JP2001326204A - 半導体装置の製造方法および研磨方法 - Google Patents

半導体装置の製造方法および研磨方法

Info

Publication number
JP2001326204A
JP2001326204A JP2001056038A JP2001056038A JP2001326204A JP 2001326204 A JP2001326204 A JP 2001326204A JP 2001056038 A JP2001056038 A JP 2001056038A JP 2001056038 A JP2001056038 A JP 2001056038A JP 2001326204 A JP2001326204 A JP 2001326204A
Authority
JP
Japan
Prior art keywords
film
copper
semiconductor device
metal film
chelate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001056038A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001326204A5 (enExample
Inventor
Shuzo Sato
修三 佐藤
Yuji Segawa
雄司 瀬川
Hiroshi Yubi
啓 由尾
Suguru Otorii
英 大鳥居
Yoshiya Yasuda
善哉 安田
Shigeo Ishihara
成郎 石原
Takeshi Nogami
毅 野上
Hisanori Komai
尚紀 駒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2001056038A priority Critical patent/JP2001326204A/ja
Priority to US09/800,580 priority patent/US6797623B2/en
Priority to KR1020010012287A priority patent/KR100741148B1/ko
Publication of JP2001326204A publication Critical patent/JP2001326204A/ja
Priority to US10/327,860 priority patent/US7186322B2/en
Publication of JP2001326204A5 publication Critical patent/JP2001326204A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2001056038A 2000-03-09 2001-02-28 半導体装置の製造方法および研磨方法 Pending JP2001326204A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001056038A JP2001326204A (ja) 2000-03-09 2001-02-28 半導体装置の製造方法および研磨方法
US09/800,580 US6797623B2 (en) 2000-03-09 2001-03-08 Methods of producing and polishing semiconductor device and polishing apparatus
KR1020010012287A KR100741148B1 (ko) 2000-03-09 2001-03-09 반도체 소자의 제조 및 연마 방법, 및 연마 장치
US10/327,860 US7186322B2 (en) 2000-03-09 2002-12-26 Methods of producing and polishing semiconductor device and polishing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-71083 2000-03-09
JP2000071083 2000-03-09
JP2001056038A JP2001326204A (ja) 2000-03-09 2001-02-28 半導体装置の製造方法および研磨方法

Publications (2)

Publication Number Publication Date
JP2001326204A true JP2001326204A (ja) 2001-11-22
JP2001326204A5 JP2001326204A5 (enExample) 2008-03-06

Family

ID=26587476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001056038A Pending JP2001326204A (ja) 2000-03-09 2001-02-28 半導体装置の製造方法および研磨方法

Country Status (1)

Country Link
JP (1) JP2001326204A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001322036A (ja) * 2000-03-09 2001-11-20 Sony Corp 研磨装置
WO2003090964A1 (en) * 2002-04-23 2003-11-06 Sony Corporation Polishing system and polishing method
WO2003090965A1 (en) * 2002-04-23 2003-11-06 Sony Corporation Polishing method, polishing device, and method of manufacturing semiconductor equipment
WO2003092945A1 (en) * 2002-04-30 2003-11-13 Sony Corporation Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device
WO2003092944A1 (en) * 2002-04-30 2003-11-13 Sony Corporation Polishing method and polishing system, and method for fabricating semiconductor device
US6783658B2 (en) 2001-10-03 2004-08-31 Kabushiki Kaisha Toshiba Electropolishing method
JP2010147489A (ja) * 2002-01-22 2010-07-01 Applied Materials Inc 電気化学的機械研磨のプロセス制御
KR101039509B1 (ko) 2006-10-18 2011-06-08 미쓰비시덴키 가부시키가이샤 방전가공 장치 및 방전가공 방법
JP2021027359A (ja) * 2019-08-05 2021-02-22 国立大学法人大阪大学 陽極酸化を援用した研磨方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144568A (ja) * 1974-10-16 1976-04-16 Nippon Telegraph & Telephone Denkaikaseiso
JPH0883780A (ja) * 1994-07-12 1996-03-26 Toshiba Corp 研磨剤および研磨方法
JPH10270412A (ja) * 1997-03-26 1998-10-09 Internatl Business Mach Corp <Ibm> ワークピースを平坦化する方法および装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144568A (ja) * 1974-10-16 1976-04-16 Nippon Telegraph & Telephone Denkaikaseiso
JPH0883780A (ja) * 1994-07-12 1996-03-26 Toshiba Corp 研磨剤および研磨方法
JPH10270412A (ja) * 1997-03-26 1998-10-09 Internatl Business Mach Corp <Ibm> ワークピースを平坦化する方法および装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001322036A (ja) * 2000-03-09 2001-11-20 Sony Corp 研磨装置
US6783658B2 (en) 2001-10-03 2004-08-31 Kabushiki Kaisha Toshiba Electropolishing method
JP2010147489A (ja) * 2002-01-22 2010-07-01 Applied Materials Inc 電気化学的機械研磨のプロセス制御
WO2003090964A1 (en) * 2002-04-23 2003-11-06 Sony Corporation Polishing system and polishing method
WO2003090965A1 (en) * 2002-04-23 2003-11-06 Sony Corporation Polishing method, polishing device, and method of manufacturing semiconductor equipment
WO2003092945A1 (en) * 2002-04-30 2003-11-13 Sony Corporation Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device
WO2003092944A1 (en) * 2002-04-30 2003-11-13 Sony Corporation Polishing method and polishing system, and method for fabricating semiconductor device
US7141501B2 (en) 2002-04-30 2006-11-28 Sony Corporation Polishing method, polishing apparatus, and method of manufacturing semiconductor device
KR101039509B1 (ko) 2006-10-18 2011-06-08 미쓰비시덴키 가부시키가이샤 방전가공 장치 및 방전가공 방법
JP2021027359A (ja) * 2019-08-05 2021-02-22 国立大学法人大阪大学 陽極酸化を援用した研磨方法
JP7628677B2 (ja) 2019-08-05 2025-02-12 国立大学法人大阪大学 陽極酸化を援用した研磨方法

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