JP2001326178A5 - - Google Patents

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Publication number
JP2001326178A5
JP2001326178A5 JP2001063900A JP2001063900A JP2001326178A5 JP 2001326178 A5 JP2001326178 A5 JP 2001326178A5 JP 2001063900 A JP2001063900 A JP 2001063900A JP 2001063900 A JP2001063900 A JP 2001063900A JP 2001326178 A5 JP2001326178 A5 JP 2001326178A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001063900A
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Japanese (ja)
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JP2001326178A (ja
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Publication date
Application filed filed Critical
Priority to JP2001063900A priority Critical patent/JP2001326178A/ja
Priority claimed from JP2001063900A external-priority patent/JP2001326178A/ja
Publication of JP2001326178A publication Critical patent/JP2001326178A/ja
Publication of JP2001326178A5 publication Critical patent/JP2001326178A5/ja
Withdrawn legal-status Critical Current

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JP2001063900A 2000-03-08 2001-03-07 半導体装置及びその作製方法 Withdrawn JP2001326178A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001063900A JP2001326178A (ja) 2000-03-08 2001-03-07 半導体装置及びその作製方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-64186 2000-03-08
JP2000-63000 2000-03-08
JP2000064186 2000-03-08
JP2000063000 2000-03-08
JP2001063900A JP2001326178A (ja) 2000-03-08 2001-03-07 半導体装置及びその作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012161138A Division JP5483763B2 (ja) 2000-03-08 2012-07-20 液晶表示装置

Publications (2)

Publication Number Publication Date
JP2001326178A JP2001326178A (ja) 2001-11-22
JP2001326178A5 true JP2001326178A5 (enExample) 2008-02-28

Family

ID=27342606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001063900A Withdrawn JP2001326178A (ja) 2000-03-08 2001-03-07 半導体装置及びその作製方法

Country Status (1)

Country Link
JP (1) JP2001326178A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916693B2 (en) * 2000-03-08 2005-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7098084B2 (en) 2000-03-08 2006-08-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP3969698B2 (ja) 2001-05-21 2007-09-05 株式会社半導体エネルギー研究所 発光装置の作製方法
US20020197393A1 (en) 2001-06-08 2002-12-26 Hideaki Kuwabara Process of manufacturing luminescent device
JP2003224070A (ja) * 2001-11-26 2003-08-08 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US8047442B2 (en) * 2007-12-03 2011-11-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN109097545B (zh) * 2018-10-08 2023-09-15 吉林大学 激光预热与高频振动耦合非晶合金表面改性装置与方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321335A (ja) * 1994-05-24 1995-12-08 Semiconductor Energy Lab Co Ltd 半導体装置の作成方法
JP3190520B2 (ja) * 1994-06-14 2001-07-23 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP4162727B2 (ja) * 1994-07-01 2008-10-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3227392B2 (ja) * 1996-09-27 2001-11-12 シャープ株式会社 半導体装置およびその製造方法
JP3493160B2 (ja) * 1999-09-13 2004-02-03 株式会社半導体エネルギー研究所 半導体装置の作製方法

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