ° C. which was higher than the melting point of the film (the melting point of nylon 6 was 215 ° C., and homo PET was 255 ° C.), and then rapidly cooled to obtain a test material. Then, using the obtained test material, a drawing ratio of 48%
Then, a cap material having a diameter of 30 mm and a height of 30 mm having a resin surface on the outer surface side was formed to form the respective structures of Examples No. 1 to No. 17.

In Comparative Examples No. 18 to No. 24, the paint-free state was obtained by a process before the coating material was provided in the above-mentioned embodiment, with a drawing ratio of 48% and a resin surface on the outer surface side.
A cap material having a diameter of 30 mm and a height of 30 mm was formed. In the case of a configuration in which paint is directly provided on an aluminum plate, a 0.3 mm thick AA1100 treated with phosphoric acid chromate is used.
The aluminum plate was directly coated with each of an epoxyphenol-based paint and a polyester-based paint obtained by adding an amino resin to a curing agent, heated at 265 ° C., and rapidly cooled to obtain a test material. Then, a cap material having a diameter of 30 mm and a height of 30 mm having a resin surface on the outer surface was formed at a drawing ratio of 48%.

For evaluation of workability, the state such as peeling and cracking of the film was visually observed. The chemical resistance is 30
% Hydrochloric acid, 10% sodium hydroxide, trichlene, and ethylene glycol were used, and the appearance of the film provided with the paint after immersion at room temperature (20 ° C.) for 10 days was evaluated.

The printability was evaluated by using a UV (ultraviolet) curable ink, dropping the ink, and visually observing the degree of bleeding of the cured ink. For each performance,
Table 1 shows good cases as and bad cases as x.

[0044]

[Table 1]

The thickness of the thermoplastic resin film is 5 to 300.
μm, the thickness of the thermosetting resin coating layer is 0.5 to
Under the conditions of 100 μm or less, Examples No. 2 to No.
As shown by Nos. 8, No. 9, No. 11 to No. 14, and No. 17, when the film was thicker than the paint, good results were obtained in workability, chemical resistance, and printability. Further, as shown in Examples No. 1, No. 6, No. 10, and No. 15, good results were obtained with respect to workability, chemical resistance, and printability even when the film and the paint had the same thickness. Further, as shown in Examples No7 and No16,
Good results were obtained for workability, chemical resistance and printability even when the paint was thicker than the film.

As shown in Comparative Examples No. 18 to No. 24, when there is no paint, when there is a paint but no film, or when the thickness of the thermoplastic resin film is 5 to 30
Workability, such as when the thickness is other than 0 μm, and when the thickness of the thermosetting resin coating layer is other than 0.5 to 100 μm,
It can be seen that either the chemical resistance or the printability was poor.

In the present invention, the resin and the thickness of the thermoplastic resin film and the thermosetting resin coating layer are limited to a predetermined type and a predetermined numerical range. The type and thickness are appropriately specified depending on the molded product molded from the laminated aluminum plate.

[0048]

As described above, the present invention has the following advantages. (1) The resin-coated laminated aluminum plate for the electronic component case is protected by the thermosetting resin coating layer having excellent chemical resistance without the thermoplastic resin film coming into contact with the degreasing agent. Therefore, the discoloration of the thermoplastic resin film in the degreasing process can be prevented and the printing performance can be improved in a state in which the formability at the time of drawing or ironing is good.

(2) The thermoplastic resin film of the resin-coated laminated aluminum plate for an electronic component case is formed of a polyamide resin or a polyester resin so that it can be formed by drawing and ironing. Particularly excellent in moldability.

(3) The thermosetting resin coating layer of the resin-coated laminated aluminum plate for an electronic component case is formed of a polyester resin containing a curing agent or an epoxy resin so that the thermosetting resin coating is applied. The adhesiveness between the film layer and the thermoplastic resin film can be improved, and the moldability of the resin-coated laminated aluminum plate for electronic component cases is ensured with the thermoplastic resin film protected by the thermosetting resin coating layer. be able to.

(4) The thermoplastic resin film of the resin-coated laminated aluminum plate for an electronic component case has a thickness of 5 to 5.
The configuration was 300 μm. With such a configuration, the moldability can be appropriately secured.

(5) The thermosetting resin coating layer of the resin-coated laminated aluminum plate for an electronic component case has a thickness of 0.5
１００100 μm. With this configuration, the thermosetting resin coating layer can secure the thickness sufficient to flatten the unevenness of the thermoplastic resin film and protect the thermoplastic resin film.

(6) As a method for producing a resin-coated laminated aluminum plate for an electronic part case, a thermoplastic resin film is provided with the thermosetting resin coating layer in advance to form a laminated film, and the laminated film is applied to the aluminum plate. The configuration was provided. With this configuration, when laminating on an aluminum plate, a simple configuration of the production line is sufficient.

(7) As a method of manufacturing a resin-coated laminated aluminum plate for an electronic component case, a thermoplastic resin film is laminated on the aluminum plate, and the thermosetting resin coating layer is formed on the thermoplastic resin film. And heat treatment was performed. With this configuration, poor adhesion between the thermoplastic resin film and the aluminum plate or between the thermosetting resin coating layer and the thermoplastic resin film due to moisture or the like can be minimized.

(8) A capacitor case was formed by molding using a resin-coated laminated aluminum plate for an electronic component case. With such a configuration, the capacitor case maintains good moldability even when formed by drawing or ironing, and is excellent in chemical resistance and printability.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view of a resin-coated laminated aluminum plate for an electronic component case according to the present invention.

FIG. 2 is a schematic view illustrating a process of manufacturing a resin-coated laminated aluminum plate for an electronic component case according to the present invention.

FIG. 3 is a schematic view showing a manufacturing process of the resin-coated laminated aluminum plate for an electronic component case according to the present invention.

FIG. 4 is a schematic view showing a manufacturing process of the resin-coated laminated aluminum plate for an electronic component case according to the present invention.

FIG. 5 is a schematic diagram showing a state in which a capacitor case is formed by forming and processing a resin-coated laminated aluminum plate for an electronic component case according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin-coated laminated aluminum plate for electronic component cases 2 Layer between aluminum plates 3 Thermoplastic resin film 4 Thermosetting resin coating layer for front part

Claims (10)

[Claims] 1. An aluminum plate, a thermoplastic resin film provided on one or both surfaces of the aluminum plate, and a thermosetting resin coating layer provided on a surface of the thermoplastic resin film. Resin-coated laminated aluminum plate for electronic component cases. 2. The resin-coated laminated aluminum plate for an electronic component case according to claim 1, wherein the thermoplastic resin film is a polyamide resin. 3. The resin-coated laminated aluminum plate for an electronic component case according to claim 1, wherein the thermoplastic resin film is a polyester resin. 4. The resin-coated laminated aluminum plate for an electronic component case according to claim 1, wherein the thermosetting resin coating layer is a polyester resin containing a curing agent. 5. The resin-coated laminated aluminum plate for an electronic component case according to claim 1, wherein the thermosetting resin coating layer is an epoxy resin. 6. The resin-coated laminated aluminum plate for an electronic component case according to claim 1, wherein the thermoplastic resin film has a thickness of 5 to 300 μm. 7. The resin-coated laminated aluminum plate for an electronic component case according to claim 1, wherein the thermosetting resin coating layer has a thickness of 0.5 to 100 μm. . 8. A method for producing a resin-coated laminated aluminum plate for an electronic component case, wherein a thermosetting resin coating layer is provided on the surface of a thermoplastic resin film provided on one or both surfaces of an aluminum plate, wherein the thermoplastic resin A method for producing a resin-coated laminated aluminum plate for an electronic component case, comprising: providing a thermosetting resin coating layer on a film in advance to form a laminated film; and providing the laminated film on the aluminum plate. 9. A method for producing a resin-coated laminated aluminum plate for an electronic component case, wherein a thermosetting resin coating layer is provided on the surface of a thermoplastic resin film provided on one or both surfaces of an aluminum plate, A method of manufacturing a resin-coated laminated aluminum plate for an electronic component case, comprising laminating a thermoplastic resin film on a substrate, applying the thermosetting resin coating layer to the thermoplastic resin film, and performing heat treatment. 10. A capacitor case formed by using the resin-coated laminated aluminum plate for an electronic component case according to claim 6 or 7.