JP2001326204A5 - - Google Patents
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- Publication number
- JP2001326204A5 JP2001326204A5 JP2001056038A JP2001056038A JP2001326204A5 JP 2001326204 A5 JP2001326204 A5 JP 2001326204A5 JP 2001056038 A JP2001056038 A JP 2001056038A JP 2001056038 A JP2001056038 A JP 2001056038A JP 2001326204 A5 JP2001326204 A5 JP 2001326204A5
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- JP
- Japan
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001056038A JP2001326204A (ja) | 2000-03-09 | 2001-02-28 | 半導体装置の製造方法および研磨方法 |
| US09/800,580 US6797623B2 (en) | 2000-03-09 | 2001-03-08 | Methods of producing and polishing semiconductor device and polishing apparatus |
| KR1020010012287A KR100741148B1 (ko) | 2000-03-09 | 2001-03-09 | 반도체 소자의 제조 및 연마 방법, 및 연마 장치 |
| US10/327,860 US7186322B2 (en) | 2000-03-09 | 2002-12-26 | Methods of producing and polishing semiconductor device and polishing apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-71083 | 2000-03-09 | ||
| JP2000071083 | 2000-03-09 | ||
| JP2001056038A JP2001326204A (ja) | 2000-03-09 | 2001-02-28 | 半導体装置の製造方法および研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001326204A JP2001326204A (ja) | 2001-11-22 |
| JP2001326204A5 true JP2001326204A5 (es) | 2008-03-06 |
Family
ID=26587476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001056038A Pending JP2001326204A (ja) | 2000-03-09 | 2001-02-28 | 半導体装置の製造方法および研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001326204A (es) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4644954B2 (ja) * | 2000-03-09 | 2011-03-09 | ソニー株式会社 | 研磨装置 |
| JP2003113500A (ja) | 2001-10-03 | 2003-04-18 | Toshiba Corp | 電解研磨方法 |
| US6837983B2 (en) * | 2002-01-22 | 2005-01-04 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| JP2003311540A (ja) * | 2002-04-30 | 2003-11-05 | Sony Corp | 電解研磨液、電解研磨方法及び半導体装置の製造方法 |
| JP2003311538A (ja) * | 2002-04-23 | 2003-11-05 | Sony Corp | 研磨方法、研磨装置及び半導体装置の製造方法 |
| JP2003311536A (ja) * | 2002-04-23 | 2003-11-05 | Sony Corp | 研磨装置及び研磨方法 |
| JP2003311539A (ja) * | 2002-04-30 | 2003-11-05 | Sony Corp | 研磨方法および研磨装置、並びに半導体装置の製造方法 |
| US8058582B2 (en) | 2006-10-18 | 2011-11-15 | Mitsubishi Electric Corporation | Electrical discharge machining apparatus and electrical discharge machining method |
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2001
- 2001-02-28 JP JP2001056038A patent/JP2001326204A/ja active Pending