JP2001308515A - Device and method for removing parts from substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for removing parts from substrate by which parts mounted on a substrate can be removed surely from the substrate. SOLUTION: The parts removing device 10 which removes parts P1 and P2 mounted on the substrate 100 from the substrate 100 is provided with a substrate holding section 14 which holds the substrate 100 in a warped state, and a removing section 30 which removes the parts P1 and P2 by bringing solder into contact with the terminals of the parts P1 and P2 exposed on the second surface 102 of the substrate 100 opposite to the first surface 101 on which the parts P1 and P2 are mounted while the substrate 100 is held by means of the holding section 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board component removing apparatus and a board component removing method for removing components mounted on the board from the board.

[0002]

2. Description of the Related Art Parts are mounted on electronic devices such as a devision receiver and a monitor device of a computer.
Printed circuit boards are used. Printed circuit boards are resistors, capacitors, coils, transformers, transistors, I
It is composed of electrical components such as C (integrated circuit), a base material in which a paper phenol resin or a glass epoxy resin is formed in a plate shape and a copper foil is adhered thereon, and a heat radiating plate made of iron or aluminum. Each component is soldered to the substrate and electrically and mechanically connected. Also, some parts have a mechanism to prevent the parts from slipping out to ensure soldering.

[0003]

At present, mounted substrates are subjected to landfill treatment or melting and refining treatment by a nonferrous metal maker (copper refining company) to recover copper and other metals. The substrate must be landfilled in a controlled landfill because harmful metals such as lead are used for the substrate. Landfill costs are increasing year by year because it is difficult to construct a new landfill site. When smelting and refining at a non-ferrous metal maker, if there is a lot of iron and aluminum, they become impurities when refining copper. Objects using iron or aluminum as a single component include transistors and heat sinks of ICs. Although the disposal cost is cheaper when the heat sink is removed, it is not easy to remove these parts by a method of tearing them off with a tool such as pliers because the parts are firmly attached to the base material. SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and to provide a board component removing apparatus and a board component removing method capable of reliably removing components mounted on the board from the board.

[0004]

A first aspect of the present invention is a board component removing apparatus for removing a component mounted on a board from a board, the board holding section holding the board in a warped state, and the board holding section. A removing operation unit configured to remove a terminal of the component, which is exposed on a second surface opposite to the first surface on which the component of the substrate held by the holding unit is mounted, by contacting solder with the terminal; An apparatus for removing a component from a substrate, comprising: In the first aspect, the substrate holding section holds the substrate by warping it. The removal operation unit removes the solder by contacting the terminals of the components on the second surface opposite to the first surface on which the components of the substrate held by the substrate holding unit are mounted, with the solder. Accordingly, the terminals and the solder of the components protruding from the second surface of the substrate can be reliably removed only by holding the substrate in a warped state.

According to a second aspect of the present invention, in the device for removing a component from a substrate according to the first aspect, the substrate holding portion holds the substrate by bending the first surface side of the substrate outward. According to the second aspect, the substrate holding portion holds the substrate by warping the first surface side of the substrate outside. Thereby, the removing operation part removes the terminal and the solder of the component protruding on the second surface side.

According to a third aspect of the present invention, in the device for removing a component from the substrate according to the first aspect, the substrate holding portion holds the substrate with the second surface of the substrate facing outward. According to the third aspect, the substrate holding unit holds the substrate with the second surface side of the substrate warped outward. Thereby, the removing operation part removes the terminal and the solder of the component protruding on the second surface side.

According to a fourth aspect of the present invention, in the device for removing a component from the board according to the first aspect, the removing operation section has a cutting blade for removing the terminal and the solder of the component by rotating. According to the fourth aspect, the terminal and the solder of the component are removed by rotating the cutting blade of the removing operation unit.

According to a fifth aspect of the present invention, in the device for removing components from the board according to the fourth aspect, the removing operation section supplies hot air to the board from which the terminals of the components and the solder have been removed. A cleaning unit that contacts and cleans the substrate after the hot air is supplied. According to the fifth aspect, the hot air supply section of the removing operation section supplies hot air to the substrate in a state after the terminals and the solder of the component have been removed. This melts the solder. Then, the substrate to which the hot air has been supplied is cleaned by the contact of the cleaning unit. As a result, even if some chips or solder on the component terminals remain, some of the solder will be melted by hot air, and the cleaning unit will clean the remaining component terminals and solder and remove them from the board. Can be removed.

According to a sixth aspect of the present invention, in the substrate component removing apparatus according to the first aspect, the substrate holding portion has a clamp portion for detachably holding the substrate. According to the sixth aspect, the clamp portion of the substrate holding portion holds the substrate by being detachably warped.

A seventh aspect of the present invention is a method for removing a component from a substrate, wherein the component mounted on the substrate is removed from the substrate. Removing the solder by contacting the terminals of the components on the second surface opposite to the first surface on which the components of the substrate held by the substrate holding portion are mounted, with the solder. A method for removing components from a substrate, characterized in that: According to the seventh aspect, in the holding step, the substrate holding section holds the substrate while warping it. In the removing step, the removing operation section removes the terminals and the solder of the component on the surface opposite to the first surface on which the component of the substrate held by the substrate holding portion is mounted. Accordingly, the terminals and the solder of the components protruding from the second surface of the substrate can be reliably removed only by holding the substrate in a warped state.

According to an eighth aspect of the present invention, in the method for removing a component from the substrate according to the seventh aspect, the substrate holding portion holds the substrate with the first surface side facing outward. According to the eighth aspect, the substrate holding section holds the substrate by warping the first surface side of the substrate to the outside. Thereby, the removing operation part removes the terminal and the solder of the component protruding on the second surface side.

According to a ninth aspect of the present invention, in the method for removing a component from the board according to the seventh aspect, the board holding portion holds the board with the second surface side facing outward. In the ninth aspect, the substrate holding unit holds the substrate with the second surface side of the substrate bent outward. Thereby, the removing operation part removes the terminal and the solder of the component protruding on the second surface side.

According to a tenth aspect of the present invention, in the method for removing a component from the substrate according to the seventh aspect, the cutting blade of the removing operation section has a cutting blade for removing the terminal and the solder of the component by rotating. . According to the tenth aspect, the terminal and the solder of the component are removed by rotating the cutting blade of the removing operation unit.

According to an eleventh aspect of the present invention, in the method for removing a component from the board according to the tenth aspect, the removing operation section supplies hot air to the board after removing the terminal of the component and the solder. The substrate after the hot air is supplied is contacted and cleaned. According to claim 11, by supplying hot air to the substrate after removing the terminals and the solder of the component,
Even if solder remains, make the solder melted. Even if a part of the terminal or the solder of the component remains, the terminal and the solder of the remaining component can be surely removed from the substrate by cleaning the substrate.

[0015]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 shows a preferred embodiment of an apparatus for removing components from a substrate according to the present invention. Board component removal device 1
Reference numeral 0 denotes an apparatus for removing a component such as an electronic component mounted on the substrate 100 from the substrate 100. The substrate component removing apparatus 10 has a base 12.
The substrate holding part 14 is fixed on the substrate. The substrate holder 14 has one holder 16 and the other holder 18, and the holders 16, 18 are fixed in parallel to the base 12. The base 12 and the substrate holding unit 14
For example, it is made of metal, and as the metal, for example, iron or aluminum can be used. The holding bodies 16 and 18 have the same shape, and the holding surfaces 20 of the holding bodies 16 and 18 shown in FIG. The substrate 100 is mounted on the holding surfaces 20, and the substrate 100 is removably held by the plurality of clamps 22 by warping the substrate 100 along the holding surfaces 20, 20.

FIGS. 2 and 3 show that the substrate 100 is
FIG. 4 shows a state in which the substrate 100 is clamped along
A plurality of electronic components P1, P2, etc. are mounted on the first surface 101 side. The second surface 102 of the substrate 100 is the first surface 1
The pin (terminal) 200 of the electronic component P1 protrudes from the second surface 102 on the side opposite to the surface 01. These pins 200 are electrically connected to the wiring pattern of the substrate 100 by solder 201. In the embodiment shown in FIGS. 1 to 3, the substrate 100 is held by the substrate holding portion 14 such that the second surface 102 is directed outward, and the substrate 100 is warped by an arc having an appropriate curvature. Thus, the pins 200 and the solder 201 are made to protrude from the second surface 102 of the substrate 100 to facilitate heating and removal.

As shown in FIGS. 1 and 3, the board component removing apparatus 10 has a removing operation section 30. The removing operation section 30 performs an removing operation of removing the end of the pin 200 protruding toward the second surface 102 of the substrate 100 and the solder 201 from the substrate 100. Removal operation unit 30
Has a cutting blade 32, a hot air supply unit 34, and a cleaning unit 36. The removing operation unit 30 is also shown in FIG. 3, and the cutting blade 32 is a cylindrical rotary blade and has a spiral cutting blade 32A. The cutting blade 32, which is a rotary blade, has a motor 3
8 is continuously rotated in the R direction.

The hot air supply section 34 shown in FIGS. 1 and 3 has a hot air source 40 and a hot air guide section 42. The hot air source 40
For example, by supplying hot air to the hot air guide section 42, the hot air guide section 42 supplies hot air directly to the second surface 102 side of the substrate 100.

The cleaning section 36 is provided on the second surface 102 of the substrate 100.
The pin 200 and the solder 201 are cut by the cutting blade 32 and heated by hot air from the hot air source 40 to clean the melted solder 201 and to remove the pin 200 as a terminal of the component cut from the substrate 100. And a function of removing the solder 201. The cleaning unit 36 includes a rotating body 44,
It has a motor 40. When the motor 40 operates, the rotating body 44 continuously rotates in the R direction. The cutting blade 32, the hot air guide 42, and the rotating body 44 are integrally held by a support 50 shown in FIG. 3, and the support 50 is warped by a driving unit (not shown) as shown in FIG. It is movable in the S direction along the second surface 102 of the substrate 100 being held.

Next, an operation example of the substrate component removing apparatus 10 shown in FIGS. 1 to 3 will be described. In the holding step,
The worker holds the holding surfaces 2 of the holding bodies 16 and 18 shown in FIGS.
The substrate 100 is placed on 0 and 20, and the four corners of the substrate 100 are fixed by the clamps 22, respectively. Thereby, the substrate 100 is held so as to be curved along the holding surfaces 20. In this case, the holding surfaces 20, 20 abut the first surface 101 of the substrate 100,
The portions where the holding surfaces 20 and 20 abut against each other are spare portions for sending the electronic components to the substrate 100 when they are mounted. No electronic components are mounted. Therefore, the holding surfaces 20, 20 can be reliably brought into contact with the first surface 101 to hold the substrate 100 in a warped state.

Next, as shown in FIGS. 1 and 3, the rotary blade 32 and the rotary body 44 of the removing section 30 are continuously rotated. Then, by moving the holder 50 in FIG. 3 in the S direction,
The rotary blade 32 has a pin 20 projecting from the second surface 102.
0 and the solder 201 are cut. And after cutting,
Since the hot air from the hot air source 40 is blown from the hot air guide portion 42 to the solder or the like, the solder is in a molten state. After that, the rotating body 44 melts while rotating.
01, the cut pins 200, and the like. By performing such a removing step, the electronic components P1 and P2 shown in FIG.
01 can be easily removed.

In the embodiment shown in FIGS. 1 to 3, the rotating body 44 is rotated in the R direction by the motor 40.
Not limited to this, the rotating body 44 may not be rotated by the motor 40, but may be rotated following the rotation of the rotating body 44 by contacting the second surface 102 of the substrate 100. The rotating body 44 can be made of a material capable of adsorbing or adhering the melted solder, the cut pins, and the like, for example, an iron wire brush. As described above, the holder 50 shown in FIG.
All the components P1 and P2 can be removed from the board 100 only by moving to 00B.

Next, another embodiment of the present invention will be described with reference to FIGS. In the embodiment of the board component removing apparatus of FIGS. 4 to 6, the first surface 101 of the board 100 is used.
Electronic components P1 and P2 are mounted on the side. Substrate 100
One end 100A and the other end 100B are detachably clamped by clamps 300 and 302, respectively.
As shown in FIG. 5, the clamps 300 and 302 hold the end 100A or 100B of the substrate 100 by sandwiching it, for example. The clamps 300 and 302 are attached to the base 312.

At the center 100C of the substrate 100, the first surface 101 side is pushed in the Z direction by the support member 340 of the actuator. Thus, the substrate 100 is sandwiched between the clamps 300 and 302,
0C is held in a state where the second surface 102 side is warped outward. The support member 340 is moved to Z1 by the actuator 350.
Retractable in the direction. On the second surface 102 side, a cylindrical cutting blade 332 is movable in the S direction. The cutting blade 332 is a cylindrical rotary blade as shown in FIG. 6, and the cutting blade 332A is formed in a spiral shape. Cutting blade 332
Is continuously rotated in the R direction by a motor 338.

Next, a description will be given of a component removing method using the board component removing apparatus shown in FIGS. One end 100A and the other end 100B of the substrate 100
0,302 fixed. Then actuator 3
The support member 340 is moved to the first surface 1
01 against the central part 100C of the central part 100.
C lifts in the Z direction. As a result, the substrate 100 is
It is warped outward such that the surface 102 is outward.

Next, when the motor 338 is driven, the rotary blade 332 of the removing section 300 moves from one end 100A to the other end 100B while rotating along S. Thus, the pins 200 and the solder 201 of the portions P1 and P2 are removed by the cutting blade 332. In this case, since the actuator 350 pushes up and holds the central portion 100C of the substrate 100 by the support member 340, the cutting blade 332 is used.
Is moved in the S direction, the board 100 itself does not dent in the Z1 direction, and the pins and solder of the electronic components of the board 100 can be reliably removed by cutting with the cutting blade 332. . That is, since the cutting blade 332 surely comes into contact with the second surface 102 of the substrate 100 by line contact, there is no dent in the substrate 100 and there is no uncut portion.

Cutting blade 3 having spiral cutting edge 332A
By using 32, it is possible to prevent a phenomenon in which a soft metal such as solder is clogged in the groove of the blade and the cutting becomes poor. This is the same for the cutting blade 32 in the embodiment of FIG. After the cutting operation is completed, the operator removes the parts P1 and P2 with a tool,
One end 100A and the other end 1 from the clamps 300 and 302
By removing 00B, the substrate can be removed.

Next, still another embodiment of the present invention will be described with reference to FIG. The substrate component removing apparatus 1000 shown in FIG. 7 is different from the embodiment of FIGS. 1 and 4 in that the first component P1 and the component P2 of the substrate 100 are mounted.
The surface 101 is on the upper surface, and the second surface 102 is on the lower surface. The base 512 includes the clamps 500 and 50.
Holding 2. The clamps 500 and 502 are connected to the substrate 1
00 is detachably sandwiched between the ends 100A and 100B.

At a position corresponding to the central portion 100C of the substrate 100, a support member 540 is abutted. The support member 540 is abutted against the first surface 101 of the central portion 100C of the substrate 100 along the Z1 direction by the operation of the actuator 550. This support member 540
Has the following functions. In a state where the one end 100A and the other end 100B of the substrate 100 are clamped by the clamps 500 and 502, the first surface 101 is clamped so that the first surface 101 side is outwardly convex. That is, the second surface 102
The side is concave. At this time, when the rotary blade 332 of the removing operation unit 300 is guided along the S direction, the central portion 10
At 0 C, the substrate 100 may be pushed by the force of the rotary blade 332. In order to prevent such a phenomenon, the support member 540 is abutted from the first surface 101 side in the Z1 direction.

In the holding step in FIG.
0 is clamped to one end 100A and the other end 100B.
It is detachably clamped by 0,502. In the state where the substrate 100 is thus clamped, the first surface 101
Are clamped so as to be convex. In this state, the actuator 550 is operated, and the supporting member 540 is moved to the central portion 1.
00C against the first surface 101.

Next, in the removing step, the rotary blade 332
It is sent in the S direction while being continuously rotated in the direction. Since the rotary blade 332 is guided along the second surface 102 of the substrate 100, the rotary blade 332 is connected to the pins 20 of the components P1 and P2.
0 and the solder 201 are removed by cutting. Thereafter, the operator removes the electronic components P1 and P2 from the substrate 100. Clamp 5 on one end 100A and the other end 100B of substrate 100
The substrate 100 can be removed by removing the support member 540 from the substrates 100 and 502 and releasing the abutment of the support member 540.

The board 100 of the above-described embodiment is a normal printed board or printed wiring board.
00 may of course be a flexible printed wiring board.

In the embodiment of the present invention, since the board is warped and fixed, and the pin, which is the terminal of the component, and the solder portion are removed while closely contacting by cutting, the pin of the solder or the component (also referred to as a foot) is removed. Can be reliably removed. In the embodiment of the present invention, not only removal by cutting such as a rotary blade, but also pins and solder can be removed by rotating a grinding body such as a grindstone. Since portions such as pins or iron such as pins and portions such as solder and pins for retaining the pins are removed from the substrate, the processing cost when the substrate is outsourced to a recycler is reduced. Aluminum and iron removed from the substrate can be sold. As a part, a normal IC
(Integrated circuit) packages and small to large components such as transformers, heat sinks, and other components.

[0035]

As described above, according to the present invention,
Components mounted on the board can be reliably removed from the board.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a preferred embodiment of a substrate component removing apparatus according to the present invention.

FIG. 2 is a view showing a state in which the substrate is warped and held with respect to a substrate holding unit in the board component removing apparatus of FIG. 1;

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a front view showing another embodiment of the substrate component removing apparatus of the present invention.

FIG. 5 is a plan view of the board component removing apparatus of FIG. 4;

FIG. 6 is a perspective view showing a rotary blade used in FIG. 4;

FIG. 7 is a front view showing still another embodiment of the substrate component removing apparatus of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Device removal apparatus of board | substrate, 14 ... board | substrate holding part, 30 ... removal operation part, 32 ... cutting blade, 100
... substrate, 101 ... first surface of substrate, 102 ...
Second surface of substrate, P1, P2 ... parts

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hajime Koike 6-35 Kita Shinagawa, Shinagawa-ku, Tokyo Sony Corporation F-term (reference) 3C022 DD08 DD11 GG00 5E319 AA02 AB01 CD57

Claims (11)

[Claims] An apparatus for removing a component mounted on a substrate from a substrate, comprising: a substrate holding unit configured to warp and hold the substrate; and the component of the substrate held by the substrate holding unit. A device for removing solder by contacting a terminal of the component exposed on a second surface opposite to the first surface on which the component is mounted with solder. 2. The method according to claim 1, wherein the substrate holding unit is configured to:
The board component removing apparatus according to claim 1, wherein the board side is held with the surface side outward. 3. The apparatus according to claim 2, wherein the substrate holding unit is configured to:
The board component removing apparatus according to claim 1, wherein the board side is held with the surface side outward. 4. The substrate component removing apparatus according to claim 1, wherein the removing operation unit has a cutting blade that removes the terminal and the solder of the component by rotating. 5. The cleaning unit according to claim 1, further comprising: a hot-air supply unit configured to supply hot air to the board from which the terminals of the component and the solder have been removed; and a cleaning unit that contacts the board after the hot air is supplied. The substrate component removing apparatus according to claim 4, further comprising a cleaning unit that performs cleaning. 6. The board component removing apparatus according to claim 1, wherein the board holding section has a clamp section for holding the board in a detachable manner. 7. A method for removing a component from a substrate, the method comprising: removing a component mounted on the substrate from the substrate, wherein the substrate holding unit warps and holds the substrate; and a removing operation unit holds the substrate by the substrate holding unit. A step of removing solder by contacting a terminal of a component exposed on a second surface opposite to the first surface on which the component is mounted on the solder, and removing the solder. Parts removal method. 8. The substrate holding unit is configured to:
8. The method for removing a component from a substrate according to claim 7, wherein the substrate is held with the surface side outward. 9. The method according to claim 9, wherein the substrate holding unit is configured to:
8. The method for removing a component from a substrate according to claim 7, wherein the substrate is held with the surface side outward. 10. The method for removing a component from a substrate according to claim 7, wherein the cutting blade of the removing operation unit has a cutting blade for removing a terminal of the component and the solder by rotating. 11. The removing operation section supplies hot air to the substrate after removing the terminals of the component and the solder, and contacts and cleans the substrate after the hot air is supplied. The method for removing components from a substrate according to claim 10.