JP2001324615A - Spatial filter - Google Patents

Spatial filter

Info

Publication number
JP2001324615A
JP2001324615A JP2000145176A JP2000145176A JP2001324615A JP 2001324615 A JP2001324615 A JP 2001324615A JP 2000145176 A JP2000145176 A JP 2000145176A JP 2000145176 A JP2000145176 A JP 2000145176A JP 2001324615 A JP2001324615 A JP 2001324615A
Authority
JP
Japan
Prior art keywords
spatial filter
filter
adhesive
receiving element
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000145176A
Other languages
Japanese (ja)
Inventor
Kenji Otani
健二 大谷
Seijiro Okada
誠治郎 岡田
Osamu Doi
修 土井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000145176A priority Critical patent/JP2001324615A/en
Publication of JP2001324615A publication Critical patent/JP2001324615A/en
Pending legal-status Critical Current

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  • Mounting And Adjusting Of Optical Elements (AREA)
  • Polarising Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Color Television Image Signal Generators (AREA)

Abstract

PROBLEM TO BE SOLVED: To overcome usually recognized difficulties in lamination of crystalline materials with themselves and lamination of two plates having optic axes shifted with each other with a thermosetting adhesive because a coefficient of linear expansion is largely varied by the optic axis and difficulties in arrangement of a dielectric in the vicinity of a photodetector because the photodetector breaks down in this case. SOLUTION: The construction of a spatial filter 3 comprising a pair of birefringent lithium niobate plates stuck to each other with a conductive and sticky adhesive makes the sticking property of the adhesive absorb distortion of the lithium niobate plates under high temperature. This enables the spatial filter 3 to be directly stuck to a casing 2 of a solid-state image pickup element equipped with the photodetector 4 and attains miniaturization of the device.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、空間フィルタに関
し、特に近年急速に普及の進んでいる受光素子(CC
D)搭載の8ミリビデオやデジタルスチルカメラ等の高
密度化・高画質化を実現する結晶の複屈折効果を利用し
た疑似色信号を除去する光学フィルタの高温時の歪及び
/または帯電防止に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spatial filter, and more particularly to a light receiving element (CC) which has been rapidly spreading in recent years.
D) Anti-distortion and / or anti-static at high temperatures of optical filters that remove pseudo-color signals using the birefringence effect of crystals to achieve higher density and higher image quality for on-board 8 mm video and digital still cameras, etc. .

【0002】[0002]

【従来の技術】従来、空間フィルタは加熱硬化型の接着
剤を用いて撮像素子の封止の提案がなされている。しか
しながら、加熱硬化型接着剤では、高温で硬化させると
きに誘電体基板は分極するため、加熱硬化性接着剤を用
いて筐体との接着はしにくいことが知られている。
2. Description of the Related Art Conventionally, there has been proposed a method of sealing an image sensor using a heat-curable adhesive for a spatial filter. However, it is known that a thermosetting adhesive is difficult to adhere to a housing using a thermosetting adhesive because the dielectric substrate is polarized when cured at a high temperature.

【0003】図5はリチュウムナイオベート(以下LN
とよぶ)を用いた空間フィルタを、加熱硬化型接着剤で
封止した従来の一例を示す図で、図6は、図5のB−B
断面の高温状態での断面を示すものである。図7は、加
工温度ストレスを加えたときの帯電状態を示すグラフで
ある。
FIG. 5 shows lithium niobate (hereinafter referred to as LN).
FIG. 6 is a diagram showing an example of a conventional space filter using a heat-curable adhesive.
It shows a cross section of the cross section in a high temperature state. FIG. 7 is a graph showing a charged state when a processing temperature stress is applied.

【0004】図6において、16は空間フィルタを構成
する第1のLN、17は空間フィルタを構成する第2の
LN、18は第1の加熱硬化型接着剤、19は第2の加
熱硬化型接着剤、11は受光素子、20及び21は分極
状態を示す電荷を示している。
In FIG. 6, reference numeral 16 denotes a first LN forming a spatial filter, 17 denotes a second LN forming a spatial filter, 18 denotes a first thermosetting adhesive, and 19 denotes a second thermosetting adhesive. The adhesive, 11 indicates a light receiving element, and 20 and 21 indicate electric charges indicating a polarization state.

【0005】従来の工法では、接着剤の信頼性を得るた
めに100℃〜150℃の加熱を加えて硬化を行ってき
た。受光素子上にLNを高温で貼りつけると、LNは誘
電体であるため分極して電荷20が発生する。
[0005] In the conventional method, curing is performed by heating at 100 ° C to 150 ° C in order to obtain the reliability of the adhesive. When LN is stuck on the light-receiving element at a high temperature, LN is polarized and generates electric charge 20 because it is a dielectric.

【0006】入射光側の電荷21(図では−)は、押さ
えの治具等で放電されるか空中へ自然に放電をされる。
しかし受光素子側の電荷20(図では+)は100℃以
上で硬化したため、第2のLN17及び受光素子11を
内包する空間は乾燥状態であり、簡単に放電しない。
The electric charge 21 (-in the figure) on the incident light side is discharged by a holding jig or the like or discharged naturally into the air.
However, since the electric charge 20 (+ in the figure) on the light receiving element side is cured at 100 ° C. or higher, the space containing the second LN 17 and the light receiving element 11 is in a dry state and does not easily discharge.

【0007】図7は実際の帯電実験をした一例のデータ
ーをグラフ化したもので、120℃で200V帯電状態
となる。その状態から治具をはずすと、受光素子11へ
放電することで素子破壊を起こしていた。LNや水晶の
上に蒸着されている反射防止膜や赤外カット膜は、一般
には絶縁体であるため抵抗値が高く、乾燥中では放電効
果はない。このため治具を外した後もこの電位が長時間
続くため、素子の破壊を招くこととなる。
FIG. 7 is a graph showing data of an example of an actual charging experiment, in which a charged state at 120 ° C. is 200 V. When the jig was removed from the state, the element was destroyed by discharging to the light receiving element 11. An antireflection film or an infrared cut film deposited on LN or quartz is generally an insulator and therefore has a high resistance value and has no discharge effect during drying. For this reason, since this potential continues for a long time even after the jig is removed, the element is destroyed.

【0008】[0008]

【発明が解決しようとする課題】このような空間フィル
タを用いた固体撮像素子においては、近年小型化、薄型
化が要求されている。LNは複屈折の値が水晶の6.3
倍と大きく、水晶と同等の空間フィルタの効果を得るに
は1/6.3の厚さで構成できることから、薄型化で最
近注目されてきている。また、同時に光学軸によって線
膨張係数が大きく違うため、結晶質の材料どおしの貼り
合わせや、光学軸をずらした加熱硬化性接着剤による貼
り合わせは困難とされていた。さらに、誘電体を受光素
子の近傍に配置することは、受光素子の破壊のため困難
とされてきた。
In recent years, a solid-state imaging device using such a spatial filter has been required to be reduced in size and thickness. LN has a birefringence value of 6.3 of quartz.
Since it can be configured with a thickness of 1 / 6.3 in order to obtain the effect of a spatial filter equivalent to that of quartz, which is twice as large, attention has recently been paid to thinning. At the same time, since the linear expansion coefficients differ greatly depending on the optical axis, it has been difficult to bond crystalline materials together or to bond them with a thermosetting adhesive whose optical axis is shifted. Further, it has been difficult to dispose the dielectric near the light receiving element due to destruction of the light receiving element.

【0009】本発明は、小型で薄型の空間フィルタの小
型化を達成しながら高信頼性も実現することを目的とし
ている。
SUMMARY OF THE INVENTION An object of the present invention is to realize high reliability while achieving downsizing of a small and thin spatial filter.

【0010】[0010]

【課題を解決するための手段】この課題を解決するため
に、本発明の空間フィルタは、少なくとも1枚以上の複
屈折を持つ第1の結晶板と第2の光学ガラス、又は少な
くとも1枚以上の複屈折を持つ第1の結晶板と少なくと
も1枚以上の複屈折を持つ第2の結晶板の何れかを貼り
合わせたフィルタであって、前記フィルタの貼り合わせ
部に伸び率50%以上、ショア硬度60度以下の粘着性
の接着剤で直接接合した構成としたものである。
In order to solve this problem, a spatial filter according to the present invention comprises at least one or more first crystal plate and second optical glass having birefringence, or at least one or more sheets. A first crystal plate having a birefringence of at least one and a second crystal plate having a birefringence of at least one, wherein the elongation rate is 50% or more at the bonded portion of the filter, It is configured to be directly bonded with a tacky adhesive having a Shore hardness of 60 degrees or less.

【0011】また、上記空間フィルタ上には、反射防止
膜、反射防止膜と同時に透明導電膜、Tiを含む多層
膜、または空間フィルタの側面は樹脂性の導電材料を塗
布しておく。
An anti-reflection film, a transparent conductive film, a multilayer film containing Ti, or a resin-based conductive material is applied to the side surfaces of the spatial filter simultaneously with the anti-reflection film.

【0012】[0012]

【発明の実施の形態】本発明の請求項1に記載の発明
は、少なくとも1枚以上の複屈折を持つ第1の結晶板と
第2の光学ガラス、又は少なくとも1枚以上の複屈折を
持つ第1の結晶板と少なくとも1枚以上の複屈折を持つ
第2の結晶板の何れかを貼り合わせたフィルタであっ
て、前記フィルタの貼り合わせ部に伸び率50%以上、
ショア硬度60度以下の粘着性の接着剤で直接接合した
構成にすることにより、結晶板は誘電体であるため結晶
軸によって線膨張係数が異なる。従来の加熱硬化性接着
剤ではソリ応力が発生し従来の加熱硬化性接着剤では高
温で分極し易くなる、粘着性の接着剤では応力が緩和さ
れ電荷量が減少させるという作用を有する。
DETAILED DESCRIPTION OF THE INVENTION According to the first aspect of the present invention, there is provided a first crystal plate and a second optical glass having at least one birefringence, or at least one birefringence. A filter in which a first crystal plate and at least one second crystal plate having birefringence are bonded to each other, and an elongation percentage is 50% or more at a bonded portion of the filter.
By adopting a configuration in which the crystal plate is directly bonded with a tacky adhesive having a Shore hardness of 60 degrees or less, since the crystal plate is a dielectric, the linear expansion coefficient differs depending on the crystal axis. A conventional heat-curable adhesive has a function of generating warpage stress, and a conventional heat-curable adhesive has an effect of being easily polarized at a high temperature, and a tacky adhesive has an effect of reducing stress and reducing the amount of charge.

【0013】請求項2に記載の発明は、貼り合わせ部に
10+8Ωm以下の導電性の接着剤を使用した構成によ
り、基板面の放電を早め素子の破壊を防止できるという
作用を有する。
According to a second aspect of the present invention, the use of a conductive adhesive of 10 +8 Ωm or less in the bonding portion has the effect of accelerating the discharge of the substrate surface and preventing the element from being destroyed.

【0014】請求項3に記載の発明は、被写体と3原色
の画素を1平面に配置した受光素子との間にフィルタを
配し、前記フィルタの前記受光素子に対向する面に10
+2Ωm以下の導体膜を施した反射防止膜を形成した構成
により、誘電体が帯電した時端面部に電荷を逃がし受光
素子の電圧破壊を防止できるという作用を有する。
According to a third aspect of the present invention, a filter is provided between a subject and a light receiving element in which pixels of three primary colors are arranged on one plane, and a surface of the filter facing the light receiving element is provided with a filter.
The configuration in which the antireflection film having the conductor film of +2 Ωm or less is formed has an effect that when the dielectric is charged, the electric charge is released to the end face to prevent a voltage breakdown of the light receiving element.

【0015】請求項4に記載の発明は、フィルタの受光
素子に対向する面に赤外光カットフィルタを備え、前記
赤外カットフィルタがTiを含む膜による10+2Ωm以
下の導電性を有する構成により、誘電体が放電したとき
に受光素子に直接放電させないようにし電圧破壊を防止
できるという作用を有する。
According to a fourth aspect of the present invention, an infrared light cut filter is provided on a surface of the filter facing the light receiving element, and the infrared cut filter has a conductivity of 10 +2 Ωm or less due to a film containing Ti. According to the configuration, when the dielectric is discharged, the light receiving element is prevented from being directly discharged, so that a voltage breakdown can be prevented.

【0016】請求項5に記載の発明は、フィルタの端面
に導電性の樹脂を塗布した構成により、誘電体が帯電し
たときに瞬時に電荷を導電性の樹脂に逃がし、誘電体の
両面の電荷を中和して放電させないようにし、素子破壊
を防止できるという作用を有する。
According to a fifth aspect of the present invention, since the conductive resin is applied to the end face of the filter, when the dielectric is charged, the electric charge is instantaneously released to the conductive resin, and the electric charge on both surfaces of the dielectric is obtained. Has the effect of preventing the device from being discharged by neutralizing it.

【0017】[0017]

【実施例】以下、本発明の空間フィルタを用いるデバイ
スの一実施例として受光素子と組み合わせた固体撮像素
子を例にとり、図1から図4を用いて説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a device using a spatial filter according to the present invention will be described below with reference to FIGS.

【0018】図1は、本発明の一実施例における空間フ
ィルタの上面図を示し、図1において、1は導電性粘着
剤で構成された遮光シート、2は本発明の空間フィルタ
を用いるデバイスの一例の固体撮像素子の筐体、3は結
晶板(リチウムナイオベート(LN基板)等)で構成さ
れた空間フィルタ、4はR,G,Bの3原色に色分解す
る複数の画素を入射光側に備えた受光素子(CCD)か
ら構成している。
FIG. 1 is a top view of a spatial filter according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a light-shielding sheet made of a conductive adhesive, and 2 denotes a device using the spatial filter of the present invention. An example of a casing of a solid-state imaging device, 3 is a spatial filter formed of a crystal plate (lithium niobate (LN substrate) or the like), and 4 is a plurality of pixels that separate colors into three primary colors of R, G, and B as incident light. It consists of a light receiving element (CCD) provided on the side.

【0019】図2は、図1のA−A断面を見た図で、5
は空間フィルタを構成する第1のLN、6は空間フィル
タを構成する第2のLN、7は第1と第2の空間フィル
タを接着する第1の粘着性の接着剤、8は第2のLNと
固体撮像素子の筐体を接着する第2の粘着性の接着剤、
9は固体撮像素子の保護スペーサー、10は固体撮像素
子の筐体、11は受光素子、13はLNの端面部を被う
導電性接着剤、12は入射光である。
FIG. 2 is a sectional view taken along the line AA of FIG.
Is a first LN that forms a spatial filter, 6 is a second LN that forms a spatial filter, 7 is a first adhesive that bonds the first and second spatial filters, and 8 is a second adhesive. A second tacky adhesive for bonding the LN and the housing of the solid-state imaging device;
Reference numeral 9 denotes a protection spacer of the solid-state imaging device, 10 denotes a housing of the solid-state imaging device, 11 denotes a light receiving element, 13 denotes a conductive adhesive covering an end face of the LN, and 12 denotes incident light.

【0020】また、第1のLN5と第2のLN6とに
は、導電性でアクリル系80%以上を主成分とし、黒色
の顔料を含み、溶剤を含まない粘着性の接着剤7で接着
され、接着剤の中央部分はあらかじめ金型で切断されて
遮光特性を有する遮光シート1が形成されている。
The first LN 5 and the second LN 6 are bonded to each other with a tacky adhesive 7 containing 80% or more of a conductive acrylic material, containing a black pigment, and containing no solvent. The central portion of the adhesive is cut in advance by a mold to form a light shielding sheet 1 having light shielding characteristics.

【0021】以上のように構成された固体撮像素子につ
いて、以下その動作について説明する。入射光12は、
空間フィルタを構成する第1のLN5と第2のLN6を
通して受光素子11に入射され、電気変換される。第1
のLN5は両面に導電性膜を施した反射防止膜(以下A
R膜という)を施し、第2のLN6は片面にARコー
ト、他方の片面に赤外光カットフィルタ(以下IRコー
トともいう)を施してある。室温状態では特に変形もな
く受光素子11に結像する事が出来る。
The operation of the solid-state image pickup device constructed as described above will be described below. The incident light 12 is
The light enters the light receiving element 11 through the first LN5 and the second LN6 constituting the spatial filter, and is converted. First
LN5 is an antireflection film (hereinafter referred to as A) having conductive films on both surfaces.
The second LN 6 has an AR coat on one side and an infrared cut filter (hereinafter also referred to as an IR coat) on the other side. At room temperature, an image can be formed on the light receiving element 11 without any particular deformation.

【0022】一方、上記固体撮像素子を高温環境下に置
くと、LN基板にそりが発生する。このような高温環境
下でも、被写体からの入射光12は、不図示のレンズを
通ったあと空間フィルタを構成する第1のLN5と第2
のLN6を通して撮像素子11に入射する。しかし、一
般に複屈折を持った結晶は結晶軸によって線膨張係数が
異なるため、高温では図3に示すように鞍状のソリを示
すこととなる。
On the other hand, when the solid-state imaging device is placed in a high temperature environment, warpage occurs on the LN substrate. Even in such a high temperature environment, the incident light 12 from the subject passes through a lens (not shown) and then forms a spatial filter with the first LN5 and the second LN5.
Incident on the image sensor 11 through the LN6 of FIG. However, since a crystal having birefringence generally has a different coefficient of linear expansion depending on the crystal axis, at a high temperature, it shows a saddle-shaped warp as shown in FIG.

【0023】このような鞍状のソリが発生しても、本発
明のフィルタを構成する第1のLN5と第2のLN6と
を、伸び率50%以上ショア硬度60度以下の粘着性の
接着剤で接着している。ちなみにLNの基板での線膨張
係数は、最大軸で14×10 -6/℃最小軸で4×10-6
/℃であり、図3に示すように、高温状態でLN基板が
反った状態を示し、一部では圧縮状態、一部では延伸状
態となるが、接着剤7が伸びの良い粘着性を持っている
ため、第1のLN5と第2のLN6とには微少なストレ
スしか掛からなく、分極電圧は最小に抑えられる。
Even if such a saddle-like warp occurs, the present invention
The first LN5 and the second LN6 forming the bright filter
With an elongation of 50% or more and a Shore hardness of 60 degrees or less
Adhered with adhesive. By the way, linear expansion on LN substrate
Coefficient is 14 × 10 on the largest axis -64 × 10 at the minimum axis / ° C-6
/ ° C., and as shown in FIG.
Indicates warped state, partly compressed, partly stretched
The adhesive 7 has good elongation and adhesiveness
Therefore, the first LN5 and the second LN6 have a small stress.
And the polarization voltage is minimized.

【0024】また、高温ではLN5とLN6とは誘電体
として分極を起こし、図6の従来の構造の様に受光素子
11に対向するLN17上に電荷20を持ち、このLN
17上に蓄積した電荷20が受光素子11に放電をする
と、受光素子11の破壊を起こし、固体撮像素子として
の機能が損なわれる。本発明の好ましい太陽において
は、空間フィルタを構成する第1のLN5と第2のLN
6との間に帯電をした基板の表面が導体処理されている
ため電荷は外気に触れている端面から放電していく。
At a high temperature, LN5 and LN6 are polarized as dielectrics, and have electric charge 20 on LN17 facing light receiving element 11 as in the conventional structure of FIG.
When the electric charge 20 accumulated on 17 discharges the light receiving element 11, the light receiving element 11 is destroyed, and the function as a solid-state imaging device is impaired. In the preferred sun of the present invention, a first LN5 and a second LN constituting a spatial filter
Since the surface of the charged substrate is treated with a conductor, the electric charge is discharged from the end surface exposed to the outside air.

【0025】また、第1のLN5及び第2のLN6の端
面部を、導電性のアクリルを主成分とする接着剤13に
よって接合する本発明の好ましい態様によると、LNの
両面の電荷は中和されることとなる。
According to a preferred embodiment of the present invention in which the end faces of the first LN5 and the second LN6 are joined by the adhesive 13 containing conductive acrylic as a main component, the charges on both surfaces of the LN are neutralized. Will be done.

【0026】なお、図4中の14は帯電状態から導電性
の膜を使用しないで温度25℃湿度38%の空気中に暴
露した状態での放電実験をした一データーで、同図15
は本発明の導電性を備えた空間フィルタの放電実験の一
データーである。図から明白なように、本発明の空間フ
ィルタでは10分程度で蓄積電荷は無くなり、受光素子
11への破壊電圧以下となるため生産性を損なうことな
く量産が出来るのに対し、従来技術では蓄積電荷の放電
に数時間程度を要する。このように、本発明の構成では
電位が0になるまでの時間が極めて短いため、事実上電
荷の蓄積はないことで空間フィルタの信頼性を向上させ
ることができる。
In FIG. 4, reference numeral 14 denotes data obtained by conducting a discharge experiment in a state where the charged state was exposed to air at a temperature of 25 ° C. and a humidity of 38% without using a conductive film.
Is data of a discharge experiment of the conductive spatial filter of the present invention. As is apparent from the figure, in the spatial filter of the present invention, the accumulated charge disappears in about 10 minutes, and the voltage becomes equal to or lower than the breakdown voltage to the light receiving element 11, so that mass production can be performed without impairing the productivity. It takes several hours to discharge the electric charge. As described above, in the configuration of the present invention, since the time until the potential becomes 0 is extremely short, the reliability of the spatial filter can be improved because there is virtually no charge accumulation.

【0027】なお、以上の説明ではLNが2枚構成で説
明したが、複屈折板の枚数やガラスの枚数には制限はな
く、線膨張係数の大きく違う材料を貼り合わせる場合に
誘電体がその中に含まれている場合は、粘着性の接着剤
を使うことで常温で加工が出来、また、誘電体の帯電を
防ぐことでCCDの信頼性の向上に影響を与えることと
なる。
In the above description, two LNs are used. However, the number of birefringent plates and the number of glasses are not limited. If it is contained, processing can be carried out at room temperature by using a tacky adhesive, and improving the reliability of the CCD will be affected by preventing charging of the dielectric.

【0028】また、導電性の膜が形成できない場合は、
例えばTiO2膜を金属化または半金属化(化学量論的
組成よりも酸素の価数が少ない低酸化物等)させて蒸着
することで同等の機能を出すことも可能である。多層膜
の場合は、吸収が激しくなるため、一部の層を金属化ま
たは半金属化させることで同等の性能を出すことが出来
る。
When a conductive film cannot be formed,
For example, an equivalent function can be obtained by depositing a TiO 2 film by metallization or semimetallization (such as a low oxide having a lower valence of oxygen than the stoichiometric composition). In the case of a multilayer film, the absorption becomes intense. Therefore, equivalent performance can be obtained by metallizing or semi-metallizing some of the layers.

【0029】以上のように本発明によれば、加工プロセ
スで高温にさらすことが無くなるため空間フィルタを信
頼性高く、例えば固体撮像素子筐体に直付けで空間フィ
ルタを設置できるため、より小型・薄型化が達成でき
る。
As described above, according to the present invention, the spatial filter is not exposed to high temperatures in the processing process, so that the spatial filter can be installed with high reliability. Thinning can be achieved.

【0030】[0030]

【発明の効果】以上のように本発明によれば、組立時に
加熱工程が不要となるため空間フィルタへのストレスを
減らすことができ、例えば本発明の空間フィルタを固体
撮像素子に適用すると、CCDに直付けの小型の撮像素
子が得られる。
As described above, according to the present invention, since a heating step is not required at the time of assembly, stress on a spatial filter can be reduced. For example, when the spatial filter of the present invention is applied to a solid-state imaging device, a CCD Thus, a small-sized image sensor directly attached to the device can be obtained.

【0031】また、通常使用時に間違って耐電をさせた
としても、空間フィルタの両面が導電性の膜で構成され
る本発明の好ましい態様によれば、電荷の中和によって
素子への放電も無くなり、例えば固体撮像素子の信頼性
を高く取ることが出来る。
In addition, according to a preferred embodiment of the present invention, in which both surfaces of the spatial filter are formed of a conductive film, even if the electric charge is erroneously made in normal use, the neutralization of the electric charge eliminates the discharge to the element. For example, the reliability of the solid-state imaging device can be increased.

【0032】このように、本発明の空間フィルタは、商
品の小型化と薄型化が同時に実現するだけでなく、加工
プロセスの短縮により低コストが実現し、しかも高信頼
性の空間フィルタが得られ、本発明の空間フィルタを用
いたデバイスの信頼性も向上できる効果がある。
As described above, according to the spatial filter of the present invention, not only the miniaturization and thinning of the product can be realized at the same time, but also the cost can be reduced by shortening the processing process, and the spatial filter with high reliability can be obtained. In addition, there is an effect that the reliability of a device using the spatial filter of the present invention can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例の上面図FIG. 1 is a top view of one embodiment of the present invention.

【図2】本発明の一実施例のA−A断面図FIG. 2 is a sectional view taken along line AA of one embodiment of the present invention.

【図3】本発明の一実施例の高温時での断面図FIG. 3 is a cross-sectional view of one embodiment of the present invention at a high temperature.

【図4】リチウムナイオベートの分極電圧と放電時間と
の関係図
FIG. 4 is a diagram showing the relationship between polarization voltage of lithium niobate and discharge time.

【図5】従来の形態の上面図FIG. 5 is a top view of a conventional embodiment.

【図6】図5の高温状態におけるB−B断面図FIG. 6 is a cross-sectional view taken along a line BB in a high temperature state of FIG. 5;

【図7】リチウムナイオベートの分極電圧と放電時間と
の関係図
FIG. 7 is a diagram showing the relationship between the polarization voltage of lithium niobate and the discharge time.

【符号の説明】[Explanation of symbols]

1 遮光シ−ト 2 固体撮像素子の筐体 3 空間フィルタ− 4 受光素子 5 空間フィルタ−を構成する第1のリチウムナイオベ
ート 6 空間フィルタ−を構成する第2のリチウムナイオベ
ート 7 粘着性の第1接着剤 8 粘着性の第2の接着剤 9 受光素子を保護する筐体部 10 固体撮像素子の筐体 11 受光素子 12 被写体からの入射光 13 導電性の接着剤 14 従来の放電特性 15 本発明の放電特性 16 高温下での空間フィルタ−を構成する従来工法の
第1のLN 17 高温下での空間フィルタ−を構成する従来工法の
第2のLN 18 第1の加熱硬化型接着剤 19 第2の加熱硬化型接着剤 20 リチウムナイオベート基板上の電荷 21 リチウムナイオベート基板上の電荷
REFERENCE SIGNS LIST 1 light-shielding sheet 2 housing of solid-state imaging device 3 spatial filter 4 light-receiving element 5 first lithium niobate constituting spatial filter 6 second lithium niobate constituting spatial filter 7 adhesive 1 Adhesive 8 Adhesive Second Adhesive 9 Housing for Protecting Light-Receiving Element 10 Housing for Solid-State Image Sensor 11 Light-Receiving Element 12 Incident Light from Subject 13 Conductive Adhesive 14 Conventional Discharge Characteristics 15 Discharge Characteristics of the Invention 16 First LN of Conventional Method Constituting Spatial Filter at High Temperature 17 Second LN of Conventional Method Constituting Spatial Filter at High Temperature 18 First Thermosetting Adhesive 19 Second thermosetting adhesive 20 Charge on lithium niobate substrate 21 Charge on lithium niobate substrate

───────────────────────────────────────────────────── フロントページの続き (72)発明者 土井 修 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 2H043 AE02 AE24 2H049 BA05 BA42 BB03 BB51 BB62 BC14 BC21 5C024 CX37 EX51 GY01 5C065 AA01 AA03 BB13 DD02 EE16 EE20  ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Osamu Doi 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. AA03 BB13 DD02 EE16 EE20

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも1枚以上の複屈折を持つ第1
の結晶板と第2の光学ガラス、又は少なくとも1枚以上
の複屈折を持つ第1の結晶板と少なくとも1枚以上の複
屈折を持つ第2の結晶板の何れかを貼り合わせたフィル
タであって、前記フィルタの貼り合わせ部に伸び率50
%以上、ショア硬度60度以下の粘着性の接着剤で直接
接合したことを特徴とする空間フィルタ。
1. A first material having at least one or more birefringence.
A filter in which any one of the crystal plate and the second optical glass, or at least one or more first crystal plate having birefringence and at least one second crystal plate having birefringence are bonded. And an elongation rate of 50 at the bonded portion of the filter.
%, Characterized by being directly bonded with a tacky adhesive having a Shore hardness of not less than 60 degrees.
【請求項2】 貼り合わせ部に10+8Ωm以下の導電性
の接着剤を使用したことを特徴とする請求項1記載の空
間フィルタ。
2. The spatial filter according to claim 1, wherein a conductive adhesive of 10 +8 Ωm or less is used for the bonding portion.
【請求項3】 被写体と受光素子との間にフィルタを配
し、前記フィルタの前記受光素子に対向する面に10+2
Ωm以下の導体膜を施した反射防止膜を形成したことを
特徴とする請求項1または2何れかに記載の空間フィル
タ。
3. A filter is provided between a subject and a light receiving element, and 10 +2 is provided on a surface of the filter facing the light receiving element.
3. The spatial filter according to claim 1, wherein an anti-reflection film having a conductor film of .OMEGA.m or less is formed.
【請求項4】 フィルタの受光素子に対向する面に赤外
光カットフィルタを備え、前記赤外カットフィルタがT
iを含む膜による10+2Ωm以下の導電性を有すること
を特徴とする請求項1〜3何れかに記載の空間フィル
タ。
4. An infrared light cut filter is provided on a surface of the filter facing the light receiving element, wherein the infrared cut filter is
The spatial filter according to any one of claims 1 to 3, having a conductivity of 10 +2 Ωm or less by a film containing i.
【請求項5】 フィルタの端面を10+2Ωm以下導電性
の樹脂でカバーしたことを特徴とする請求項1〜4何れ
かに記載の空間フィルタ。
5. The spatial filter according to claim 1, wherein an end face of the filter is covered with a conductive resin of 10 +2 Ωm or less.
JP2000145176A 2000-05-17 2000-05-17 Spatial filter Pending JP2001324615A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000145176A JP2001324615A (en) 2000-05-17 2000-05-17 Spatial filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000145176A JP2001324615A (en) 2000-05-17 2000-05-17 Spatial filter

Publications (1)

Publication Number Publication Date
JP2001324615A true JP2001324615A (en) 2001-11-22

Family

ID=18651718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000145176A Pending JP2001324615A (en) 2000-05-17 2000-05-17 Spatial filter

Country Status (1)

Country Link
JP (1) JP2001324615A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1462826A1 (en) * 2003-03-28 2004-09-29 Agfa-Gevaert AG Device for reading image information from a phosphor layer
EP1469326A1 (en) * 2003-03-28 2004-10-20 Agfa-Gevaert AG Device for reading image information from a phosphor layer
JP2012061666A (en) * 2010-09-15 2012-03-29 Oki Data Corp Exposure device and image forming apparatus
JP2012066499A (en) * 2010-09-24 2012-04-05 Oki Data Corp Exposure device, led head and image forming device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1462826A1 (en) * 2003-03-28 2004-09-29 Agfa-Gevaert AG Device for reading image information from a phosphor layer
EP1469326A1 (en) * 2003-03-28 2004-10-20 Agfa-Gevaert AG Device for reading image information from a phosphor layer
US7071484B2 (en) 2003-03-28 2006-07-04 Agfa-Gevaert Healthcare Gmbh Device for acquiring information contained in a phosphor layer
US7176476B2 (en) 2003-03-28 2007-02-13 Agfa- Gevaert Healthcare Gmbh Device for acquiring information contained in a phosphor layer
JP2012061666A (en) * 2010-09-15 2012-03-29 Oki Data Corp Exposure device and image forming apparatus
JP2012066499A (en) * 2010-09-24 2012-04-05 Oki Data Corp Exposure device, led head and image forming device

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