JP2001313094A - Ground connection apparatus of electronic device - Google Patents

Ground connection apparatus of electronic device

Info

Publication number
JP2001313094A
JP2001313094A JP2000130516A JP2000130516A JP2001313094A JP 2001313094 A JP2001313094 A JP 2001313094A JP 2000130516 A JP2000130516 A JP 2000130516A JP 2000130516 A JP2000130516 A JP 2000130516A JP 2001313094 A JP2001313094 A JP 2001313094A
Authority
JP
Japan
Prior art keywords
bolt
ground connection
case
electronic device
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000130516A
Other languages
Japanese (ja)
Other versions
JP3508692B2 (en
Inventor
Koji Aoike
孝二 青池
Naotaka Murakami
直隆 村上
Toshio Nagata
敏男 永田
Kenji Suzuki
研司 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin AW Co Ltd
Original Assignee
Aisin AW Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin AW Co Ltd filed Critical Aisin AW Co Ltd
Priority to JP2000130516A priority Critical patent/JP3508692B2/en
Publication of JP2001313094A publication Critical patent/JP2001313094A/en
Application granted granted Critical
Publication of JP3508692B2 publication Critical patent/JP3508692B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To attain both a cost reduction and a certain ground connection by attaching low cost parts simply to a case. SOLUTION: A PC board 3 is mounted on a case 2 made of an aluminum die cast, and an earth contact of the printed circuit board and the case 2 are bonded with an earth wire 10. A ground of the case side is connected with a bolt 12 for ground connection to the case 2, and by giving nickel plating on a head upper surface 12a1 of the bolt, it is managed to a predetermined surface coarseness, and a wire bonding by ultrasonic crimping is carried out by making an upper surface of the bolt-head section into a putt surface.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、電子装置のアース
接続装置に係り、特に自動車に搭載されるコントロール
ユニットのアース接続に用いて好適であり、詳しくは電
子装置のアース線をワイヤボンディングによりケースに
接続するアース接続装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ground connection device for an electronic device, and more particularly to a ground connection for a control unit mounted on a motor vehicle. And a ground connection device connected to the ground connection device.

【０００２】[0002]

【従来の技術】従来、ケースへのワイヤボンディングに
よるアース接続は、例えば特開平４−３３７６４１号公
報に示すように、ケースに接続用台座部（パット部）を
設け、該台座部表面を切削、研磨等の機械加工により平
滑化して、該表面にワイヤボンディングによりリード線
を接続していた。また、ケースの材質がワイヤボンディ
ングに適さない場合、ケースに純アルミ等のワイヤボン
ディング可能な金属板を半田付け、溶接等により取付
け、該金属板表面を機械加工により平滑化して、接続用
パット部としていた。2. Description of the Related Art Conventionally, a ground connection by wire bonding to a case is provided, for example, by providing a connection pedestal (pat) in the case and cutting the surface of the pedestal as shown in Japanese Patent Application Laid-Open No. 4-337641. The surface was smoothed by mechanical processing such as polishing, and a lead wire was connected to the surface by wire bonding. If the material of the case is not suitable for wire bonding, a wire-bondable metal plate such as pure aluminum is attached to the case by soldering, welding, or the like, and the surface of the metal plate is smoothed by machining to form a connection pad portion. And had

【０００３】[0003]

【発明が解決しようとする課題】上述した従来の技術で
は、いずれの場合でも、ケースのパット部を機械加工に
より所定の表面粗さに平滑化する必要があり、コストア
ップの原因になると共に、輸送時にパット部表面に傷が
付き、平滑面を損う虞れがあり、この場合良好なワイヤ
ボンディングを行うことができない。特に、ケースに別
な金属板を取付ける場合は、該パット部の材料費用と溶
接等の取付け工費が余分にかかり、更なるコストアップ
の原因になると共に製造工数の増大を生じる。In any of the above-mentioned prior arts, in any case, it is necessary to smooth the pad portion of the case to a predetermined surface roughness by machining, which leads to an increase in cost and During transport, the surface of the pad may be scratched and the smooth surface may be damaged. In this case, good wire bonding cannot be performed. In particular, when another metal plate is attached to the case, the material cost of the pad portion and the installation cost such as welding are extra, which causes a further cost increase and an increase in the number of manufacturing steps.

【０００４】そこで、本発明は、簡単に加工できる部品
をケースに簡単に取付けてパット部とし、もって上述課
題を解決して電子装置のアース接続装置を提供すること
を目的とするものである。Accordingly, an object of the present invention is to provide a ground connection device for an electronic device that solves the above-mentioned problems by simply attaching a part that can be easily processed to a case to form a pad portion.

【０００５】[0005]

【課題を解決するための手段】請求項１に係る本発明
は、ケース（２）にアース線（１０）をワイヤボンディ
ングにより接合する、電子装置のアース線接続装置にお
いて、前記ケース（２）に、ボルト頭部上面（１２
ａ1 ）が所定表面粗さに管理されたアース接続用ボルト
（１２）を螺合し、前記ボルト頭部上面をパット面とし
てアース線（１０）をワイヤボンディングにより接合し
てなる、ことを特徴とする電子装置のアース接続装置に
ある。According to a first aspect of the present invention, there is provided a ground wire connecting device for an electronic device, wherein a ground wire (10) is joined to a case (2) by wire bonding. , Bolt head upper surface (12
a 1 ) is formed by screwing a ground connection bolt (12) controlled to a predetermined surface roughness and bonding the ground wire (10) by wire bonding with the upper surface of the bolt head as a pad surface. In the ground connection device of the electronic device.

【０００６】請求項２に係る本発明は、前記ボルト頭部
上面（１２ａ1 ）の十点平均表面粗さ（Ｒｚ）が、６．
３〜２．８〔μｍ〕である、請求項１記載の電子装置の
アース接続装置にある。According to a second aspect of the present invention, the ten-point average surface roughness (Rz) of the upper surface (12a 1 ) of the bolt head is 6.
2. The ground connection device for an electronic device according to claim 1, wherein the thickness is 3 to 2.8 [μm].

【０００７】請求項３に係る本発明は、前記アース接続
用ボルト（１２）は、例えば真鍮等の所定金属を母材と
してボルトを形成し、該ボルトに２〜１０〔ｍｍ〕の所
定金属メッキ（例えばニッケルメッキ、金メッキ、ニッ
ケル下地の金メッキ）を施して形成されてなる、請求項
１又は２記載の電子装置のアース接続装置にある。According to a third aspect of the present invention, the earth connection bolt (12) is formed of a predetermined metal such as brass as a base material, and the predetermined metal plating of 2 to 10 [mm] is formed on the bolt. 3. The ground connection device for an electronic device according to claim 1, wherein the ground connection device is formed by applying (for example, nickel plating, gold plating, or gold plating on a nickel base).

【０００８】請求項４に係る本発明は、前記所定金属メ
ッキが、ニッケルメッキであり、かつ前記アース線（１
０）がアルミニウム線である、請求項３記載の電子装置
のアース接続装置にある。According to a fourth aspect of the present invention, the predetermined metal plating is nickel plating and the ground wire (1
4. The ground connection device for an electronic device according to claim 3, wherein 0) is an aluminum wire.

【０００９】請求項５に係る本発明は、該アース線を、
前記ボルト頭部上面に超音波圧着により接合してなる、
請求項題１ないし４のいずれか記載の電子装置のアース
接続装置にある。According to a fifth aspect of the present invention, the ground wire is
It is joined to the bolt head upper surface by ultrasonic pressure bonding,
A ground connection device for an electronic device according to any one of claims 1 to 4.

【００１０】請求項６に係る本発明は（例えば図２、図
４、図５参照）、前記ケース（２）接続用ボルト（１
２）を螺合するネジ孔（１１）は、その開口部周囲に、
前記ボルトの切上げ部（１２ｄ）との干渉を防止する面
取り部（１１ａ）を形成してなる、請求項１ないし図５
のいずれが搭載の電子装置のアース接続装置にある。According to a sixth aspect of the present invention (see FIGS. 2, 4 and 5, for example), the case (2) connecting bolt (1
The screw hole (11) for screwing 2) is formed around the opening.
A chamfered portion (11a) for preventing interference of the bolt with a cut-up portion (12d) is formed.
Are in the ground connection device of the on-board electronic device.

【００１１】請求項７に係る本発明は（例えば図４参
照）、前記アース接続用ボルト（１２）を螺合するネジ
孔は、前記ケースにおける所定肉厚を有するランド部
（２ｂ）に形成されてなる、請求項１ないし６のいずれ
が記載の電子装置のアース接続装置にある。According to a seventh aspect of the present invention (for example, see FIG. 4), a screw hole for screwing the ground connection bolt (12) is formed in a land portion (2b) having a predetermined thickness in the case. The electronic device according to any one of claims 1 to 6, wherein:

【００１２】請求項８に係る本発明は、前記電子装置
は、自動車に搭載されるコントロールユニットである、
請求項１ないし７のいずれが記載の電子装置のアース接
続装置にある。[0012] The present invention according to claim 8 is that the electronic device is a control unit mounted on an automobile.
An electronic device according to any one of claims 1 to 7 is a ground connection device.

【００１３】〔作用〕以上構成に基づき、アルミダイキ
ャスト等のケース（３）にＰＣボード（３）等を実装
し、該ＰＣボード等のアース接点（３ａ）とケース
（２）とをアース線（１０）にて接合する。ケース側の
グランドは、ケース（２）にアース接続用ボルト（１
２）を螺合し、該ボルトの頭部上面（１２ａ1 ）をニッ
ケルメッキを施す等により所定表面粗さに管理し、該ボ
ルト頭部上面をパット面として、超音波圧着等によりワ
イヤボンディングする。[Operation] Based on the above configuration, a PC board (3) or the like is mounted on a case (3) made of aluminum die cast or the like, and the ground contact (3a) of the PC board or the like and the case (2) are grounded. Join at (10). The case-side ground is connected to the case (2) with the ground connection bolt (1
2) is screwed, the top surface (12a 1 ) of the bolt is controlled to a predetermined surface roughness by applying nickel plating or the like, and wire bonding is performed by ultrasonic pressure bonding or the like with the top surface of the bolt as a pad surface. .

【００１４】なお、上記とカッコ内の符号は、図面と対
照するためのものであるが、各請求項記載の本発明の構
成に何等影響を及ぼすものではない。The reference numerals in parentheses above are for the purpose of comparison with the drawings, but do not affect the configuration of the present invention described in each claim.

【００１５】[0015]

【発明の実施の形態】以下、図面に沿って、本発明の実
施の形態について説明する。図１は、自動車に搭載させ
るコントロールユニット、特に自動変速機用として好適
なエンジンルーム内に配送されるコントロールユニット
を示す平面図であり、該コントロールユニットは、アル
ミ合金等の金属（電導性材料）からなるケース２と、該
ケースに実装をされる１Ｃパッケージ及びセラミック基
板等からなるＰＣボード（組立体）３と、入力側（セン
サ側）コネクタ５と、出力側（アクチュエータ側）コネ
クタ６と、図示しない蓋部材と、を有する。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a control unit mounted on an automobile, particularly a control unit delivered to an engine room suitable for an automatic transmission. The control unit is made of a metal (conductive material) such as an aluminum alloy. A PC board (assembly) 3 composed of a 1C package, a ceramic substrate, and the like mounted on the case, an input-side (sensor-side) connector 5, and an output-side (actuator-side) connector 6, And a cover member (not shown).

【００１６】ＰＣボード３は、多数のリード線９…によ
り上記入力側コネクタ５及び出力側コネクタの接続端子
に接続していると共に、４個のグランド用のワイヤ１０
…によりケース２にアース接続されている。上記リード
線及びグランド用ワイヤ１０…は、アルミ線によるワイ
ヤボンディングにより接合されており、上記ＰＣボード
３には４個のグランド用接点３ａ…が設けられている。
なお、図１におけるＡは、ボンディング位置認識マーク
である。また、上記ケース２はアルミダイキャストにて
成形されており、該ケースには図２に詳示するように４
個の円筒状ボス部２ａ…が一体に形成されている。これ
らボス部２ａにはネジ孔１１が機械加工により形成され
ており、かつ該ネジ孔１１の開口部周囲には面取り部１
１ａが形成されている。The PC board 3 is connected to the connection terminals of the input side connector 5 and the output side connector by a large number of lead wires 9... And has four ground wires 10.
.. Are grounded to the case 2. The lead wires and the ground wires 10 are joined by wire bonding using an aluminum wire, and the PC board 3 is provided with four ground contacts 3a.
A in FIG. 1 is a bonding position recognition mark. The case 2 is formed by die-casting with aluminum. As shown in FIG.
Are formed integrally with each other. A screw hole 11 is formed in these boss portions 2a by machining, and a chamfered portion 1 is formed around the opening of the screw hole 11.
1a is formed.

【００１７】上記ネジ孔１１にはアース接続用ボルト１
２が螺合される。該接続用ボルト１２は図５に詳示する
ように、頭部１２ａ、４ピッチ以上のネジ部１２ｂ、先
端テーパ部１２ｃ及び頭部とネジ部との間にアール状の
切上げ部１２ｄを有する。該接続用ボルト１２は真鍮
（黄銅）を母材として塑性加工により形成されており、
更にニッケルメッキが施されている。該ニッケル(Ｎｉ)
メッキの厚さは２〜１０〔μｍ〕であり、好ましくは
５．５±２．５〔μｍ〕であり、該所定厚さのニッケル
メッキにより、ボルト頭部上面１２ａ、特にワイヤボン
ディングパット面となる中央部分の表面粗さが所定算術
平均粗さ以下（平滑面）になるように管理されている。
具体的には、上記ボルト頭上面１２ａ1 は、面粗度算術
平均粗さＲａが３．２〔μｍ〕以下に管理されることが
好ましい。なお、前記接続用ボルト１２は、ヘッディン
グによる頭部１２ａの成形及び転造によるネジ部１２ｂ
の成形等による塑性加工のままで、層厚が管理されたメ
ッキ処理のみにより、ボルト頭部上面１２ａ1 を上記所
定面粗度に管理してもよく、またボルトを塑性加工した
状態で、頭部上面１２ａ1 のみを研削、研磨等により平
滑化した後、メッキ処理を施してもよい。更に、純アル
ミ等の素材のみでアース接続用ボルトを形成する場合、
ボルト頭部上面に研削、研磨のみにより上記所定面粗度
に管理してもよい。The screw hole 11 is provided with a ground connection bolt 1.
2 is screwed. As shown in detail in FIG. 5, the connection bolt 12 has a head portion 12a, a thread portion 12b having four or more pitches, a tapered end portion 12c, and a round-up portion 12d between the head portion and the threaded portion. The connection bolt 12 is formed by plastic working using brass (brass) as a base material.
Further, nickel plating is applied. The nickel (Ni)
The plating thickness is 2 to 10 [μm], preferably 5.5 ± 2.5 [μm], and the nickel plating of the predetermined thickness allows the bolt head upper surface 12a, especially the wire bonding pad surface to be The surface roughness of the center portion is controlled so as to be equal to or less than a predetermined arithmetic average roughness (smooth surface).
Specifically, the bolt overhead surface 12a 1 is preferably surface roughness arithmetic average roughness Ra is managed below 3.2 [μm]. The connection bolt 12 has a screw portion 12b formed by forming and rolling the head portion 12a by heading.
The remains of plastic working by molding, by only plating layer thickness is managed, the bolt head upper surface 12a 1 in a state that may be managed in a predetermined surface roughness, also the bolts and plastic working head only part upper surface 12a 1 grinding, was smoothed by polishing or the like, may be subjected to plating treatment. Furthermore, when forming a ground connection bolt using only a material such as pure aluminum,
The above-mentioned predetermined surface roughness may be managed only by grinding and polishing the bolt head upper surface.

【００１８】そして、本コントロールユニットは、ケー
ス２、ＰＣボード３及び接続用ボルト１２がそれぞれ別
個に製造されて、組立てられる。この際、接続用ボルト
１２は、その頭部上面１２ａ1 に傷が付かないように梱
包・輸送される。そして、アース接続の前記工程におい
て、前記ボルト１２がケース２のネジ孔１１に螺合され
る。従って、ケース輸送時等において、アース接続用パ
ット面が傷つくことはなく、パット面に起因するワイヤ
ボンディング不良等による不良品の発生を減少して、製
品歩留まりを向上し得る。In this control unit, the case 2, the PC board 3, and the connection bolts 12 are separately manufactured and assembled. In this case, connecting bolt 12 is wound on the head top surface 12a 1 are packed and transported as not attached. Then, in the step of ground connection, the bolt 12 is screwed into the screw hole 11 of the case 2. Therefore, the pad surface for ground connection is not damaged when the case is transported, and the occurrence of defective products due to defective wire bonding due to the pad surface can be reduced, and the product yield can be improved.

【００１９】前記ボルト１２の取付け作業は、図６に示
すようなツール（６角レンチ）を用いて行われる。The operation of mounting the bolt 12 is performed using a tool (hexagon wrench) as shown in FIG.

【００２０】該ツール１５は、パット面となるボルト頭
部上面１２ａ1 に対応する部分が中空部１５ａとなって
おり、その下面周囲に段付き孔に形成された６角孔１５
ｂにて締付けが行われる。この際、中空部１５ａからエ
アを吸い込むことにより、ボルト１２は上記６角孔１５
ｂに固定されて、ボルト１２のケース２への取付け作業
を容易に行うことができると共に、パット面となるボル
ト頭部上面１２ａ1 は、中空部１５ａによりツール１５
に接触しないので、該パット面の表面粗さ（平滑面）が
損なうことはない。[0020] The tool 15, bolt head upper surface 12a 1 corresponding portion and becomes a hollow portion 15a, 6 square hole 15 formed in a stepped hole on its lower surface around which the pad surface
Tightening is performed at b. At this time, by sucking air from the hollow portion 15a, the bolt 12 is connected to the hexagonal hole 15a.
b, the bolt 12 can be easily attached to the case 2, and the bolt head upper surface 12 a 1 serving as a pad surface is formed with a tool 15 by a hollow portion 15 a.
, So that the surface roughness (smooth surface) of the pad surface is not impaired.

【００２１】また、上記ボルト１２のネジ孔１１への螺
合において、ネジ切上げ部１２ｄがネジ孔の面取り部１
１ａにより干渉することが防止され、ボス部２ａの上面
がボルト頭部１２ａの裏面に密着して、正確かつ確実に
ボルト１２がケース２へ取り付けられる。When the bolt 12 is screwed into the screw hole 11, the screw cut-up portion 12d is formed into the chamfered portion 1 of the screw hole.
Interference is prevented by 1a, the upper surface of the boss 2a is in close contact with the back surface of the bolt head 12a, and the bolt 12 is accurately and reliably attached to the case 2.

【００２２】この状態で、アルミニウムからなるボンデ
ィングワイヤ１０がＰＣボード３のアース用接点３ａと
上記ボルト頭部上面１２ａ1 とのパット面との間に接合
される。上記ワイヤ１０のアース用接点３ａとボルト頭
部パット面１２ａ1 との接合は、共に超音波圧着による
ウェッジボンディングにより行われる。該超音波圧着に
よるワイヤボンディングは、ボルト頭部上面１２ａ1 が
ニッケルメッキからなり、酸化膜の浸透深さは薄く、か
つ所定硬度を有し、かつ所定面粗度からなる平滑面から
なるので、上記超音波振動により酸化膜が除去されて、
金属表面が直接に接触して振動することにより、原子間
結合等により確実な接合が行われる。[0022] In this state, the bonding wire 10 made of aluminum is joined between the pad surface and the earthing contact 3a and the bolt head top surface 12a 1 of the PC board 3. Bonding of the earthing contact 3a and the bolt head pad surface 12a 1 of the wire 10, are both performed by the wedge bonding by ultrasonic bonding. Wire bonding using ultrasonic crimping, bolt head upper surface 12a 1 being nickel-plated, the penetration depth of the oxide film is thin, and has a predetermined hardness, and since the smooth surface of a predetermined surface roughness, The oxide film is removed by the above ultrasonic vibration,
When the metal surface is in direct contact and vibrates, reliable bonding is achieved by interatomic bonding and the like.

【００２３】図３及び図４は、一部変更した実施例を示
す図である。先の実施例は、ケース２にボルト用ボス部
２ａを設けており、ケース全体の薄肉化を図り、軽量化
のために好適であるが、上述したアース線接続は、アー
ス線１０の長手方向に沿って６０〔ＫＨｚ〕程度の超音
波振動をボルト頭部１２ａに与えるため、該ボルト１２
部分の剛性が不足する虞れがある。FIGS. 3 and 4 show a partially modified embodiment. In the above embodiment, the case 2 is provided with the boss portion 2a for a bolt, which is suitable for reducing the thickness of the entire case and reducing the weight. To apply ultrasonic vibration of about 60 [KHz] to the bolt head 12a along
There is a possibility that the rigidity of the portion is insufficient.

【００２４】そこで、本実施例にあっては、ケース２の
ボス部を廃し、所定肉厚を有するランド部２ｂとした点
を特徴とするものであり、他の点は、先の実施例と同じ
であり、同じ符号を付して説明を省略する。本実施例の
ケース２は、所定肉厚のランド部２ｂを有しており、更
にケース縁部２ｃにかけて更に段付き状の肉厚部２ｄに
なっている。上記ランド部２ｂにネジ孔１１が形成され
ており、該ネジ孔１１は、先の実施例と同様に、面取り
部１１ａが形成されていると共に、同様な接続用ボルト
１２が螺合される。Therefore, the present embodiment is characterized in that the boss portion of the case 2 is abolished and a land portion 2b having a predetermined thickness is provided, and the other points are the same as those of the previous embodiment. It is the same, and the same reference numerals are given and the description is omitted. The case 2 of this embodiment has a land portion 2b having a predetermined thickness, and further forms a stepped thick portion 2d over the case edge 2c. A screw hole 11 is formed in the land portion 2b. In the screw hole 11, a chamfered portion 11a is formed as in the previous embodiment, and a similar connection bolt 12 is screwed into the screw hole 11.

【００２５】頭部上面１２ａ1 の表面粗さが管理されて
グランド用パット面となっているボルト頭部にアルミ線
からなるアース線が接合される際、超音波振動がボルト
頭部１２ａに作用するが、該ボルト１２は、ケース２の
ランド部２ｂに螺合して、高い剛性を有しており、アー
ス線１０と連れ動きすることがなく、アース線との間に
所定量の相対移動をして、確実なウェッジボンディング
を行い得る。[0025] When the ground wire surface roughness of the head top surface 12a 1 is made of aluminum wire to the bolt head is managed and has a ground pad surfaces are bonded, ultrasonic vibration acts on the bolt head 12a However, the bolt 12 is screwed into the land portion 2b of the case 2 and has high rigidity, does not move with the ground wire 10, and moves a predetermined amount relative to the ground wire. Thus, reliable wedge bonding can be performed.

【００２６】図７は、上記図４、図５に示す実施例によ
りワイヤボンディングしたボルト頭部上面の面粗度と、
ワイヤ接合のシェア強度との関係を試験した結果を示す
図である。図中、面粗度は、十点平均粗さ（Ｒｚ）を示
すもので、かつ水平とは、上記超音波の振動方向と同じ
方向にボルト頭部上面１２ａ1 に傷を付けた場合であ
り、また垂直とは、超音波の振動方向と直交する方向に
ボルト頭部上面に傷をつけた場合を示す。該試験結果か
ら、ボルト頭部上面１２ａ1 の面粗度が、上記Ｒｚ＝
６．３〜２．８〔μｍ〕である場合、水平及び垂直方向
共に、充分なワイヤの接合強度を有することが解る。該
面粗度Ｒｚが、６．３〔μｍ〕より大きい１２．８〔μ
ｍ〕では水平及び垂直方向共に充分なシェア強度が得ら
れず、確実なワイヤボンディングが行われない場合があ
り、また面粗度Ｒｚ２．８〔μｍ〕以下の平滑面は、加
工技術的に困難を伴い、費用対効果の点からもオーバー
スペックとなる。なお、上記試験において、水平及び垂
直方向に傷をつけたものを用いたが、ワイヤボンディン
グに際し、ボルト頭部がワイヤに対してどのような向き
になるかは不明であって、両方向を試験することによ
り、接合に対する信頼性が確認できる。FIG. 7 shows the surface roughness of the upper surface of the bolt head wire-bonded according to the embodiment shown in FIGS.
It is a figure showing the result of having tested the relation with the shear strength of wire joining. In the figure, the surface roughness is intended to represent the ten-point average roughness (Rz), and the horizontal, be the case where scratch the same direction as the vibration direction of the ultrasonic waves to the bolt head top surface 12a 1 Vertical means that the upper surface of the bolt head is scratched in a direction perpendicular to the ultrasonic vibration direction. From the test results, the surface roughness of the bolt head top surface 12a 1 is, the Rz =
When it is 6.3 to 2.8 [μm], it can be seen that the wire has sufficient bonding strength in both the horizontal and vertical directions. The surface roughness Rz is 12.8 [μm] larger than 6.3 [μm].
m], sufficient shear strength cannot be obtained in both the horizontal and vertical directions, and reliable wire bonding may not be performed. In addition, a smooth surface having a surface roughness Rz of 2.8 [μm] or less is difficult to process. And over-spec from the viewpoint of cost effectiveness. In the above test, the one that was scratched in the horizontal and vertical directions was used.However, in wire bonding, it is unclear what direction the bolt head will be with respect to the wire. Thereby, the reliability of the joining can be confirmed.

【００２７】なお、上述実施の形態は、アルミ線による
ワイヤボンディングについて説明したが、これは、Ａｕ
系、Ｃｕ系等のボンディングワイヤにも同様に適用可能
であり、また自動車に搭載されるコントロールユニット
について説明したが、本発明に係る技術は、民生品等の
他の製品に組込ませる電子装置のアース装置にも同様に
適用可能である。更に、アース接続用ボルトは、真鍮母
材にニッケルメッキを施してあるが、これに限らず、金
メッキ等の他の金属メッキ、ニッケルメッキ下地の金メ
ッキ等の多層メッキ、又はアルミニウム浸透メッキ等の
金属浸透メッキ等の、所定硬度を有しかつ酸化膜の形成
が所定厚さ以下となる他の表面処理でもよく、また母材
はＦｅ系等の他の金属でもよく、更に純アルミ、純ニッ
ケル等のワイヤボンディング可能な母材を用いて、メッ
キ等の表面処理をしないものでもよい。また、アース接
続用ボルトは、６角ボルトに限らず、４角、８角等のボ
ルト頭部上面が平坦面からなるボルトであればよい。In the above embodiment, wire bonding using aluminum wire has been described.
System, a Cu-based bonding wire and the like, and a control unit mounted on an automobile has been described. However, the technology according to the present invention is applicable to an electronic device to be incorporated into another product such as a consumer product. The present invention is similarly applicable to a grounding device. Furthermore, the earth connection bolt is made of nickel-plated brass base material, but is not limited to this, other metal plating such as gold plating, multilayer plating such as gold plating under nickel plating, or metal such as aluminum penetration plating. Other surface treatments such as infiltration plating or the like having a predetermined hardness and forming an oxide film of a predetermined thickness or less may be used, and the base material may be another metal such as Fe-based metal, and further, pure aluminum, pure nickel, etc. A material which is not subjected to surface treatment such as plating using a base material capable of wire bonding may be used. The earth connection bolt is not limited to a hexagonal bolt, but may be a bolt having a flat top surface such as a quadrilateral or octagonal bolt head.

【００２８】[0028]

【発明の効果】請求項１に係る本発明によると、ボルト
をケースに螺合し、該ボルトの平滑な頭部上面をグラン
ド用パット面とするので、安価な部品でかつケースへの
取付けも簡単かつ容易であり、コストダウンと確実なア
ース接続の両方を達成することができる。According to the first aspect of the present invention, the bolt is screwed into the case, and the smooth upper surface of the bolt is used as the ground pad surface, so that it is an inexpensive part and can be attached to the case. It is simple and easy, and can achieve both cost reduction and reliable ground connection.

【００２９】請求項２に係る本発明によると、ボルト頭
部上面の表面粗さを所定範囲に納めることにより、製造
の容易化によるコストダウンと信頼性の充分なアース接
続との両方のバランスを図って、共に達成することが可
能となる。According to the second aspect of the present invention, by keeping the surface roughness of the upper surface of the bolt head within a predetermined range, it is possible to balance both the cost reduction due to the simplification of the manufacturing and the reliable ground connection. It is possible to achieve both together.

【００３０】請求項３に係る本発明によると、所定厚さ
の金属メッキを母材ボルトに施すことにより、ボルト頭
部上面を所定表面粗さに管理することができ、安価にグ
ランド側パット面を形成することができる。According to the third aspect of the present invention, by applying metal plating of a predetermined thickness to the base material bolt, the upper surface of the bolt head can be controlled to a predetermined surface roughness, and the ground-side pad surface can be inexpensively manufactured. Can be formed.

【００３１】請求項４に係る本発明によると、ニッケル
メッキによるボルト頭部上面のパット面と、アルミニウ
ムアース線との組合せにより、安価な材料にて、かつ所
定硬度及び薄い酸化膜により、高い信頼性で接合が可能
となる。According to the fourth aspect of the present invention, the combination of the pad surface on the bolt head upper surface formed by nickel plating and the aluminum earth wire makes it possible to use an inexpensive material and a predetermined hardness and a thin oxide film to provide high reliability. Bonding becomes possible by the nature.

【００３２】請求項５に係る本発明によると、超音波圧
着により高い熱を与えることなく接合が可能であり、Ｉ
Ｃ等の電子部品に悪影響を与えることがなく、かつウェ
ッジボンディングにより確実に接合することができる。According to the fifth aspect of the present invention, bonding can be performed without applying high heat by ultrasonic pressure bonding.
Electronic components such as C are not adversely affected, and can be reliably joined by wedge bonding.

【００３３】請求項６に係る本発明によると、ネジ孔の
面取り部によりボルトの切上げ部の干渉を防止し、ボル
トをケースに形成したネジ孔に、頭部裏面をケース面に
密着して確実かつ正確に螺合することができ、ボルトの
剛性を常に保持して、ワイヤボンディングを確実に行う
ことができる。According to the sixth aspect of the invention, the chamfered portion of the screw hole prevents interference with the cut-up portion of the bolt, and the bolt is formed in the case so that the back of the head is in close contact with the case surface and is securely inserted. In addition, the screws can be screwed accurately, and the rigidity of the bolt can be always maintained, and the wire bonding can be reliably performed.

【００３４】請求項７に係る本発明によると、ケースに
おける所定肉厚を有するランド部にネジ孔を形成したの
で、該ネジ孔に螺合するボルトの剛性を高めて、超音波
振動等に際してボルトが確実に対抗して、超音波圧着等
によるワイヤボンディングを高い信頼性でもって行うこ
とができる。According to the seventh aspect of the present invention, since the screw holes are formed in the lands having a predetermined thickness in the case, the rigidity of the bolts screwed into the screw holes is increased, and the bolts are used for ultrasonic vibration or the like. Therefore, wire bonding by ultrasonic pressure bonding or the like can be performed with high reliability.

【００３５】請求項８に係る本発明によると、エンジン
ルーム等の劣悪な環境であってかつ高い信頼性が要求さ
れる自動車用コントロールユニットに適用して、上記厳
しい要求を満たすと共に更なるコストダウンが可能とな
る。According to the eighth aspect of the present invention, the present invention is applied to a control unit for an automobile which is required to have high reliability even in a poor environment such as an engine room, thereby satisfying the above strict requirements and further reducing the cost. Becomes possible.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１の実施の形態によるコントロール
ユニットを示す平面図。FIG. 1 is a plan view showing a control unit according to a first embodiment of the present invention.

【図２】その要部の拡大断面図。FIG. 2 is an enlarged sectional view of a main part thereof.

【図３】本発明の第２の実施の形態によるコントロール
ユニットを示す平面図。FIG. 3 is a plan view showing a control unit according to a second embodiment of the present invention.

【図４】その要部の拡大断面図。FIG. 4 is an enlarged sectional view of a main part thereof.

【図５】本発明に係るアース接続用ボルトを示し、
（ａ）は平面図（ｂ）は正面図。FIG. 5 shows an earth connection bolt according to the present invention,
(A) is a plan view and (b) is a front view.

【図６】アース接続用ボルトを締付けるツールを示す断
面図。FIG. 6 is a sectional view showing a tool for fastening a ground connection bolt.

【図７】ボルト頭部上面の面粗度と、ワイヤ接合面シェ
ア強度との関係を示す、試験結果による図。FIG. 7 is a diagram based on test results showing the relationship between the surface roughness of the upper surface of the bolt head and the wire joint surface shear strength.

【符号の説明】[Explanation of symbols]

１ 電子装置（コントロールユニット） ２ ケース ２ａ ボス部 ２ｂ ランド部 ３ ＰＣボード １０ アース線 １１ ネジ孔 １１ａ 面取り部 １２ アース接続用ボルト １２ａ 頭部 １２ａ1 頭部上面 １２ｂ ネジ部 １２ｄ 切上げ部Reference Signs List 1 electronic device (control unit) 2 case 2a boss portion 2b land portion 3 PC board 10 ground wire 11 screw hole 11a chamfered portion 12 ground connection bolt 12a head 12a 1 head upper surface 12b screw portion 12d cut-up portion

───────────────────────────────────────────────────── フロントページの続き (72)発明者 永田 敏男 愛知県安城市藤井町高根10番地 アイシ ン・エィ・ダブリュ株式会社内 (72)発明者 鈴木 研司 愛知県安城市藤井町高根10番地 アイシ ン・エィ・ダブリュ株式会社内 Ｆターム(参考） 5E085 BB02 BB15 BB30 CC01 CC03 DD01 DD04 EE01 EE23 EE32 JJ04 JJ38 5F044 AA00 JJ03  ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshio Nagata 10th Takane, Fujiimachi, Anjo, Aichi Prefecture Inside Aisin AW Co., Ltd. (72) Kenji Suzuki 10th Takane, Fujiimachi, Anjo, Aichi Prefecture Aisin・ F-term in AW Co., Ltd. (Reference) 5E085 BB02 BB15 BB30 CC01 CC03 DD01 DD04 EE01 EE23 EE32 JJ04 JJ38 5F044 AA00 JJ03

Claims (8)

【特許請求の範囲】[Claims] 【請求項１】 ケースにアース線をワイヤボンディング
により接合する、電子装置のアース接続装置において、 前記ケースに、ボルト頭部上面が所定表面粗さに管理さ
れたアース接続用ボルトを螺合し、 前記ボルト頭部上面をパット面としてアース線をワイヤ
ボンディングにより接合してなる、 ことを特徴とする電子装置のアース接続装置。1. A ground connection device for an electronic device, wherein a ground wire is joined to a case by wire bonding, wherein a ground connection bolt whose bolt head upper surface is controlled to a predetermined surface roughness is screwed into the case. An earth connection device for an electronic device, wherein an earth wire is joined by wire bonding with the upper surface of the bolt head being a pad surface. 【請求項２】 前記ボルト頭部上面の十点平均表面粗さ
（Ｒｚ）が、６．３〜２．８〔μｍ〕である、 請求項１記載の電子装置のアース接続装置。2. The ground connection device for an electronic device according to claim 1, wherein a ten-point average surface roughness (Rz) of the upper surface of the bolt head is 6.3 to 2.8 [μm]. 【請求項３】 前記アース接続用ボルトは、所定金属を
母材としてボルトを形成し、該ボルトに２〜１０〔μ
ｍ〕の所定金属メッキを施して形成されてなる、 請求項１又は２記載の電子装置のアース接続装置。3. The bolt for earth connection is formed by using a predetermined metal as a base material, and the bolt is connected to the bolt by 2 to 10 μm.
3. The ground connection device for an electronic device according to claim 1, wherein the ground connection device is formed by performing predetermined metal plating of [m]. 【請求項４】 前記所定金属メッキが、ニッケルメッキ
であり、かつ前記アース線がアルミニウム線である、 請求項３記載の電子装置のアース接続装置。4. The ground connection device for an electronic device according to claim 3, wherein the predetermined metal plating is nickel plating, and the ground wire is an aluminum wire. 【請求項５】 前記アース線を、前記ボルト頭部上面に
超音波圧着により接合してなる、 請求項１ないし４のいずれか記載の電子装置のアース接
続装置。5. The ground connection device for an electronic device according to claim 1, wherein said ground wire is bonded to said bolt head upper surface by ultrasonic pressure bonding. 【請求項６】 前記ケースに形成された、前記アース用
接続用ボルトを螺合するネジ孔は、その開口部周囲に、
前記ボルトの切上げ部との干渉を防止する面取り部を形
成してなる、 請求項１ないし５のいずれか記載の電子装置のアース接
続装置。6. A screw hole formed in the case for screwing the ground connection bolt is provided around an opening thereof.
The ground connection device for an electronic device according to any one of claims 1 to 5, wherein a chamfered portion for preventing interference with the cut-up portion of the bolt is formed. 【請求項７】 前記アース接続用ボルトを螺合するネジ
孔は、前記ケースにおける所定肉厚を有するランド部に
形成されてなる、 請求項１ないし６のいずれか記載の電子装置のアース接
続装置。7. The ground connection device for an electronic device according to claim 1, wherein a screw hole into which the ground connection bolt is screwed is formed in a land portion having a predetermined thickness in the case. . 【請求項８】 前記電子装置は、自動車に搭載されるコ
ントロールユニットである、 請求項１ないし７のいずれか記載の電子装置のアース接
続装置。8. The ground connection device for an electronic device according to claim 1, wherein the electronic device is a control unit mounted on an automobile.
JP2000130516A 2000-04-28 2000-04-28 Electronic device ground connection device Expired - Fee Related JP3508692B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000130516A JP3508692B2 (en) 2000-04-28 2000-04-28 Electronic device ground connection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000130516A JP3508692B2 (en) 2000-04-28 2000-04-28 Electronic device ground connection device

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JP2001313094A true JP2001313094A (en) 2001-11-09
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016506615A (en) * 2012-11-23 2016-03-03 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミットベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ Equipotentialization in automotive control equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016506615A (en) * 2012-11-23 2016-03-03 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミットベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ Equipotentialization in automotive control equipment
US10010017B2 (en) 2012-11-23 2018-06-26 Conti Temic Microelectronic Gmbh Potential equalization in a control device for a motor vehicle

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